List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
676～720 item / All 5103 items
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
![[Device Production Example] Film Fo...](https://image.mono.ipros.com/public/product/image/2063560/IPROS14926181795092471963.jpg?w=280&h=280){kind=small}
From design to after-service of the equipment! We can offer various equipment proposals.
- Sputtering Equipment
![[Device Production Example] Design ...](https://image.mono.ipros.com/public/product/image/2063560/IPROS6387341858822702427.jpg?w=280&h=280){kind=small}
Support for the entire lifecycle from device design to after-sales service!
- Sputtering Equipment
- Plasma surface treatment equipment
We relentlessly pursue customer satisfaction and technical expertise, contributing to society. We have extensive experience in contract manufacturing for OEMs and prototype machines.
- CVD Equipment
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Under the management philosophy of 'pursuing customer satisfaction and technical expertise to the utmost and contributing to society,' we develop our business.
- Vacuum Equipment
- Evaporation Equipment
- Sputtering Equipment
Using conductive PP! Suitable for prototypes and small-scale transportation, shipping, and storage.
- Racks and Cases
- Other semiconductor manufacturing equipment
- cabinet
Introduced the ROKURO CEGA capable of processing at Φ0.01. Also supports simultaneous 5-axis machining.
- Ion implantation equipment
Round hole filters and honeycomb mesh, etc.! You can create freely shaped designs.
- Etching Equipment
Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.
- Other semiconductor manufacturing equipment
We will be exhibiting at the Kyoto Pulse Plaza, which will be held in Kyoto from February 18, 2026.
This time, Orte Corporation will exhibit at "Kyoto Pulse Plaza" again this year, following our participation in last year's semiconductor exhibition. The latest cutting-edge collets that can only be seen here will be on display! Our specialists in chip transport collets will unveil the latest lineup that solves on-site "troubles"! Be amazed by our rubber collet that achieves a contact width of less than 0.1mm! Of course, we have rubber collets that address ionizer countermeasures, as well as patented holder mechanisms that perfectly accommodate high-aspect and large chips. You will surely find yourself thinking, "This is the collet I wanted!"... We plan to showcase many actual samples! You can actually hold, touch, and experience the performance on the spot. Please come and visit our booth! We are confident that you will definitely think, "I'm glad I came to see this!" 【Exhibition Contents】 - Pickup collets (rubber/plastic/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays)
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
- Other semiconductor manufacturing equipment
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
- Bonding Equipment
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
High-speed line inspection at SWIR 2K×1, 110kHz
- Monochrome camera
- Semiconductor inspection/test equipment
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
The micro heater can be easily wrapped around pipes and can be used even in a vacuum.
- Other semiconductor manufacturing equipment
- Food Packaging Machinery
Various shapes can be produced according to the shape of the heated object. We can manufacture even from just one piece!
- Other semiconductor manufacturing equipment
- Other processing machines
Support yield improvement through pressure management!
- Other semiconductor manufacturing equipment
- Other measurement, recording and measuring instruments
Support yield improvement through pressure management!
- Other semiconductor manufacturing equipment
- Other measurement, recording and measuring instruments
The layout and operability of the NS series remain unchanged, achieving stable low-temperature measurements.
- Tester
- Other semiconductor manufacturing equipment
Full support from FPC design, prototyping, and mass production to board power-on testing, appearance inspection systems, and FA automation! TAIYO FPC SOLUTIONS!
- Semiconductor inspection/test equipment
- Printed Circuit Board
- Circuit board design and manufacturing
Technological capabilities that contribute to the development and practical application of advanced materials.
- Etching Equipment
- Plating Equipment
- Other surface treatment equipment
Equipped with a function to adjust the swing angle! It can maintain an even spray balance!
- Wafer processing/polishing equipment
- Other surface treatment equipment
Design of the arrangement of transport components (rolls) developed independently by our company! Stable transport without corner bends or dents is possible.
- Etching Equipment
Utilizing hydrogen gas, stainless steel bright treatment is possible!
- stainless
- Annealing furnace
- Electric furnace
It is a top-grade fluid transfer solution that achieves visibility and flexibility.
- Piping Materials
- hose
- Other semiconductor manufacturing equipment
Automatically control the specific resistance of ultrapure water to solve static electricity issues in precision cleaning.
- Other semiconductor manufacturing equipment
Compact pressure gauge compatible with the gas supply system integration for semiconductors.
- Other semiconductor manufacturing equipment
- Sensors
High Cost Performance Mixed Signal Tester
- Semiconductor inspection/test equipment
We respond to strict requirements for small lots! Etching processing.
- Etching Equipment
Compact yet professional! Reproducing realistic etching tests with a small amount of liquid.
- Etching Equipment
The film is transported to ensure that the load does not exceed a certain value! This achieves high spray efficiency.
- Etching Equipment
Leave silicon carbide and silicon nitride to JFC.
- Fine Ceramics
- Other machine elements
- Semiconductor inspection/test equipment
Exhibited at the 2017 High-Performance Ceramics Exhibition at Tokyo Big Sight from April 5 to 7.
Thank you to everyone who visited us. We will be exhibiting at the "High-Performance Ceramics Exhibition" held at Tokyo Big Sight in April. At our booth, we will showcase: - A new product that further enhances the fracture resistance of silicon nitride ceramics and improves thermal conductivity. - A new material that does not bend like iron, utilizing the lightweight properties of aluminum, known as "composite materials of metals and ceramics." - "Ceramic substrates" characterized by thin film and film formation technology. If you have any concerns regarding equipment design, component design, thermal design, or anything else, please feel free to stop by our booth for a consultation. We look forward to seeing you.
It is a composite material that combines the lightness of aluminum with the rigidity of steel, low thermal expansion, and excellent heat dissipation due to high thermal conductivity.
- Fine Ceramics
- Other machine elements
- Other semiconductor manufacturing equipment
Exhibited at the 2017 High-Performance Ceramics Exhibition at Tokyo Big Sight from April 5 to 7.
Thank you to everyone who visited us. We will be exhibiting at the "High-Performance Ceramics Exhibition" held at Tokyo Big Sight in April. At our booth, we will showcase: - A new product that further enhances the fracture resistance of silicon nitride ceramics and improves thermal conductivity. - A new material that does not bend like iron, utilizing the lightweight properties of aluminum, known as "composite materials of metals and ceramics." - "Ceramic substrates" characterized by thin film and film formation technology. If you have any concerns regarding equipment design, component design, thermal design, or anything else, please feel free to stop by our booth for a consultation. We look forward to seeing you.
Heat recovery type, low running cost, hot air dryer for painting.
- Other painting machines
- Drying Equipment
- Annealing furnace
Comparison of Grinding Methods
- Wafer processing/polishing equipment
Types and Characteristics of Grinding
- Wafer processing/polishing equipment