List of Semiconductor Manufacturing Equipment products
- classification:Semiconductor Manufacturing Equipment
271~315 item / All 4974 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools

Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
Full package of RO + EDI! Environmentally friendly pure water system (pure water production system)
- Other semiconductor manufacturing equipment
- others
Easily in places where pure water is needed!
- Other semiconductor manufacturing equipment
Precision temperature control, cleanroom manufacturing. Heaters supporting next-generation semiconductors.
- Heating device
- Other heaters
- Other semiconductor manufacturing equipment
No soldering required. The new standard for cooling plates.
- Other semiconductor manufacturing equipment
Solving Gas Solidification Troubles! Case Study of Temperature Improvement Using High-Performance Mica Heaters
- Heater
- Other heaters
- Other semiconductor manufacturing equipment
We safely treat harmful exhaust gases emitted from devices that cannot release them into the atmosphere. We also design treatment agents based on on-site analysis of exhaust gas components.
- CVD Equipment
- Plasma surface treatment equipment
- Gas recovery/treatment equipment

We will exhibit at SEMICON Japan 2021 Hybrid from December 15 (Wednesday) to 17 (Friday), 2021.
Bashokai Co., Ltd. will be exhibiting at 'SEMICON Japan 2021 Hybrid' to be held at Tokyo Big Sight from December 15 (Wednesday) to December 17 (Friday), 2021. This year's theme is to provide safety, security, and stability, contributing to the development of our customers and society. We plan to introduce a wide range of services and equipment, including energy-saving products, covering everything from gas supply to exhaust treatment, both domestically and internationally. [Main Exhibits (Tentative)] ■ Organometallic Compounds - Products from Dockweiler Chemicals ■ Organometallic Compounds - Products from Nouryon ■ Container Shut-off Device "VS / AVS" ■ Gas Supply Systems "Smart Series, TM Series" ■ Exhaust Treatment Equipment "MAK Series", New Products (Reference Exhibit) ■ Yokohama Research Institute ■ Infectious Disease Control Products We sincerely look forward to your visit.
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
- Sputtering Equipment
- Etching Equipment
- CVD Equipment
Providing mass production solutions for high-speed and flexible substrate film deposition applications!
- Sputtering Equipment
- Etching Equipment
The illumination distribution of the exposure light source is within ±5%! A lineup of desktop and standalone models is available.
- Wafer processing/polishing equipment

We will be exhibiting at 'Mecatronics Tech Japan' at Port Messe Nagoya from Wednesday, October 22 to Saturday, October 25, 2025.
We will be exhibiting at "Mechatrotech Japan" to be held at Port Messe Nagoya from October 22 (Wednesday) to October 25 (Saturday), 2025. We sincerely look forward to your visit. Event Period: October 22 (Wednesday) to October 25 (Saturday) 10:00-17:00 *On the final day, October 25 (Saturday), it will be open until 16:00 Venue: Port Messe Nagoya Booth: 3B47 (Hall 3) Exhibits this time: ● Mobile collaborative robot "AGBOT" ● Visual inspection with robot "EYESBOT" ● Deburring finishing system "Bari-Motion" ● High-performance stepping servo "Si servo3"
We offer sizes of 4 inches and 8 inches! It has high versatility compatible with round and square samples.
- Other semiconductor manufacturing equipment

We will be exhibiting at 'Mecatronics Tech Japan' at Port Messe Nagoya from Wednesday, October 22 to Saturday, October 25, 2025.
We will be exhibiting at "Mechatrotech Japan" to be held at Port Messe Nagoya from October 22 (Wednesday) to October 25 (Saturday), 2025. We sincerely look forward to your visit. Event Period: October 22 (Wednesday) to October 25 (Saturday) 10:00-17:00 *On the final day, October 25 (Saturday), it will be open until 16:00 Venue: Port Messe Nagoya Booth: 3B47 (Hall 3) Exhibits this time: ● Mobile collaborative robot "AGBOT" ● Visual inspection with robot "EYESBOT" ● Deburring finishing system "Bari-Motion" ● High-performance stepping servo "Si servo3"
Simultaneous processing of stainless materials such as SUS316 using CNC lathes and machining centers. Manufacturing high-precision ring parts for semiconductor production.
- Other semiconductor manufacturing equipment
- Processing Contract
Safe even at 1000℃. An insulating material suitable for thermal design.
- Other machine elements
- Other processing machines
- Other semiconductor manufacturing equipment
Flagship model: A handler that thoroughly pursues excellent stability and significant reductions in working time.
- Semiconductor inspection/test equipment
- Circuit Board Inspection Equipment
- Testing Equipment and Devices
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environm...
- CVD Equipment
- Sputtering Equipment
- Resist Device
Pre-treatment for metal structure inspection will be carried out due to surface corrosion caused by chemicals.
- Other services
- Processing Contract
- Etching Equipment
Polishing equipment (Edge Polish) that performs mirror polishing, rough polishing, and cleaning using filtered water and pure water as the medium without slurry.
- Other semiconductor manufacturing equipment
Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.
- Sputtering Equipment
- Etching Equipment
Correction of sensitivity coefficients and sputtering rates across all depths in response to changes in the sample matrix, enabling high-precision depth profile analysis.
- Contract Analysis
- Secondary ion mass spectrometer
- Ion implantation equipment
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
- Sputtering Equipment
- Etching Equipment
Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.
- Sputtering Equipment
- Etching Equipment
Introducing the BAK deposition platform that allows for various chamber sizes and process automation options.
- Evaporation Equipment
A unique LED UV curing solution with numerous patents obtained! Applying UV resin curing in electronics, industry, medical, and optics!
- Other semiconductor manufacturing equipment
- LED Module
- Ultraviolet irradiation equipment

Expanding UV LED products to strengthen response to the growing and diversifying needs for ultraviolet curing.
Excelsius Noble Light Japan Co., Ltd. (Headquarters: Bunkyo-ku, Tokyo, President: Masahiko Suzuki, hereinafter referred to as "the Company") will expand its product portfolio of UV LEDs, one of the light sources for UV curing, and strengthen the provision of UV curing process solutions in new growth areas. In January 2024, the Company was absorbed by Excelsius Technologies, headquartered in the United States (hereinafter referred to as "Excelsius"), and is now handling UV LED products previously managed by its predecessor, Heraeus Noblelight Japan Co., Ltd., and Foseon Technology Japan Co., Ltd., as well as Excelsius. These products encompass a wide range of UV LED light sources for line and area irradiation as well as spot irradiation, regardless of cooling methods. As market demands become increasingly diverse, the Company has established a system that enables more detailed proposals to a broad range of industries through this product expansion.
Process analyzer / Online analyzer for continuous monitoring of hydrogen peroxide concentration in the CMT process!
- Analytical Equipment and Devices
- Semiconductor inspection/test equipment
- Wafer
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
- Analytical Equipment and Devices
- Wafer
- Semiconductor inspection/test equipment
Achieving thin film coating in micrometer units with a coater head (slot coat) application device.
- Coater
Used for temporary fixing and bonding with hot melt adhesive!
- Molding Equipment
OptiSeal VSE is a versatile external pressure face seal. It features low friction, excellent chemical resistance, and can be used in environments ranging from extremely low temperatures to high temper...
- Sealing
- Other machine elements
- Other semiconductor manufacturing equipment
A rod/piston seal compatible with the P-number grooves of JIS B2401, suitable for use in harsh environments. It features low friction and excellent heat and chemical resistance.
- Other machine elements
- Other semiconductor manufacturing equipment
- Sealing
Overwhelming mass production capability at 4000 UPH. Automatic for dynamic, static, and high-temperature conditions.
- Tester
We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!
- Semiconductor inspection/test equipment
- Semiconductors and ICs
- Microcomputer
Quality control of high-purity lithium salts used in various manufacturing processes with an automatic titration device.
- Analytical Equipment and Devices
- Electrotitrator
- Semiconductor inspection/test equipment
Automating the concentration process involving neutralization and matrix removal in ion chromatography to measure impurities in high-purity ammonium hydroxide used in semiconductor manufacturing.
- Analytical Equipment and Devices
- Ion Chromatography
- Semiconductor inspection/test equipment
Processing S45C quenched and tempered steel using high-precision CNC machining technology. Manufacturing ring components for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Processing Contract
Using SUS304 stainless steel and utilizing NC lathes, machining centers, and cylindrical grinding, we manufacture high-precision ring components for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Processing Contract
Measurement of hydrogen peroxide trimethylamine and standard cations for semiconductor manufacturing using ion chromatography.
- Ion Chromatography
- Semiconductor inspection/test equipment
- Analytical Equipment and Devices
A super high-resolution camera capable of wide-angle and ultra-high-definition imaging, suitable for various MV applications.
- Monochrome camera
- Color camera
- Semiconductor inspection/test equipment
A smart test system optimized for mass production screening of silicon photonics.
- Tester
One unit compatible with LIV·EA·spectrum — fully automatic, ultra-high efficiency tester, essential for mass production.
- Tester
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace

□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
- Sputtering Equipment
- Evaporation Equipment
- CVD Equipment

★nano BenchTop Series Thin Film Experiment Device★
Equipped with various conditions necessary to create a highly uniform "high-quality" thin film required in research and development settings. The nano series is a high-performance device that condenses functionality into a compact body. It employs a robust and highly airtight stainless steel chamber that ensures a high vacuum environment and sufficient T/S adjustment distance, which are essential elements for high-quality film formation with minimal defects. Additionally, all models share the IntelliDep software, which allows anyone to operate the system regardless of their level of expertise, thanks to its intuitive and easy-to-understand touch panel interface. 【nano Benchtop Compact Thin Film Experimental Equipment】 ◉ nanoPVD-S10A: RF/DC Magnetron Sputtering Device ◉ nanoPVD-T15A: Organic Film and Metal Film Deposition Device ◉ nanoPVD-ST15A: Mixed Deposition and Sputtering Composite Thin Film Experimental Device ◉ ANNEAL: Wafer Annealing Device ◉ nanoCVD: Graphene/CNT Synthesis Device ◉ nanoEM: High Vacuum EM Coater * For other detailed specifications, please contact us.
Compatible with high aspect ratio TGV/TSV. The world's largest chamber size for ALD (1000mm□).
- Other semiconductor manufacturing equipment
- Plasma surface treatment equipment
- Surface treatment contract service
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
- Annealing furnace
- Heating device
- Electric furnace

【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Handling electronic assembly products such as solder balances and stirrers, as well as soldering equipment and semiconductor devices!
- Soldering Equipment
- Other semiconductor manufacturing equipment