List of Semiconductors and ICs products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.

• Other Pumps

GC/MS: Gas Chromatography-Mass Spectrometry

• Contract Analysis
• Memory

AFM: Atomic Force Microscopy Method

• Contract Analysis
• Wafer

You can investigate the changes in degassing intensity while maintaining the temperature.

• Contract Analysis
• Memory

The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).

• Contract Analysis
• Transistor

The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.

• Contract Analysis
• magnet
• Memory

Microscopic structural analysis of amorphous films is possible through simulation.

• Contract Analysis
• Memory

It is possible to confirm the stress distribution in the sample cross-section.

• Contract Analysis
• Wafer

It is possible to evaluate trace metals in ppm orders.

• Contract Analysis
• Ceramics
• Wafer

Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.

• Contract Analysis
• Transistor
• Power storage device

Non-destructive three-dimensional observation of the internal structure of a discrete package.

• Contract Analysis
• Other semiconductors

Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.

• Contract Analysis
• Other semiconductors

Evaluation of microscopic atomic structures is possible through computational simulation.

• Contract Analysis
• Other semiconductors

Reverse engineering of DRAM on the product's internal substrate.

• Contract Analysis
• Memory

It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.

• Contract Analysis
• Memory

It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.

• Contract measurement
• Transistor
• Memory

Simultaneous measurement of inorganic and organic components in minute specific areas.

• Contract measurement
• Wafer
• Memory

We evaluate abnormalities inside the device non-destructively.

• Contract Analysis
• Other electronic parts
• Transistor

Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.

• Wafer
• Contract measurement
• Other semiconductors

Shape observation and simple quantitative analysis using SEM-EDX.

• Contract Inspection
• Wafer
• Other semiconductor manufacturing equipment

It is effective to differentiate between the two methods depending on the surface structure of interest.

• Contract Analysis
• Memory

High-sensitivity analysis of various solutions, such as pure water and wafer cleaning liquids, is possible.

• Contract Analysis
• Wafer
• Water quality testing

It is possible to evaluate the competitive adsorption of multiple molecules using the focus parameters for film formation (temperature, pressure).

• Contract Analysis
• Other electronic parts
• Memory

From semiconductor and LCD manufacturing equipment parts to nursing and welfare equipment parts. MINWA delivers high-precision and high-quality machining.

• Other semiconductors
• LCD display
• Other machine elements

The introduction of the laminated substrate reduces the degradation of the forward characteristics of the body diode!

• diode

The encapsulating materials for advanced semiconductor packages require various characteristics such as low stress, moisture resistance, and high reliability. Guidelines for the design and evaluation ...

• Other semiconductors
• Engineering Plastics
• Technical Seminar

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...

• Other semiconductor manufacturing equipment
• Other semiconductors
• Technical Seminar

Achieve high current while minimizing losses during implementation with Power PKG (HSOP8)!

• Transistor

For thermal management of medium-sized devices. You can specify the ideal length in 1mm increments, without being constrained by the fixed sizes in the catalog, to match the enclosure space.

• Other semiconductors

Knowledge of gain chips useful for research and development. Explanation of features, mechanisms, and how to choose.

• diode

Not constrained by fixed catalog sizes. You can specify the ideal length in millimeters to match thermal design and enclosure space. Additional processing can also be handled in bulk!

• Other semiconductors

I will explain the structure, features, and key points of the application of VCSELs.

• diode

Looking for the appropriate PD. An explanation of the types of photodiodes and their structural characteristics!

• diode

Pin fin heat sink, width 40mm, height 20mm, length 40mm, material: Al99.5.

• Other semiconductors

Square pin fin heat sink, width 50mm, height 25mm, length 50mm, material: Al99.5.

• Other semiconductors

Achieve automation of IC packaging with space-saving design! Inspection equipment capable of high-precision 2D and 3D dimensional measurement.

• Microcomputer

Custom formulations for important applications

• Other semiconductors
• Other medical supplies and cosmetic manufacturing materials

FFKM solutions designed for harsh operating conditions.

• Other semiconductors

For heat dissipation of surface mount packages such as DPAK, D2PAK, and SO-8. Our compact design reliably solves thermal issues in power converters and power supply boards.

• Other semiconductors

We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!

• Other semiconductors

From margin design that protects by looking at temperature to confident design that attacks by looking at heat flow.

• Dedicated IC

Designed for a wavelength range of 760 to 2900 nm with an accuracy of ±10 nm.

• Other semiconductors

QCL optimal for high-precision gas detection using TDLAS.

• Other semiconductors

FP laser with a wavelength of 760 to 6500 nm

• Other semiconductors