ソフエンジニアリング List of Products and Services

《1》【W-Spin Scrub Automatic Processing Device】 　◆ This is the latest model of "automatic scrub cleaning device" for mass production. 　◆ It is a model focused on high throughput and high reliability. 　◆ Suitable for "cleaning after CMP or polishing," "incoming cleaning," "final cleaning," etc.! 　◆ It supports a variety of options such as "reverse function," "brush pressure setting function," "CO2 ionizer," and more. 　◆ Customization for various needs is also available. 《2》【Photo Mask Cleaning Device】 　◆ This device corresponds to a series based on mask size. 　◆ It is a long-selling model with over 200 units sold in total. 　◆ It has a rich track record with over 90% market share in domestic masks! 　◆ There are also many units in operation at various device manufacturers. 　◆ There are numerous successful cases for "removing resist that adhered during contact exposure" as well! * Please feel free to download the PDF materials or contact us for more information.

• Other semiconductor manufacturing equipment

■Suitable for various WET processes such as etching, RCA cleaning, and developing ■Ideal for organic stripping/lift-off processes that do not use ultrasound 　◎Compatible with high-pressure jet and spray treatments 　◎When using ultrasound for effective removal of dry-etch residues and burrs during lift-off, the "Spin Dip Processor" is recommended. ■Full process of chemical solution ⇒ rinse ⇒ drying in a single chamber, supporting Dry-In/Dry-Out 　◎Conventional method: 2-chamber configuration (substrate remains in a chemical solution during transfer between chambers) 　◎New method: UDS type uses a 1-chamber configuration. ■Basic operation of the substrate 　◎ "Upper section... LD of the substrate" ⇒ "Lower section... chemical treatment" ⇒ 　　　　　　　　　　　　⇒ "Middle section... rinse and dry" ⇒ "Upper section... ULD of the substrate" ■The patented isolation plate ensures the concentration of the chemical solution during reuse. 　◎Since there is no dilution from rinse water contamination, the chemical solution can be temperature-controlled and reused. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, resist coating equipment, cleaning equipment, megasonic, photoresist, photolithography process.

• Other processing machines

This device is equipped with a variety of tools, including [horn-type ultrasonic], [BLT-type ultrasonic], [high-pressure jet nozzle], and [spray nozzle], to support demonstrations of organic lift-off for various substrate surface conditions. It can accommodate various sizes, substrate types, and device pattern states with an in-house demonstration machine. Furthermore, we will incorporate the insights and know-how gained to customize the implementation device into an optimal form. *For more details, please refer to the PDF materials or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, megasonic, cleaning equipment, photoresist, photolithography process, silicon, batch substrate cleaning machine, batch spin cleaning machine, surface treatment, thin wafer, insulating film, high-pressure jet cleaning machine, substrate cleaning equipment, load lock chamber, glass transport, glass substrate, wafer cleaning machine.

• Other processing machines

The device is a dedicated single-wafer processing equipment designed to address various issues such as the re-adhesion contamination of a large amount of peeling metal debris generated during the lift-off process. In the peeling dip tank, a combination of downflow/QDR/spray/shower/side US/swing is used, while the cleaning and drying spin single-wafer chamber employs special nozzles/MS rinse/HP-Jet, achieving high-efficiency and uniform short-time lift-off without re-adhesion dirt, resulting in a high-purity substrate surface. 【Features】 ■ Usable for organic peeling as well ■ Significant reduction in filter load with cyclone and composite mesh ■ Over 10 years of delivery records with numerous units supplied to major electronic component manufacturers ■ This system can be replaced with the new "Spin/Dip type" or "UDS type" *For more details, please refer to the PDF materials or feel free to contact us. Wafer, single-wafer cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic cleaning equipment, cleaning equipment, resist, photoresist, wafer cleaning equipment, wafer cleaning machines, loaders, unloaders.

• Other cleaning machines

■ This is a cassette-type batch processing device. ■ Ideal for batch processing compatible with RCA processes such as APM/MS, SPM, HPM, and DHF. ■ Also supports substrate regeneration processes such as organic stripping and Poly-Si regeneration. ■ Proven capability for anisotropic etching such as MEMS. ■ Achievements up to 300mm. ■ Compatible with various drying units including S/D, IPA vapor drying, and hot water lift drying. ◎ The IPA vapor drying features a watermark suppression function. ■ For recent demands of "small quantity and diverse variety," we recommend the latest UDS spin processor as a spin single wafer. ◎ Throughput improvement is achieved by multi-chamber configuration of the UDS chamber. *For more details, please refer to the PDF document or feel free to contact us. Wafer, substrate cleaning equipment, semiconductor manufacturing equipment, semiconductor, resist stripping equipment, megasonic, low-cost, cleaning equipment, automatic cleaning machine, resist, batch cleaning equipment, silicon, etching equipment, RCA cleaning, insulating film, film formation, ceramic, loader unloader.

• Other cleaning machines

The device achieves complete separation and reuse of chemical solutions, and is a manual Spin single-wafer processing device capable of handling the full process of chemical treatment ⇒ rinsing ⇒ drying in one spin. It significantly reduces footprint and costs, and is already patented. It can accommodate not only round substrates but also square-shaped substrates. It has a proven track record in various process treatments such as "RCA," "developing," "etching," "cleaning," "stripping," and "lift-off." 【Features】 ■ It is possible to consolidate various chemical treatment processes such as cleaning and etching into a single total system. ■ It can significantly reduce equipment purchase costs and footprint. ■ Since transfer between chambers is unnecessary, it reduces workpiece attachment and detachment, streamlining operations and preventing transport accidents, thereby improving transport reliability. *For more details, please refer to the PDF document or feel free to contact us. Wafer, single-wafer cleaning device, coating and developing device, substrate cleaning device, spin cleaning device, semiconductor manufacturing equipment, semiconductor, resist stripping device, megasonic, cleaning device, resist, photoresist, photolithography process, silicon, scrub cleaning device, scrub cleaning, wafer stripping device, wafer cleaning device, wafer cleaning machine.

• Other cleaning machines

This is an introduction to a device that performs a series of patterning processes, including developing, etching, rinsing, and drying, using a conventional spin method. Depending on the substrate type, it allows for the selection of spray or paddle recipes during the developing and etching processes, and it can also improve uniformity through speed control during scanning. This machine is low-cost and has a wealth of experience with numerous users, but the process for recycling requires a two-chamber setup. If proper separation of waste liquid, drainage, and exhaust is necessary, we will respond with a new type of UDS device. *For more details, please refer to the PDF materials or feel free to contact us.*

• Etching Equipment

■ Ideal for "prototype development," "alternative to manual cleaning," "labor-saving," and "quality improvement," etc. ■ Unlike manual cleaning, it achieves a high level of surface quality without variation. ■ Achieves both improved base quality and reduced cleaning labor costs. 　◎ For example, operating four tabletop cleaning machines with one worker at a low labor cost. ■ Optimal for processing Si, SiC, GaN, sapphire, GaAs, LT, etc. ■ Compatible with round substrates as well as square shapes like Cr masks. 　◎ Max size: Φ20mm, 6 inches square. ■ The basic processing sequence is "detergent/scrub ⇒ DIW two-fluid ⇒ front and back rinse ⇒ spin dry." 　◎ Scanning rotation function is standard during scrubbing and two-fluid processing. 　◎ Excellent particle removal performance with the DIW two-fluid tool. 　◎ Choose between nylon brush or PVA brush depending on the substrate surface condition. ■ Options available for <automatic detergent dilution unit> and <CO2 ionizer>. *For more details, please refer to the PDF document or feel free to contact us.*

• Other cleaning machines

■Supports ultra-large heavy substrates of the G8.5 generation. 　◎Supported substrate size: 1.3m X 1.5m X 15mm t ■Compatible with the integrated processing of the photolithography process. 　◎Processing steps: LD ⇒ Development ⇒ Etching ⇒ Stripping ⇒ Cleaning ⇒ ULD ■We have multiple units in operation from various domestic manufacturers. *For more details, please refer to the PDF document or feel free to contact us. Sheet-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, cleaning equipment, resist, photoresist, photolithography process, organic EL, surface treatment, wafer stripping equipment, wafer cleaning equipment, wafer cleaning machines.

• Photomask

This is an introduction to our large substrate resist coaters. It is a resist spin coat unit designed for large substrates. In addition to airflow control within the chamber, it excels in maintainability, and we can also offer models equipped with automatic transport systems suitable for large substrates. *For more details, please refer to the PDF materials or feel free to contact us.

• Photomask

This is an introduction to our small resist coater. Resist coating material is applied to glass substrates using a spinner. We pay attention to airflow control within the chamber and maintenance, allowing for optimal acceleration selection based on the viscosity of the resist coating material. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, coating and developing equipment, spin cleaning equipment, spin coater, semiconductor manufacturing equipment, resist coating equipment, coating equipment, coating uniformity, low price, photolithography process, batch substrate cleaning machine, batch spin cleaning machine, surface treatment, wafer cleaning equipment.

• Photomask

■We boast a 90% market share in the domestic mask manufacturing industry. ■Ideal for "post-polishing cleaning," "incoming cleaning," and "final cleaning." ■We have extensive experience in "removing resist adhered during contact exposure" for device manufacturers. ■These are standard devices categorized by substrate size, but custom solutions are also available. ■The basic processing sequence is "detergent/scrub ⇒ DIW2 fluid ⇒ front and back rinse ⇒ spin dry." 　◎The scrub and two-fluid processing feature a standard scan rotation function. 　◎Excellent particle removal with the DIW2 fluid tool. 　◎Scrub brushes can be selected based on the substrate surface condition: nylon brush or PVA brush. ■Various options are available to meet diverse needs. 　◎<Automatic dilution of detergent><Self-ultrasonic cleaning of brushes><CO2 ionizer><MS cleaning> ■We have extensive experience in handling automatic transport processing devices for substrates. *For more details, please refer to the PDF document or feel free to contact us. Sheet-type cleaning devices, coating and developing devices, substrate cleaning devices, spin cleaning devices, semiconductor manufacturing devices, semiconductors, resist stripping devices, megasonic cleaning devices, cleaning devices, resist, photoresist, photolithography process, mask cleaning devices, wafer cleaning devices.

• Other semiconductor manufacturing equipment

- Suitable for various WET processes such as etching, RCA cleaning, and developing. - A full process of "chemical solution ⇒ rinse ⇒ drying" is handled in a single chamber with Dry-In/Dry-Out. - Conventional method: 2-chamber configuration (the substrate remains in contact with the chemical solution during transfer between chambers). - New method: UDS type uses a 1-chamber configuration. - Basic operation of the substrate: - "Upper section… Substrate LD" ⇒ "Lower section… Chemical treatment" ⇒ - "Middle section… Rinse drying" ⇒ "Upper section… Substrate ULD" - The patented isolation plate ensures the concentration of the chemical solution during reuse. - There is no dilution from rinse water contamination. - For example, it can accommodate "Lower section… SPM treatment" and "Middle section… APM/MS." - The patented isolation plate completely separates and prevents the scattering of chemical gases and mists in the lower treatment section. - Chemical solution/rinse treatment can be performed on the backside of the substrate, ensuring it is contamination-free. - Shortening the manufacturing process significantly increases production efficiency and can greatly reduce cleanroom occupancy area. - A seamless process of etching ⇒ stripping is possible within a single system device. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment

■Rich track record in lift-off and organic peeling processes ■Capable of building systems with wide process margins according to various substrate conditions ■Simultaneous mounting of various peeling/lift-off tools possible Tool selection and combined use possible based on substrate conditions (type/process, etc.) ◎<BLT-type ultrasonic><Horn-type ultrasonic><High-pressure jet><Chemical two-fluid><Multi-spray> ■Equipped with <BLT-type ultrasonic> for low-damage, general-purpose substrate ultrasonic processing ◎BLT-type ultrasonic: Frequency = 38KHz, Vibration amplitude = less than 1μ (P-P) ■Capable of mounting ultra-high amplitude <Horn-type ultrasonic> suitable for robust resist peeling/lift-off ◎Horn-type ultrasonic: Frequency = 38KHz, Vibration amplitude = Max 20μ (P-P) ■Conducting highly uniform ultrasonic processing ◎Standing wave irregularities... theoretically impossible (ultrasonic processing with only direct waves) ◎Irregularities within the ultrasonic vibration surface... strong/weak irregularities above the element (strong) and between elements (weak) are resolved by <substrate rotation> and ultrasonic <scan optimization> ■Application development for burr removal and cleaning after polishing has been implemented *For more details, please refer to the PDF document or feel free to contact us.

• Semiconductor inspection/test equipment

■ Optimized for mass production sites as "post-CMP and post-polishing cleaning," "incoming cleaning," and "final cleaning" ■ Capable of handling "resist removal" adhered during mask contact exposure ■ Proven performance with a 2-chamber configuration supporting 1.8 minutes per sheet ■ Options available for "inversion function," "brush pressure setting function," "CO2 ionizer," etc. ■ High-pressure jet and DIW two-fluid systems address bevel area contamination ■ Basic concept is contamination-free on the backside ◎ Vacuum chucks are generally not used due to contamination at the contact area ◎ Backside rinse function is standardly equipped. * For more details, please download the PDF document or feel free to contact us. * Please also refer to the catalog for similar models of "photo mask cleaning machines." Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductor, resist stripping equipment, megasonic, substrate cleaning equipment, cleaning equipment, resist, photoresist, photolithography process, silicon, scrub cleaning equipment, scrub cleaning, wafer cleaning equipment, wafer cleaning machines, transport equipment.

• Other physicochemical equipment

- Ideal for etching and cleaning processes. - Chemical treatment is done using a spin method, and rinse drying is done using a conveyor method. - Proven track record of high throughput support with W-lane configuration. - Measures against hazardous corrosive gases during etching: ◎ Equipped with front and rear shutters and rollers in the spin chamber. - Features temperature control circulation and reuse function for chemicals, as well as concentrated/diluted separation function for wastewater. - Swing spray function during rinsing can also be installed. - Up and down air knife drying designed to prevent reattachment of rinse water splashes. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic, cleaning equipment, resist, photoresist, photolithography process, silicon, scrub cleaning equipment, scrub cleaning, wafer stripping equipment, wafer cleaning equipment, wafer cleaning machine.

• Ultrasonic Cleaner

■ We recommend the latest model of the UDS spin processor. 　◎ It is positioned as the "OLD" system within our company. 　◎ Please refer to the new UDS spin processor and the new Spin Dip processor. 　◎ All various elemental technologies related to spinning, such as mixing and rotational speed control, have been developed and applied to the new spin processor. ■ Optimal for RCA processing such as SPM, APM, HPM, and DHF. ■ Supports etching processes like ferric chloride and HF/HNO3. ■ Also compatible with lift-off resist stripping. ■ Can build a cost-effective system as a conventional flat Spin single wafer. ■ Ideal for the disposal of chemical waste. ■ Cross-contamination free. 　◎ During SPM processing, mixing of new sulfuric acid and hydrogen peroxide is done directly above the substrate, eliminating the need for a heater. 　◎ During APM processing, DIW is heated directly with water, and NH4OH and H2O2 are mixed in. ■ Optimal for processing Si, SiC, GaN, sapphire, GaAs, LT, etc. ■ Compatible with round substrates as well as square shapes like Cr masks. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

■ Effective for etching pre-treatment, resist removal pre-treatment, post-stripping cleaning, and adhesion pre-treatment, etc. 　◎ Etching pre-treatment… Hydrophilization, improved uniformity 　◎ Resist removal pre-treatment… Removal of the hardened surface layer of the resist 　◎ Post-stripping cleaning… Removal of trace resist residues 　◎ Adhesion pre-treatment… Increased adhesion strength by removing organic substances ■ Breaks molecular bonds with high photon energy ■ No discharge or damage to substrates or device patterns ■ Instant on/off capability ■ Mercury-free and environmentally friendly ■ Minimal use of N2 * The catalog will be disclosed soon.

• Other physicochemical equipment