イー・スクエア List of Products and Services

E-Square Co., Ltd. was established in August 1999 with the aim of contributing to the global environment by applying plasma removal technology to eliminate PFCs (perfluorocarbons) emitted during IC manufacturing and other processes. In October 2001, the company began developing a surface modification treatment device utilizing atmospheric pressure plasma equipment. Experiments on resist stripping using atmospheric pressure plasma led to the development of a surface modification device widely used in LCD manufacturing processes. In August 2002, the surface treatment device was completed, which also became a turning point for entering the coating, film, and printed circuit board industries. E-Square has developed, manufactured, and sold the atmospheric pressure plasma surface treatment device 'Precise II,' which is ultra-compact, lightweight, highly reliable, and capable of generating high-density plasma, achieving cumulative sales of over 1,200 units (as of 2021). [Features] - Newly upgraded Precise series - Superior modification performance compared to competitors (high-density plasma generation) - Damage-free and particle-free - Ultra-compact and lightweight (Precise series) For more details, please contact us or download the catalog.

The fiber bundle surface modification device can efficiently hydrophilize fiber bundles, such as carbon fibers, brass fibers, and polymer fibers, targeting the interior of the bundle. The plasma treatment width can be freely designed according to the processing speed, and the structure that confines the plasma (radicals) inside the treatment chamber allows for uniform processing throughout the interior of the bundle. The treated work does not become charged. (Patent pending) 【Features】 - Efficient hydrophilization treatment of each individual fiber in the bundle due to the structure that confines the plasma. - High reliability. - Damage-free processing. For more details, please contact us or download the catalog.

The atmospheric pressure plasma device "Precise Series" is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it is discharged, and there is no particle adhesion in the air after processing. 【Features】 ○ Low-temperature processing ○ Damage-free ○ No need for an ionizer device before ESD-free processing ○ Maintenance-free for 2 years ○ Compact and lightweight (compared to other companies: approximately 1/2 or less in volume ratio, approximately 1/3 or less in weight ratio) ○ Semi-permanent long lifespan dielectric electrodes ○ Particle-free ○ Uniform processing for a wide range of workpieces For more details, please contact us or download the catalog.

The atmospheric pressure plasma device "AP Plasma Precise II" is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it can be neutralized, and there is no particle adhesion in the air after processing. 【Features】 ○ No need for electrode replacement (dielectric part) ○ Wide processing range (100 mm to 3000 mm) ○ No damage to the processing surface due to the downstream electrode configuration. ○ Maintenance only every two years For more details, please contact us or download the catalog.

The Atmospheric Pressure Plasma Device Precise Series is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it is discharged during processing, and there is no particle adhesion in the air after treatment. By changing the added gas, it is possible to select bonding molecules such as functional groups, OH groups, and amine groups on the treated surface, enabling optimization of bonding conditions in the next process. For more details, please contact us or download the catalog.

Our atmospheric pressure plasma surface treatment device, "Precise," features a plasma generation unit that is separated from the treatment area (downstream type), allowing for the application of functional groups and hydroxyl groups to the surface through molecular bonding without damaging the treatment side. This enables direct adhesion to liquid crystal polymers (LCP) and fluororesins while maintaining a smooth surface. Additionally, by activating the surfaces of the positive and negative electrode parts and separators through plasma treatment, we can expect a reduction in the impregnation time for electrolyte injection into lithium-ion batteries. For more details, please contact us or download the catalog.

We have developed a method that can efficiently handle the dispersion of particles, hydrophilization of particles, and surface reduction of metal particles using an atmospheric pressure plasma device. By utilizing a structure that takes advantage of a downstream type processing method suitable for wide and long workpieces, we are able to trap radicals inside the cavity and stir them with the workpiece, enabling more efficient surface treatment. Since we completely eliminate electrical and electromagnetic wave damage, as well as UV damage to the workpiece, there is no damage to the surface of the workpiece, and surface modification of metal particles is also achieved. As a result, there is no charge buildup on the workpiece after processing. 【Features】 ■ Downstream type suitable for wide applications ■ Structure that leverages advantageous processing methods for long workpieces ■ Complete elimination of electrical, electromagnetic wave, and UV damage to the workpiece ■ Plasma irradiation width can be produced in the range of 100mm to 2000mm *For more details, please refer to the materials. Feel free to contact us with any inquiries.

There is a rapidly increasing demand for substrate materials in the FCCL market for millimeter-wave devices, and a technology that allows for direct adhesion without roughening the surface is required. Our company's downstream atmospheric pressure plasma equipment focuses on molecular bonding, enabling processing that causes no damage to the surface or any scientific damage from UV light or other effects of plasma. Our "Precise" system separates the plasma generation unit from the processing unit (downstream type), allowing for the addition of functional groups and hydroxyl groups to the surface without damaging the processing area. This enables direct adhesion to liquid crystal polymers (LCP) and fluororesins while maintaining a smooth surface. Since our plasma treatment for adhesion and bonding is based on molecular bonding, it can be performed without causing any damage to the surface or any scientific damage from UV light or other effects of plasma. Additionally, by performing a pre-treatment for electroless plating through plasma treatment, we improve the dispersion of the catalyst and achieve uniform copper plating. For more details, please contact us or download the catalog.

Fluororesins (PTFE, PFA) and LCP films, which are attracting attention as materials for substrates supporting 5G and 6G, can be Cu-plated or directly bonded. Our atmospheric pressure plasma surface treatment device, 'Precise', has a plasma generation unit that is separated from the treatment area (downstream type), allowing for the addition of functional groups and hydroxyl groups to the surface through molecular bonding without damaging the treatment area. This enables direct bonding to liquid crystal polymers (LCP) and fluororesins (PTFE, PFA) while maintaining a smooth surface. Since our plasma treatment for bonding and joining is primarily based on molecular bonding, it allows for processing without any damage to the surface or any scientific damage from UV light or other effects of plasma. Additionally, by activating the surfaces of the positive and negative electrode parts and separators through plasma treatment, we can expect a reduction in the impregnation time for electrolyte injection into lithium-ion batteries. The treatment width can be uniformly processed from 100 mm to 3000 mm. For more details, please contact us or download the catalog.

We contribute to the manufacturing processes of printed circuit boards and FCCL for 5G and 6G using atmospheric pressure plasma devices. Our "Precise" system separates the plasma generation unit from the processing unit (downstream type), allowing us to impart functional groups and hydroxyl groups to the surface primarily through molecular bonding without damaging the processing area. This enables direct adhesion to liquid crystal polymers (LCP) and fluorine resins while maintaining a smooth surface. Since our plasma treatment focuses on molecular bonding, it allows for processing without any damage to the surface or scientific damage from UV light and other effects of plasma. We are conducting sample work on damage-free direct adhesion to various films. According to our experimental data, the adhesion strength achieved is over 9N/cm (Cu/LCP). The adhesion strength on Ni surfaces can be improved by arranging amine groups on the surface. These treatments can be easily achieved by changing the added gases.

Our atmospheric pressure plasma device "Precise" can shorten the impregnation time of the electrolyte into lithium-ion batteries by activating the surfaces of the positive and negative electrode parts and the separator through plasma treatment. Additionally, since the treatment is isolated from the plasma generation area and involves only radical species, there is no damage to the surface at all. By activating the surface of the workpiece and imparting hydrophilicity, we can expect a reduction in the injection time of the electrolyte due to the capillary action between opposing surfaces. If you are interested, we would be grateful if you could contact us.

Here, we focus on explaining an atmospheric pressure plasma device that generates pure bulk plasma, rather than devices using corona treatment or arcs. By using a special electrode structure and applying high-frequency power to the electrodes based on nitrogen gas and noble gases, high-density plasma is generated. The high-density reactive species produced impart functional groups, hydroxyl groups, and amine groups to the work surface, enabling treatments such as wettability enhancement, coating performance improvement, and organic material removal. By changing the added gas, selectively generated molecules can be produced, allowing for treatments such as hydrophobization, reduction, thin film volume adjustments, and dry etching. Additionally, performing plasma treatment before cleaning processes or plating treatments activates the treated surface, enhancing reactivity with chemical solutions, improving cleaning performance, and aiding in the removal of bubbles. Considering the nature of the work and the conditions for the next process, I hope this summary serves as a reference for optimizing the selection of atmospheric pressure plasma devices. Furthermore, regarding adhesive-free bonding without the use of adhesives, I believe that bonding technology based on molecular bonding with copper foil can reduce transmission loss and contribute to the manufacturing of FCCL for 5G and 6G applications.

E-Square Co., Ltd. is a specialized manufacturer of atmospheric pressure plasma devices, boasting over 1,200 units sold since the release of its atmospheric pressure plasma device in 2001 (as of 2021, in the domestic and international display device market and others). This time, we present a new proposal for imparting functionality to surfaces without damaging the "work surface" or "electronic devices." [Contents] ■ Introduction - Background ■ Plasma Treatment Forms ■ Various Damages Caused by Atmospheric Pressure Plasma Devices ■ Current Development Themes ■ Conclusion This document describes the various damages and their causes when using atmospheric pressure plasma, the relationship with electrode structure, and details on damage-free surface functionalization at the nano level. *For more details, please download the PDF or contact us directly.

Our company's downstream plasma device eliminates various damages that occur during processing, enabling clean treatment and smooth surface adhesion. It is suitable for applications such as FCCL manufacturing for 5G and 6G, as well as for carbon films in the secondary battery market, and for bonding dissimilar materials during electrode manufacturing and dry pre-treatment. Additionally, by changing the added gas and optimizing plasma parameters, we can selectively impart functional molecules (such as covalent bonding molecules) to the interface, matching the bonding molecules to the material of the joining interface. Even for challenging hydrophilization of PFA and PTFE surfaces, it is possible to reduce the contact angle to below 10 degrees. *Sample work is also conducted at our lab. [Contents] ■ Basic Concept ■ Advantages ■ Processing Image (R to R) *For more details, please refer to the PDF document or feel free to contact us.