List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
586～630 item / All 5103 items
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
It is possible to regrind brooches and reduce purchase costs! We offer a lineup of tools such as uneven end mill grinders, cutting machines, and tap grinders!
- Wafer processing/polishing equipment
- Other processing machines
A super high-resolution camera capable of wide-angle and ultra-high-definition imaging, suitable for various MV applications.
- Monochrome camera
- Color camera
- Semiconductor inspection/test equipment
Minimize the footprint within the device! But with excellent high pressure and flow capacity! Fluororesin valve.
- valve
- Other semiconductor manufacturing equipment
Fluororesin diaphragm valve ideal for abrasive fluids such as slurries.
- CMP Equipment
[Online Exhibition 3/8-3/10] Invitation to Exhibit at the Future of Japanese Manufacturing Exhibition
From March 8 to 10, 2021, we will be exhibiting at the "Future of Japanese Manufacturing" exhibition. Once called a "manufacturing powerhouse," the Japanese manufacturing industry is now facing a crisis due to delays in digital transformation (DX) and other factors, bringing together technologies that will have a significant impact. Mr. Akira Ikegami and Mr. Wang, the chairman of HUAWEI, will also be speakers at the event. This is an opportunity to think together about the "future" of Japanese manufacturing! We look forward to your visit.
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
- Heating device
- Electric furnace
- Annealing furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
We will extend the life of your equipment with bolt-on and coupler-on solutions.
- Sputtering Equipment
- Solenoid Actuators
- Transport and handling robots
TKC Corporation Nagaoka Service Center Opening: We will achieve one-stop device regeneration and prolongation.
In recent years, we have received numerous requests for extending the lifespan of operational equipment. With the advancement of high functionality in both equipment and components, the specialization of repair services has progressed. Along with this specialization, it has become increasingly difficult to provide comprehensive "repairs" through integrated diagnostics and verification. With the establishment of this service center, we will offer one-stop regeneration and lifespan extension through "comprehensive diagnostics of equipment" by our skilled engineers and the "integration of specialized techniques" from partner engineers located nationwide.
This is a formed bellows for vacuum piping, equipped with JIS standard vacuum flanges.
- Other semiconductor manufacturing equipment
- Vacuum Equipment
It is a polishing method that finishes the wrapped processed pear ground into a flat mirror surface.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
![[Polishing Technology] Ultra-Precis...](https://image.mono.ipros.com/public/product/image/54f/2000603990/IPROS83849052596060099439.png?w=280&h=280){kind=small}
From ceramics to metals, glass, and single crystals, we accommodate a wide range of materials! Introducing our processing technology.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
Achievements in the semiconductor industry worldwide, including the United States and Japan. A range of PFA products that contribute with outstanding reliability and purity.
- Other semiconductor manufacturing equipment
The design of the coating die can be done using Excel spreadsheets.
- Coater
- Winding Machine
- Painting Machine
We provide development and design technology for heating furnaces and heating systems with 30 years of experience in drawing furnaces and vitrification furnaces for optical fibers.
- Industrial Furnace
- Electric furnace
- Semiconductor inspection/test equipment
TRU HONE: Extends the lifespan of blades by 50%! Perfectly sharpens the edge of blades in a short time.
- Wafer processing/polishing equipment
Powder agglomeration measures are possible! Custom-made solutions tailored to various requests can also be produced!
- Sputtering Equipment
- Plasma surface treatment equipment
- Other surface treatment equipment
![[Information] Introduction to Produ...](https://image.mono.ipros.com/public/product/image/71117/IPROS2990827484065208279.png?w=280&h=280){kind=small}
Introducing noise control tubes, conductive gaskets, and more! We also offer wiring protection products against chemicals, heat, and wear.
- Other semiconductor manufacturing equipment
- Wiring materials
Significant cost reduction for AI appearance inspection systems!! A starter set that can be introduced more easily, more simply, and in a short period of time.
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
- Inspection fixture
[Seminar Information] Applied Business Fair 2025 in Nagoya
★Business Proposal Ahead of the Curve: Applied Business Fair - Cutting-edge HPC Solutions Supporting Research and Development in the AI Era: "Explaining Applied AI Servers/HPC Products" We will provide a clear introduction to the latest AI servers and HPC solutions offered by Applied, incorporating actual implementation examples and use cases. We will explain the product lineup and selection points that are useful for applications across a wide range of fields. - Latest Business Computer Exhibition We will showcase actual models of cutting-edge computers such as workstations, HPC, and AI servers. - Explanation of the Latest Image Analysis Software 1. 3D Image Analysis Software 'Dragonfly': Ideal for analyzing X-ray CT devices and 3D electron microscope images. 2. 2D Image Analysis Software 'Image-Pro AI': Ideal for analyzing 2D microscope images. - Explanation of AI Visual Inspection Systems We will introduce an innovative solution that allows for no-code in-house development of AI visual inspection in the manufacturing industry. Additionally, we will guide you through the all-in-one system "A eye BOX" for AI visual inspection, which consolidates inspection equipment into one unit, allowing you to see the actual device.
Delta Seal (HNV HELICOFLEX(R) DELTA) achieves ultra-high vacuum! [Standardized for JIS V-groove flanges]
- Sealing
- CVD Equipment
- Etching Equipment
[Standardized for JIS V Groove Flange] Low Tightening Pressure Y 'Ultra High Vacuum Delta Seal' for Semiconductor Field
The Delta Seal (HNV HELICOFLEX(R) DELTA) has two delta-shaped protrusions on the contact side of the cross-section. The delta-shaped protrusions are designed to collapse and disappear during the compression of the outer casing when the flange groove is assembled. The design tightening pressure of the Delta Seal is lower compared to the Helicoflex seal, allowing for replacement with elastomer O-rings. Leak rate: *For circular shapes, 10⁻¹² Pa·m³/sec. (10⁻¹¹ atm·cm³/sec.) *Depends on the quality of the installation side. 【Features】 ■Two delta-shaped protrusions on the contact side of the cross-section ■Achieves ultra-high vacuum ■Has excellent elasticity and can be used at high temperatures ■Can be replaced with elastomer O-rings *For more details, please refer to the PDF document or feel free to contact us.
Achieve high quality, low cost, and mass production with our centerless grinding machine, boasting high production numbers and precision!
- Wafer processing/polishing equipment
- Processing Contract
- others
We will provide the 'electrolytic polishing device,' 'dedicated electrode jig,' and 'electrolytic polishing solution' as a package.
- Other surface treatment equipment
- Wafer processing/polishing equipment
Automatically distill 1ppb grade hydrochloric acid, hydrofluoric acid, and nitric acid to 10ppt grade, reducing the procurement costs of high-purity acids.
- Other semiconductor manufacturing equipment
- Distillation Apparatus
We provide fully customized production equipment based on your requests.
- Other semiconductor manufacturing equipment
Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17
■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, more sophisticated material design for encapsulants is required than ever before. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulants. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials
As an automatic device for chemical polishing of thin glass substrates for LCDs, it is suitable for thinning processes up to the G6 generation.
- Other processing machines
- Etching Equipment
- Other surface treatment equipment
We equip our company with processing machines tailored to our know-how! This allows us to provide highly reliable products to our customers.
- Wafer processing/polishing equipment
Introducing various application notes for semiconductor strength testing, surface inspection, environmental testing, and more.
- Wafer
- Semiconductor inspection/test equipment
- Other semiconductors
Leakage Current Circuit Breaker 【LCB 15mA 100V 15A PSC AAM A】
- Tester
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No need to change the size or number of existing bolts? A must-see for those struggling with "wanting to eliminate gas permeation and gas release from vacuum rubber O-rings" in semiconductor manufactu...
- Sealing
- CVD Equipment
- Electron beam lithography equipment
If you want to eliminate gas permeation and gas release with a vacuum rubber O-ring, replace it with a spring-energized C-ring! 'Delta Beta HNRV'
The Delta Beta HNRV is originally designed with a low tightening pressure (Y) HELICOFLEX Delta seal combined with a specially processed internal spring, achieving replacement of rubber O-rings and improved performance. This metal seal is recommended for those who have concerns such as "wanting to eliminate gas permeation and gas release from rubber O-rings" and "unable to change the number or size of bolts on existing flanges." 【Features】 ■ Mainly for ultra-high vacuum use ■ Even lower design tightening pressure than before ■ Can be exchanged with elastomer O-rings ■ Two delta-shaped protrusions on the contact side of the cross-section It does not guarantee compatibility with existing flanges. Specifications for existing flanges are required. *For more details, please download the PDF or feel free to contact us.
High corrosion-resistant and durable rollers suitable for the etching process.
- Etching Equipment
A 3D spray coater that can be applied to any 3D shape. It reads the substrate shape with a laser scanner and automatically generates the application path.
- Coater
Resist coater for cover glass integrated touch panel (OGS)
- Resist Device
Sintering device equipped with a patented micro punch press. Capable of sintering dies of different heights and substrates of various shapes.
- Other semiconductor manufacturing equipment