エスタカヤ電子工業 List of Products and Services

Our company offers COF (Chip On Film) assembly services. We have developed our own production equipment using a highly productive reel-to-reel method, and we possess a wide range of integrated equipment. This allows us to leverage the product features of COF (film bendability, fine wiring pitch compatibility, and thin profile support) to meet the diverse needs of our customers, not limited to display applications. 【Service Features】 - Mass production of fine wiring pitch products is possible (mass production record: 22um pitch, prototype record: 18um pitch) - We can accommodate various needs such as mounting multiple ICs, attaching reinforcement plates, component mounting, drilling, singulation, and conducting various reliability tests. - We have a production capacity of 12 million units per month. *Please feel free to contact us.

• Other semiconductors

The "PV SP Cleaner" has a mild formulation with a pH of 11.3 while possessing excellent cleaning capabilities. Its unique cleaning components penetrate and lift dirt, making it possible to efficiently clean soot and grease stains from factories and vehicles, as well as organic stains such as tree sap, pollen, and bird droppings from mountainous areas in a short time. 【Features】 ■ Residue of cleaning components is almost zero ■ High safety ■ Cost reduction with a small amount of use ■ High safety for panel materials *For more details about the product, please refer to the catalog. *Free samples are also available. Please contact us for more information.

• Cleaning agents

Our company provides semiconductor package services, including wafer processing and 2D + 3D automatic inspection for bump bonding wafers. We are capable of conducting 100% inspection by combining 2D (chip surface condition/dicing condition inspection) and 3D (bump bonding measurement) technologies. We offer a consistent response from wafer acceptance inspection to post-inspection, implementing complete traceability. 【Features】 ■ Consistent manufacturing and inspection line ■ Complete traceability ■ Ability to differentiate between wafer-related and process-related issues ■ Prevention of defective products flowing into subsequent processes *For more details, please feel free to contact us.

• Other services

We offer various processing options, including laser grooving that allows for damage-free dicing of fragile chips such as low-k wafers. With many years of experience, we have numerous achievements! If you have any concerns, please feel free to consult us. - Back grinding - Laser grooving / dicing with blades - Wafer rib cutting TAIKO*1 - We can also handle bare die shipping and package assembly. - You can choose the shipping method as well. (Tray, dicing tape, embossed tape (reel) packaging, etc.) We can accommodate wafer diameters from 6 to 12 inches (rib cutting is only available for 8 inches).

• Wafer

- Back grinding processing - Laser grooving / dicing processing with blades - Rib cutting of TAIKO*1 wafers - We can also handle bare die shipping and package assembly. - You can also choose the shipping method. (Tray, dicing tape, embossed tape (reel) packaging, etc.) If you have any concerns, please feel free to contact us. *1 TAIKO is a registered trademark of Disco Corporation. TAIKO Process The "TAIKO Process" is a technology that differs from conventional back grinding. When grinding the wafer, it leaves the edge portion of the outer circumference (about 3 mm) intact and only grinds the inner circumference to reduce thickness. The introduction of this technology reduces the transport risk of thin wafers and minimizes warping. (Refer to https://www.disco.co.jp/jp/solution/library/grinder/taiko_process.html)

• Wafer

The "DX Series" is a fully automated test handler with a structure that separates the transport section from the inspection section. Depending on the inspection requirements for camera modules, we can propose various test units. We have adopted test units such as "DX1533," "DX1327," and "DX2299." For other packages like CSP/BGA/QFN/QFP, we will provide proposals upon consultation. 【Features】 ■ Test unit configuration can be customized to various workpieces and inspection requirements ■ Commonized work transport section ■ Handler dimensions: W1760×D1230×H2280 (mm) ■ Test unit dimensions: W940×D700×H1000 (mm) ■ Processing capacity: 300–500 (UPH) ■ Demo units available for loan ■ Compatible with various models ■ Comprehensive after-sales support even after model changes We will handle everything from design development for the automation of camera module testing to after-sales support for mass production implementation. *For more details, please refer to the PDF materials or feel free to contact us.

• Testing Equipment and Devices

☑ Eliminate variations in manual soldering ☑ Enables soldering with low thermal stress ● With the introduction of new equipment, soldering can be done simply without the need for expensive masks! ● It is also possible to melt solder balls with a laser and blow them onto terminals using N2! ● Localized processing becomes possible, so flux is unnecessary, and thermal load on the entire circuit board is not required!

• Other semiconductors

Our company offers "flip chip mounting," which can reduce the mounting area compared to conventional wire bonding. In the formation of stud bumps, we can customize the shape according to specifications. We are equipped to handle large wafers up to 12 inches. We possess extensive know-how and can accommodate inquiries for chip sizes below 0.5mm. We can also provide proposals that include processes following flip chip mounting. 【Features】 ■ Supports 6-inch, 8-inch, and 12-inch wafers ■ Capable of forming two-tier bumps for stud bumps ■ Supports bare wafers, tape-mounted wafers, and reconstructed wafers ■ Accommodates bump leveling *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Circuit board design and manufacturing

Our company offers a one-stop service for "Outsourced Semiconductor Assembly and Test (OSAT)" that covers everything from wafer testing to module implementation. Based on product and material information, we propose manufacturing methods tailored to our customers' needs, supporting the development and mass production of LSI devices and module products. We can also accommodate contracts for only certain processes and assembly of electronic devices. 【Features】 ■ Fast delivery due to domestic operations, with smooth communication ■ Capable of handling requests for small-lot production of various types ■ PCB assembly for automotive and medical devices is also possible 【Examples of Contracted Services】 ◎ Wafer processing ◎ COF ◎ BGA ◎ Image sensors ◎ Camera module assembly ◎ SMT PCB assembly etc. *For more details, please refer to the materials. Feel free to contact us.

• Contract manufacturing

We support testing of semiconductor products from CP (Wafer) test to FINAL test, ensuring consistency throughout the assembly process. We provide testing and test development for a wide variety of semiconductor products, including logic-related (LCD drivers, printer drivers, etc.) and analog-related products. We will accommodate if it is possible to use our available testers.

• Wafer

We provide testing for semiconductor products that is consistent from CP (Wafer) test to FINAL test. We offer testing and test development for a wide variety of semiconductor products, including logic-related (LCD drivers, printer drivers, etc.) and analog-related products. We will accommodate if it can be used with the testers we possess.

• Wafer

■ Surface mounting is performed in a Class 10000 environment. ■ We select the supply method for solder and adhesive according to the product using printing, dispensing, and pin transfer. ■ We have production experience with FPCs with component sizes of 0402, a distance between components of 0.13mm, and a substrate thickness of 0.5mm or less. ■ We can accommodate laser soldering (local soldering). ■ We also support surface mounting on individual substrates. ■ We provide post-surface mounting services such as automatic visual inspection, flux cleaning, underfill, substrate cutting, and marking. Additionally, we can offer integrated support combined with various package assembly, so please consult with us. ■ We can also handle various analyses in-house, so please inquire.

• Circuit board design and manufacturing

The flip chip structure can reduce the mounting area compared to wire bonding. Flip chip mounting of bare chips is performed on flexible substrates, rigid substrates, and ceramic substrates. In addition to GGI (Gold to Gold Interconnection) and ACF/ACP (Anisotropic Conductive Film/Paste), there are many other methods for flip chip technology, and we will propose the method you require. We suggest implementing glass on the bare chip. We will also propose the processes following the flip chip as per your requirements.

• Other semiconductors

COF stands for Chip On Film, which is a method of mounting that provides both electrical connectivity and mechanical fixation of driver ICs onto a film-like substrate. It is primarily used for the implementation of display driver ICs, allowing for high-precision mounting of ICs on substrates with fine wiring pitches. We possess numerous integrated facilities, including self-developed equipment utilizing a highly productive reel-to-reel method, enabling us to respond to a wide range of customer needs beyond just display applications by leveraging the product features of COF (film bendability, fine wiring pitch compatibility, thin profile compatibility). **Features** - Technology development aimed at mass production of fine wiring pitch products Mass production track record: 22um pitch, prototype track record: 18um pitch - Not only for the mounting of driver ICs but also accommodating a wide range of customer requirements Implementation of multiple ICs, attachment of reinforcement plates, component mounting, hole drilling, individual piece processing, and conducting various reliability tests.

• Other semiconductors

Stud bump processing is essential in flip chip mounting technology. Our company can form stud bumps even from a single wafer. We can also process two-tier bumps. We provide leveling support. We can accommodate wafer sizes up to a maximum of 12 inches. We support individual chips, bare wafers, tape-mounted wafers, and reconstructed wafers.

• Wafer

We handle assembly processing of semiconductor wafers. - Available wafer diameters: 6 to 12 inches - We can perform back grinding (backside polishing) of wafers only, and shipping after dicing with laser grooving/blade is also possible. - The thickness distribution of wafers after backside polishing can be measured non-contact and non-destructively. - We can pick up specific dies from shuttle wafers and ship bare dies or perform package assembly. - If you provide the results of wafer tests in a map format, we can also accommodate inkless processing. - The condition of both sides of the dies will be inspected in full by automatic visual inspection machines. - For bare die shipments, you can choose between tray, dicing tape, or embossed tape (reel) packaging. 【Business Content】 - Processing and shipping support after the supply of semiconductor wafers - Automatic visual inspection of the front and back surfaces of wafers - Evaluation and analysis in the latter processes associated with die development

• Circuit board design and manufacturing

● Pre-molded hollow package This is a package in which the cavity is pre-formed with molded resin, resulting in a hollow interior. It allows for packaging at a lower cost compared to cavity-type substrates such as ceramic substrates.

• Dedicated IC

●Partial Exposure Mold This is a package that partially opens the mold resin to expose the surface of the semiconductor. The exposed shape can be customized according to the application of the component.

• Dedicated IC

●Transparent Resin Mold This is a package made using transparent mold resin. It is ideal for devices that sense light. It achieves high transparency and weather resistance.

• Dedicated IC

Estakaya Electronics Co., Ltd. is engaged in the business of semiconductor backend process PKG development, evaluation, and analysis. We provide a comprehensive response from PKG design to manufacturing, testing, various equipment development, and reliability testing within our domestic infrastructure. At our factory in Okayama Prefecture, Japan, we can design, develop, and produce a diverse range of PKG types, including MOLD, BGA, FBGA, LCC (QFN), COF, MODULE, ceramic PKG, and bare die shipments. Additionally, leveraging over 30 years of extensive knowledge, we can also propose new PKG developments that span across processes. 【Business Activities】 　■ Design and manufacturing of semiconductor PKG 　■ Reliability evaluation, investigation, and analysis (AEC-Q100 compliant) 　■ Development and manufacturing of production equipment

• Memory

The Low-k film used as an insulating film on high-density wiring wafers has low mechanical strength, and in typical blade dicing, there was a risk of damaging the wiring layer and causing film delamination. The process of removing the wiring layer, including the Low-k film, using a laser saw is called laser grooving. We can also process shuttle wafers of different chip sizes, so we can accommodate prototype wafers in the development stage. In addition to Low-k wafers, we can also process narrow street wafers with widths of 20um or less, depending on your requirements.

• Wafer

We will respond to your requests with the know-how cultivated in various PKG types of semiconductor manufacturing, whether you want to conduct reliability evaluations, investigate the causes of defects in nonconforming products, or closely observe the condition of products. ■ Reliability Equipment - Temperature Cycle Tester - Constant Temperature and Humidity Tester - PCT Tester - Drop Tester - High-Temperature Constant Temperature Chamber ... and more ■ Analysis/Measurement Equipment - SEM-EDX - FT-IR - SAT - Resin Opening with Chemicals - Cross-Section Polishing Machine ... and more

• Dedicated IC

We provide contract manufacturing for camera module assembly and inspection, as well as packaging for image sensor chips. From development prototypes to mass production, we propose, evaluate, and analyze optimized processes tailored to each step, and build inspection environments to bring our customers' ideas to life. 【Features】 ■ Comprehensive support from assembly to imaging inspection at our domestic factory ■ Active alignment support ■ Various reliability tests conducted ■ Imaging inspection environments (sockets, charts, etc.) and inspection equipment are also manufactured in-house *For more details, please contact us or download the PDF to view.

• Other semiconductors

Our company is capable of providing custom designs for antennas, shapes, and more to meet customer requests. We also offer support for case design and simulation. Using the evaluation kit, you can immediately start evaluating millimeter-wave radar modules, and by identifying issues, it is possible to reduce the man-hours required for subsequent prototyping and evaluation. Additionally, we are equipped with various devices necessary for RF measurement, such as anechoic chambers and various measuring instruments, as well as cutting machines for enclosures and circuit boards, and temperature-controlled chambers and vibration testing machines required for reliability testing. 【Features】 ■ Technical capabilities that allow for seamless support from development to mass production ■ Accelerated development using evaluation kits ■ Collaborative system with a technical trading company ■ Well-equipped facilities that enable everything from development to mass production *You can view the catalog and evaluation kit from the "PDF Download" link below! For more details, please feel free to contact us.

• Mechanical Design

The "PV Scale Remover" is a stripping agent designed to remove stubborn dirt that cannot be cleaned with general cleaning methods, such as a combination of minerals and iron powder. It can refresh panels that have accumulated dirt and discolored, bringing them close to a like-new condition. Many power generation operators are experiencing a decrease in power generation due to unexpected dirt such as iron powder, scale (water stains), fecal damage, and tree sap at the time of installation. To maintain stable power generation, cleaning solar panels will become essential in the future. The PV Chemical Series addresses various challenges necessary for the maintenance of solar panels, including "cleaning, anti-fouling treatment, iron powder removal, rust prevention, and scale removal." We encourage you to consider utilizing the PV Chemical Series. 【Features】 ■ A dedicated stripping agent for stripping and re-coating scales and coatings. ■ It does not fall under the category of toxic or hazardous substances. ■ We offer liquid agents for ground-mounted and roof-mounted installations. *For product details, please refer to the catalog. *Free samples are also available. Please contact us for more information.

• Solar power generator
• Cleaning agents

The "PV Iron Remover" is a product designed to dissolve and remove iron powder that accumulates on solar panels. By increasing the amount of ammonium thioglycolate, the iron powder dissolving power has been enhanced. Using a pressurized pump spray allows for faster work, leading to reduced workload and improved efficiency. Many power generation operators are struggling with decreased power generation due to unexpected dirt such as iron powder, water stains, droppings, and tree sap at the time of installation. To maintain stable power generation, cleaning solar panels will become essential in the future. The PV Chemical Series addresses various challenges necessary for solar panel maintenance, including "cleaning, anti-soiling treatment, iron powder removal, rust prevention, and scale removal." We encourage you to consider our products. 【Features】 ■ Increased amount of ammonium thioglycolate, achieving excellent iron powder dissolving power ■ Eliminates unpleasant ammonia odor ■ Fast reaction speed and high rinsing performance improve work efficiency ■ We also offer cleaning agent sales and cleaning services (depending on the region) ■ Extensive track record of adoption *Free samples are also available. Please contact us for more details.

• Solar power generator
• Cleaning agents

"PV Hydrocoat" maximizes the power of rain to keep the surface of solar panels clean, preventing output reduction due to dirt and supporting stable power generation over a long period. It does not degrade under intense ultraviolet rays or temperature changes, and it excels in abrasion resistance by chemically bonding colloidal silica to the module surface. Additionally, with specialized installation tools, it can be applied in a short time without compromising the original performance of the module. The PV Chemical Series addresses various maintenance challenges for solar panels, such as "cleaning, anti-soiling treatment, iron powder removal, rust prevention, and scale removal." We encourage you to consider utilizing the PV Chemical Series. 【Features】 ■ Self-cleaning that maximizes the power of rain ■ Anti-static function prevents dirt adhesion during dry periods ■ Increased transmittance stabilizes power generation ■ Long-term effects using completely inorganic materials *For more details, please refer to the PDF document or feel free to contact us.

• Solar power generator
• Coating Agent