List of For Techies products
- classification：For Techies
631～675 item / All 4715 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
![[Technical Seminar] Medical Device ...](https://image.mono.ipros.com/public/product/image/2008760/IPROS3524099235809872882.png?w=280&h=280){kind=small}
Learn from over 500 consultation achievements: Regulatory affairs and QMS during new market entry, development processes, exit strategies, and common pitfalls.
- Technical Seminar
From the principles of generation to measurement evaluation and practical examples. An introductory and practical seminar to systematically learn about fine bubble technology.
- Gas Generator
- Water treatment equipment
- Technical Seminar
An integrated strategy that governs the physical constraints of AI infrastructure!
- Technical and Reference Books
Systematically acquire semiconductor packaging technology from the basics. Learn about quality control and the latest packaging trends in one day.
- Technical Seminar
- Other semiconductor manufacturing equipment
- Other semiconductors
The forefront of plastic and fiber recycling. An explanation of resource circulation, separation and re-resource technology for difficult-to-recycle materials, and the utilization of biomass.
- Other environmental measures and recycling
- Plant-based plastics
- Technical Seminar
Understanding industrial reorganization and profit structure through Control Point and Control Plane!
- Technical and Reference Books
- Other medical supplies and cosmetic manufacturing materials
Five days of practical training at an actual battery factory! Acquire factory-level manufacturing techniques from slurry adjustment to coating, stacking, cell assembly, and initial charging.
- Secondary Cells/Batteries
- Lithium-ion battery
- Technical Seminar
Please make great use of it as a place for information gathering, business negotiations and sales promotion, mutual exchange, and human resource development!
- Technical Seminar
- Seminar
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Japan Bo Pixel Product Comprehensive Catalog
[Latest] Japan Bo-Pixel Product Comprehensive Catalog [2025.08.A] You can download it from the bottom of this page > Related Catalogs. ■ Japan Bo-Pixel's CoaXPress Cameras High-speed and high-resolution, yet compact and fanless CoaXPress cameras. By adopting "next-generation key devices," we are addressing the traditional issue of heat generation, leveraging the advantages unique to latecomer manufacturers to take a new approach. [Contents] ■ CoaXPress Area Scan Camera ■ CoaXPress Line Scan Camera ■ CameraLink ■ 3D Camera ■ DLP Projector *For detailed information and specifications, please contact us.
[Exhibition at Nepcon Japan 2026] CoaXPress camera that does not require a fan or heat sink. With a low heat generation design, you no longer have to worry about heat management.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Japan Bo Pixel Product Comprehensive Catalog
[Latest] Japan Bo-Pixel Product Comprehensive Catalog [2025.08.A] You can download it from the bottom of this page > Related Catalogs. ■ Japan Bo-Pixel's CoaXPress Cameras High-speed and high-resolution, yet compact and fanless CoaXPress cameras. By adopting "next-generation key devices," we are addressing the traditional issue of heat generation, leveraging the advantages unique to latecomer manufacturers to take a new approach. [Contents] ■ CoaXPress Area Scan Camera ■ CoaXPress Line Scan Camera ■ CameraLink ■ 3D Camera ■ DLP Projector *For detailed information and specifications, please contact us.
No need for heat sinks or cooling fans! Contributes to space-saving in monitoring systems.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
No need for heat sinks or cooling fans! Contributes to space-saving in signal systems.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
We exhibited at NEPCON Japan 2026 (digest version materials available).
◇◆We exhibited at the 40th InterNepcon Japan◆◇ ーーーーーーーーーーーーーーーーーーーーーーーーーー Thank you for your continued support. This is Japan Bopixel. The "40th InterNepcon Japan," held from January 21 to 23, recently concluded successfully. We sincerely thank everyone who visited us. 【Highlights of this exhibition】 - 105MP/245MP ultra-high-resolution sensor-equipped CoaXPress area scan cameras - 10MP/14MP/21M ultra-high-speed CoaXPress area scan cameras - 8k TDI 1MHz CoaX over Fiber 100G line scan cameras - 2k & 4k CoaXPress line scan cameras ▼ You can download the PDF materials of the new products introduced at the exhibition from the "Related Materials" section at the bottom of this page. Related Materials > Exhibition Digest_Japan Bopixel.pdf We also welcome requests for individual explanations! Please feel free to contact us. Japan Bopixel Corporation, Sales Department
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
A business model that provides a "place" where people with various needs and seeds from industry, academia, government, and finance both domestically and internationally can gather!
- Technical Seminar
- Seminar
Technical Documentation Collection for Electrode Plate Manufacturing
- Technical and Reference Books
Updated version of the two-year data report on positive reviews (re-evaluating the impact of the COVID-19 pandemic)
- Technical and Reference Books
Chemical materials and process technologies such as binders in the manufacturing process of electrode plates.
- Technical and Reference Books
The latest version with a significant update on the impact of COVID-19 and future outlook.
- Technical and Reference Books
A systematic explanation from the basics of Cu/ZnO-based catalysts to CO₂ hydrogenation, reactor design, and green methanol.
- Chemicals
- Energy efficient utilization system
- Technical Seminar
A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!
- Technical and Reference Books
- Other semiconductors
- Technical and Reference Books
11/5 Webinar: Basics of Semiconductor Packaging and Quality Control
■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors
![[Book] Hydrogen Production and Its ...](https://image.mono.ipros.com/public/product/image/536/2000743760/IPROS81235308075844465306.jpeg?w=280&h=280){kind=small}
[Available for preview] ★ Latest examples of catalyst, cell, and equipment development aimed at improving efficiency and reducing costs in green hydrogen production!
- others
- Technical and Reference Books
- Technical and Reference Books
[Book] Hydrogen Production and Its Transportation, Storage, and Utilization Technologies (No. 2172) [Available for Preview]
★ Latest examples of catalyst, cell, and equipment development aimed at improving the efficiency and reducing the cost of green hydrogen production! ★ Business opportunities arising from the establishment of large-scale supply chains and the utilization of hydrogen! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Research and Development Trends and Policy Directions Toward a Hydrogen Society Chapter 2: Hydrogen Production Technologies and Their Equipment and Material Technologies Chapter 3: Hydrogen Transportation, Storage Technologies, and Supply Chain Development Chapter 4: Design and Measurement Technologies for Hydrogen Storage Tanks and Piping Chapter 5: Initiatives for Hydrogen Utilization and Their Future Outlook －－－－－－－－－－－－－－－－－－－－－ ● Published: September 30, 2022 ● Format: A4, 603 pages ● Authors: 59 individuals ● ISBN: 978-4-86104-899-9 －－－－－－－－－－－－－－－－－－－－－
Clearly introduces the limitations of liquid systems and the challenges of all-solid systems through abundant charts and point explanations based on mechanism of action and model calculations.
- Technical and Reference Books
Providing "seeds" of inspiration for readers as a collection of "x/z EV business materials."
- Technical and Reference Books
Explaining the essential thermal management for improving performance, energy efficiency, comfort, and safety.
- Technical and Reference Books
Explanation of requirement characteristics, issues, and countermeasure technologies from the basics to the latest trends.
- Technical and Reference Books
![[December Seminar] Basic Electrical...](https://image.mono.ipros.com/public/product/image/312172/IPROS15540657988288511321.jpg?w=280&h=280){kind=small}
- To deepen understanding by actually handling electrical equipment, the number of participants is limited, and it includes plenty of "hands-on exercises with real devices" - for those outside the spe...
- Technical Seminar
Latest Trends in Wet/Dry Etching and Post-Etching Technologies
- Technical and Reference Books
Published 10 years after the preface "Membrane Separation Technology in Energy and Chemical Processes."
- Technical and Reference Books
An easy-to-understand explanation of the latest trends in PFAS regulations, which are being strengthened globally!
- Technical and Reference Books
- Other semiconductors
11/5 Webinar: Basics of Semiconductor Packaging and Quality Control
■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors
Reconstructing the value chain through the lens of employment conditions, environmental regulations, and certifications!
- Technical and Reference Books
Cooling, water treatment, location, Digital Twin, and market outlook for 2035 in the era of water constraints!
- Technical and Reference Books
![[Seminar] Understanding the Require...](https://image.mono.ipros.com/public/product/image/251391/IPROS2443264465005456492.PNG?w=280&h=280){kind=small}
On December 7, leading experts from Germany will thoroughly explain the main changes from the old machinery directive and specific measures for cybersecurity requirements.
- Technical Seminar
[Seminar/Training] [Latest Trends] Understanding the Requirements of the EU Machinery Regulation (2023/1230) and Cybersecurity Practical Compliance Guide
The EU Machinery Regulation (EU Machinery Regulation 2023/1230) is a comprehensive legal framework aimed at ensuring the safety, reliability, and compliance of machinery placed on the EU market. Established in June 2023, it will fully apply from January 20, 2027, as a new regulation replacing the previous EU Machinery Directive (2006/42/EC). This seminar will clearly explain important topics faced in practice, including key amendments in the new regulation, digitalization and cybersecurity (such as Annex III 1.1.9), and safety requirements for AI and autonomous systems. < Seminar Topics > - Part 1: Overview of the EU Machinery Regulation (2023/1230) and key changes from the old directive (2006/42/EC) - Part 2: Safety requirements and responses to cybersecurity and new technologies - Part 3: Practical aspects of conformity assessment procedures and technical documentation (TCF) - Part 4: Practical roadmap and case studies for entering the European market
![[Seminar] IATF 16949 Internal and S...](https://image.mono.ipros.com/public/product/image/251391/IPROS14383599808342287714.PNG?w=280&h=280){kind=small}
Recommended seminar for those considering skill enhancement and competency maintenance for IATF 16949:2016 internal auditors and second-party auditors, held on December 1st.
- Technical Seminar
IATF 16949 Rules 6th Edition Certification Structure Optimization Seminar - Changes in IATF Rules 6 That You Will Regret Not Knowing
With the issuance of the IATF Rules 6th Edition, the concepts regarding multi-site certification, corporate schemes, remote support locations (RSL), and extended sites have been reviewed. These changes are not merely rule modifications; they have the potential to reduce audit man-hours and certification maintenance costs by optimizing the certification structure. On the other hand, many companies continue to maintain their traditional certification structures and are not fully utilizing the benefits of the rule changes. In this seminar, we will explain how to streamline the certification structure by utilizing the new concepts recognized in the Rules 6th Edition, including: - Utilizing extended sites - Optimizing remote support locations - Reviewing corporate schemes (redesigning multi-site configurations) We will provide examples to illustrate these points. This seminar is recommended for: - Automotive industry suppliers with multiple factories - Organizations that have multiple registered sales offices, etc. - Those considering a review of certification maintenance costs and audit man-hours - Individuals who want to understand the changes in the Rules 6th Edition from a practical perspective.
![[Seminar] JC-STAR Level 1 Applicati...](https://image.mono.ipros.com/public/product/image/251391/IPROS14948709653097941850.PNG?w=280&h=280){kind=small}
Seminar on systematically learning the structure, technical requirements, and evaluation methods of JC-STAR held on November 18.
- Technical Seminar
[Seminar/Training] Security Labeling System (JC-STAR) Level 1 (★1) Application Practice Seminar
With the spread of IoT products and the increasing security risks, Japan has launched the IoT product security labeling system "JC-STAR," operated by the IPA. This seminar will clearly explain the overview of JC-STAR in harmony with international standards, the application procedures for obtaining ★1, and key points regarding technical requirements and evaluation methods. TÜV SÜD Japan, a registered organization certified by the Ministry of Internal Affairs and Communications and a JC-STAR verification provider, will provide useful knowledge from application preparation to acquisition based on its experience in third-party evaluations. <Seminar Topics> - Overview and objectives of the JC-STAR system - Steps and necessary documents from application to label issuance - Details of technical requirements and the underlying concepts - Specific processes and key points of the evaluation method - Common application mistakes and how to avoid them
![[Technical Seminar] Identifying and...](https://image.mono.ipros.com/public/product/image/2008760/IPROS1736491160973720006.png?w=280&h=280){kind=small}
Transforming 'good research seeds' into projects that can be adopted by pharmaceutical companies.
- Technical Seminar
From microwave ovens to high-temperature heating furnaces! A thorough explanation of the basics and applications of microwave heating, equipment design, problem-solving, and chemical reactions.
- Heating device
- Microwave Reactor
- Technical Seminar