Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
16～30 item / All 37 items
Manual exposure machine compatible with up to 4-inch square substrates.
The ZS Microtech MJB4 is a manual mask aligner (exposure device) that can accommodate substrates up to 4 inches square. It features simple operability, high-precision alignment, and high exposure resolution. It can be used not only for research and development purposes but also for small-scale production.
Achieved fiber optic coupling efficiency of 98%! Collaboration model from Akira Furusawa's laboratory at the University of Tokyo.
The "FA1000S_θ" is a device designed to couple a laser beam propagating in free space into an optical fiber after passing through an aspheric lens, developed with the full cooperation of Professor Akira Furusawa's laboratory at the University of Tokyo. It features a two-axis θ adjustment mechanism that allows for independent adjustment of two orthogonal rotation axes without moving the fiber's entry point from the center of the sphere, thanks to specialized processing technology (spherical gimbal mechanism). This new mechanism simplifies alignment, which was previously very difficult, and ensures long-term stability. 【Features of the θ Axis Adjustment Mechanism】 ■ Spherical Gimbal Mechanism (Patent No. 5888775 granted) - A structure where the fiber's entry point aligns with the center of the spherical rotating element due to specialized processing technology. - The entry point experiences minimal positional shift even when angle adjustments are made. ■ High operability and long-term stability achieved - Adjustment screws use a fine pitch screw with very little backlash of 0.15mm. - Our unique soft lock mechanism provides high holding power after adjustments. *For more details, please download the PDF (English version) or contact us.
Using a 2-phase stepping motor! Compatible with 5, 6, and 8-inch silicon wafer aligners.
The AA2568 is an aligner compatible with 5, 6, and 8-inch wafers. Wafer centering is achieved by clamping the wafer's outer circumference with a polyacetal resin clamp. It allows for suction via a spindle and positioning using a light sensor. It uses a 2-phase stepping motor. 【Features】 ■ Wafer centering: Clamping the wafer's outer circumference with a polyacetal resin clamp ■ Notch positioning: Suction via spindle and positioning using a light sensor ■ Compact and clean body for improved cleanliness ■ RS232C communication control or I/O control *For more details, please refer to the PDF materials or feel free to contact us.
Reduce manufacturing costs with a super simple structure! 4-inch wafer compatible edge grip specification aligner.
The "GA2400" is an edge grip specification aligner that holds the wafer's outer circumference with a PEEK resin clamp. It grips the wafer's outer circumference and allows for positioning using a light sensor. By adopting an extremely simple structure, manufacturing costs can be significantly reduced. Additionally, it uses a 2-phase stepping motor. 【Features】 ■ Wafer centering: Grips the wafer's outer circumference with a PEEK resin clamp ■ Notch positioning: Grips the wafer's outer circumference and allows for positioning using a light sensor ■ Uses a 2-phase stepping motor ■ RS232C communication control *For more details, please refer to the PDF document or feel free to contact us.
Our company's unique multilayer film deposition multi-mirror lamp house-equipped device.
■ Adoption of a multi-mirror lamp house results in a highly uniform illumination distribution. ■ Improved operability with the adoption of various automatic mechanisms, allowing for semi-automatic use. ■ The alignment microscope features a trinocular tube. Alignment via a monitor is also possible (optional).
This is an exposure device that has replaced the light source from a mercury lamp to an LED. It features automatic parallel adjustment, complete non-contact gap management, and auto-alignment functions.
This product is an automatic batch equal magnification exposure device (mask aligner) equipped with a UV-LED light source. One of our features is that it allows for fully non-contact automatic parallel adjustment of the stage and mask for the photomask and wafer. By incorporating a super-precision UVW drive stage and performing high-performance image processing, the alignment of the photomask and wafer is also carried out accurately. It supports exposure methods including proximity, soft, and hard contact. We offer a lineup that matches production volume, from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Compatible with i-line (365nm) and H-line (405nm)! (Please consult us for g-line) ■ Non-contact parallel alignment and exposure of photomask and wafer ■ Auto-alignment function ■ Easy setup change and compatible with multiple substrate sizes ■ Space-saving & easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Equipped with a super-precision UVW stage *For more details, please refer to the PDF document or feel free to contact us.
The illumination distribution of the exposure light source is within ±5%! A lineup of desktop and standalone models is available.
The "BA100/160/200" is a manual double-sided mask aligner that achieves high positional accuracy patterning on both the top and bottom sides. In addition to the desktop models "BA100" for 4-inch wafers and "BA160" for 6-inch wafers, there is also a standalone model "BA200" for 8-inch wafers. Furthermore, the alignment accuracy is ±2μm on the top side and ±5μm on the bottom side. 【Specifications (excerpt)】 ■ Wafer size: 4in/6in/8in ■ Exposure light source intensity distribution: within ±5% ■ Exposure resolution ・Soft contact: L/S 3μm ・Hard contact: L/S 1μm *For more details, please refer to the PDF document or feel free to contact us.
![Laser Belt Aligner [Z5A Belt-Aligner]](https://image.mono.ipros.com/public/product/image/8e9/2001418677/IPROS16636890750032025935.jpg?w=280&h=280)
Laser Belt Alignment Tool
The Z5A Belt-Aligner is a line laser for alignment with a proven track record as a positioning tool for adjusting the position of drive wheels. Based on the battery-operated line laser ZAT series, it fits neatly and securely into a specially designed mounting bracket. The red laser line is emitted precisely parallel to the magnetic contact surface. Equipped with a target marker, it allows for safe alignment of the drive wheel and impeller (fan wheel) while in idle state. [Features] Powered by AA batteries or rechargeable batteries Convenient ON/OFF button Accurately calibrated red line Output power of 5mW Powerful magnetic mount with a holding force of 100N Protection rating IP40
Supports transportation requiring wafer positioning in semiconductor manufacturing equipment, such as inspection devices.
The optical aligner SAL38C2/SAL3361 series is designed to support the positioning of wafers in semiconductor manufacturing equipment and inspection devices that require precise transport. It centers silicon wafers and positions the orientation flat and notch quickly and accurately. It is equipped with a 0.1μm filter on the spindle side, and the control method is RS232C and parallel photo I/O. It achieves approximately 50% reduction in footprint compared to the conventional models SAL46C6 and SAL4484. For more details, please contact us or refer to the catalog.
High-speed, high-precision positioning of silicon wafer centering and Orifla notch.
The SAL46C6 series optical aligner, compatible with 150mm to 300mm, is designed for positioning wafers in semiconductor manufacturing equipment and inspection devices. It achieves high-speed and high-precision centering of silicon wafers and positioning of the orientation flats and notches. The control method uses RS232C and parallel photo I/O. For more details, please contact us or refer to the catalog.
Support for transport requiring positioning of wafers (silicon, GaAs, glass).
The optical aligner SAL4381 series is designed for the positioning of wafers (silicon, GaAs, glass) in semiconductor manufacturing equipment and inspection devices that require precise alignment. It achieves high-speed and high-precision centering and alignment of silicon wafers. A 0.1μm filter is equipped on the spindle side. The control method is via RS232C and parallel photo I/O. Options are available for compatibility with GaAs wafers and glass as well. For more details, please contact us or refer to the catalog.
It is possible to minimize contact with the wafer by adopting an edge grip method.
The 300mm compatible edge grip aligner SAL20C1 series is designed for transport that requires positioning of wafers in semiconductor manufacturing equipment and inspection devices. By adopting the edge grip method, it minimizes contact with the wafer. After notch searching, a repositioning operation is included to move the notch to the specified position. For more details, please contact us or refer to the catalog.
Alignment possible with minimized wafer damage using the Bernoulli method.
The SAL30C1 series optical aligner compatible with 300mm is designed for transporting wafers that require positioning within semiconductor manufacturing equipment and inspection devices. It achieves high-speed and high-precision centering and notching of silicon wafers, enabling alignment of thin wafers. It supports thin, warped, and film-coated wafers, but please inquire about work detection capabilities and positioning accuracy. Alignment is possible while minimizing wafer damage through the Bernoulli method. The control methods are RS232C and parallel photo I/O. For more details, please contact us or refer to the catalog.
A new type of aligner that is not affected by wafer material.
A new type of aligner compatible with various wafer sizes from 100 to 200 mm. It can perform alignment without being affected by wafer materials such as silicon wafers, silicon wafer BG tape (milky white), transparent, and translucent wafers. Utilizing a uniquely developed image sensor, it incorporates a motor driver and controller within the main unit. It is also possible to change the spindle diameter, shape, and material according to wafer size and material. Bernoulli spindles can also be equipped. Control method: RS232C and parallel photo I/O. It is possible to accommodate notches and orifices that are not specified in SEMI standards. Models with a Z-axis capable of wafer re-gripping operations can also be produced.
