List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
271～315 item / All 5261 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
- Other semiconductor manufacturing equipment
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Supports high-speed semiconductor inspection and long-distance wiring. High resolution and high frame rate.
- Semiconductor inspection/test equipment
![[Printing Industry] Ultra High-Spee...](https://image.mono.ipros.com/public/product/image/2034982/IPROS11709385356860154695.png?w=280&h=280){kind=small}
Accelerate the quality check of printed materials. Supports high resolution and long-distance transmission.
- Semiconductor inspection/test equipment
No damage to the substrate! A vacuum deposition device capable of ultra-low temperature sputtering.
- Sputtering Equipment
Four types of products are lined up: CB type, VD type, CSH type, and SP type!
- Wafer processing/polishing equipment
- Other surface treatment equipment
- Other painting machines
Ideal for the automation of high-precision polishing processes, deburring, chamfering, and mirror finishing! Supports specification selection according to work size and production volume!
- Wafer processing/polishing equipment
- Other surface treatment equipment
We will be exhibiting at JIMTOF2026.
Dear Sir/Madam, I would like to express my congratulations on the continued prosperity of your esteemed company. I sincerely appreciate your exceptional support. We will be exhibiting at JIMTOF2026. Focusing on the aerospace and power generation sectors, we will showcase the latest technologies, including high-precision processing of difficult-to-machine materials for aircraft engine components and power generation equipment, as well as production efficiency technologies for EVs and next-generation mobility. We kindly invite you to visit our exhibition booth and view our displays.
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
We propose a custom-made dispenser that fulfills your ideals.
- Other semiconductor manufacturing equipment
Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.
- Other semiconductor manufacturing equipment
Notice of Exhibited Products and Events for Nepcon Japan 2024
We are pleased to announce that Shinwa will be exhibiting at the Internepcon Japan, which will be held from January 24 to January 26. Date: January 24 (Wed) - January 26 (Fri) 10:00 AM - 5:00 PM Location: Tokyo Big Sight, East Hall 1 Booth Number: [E4-8B] At our booth, we will be showcasing the newly redesigned dispenser device "Quspa-LX" for the first time. You will be able to see a demonstration. Additionally, we will introduce the TXC Corporation's crystal oscillators, which hold the number one global market share, and the CMOS camera modules for automotive applications from the Foxconn Group. On January 25 (Thu), the famous YouTuber Monozukuri Taro will be appearing at our booth! He will clearly explain the appeal of our new products. There will be two sessions on that day, so don't miss this opportunity! Morning: 11:00 AM Afternoon: 3:00 PM We look forward to seeing you there. Please note that pre-registration is required for entry to Internepcon Japan this year. If you have not registered, please do so via the link.
Heat recovery type, low running cost, paint drying oven.
- Other painting machines
- Drying Equipment
- Annealing furnace
Dryer Dry Tech Price Information Public Site Now Available
We have launched a price information website for the painting-specific dryer, Drytech. The site features product information and sizes focused on standard models of Drytech, both front and single-door types, as well as custom products and options, including performance and price information. We have disclosed price information to facilitate a quicker process from consideration and decision-making to implementation. Please make use of it.
Heat recovery type, low running cost, hot air dryer for painting.
- Other painting machines
- Drying Equipment
- Annealing furnace
CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.
- Other semiconductor manufacturing equipment
- Annealing furnace
- CVD Equipment
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
High-durability PTFE hoses achieve both high flexibility and durability through a fine wave PTFE structure. They are suitable for chemical supply lines and movable piping sections in semiconductor man...
- hose
- Other semiconductor manufacturing equipment
- Etching Equipment
Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
- Bonding Equipment
Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.
- Bonding Equipment
Equipped with two chromatic confocal line sensors. Achieves high-speed and high-precision dual-side thickness analysis at 2×384,000 data points per second.
- Bonding Equipment
Achieves high-resolution 3D optical measurement within a maximum range of 350×350mm². Supports extensive surface analysis with six types of sensor technologies.
- Bonding Equipment
Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.
- Bonding Equipment
From RF solutions to repair and refurbishment. FNS supports semiconductor manufacturing as a whole.
- Other semiconductor manufacturing equipment
![[Hot Stage] Ultra High Temperature ...](https://image.mono.ipros.com/public/product/image/671/2000002653/IPROS21404174246949592221.png?w=280&h=280){kind=small}
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
- Sputtering Equipment
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.
- Bonding Equipment
It is a high-precision top-hat beam shaper that is not limited to specific wavelengths, thanks to a smooth aspheric lens.
- Electron beam lithography equipment
Small-scale test coater for material development using RtoR (Roll-to-Roll) technology.
- Coater
Ideal for precise application of high-viscosity thermal conductive gel materials!
- Other semiconductor manufacturing equipment
- dispenser
Continuously measure the target circuits of the material supply process. By comparing production plans, material changes, setup, work records, and current history, you can confirm usage trends.
- Sensors
- Other semiconductor manufacturing equipment
- Instrumentation and Control Systems
Collect simple measurement data from multiple single-phase three-wire and three-phase three-wire circuits. Organize it by line, equipment group, and period, and it can be confirmed on a common screen.
- Sensors
- Injection Molding Machine
- Other semiconductor manufacturing equipment
Total solution provided from equipment development stage to line operation! Operates stably in a light noise environment.
- Other semiconductor manufacturing equipment
Compare the use of existing PLCs, small-scale cloud solutions, and centralized management through monitoring software. You can choose a configuration that matches the scale of implementation, verifica...
- Other machine tools
- Other processing machines
- Other semiconductor manufacturing equipment
Options to prevent stoppage in the subsequent processes that cannot be halted.
- Other semiconductor manufacturing equipment
Explanation of specialized terms in grinding and polishing.
- Wafer processing/polishing equipment
PUR hot melt applicator
- Molding Equipment
- glue
- Other packaging machines
![[Leak Detection] An algorithm for n...](https://image.mono.ipros.com/public/product/image/315214/IPROS12853703792727575734.PNG?w=280&h=280){kind=small}
[Leakage Prevention] Not a single drop of leakage will be overlooked without touching. Move to liquid leakage monitoring without tape.
- Business Intelligence and Data Analysis
- Other measurement, recording and measuring instruments
- Other semiconductor manufacturing equipment
Information on Exhibiting at the Hokkaido Business EXPO 2026
We are pleased to announce that we will be exhibiting at the "Hokkaido Business EXPO 2026," which will be held at Access Sapporo from November 5 (Thursday) to November 6 (Friday), 2026. We sincerely invite you to visit us during this opportunity. <Exhibition Overview> Name: Business EXPO "40th Hokkaido Technology and Business Exchange Meeting" Dates: November 5, 2026 (Thursday) 10:00 AM - 5:30 PM November 6, 2026 (Friday) 9:30 AM - 5:00 PM Venue: Access Sapporo <Exhibited Products> ■ Liquid Leakage Detection Algorithm Liquidseeker We will introduce a technology that detects liquid leakage non-contact, which eliminates disconnections and peeling compared to traditional leak detection tape, contributing to reduced maintenance costs.
You can monitor the equipment and conditions in the factory in real time!
- Other semiconductor manufacturing equipment
Achieving both high purity and high yield. Contributing to the purification of semiconductor materials.
- Other semiconductor manufacturing equipment
- Refining and Extraction Equipment
- Organic EL
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
- Annealing furnace
- Heating device
- Electric furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)