Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 80 items
Anodic bonding device
Batch processing achieves low dew point. High-precision alignment can be performed in the atmosphere or in a vacuum. Changing the conditions of the joining atmosphere is easy. Since only the necessary parts are heated, distortion is minimal during joining. There is no variation between rods, resulting in good yield. Automation of operations allows for labor savings.
Surfactant activation bonding device
It can apply a maximum pressure of 1500 kg to an 8-inch wafer and heat it up to a maximum of 1100°C. It is also compatible with ultra-high vacuum.
Surface active bonding device (room temperature bonding). Bonding at low temperatures without using sealing materials!
●This is an optimal system for the development of next-generation MEMS devices and semiconductor packaging. ●It performs high-precision alignment and weight application in ultra-high vacuum. ●It allows for the bonding of dissimilar materials by directly bonding without heating the substrate. ●It is compatible with load lock systems and cluster systems.
![[Comprehensive Catalog] Surface Activation Bonding Device SAB Series](https://image.mono.ipros.com/public/product/image/26f/2000113743/IPROS3080349482417492217.JPG?w=280&h=280)
It can flexibly accommodate changes in sample shape, allowing for various types of bonding experiments, from those that do not use sealing materials to those that can be bonded at room temperature.
We have achieved wafer bonding that provides bulk fracture strength at room temperature. We cater to a range of bonding equipment from research and development to mass production. Our technology is used in a wide variety of fields, including wafer-level packaging and 3D integration. For development purposes, we offer a series of research-grade surface activation bonding devices, ranging from those with focused functions for activation treatment and bonding to those equipped with high-precision alignment and analysis capabilities. For mass production, we provide equipment designed for bonding substrates such as silicon and compound semiconductors after activating the bonding surfaces under ultra-high vacuum conditions. This process allows for bonding at room temperature without the use of sealing materials. For more details, please download the catalog or contact us.
For those interested in joining machines and thermography. You can experience proposals for your concerns and a vision of implementation.
The Solution Center consists of a showroom, seminar room, and webinar room, featuring the joining equipment business and sensing solution business. ◆Showroom In the showroom, you can view solution examples that we propose to customers through displays and videos of products and applications from the joining equipment and sensing solution businesses. It is a space where customers can actually "see," "touch," and "experience," allowing them to more concretely feel our efforts to address their challenges and have a more realistic image of implementation. ◆Seminar Room & Webinar Room ■ Seminars on the basics of joining and infrared technology ■ Introduction of new products and applications ■ Individual consultations with sales and technical staff are also available ◆Access Both the showroom and seminar room are located within our Yokohama office. Address: 2-28-2 Hongō, Seya-ku, Yokohama-shi, Kanagawa 246-0015, Japan Avionics Corporation.
Effective for quality assurance and quality control! Stable metal joining is possible with a highly reliable ultrasonic system.
The "PB500" is an ultrasonic precision metal welder that enables stable metal joining and is particularly suitable for small and compact joints. With a unique load control method using a high-resolution digital scale [PAT-P], it quickly follows the workpiece displacement during ultrasonic joining, efficiently transmitting ultrasonic energy to the workpiece with a constant load. Additionally, the high-rigidity press unit, specifically designed for ultrasonic metal joining, ensures sufficient strength and stabilizes processing quality. [Features] ■ The high-rigidity press unit offers high-speed and high-precision control in the range of 10N to 520N. ■ Equipped with a highly reliable digital ultrasonic generator that achieves stable joining quality. ■ Various ultrasonic oscillation modes are available. ■ The device can be automated to meet user needs. ■ The ultrasonic horn is designed to match the shape and material of the workpiece. *For more details, please refer to the PDF document or feel free to contact us.
For various sensors and micromachines! A compact and economical type suitable for research and development.
The "Anodic Bonding Device" allows for easy bonding of heated silicon substrates and glass substrates by applying high voltage. It is a compact and economical type suitable for research and development, with a small tabletop design for the alignment section. The standard sample size is 4 inches, with an option for a maximum of 6 inches. It can be used for various sensors, micromachines, biomaterials, and various optical applications. 【Features】 ■ Easily bonds heated silicon substrates and glass substrates by applying high voltage ■ Compact and economical type suitable for research and development ■ Small tabletop design for the alignment section ■ Standard sample size is 4 inches, with an option for a maximum of 6 inches *For more details, please refer to the related links or feel free to contact us.
Achieving the joining of metals without melting through the use of ultrasound.
Features of Ultrasonic Metal Welders ● Capable of joining not only the same materials but also different materials. ● Allows for low-temperature joining due to solid-state bonding, resulting in minimal thermal impact on the workpiece. ● Significantly reduces power consumption compared to other joining methods. ● Provides a clean working environment. ● Good electrical conductivity at the joint. ● Fewer consumables involved in the joining process. Product List ● High-power ultrasonic metal joining machine ● Compact ultrasonic metal joining machine ● Compact precision ultrasonic metal joining machine ● Ultrasonic wire bonding machine
![Ultrasonic Metal Joining [*Technical Data Gift*]](https://image.mono.ipros.com/public/product/image/3f1/2000686435/IPROS42479912866989863196.png?w=280&h=280)
A basic explanation of what ultrasound is! Download technical materials that include the principles of ultrasonic vibrations.
This document introduces ultrasonic metal joining. "Ultrasonic metal joining" is a technology that joins overlapping metals using ultrasonic vibrations, allowing for the joining of the same material as well as dissimilar materials such as copper and aluminum. We explain "types of metal joining," "ultrasonic metal joining and ultrasonic metal joining machines," and "joinable materials," among other topics. Please take a moment to read it! 【Contents (partial)】 ■ Types of metal joining ■ What is ultrasound? ■ Principle of ultrasonic vibrations ■ Ultrasonic metal joining and ultrasonic metal joining machines ■ Joinable materials *For more details, please refer to the PDF document or feel free to contact us.
A high-power ultrasonic metal joining machine with a maximum output of 12,000W that enables the connection of thick wire harnesses.
**Features** ■ Maximum output of 12,000W ■ Maximum pressing force of 7,000N Joint management using actual load via load cells. By directly detecting the load value and reflecting it in the joining conditions, it becomes possible to set clear joining conditions, achieving stable quality control. ■ Rack-type oscillator compliant with EIA standards Utilizes vertical space effectively without directly stacking equipment on top of each other. By consolidating related devices, such as control of movable parts of fixtures, maintenance and servicing become easier. ■ High positional reproducibility for efficient setup changes The structure establishes positional reproducibility of the vibration system unit, ensuring safe and reliable setup. Additionally, when fixtures are installed, the workspace for exchanging tool horns tends to become limited. The vibration system unit adopts a rail mechanism that allows for attachment and detachment from either the front or back of the device, facilitating work outside the machine and ensuring efficiency. ■ T-slot structure for fixture mounting base The device features T-slot machining in the front and rear directions, making fixture alignment easier. Furthermore, it is less affected by restrictions from screw positions on the base side, increasing the design flexibility of fixtures.
![First, give it a try!! Ultrasonic metal joining test [Now accepting applications]](https://image.mono.ipros.com/public/product/image/2001549304/IPROS3327695508506233145.jpg?w=280&h=280)
We support the first step of ultrasonic metal joining with a rich lineup and the visualization of processes and results.
We provide a testing environment that meets the diverse needs of our customers. We will guide you to the optimal model based on the material and shape of the workpieces you wish to join. Additionally, we offer a wide variety of horns and anvils, allowing for evaluations that closely resemble actual joining conditions. Furthermore, by utilizing our "Joining Management Software J-Tool," test data can be displayed clearly in tables and graphs. This allows for visualization not only of the joining results but also of various condition changes such as pressure, power, and penetration distance. This enables objective evaluations based on numerical data, facilitating the smooth identification of optimal joining conditions. Whether you want to "test if this material can be joined" or "search for the optimal conditions," please feel free to contact us, whether you are a first-time user or someone who is already considering specific options! Our specialized staff will provide solid support for your manufacturing through verification using actual workpieces.
The astonishing repeatability of processing accuracy achieves quality improvement. We provide an easy-to-understand joining logic (waveform data and parameter settings). Comparisons and evaluations are welcome.
The ultrasonic metal bonding machine 'USDB' is an ultrasonic metal bonding machine that achieves high-speed cycle operation, high-speed data transfer, and high-precision position control. The servo motor press pressure control with a one-axis rigid structure realizes ultra-fine position accuracy and high-speed load tracking, providing stable ultrasonic energy addition and dramatically improving processing reproducibility. The new Ethernet/IP connection simplifies the operation management of automated lines and converts all bonding results into big data. 【Features】 - Processing assembly accuracy, operational precision, and ultrasonic control that ensure the ultrasonic vibration energy during bonding is reliably transmitted to the workpiece. - High reliability in position accuracy (1µm) achieved through the rigidity of the distinctive one-piece frame structure. - Original program that realizes high-speed load tracking (stable load) against load fluctuations during bonding. - Easy setting operations enabled by the simple screen MMI (man-machine interface) with a color touch panel. - Unique ultrasonic control method for applications sensitive to frequency and impedance fluctuations. - Protective circuit program included to prevent failures of the ultrasonic oscillator and servo due to overloads. - Excellent bonding reproducibility that allows for easy reading of processing behavior from bonding data waveforms and performing multiple regression analysis of the data.
![[Processing Report] Joining of Metal and Resin](https://image.mono.ipros.com/public/product/image/a3a/2000387503/IPROS1612133600781176705.jpg?w=280&h=280)
Enshu Corporation's Optical Division introduces the joining of CFRP and titanium alloys!
This report introduces the joining of CFRP (carbon fiber reinforced plastic) and titanium alloy. By irradiating a laser on the titanium alloy side (t=2mm), we melted the resin portion covering the surface of the CFRP to achieve the joint. Conventional methods include mechanical fastening using adhesives, bolts, etc., but the laser-based joining method addresses the issues associated with traditional joining methods. [Overview] ■ Test Processing ・Joining of CFRP (carbon fiber reinforced plastic) and titanium alloy ■ Results ・Elimination of environmental issues caused by volatile harmful substances from adhesives, as well as the shape limitations and weight increase associated with mechanical fastening in conventional joining methods. *For more details, please refer to the PDF document or feel free to contact us.
It is a light scanning type glass microchip automatic bonding system.
This device is an optical scanning glass microchip automatic bonding system. It achieves a significant reduction in bonding time, which was difficult with conventional methods, by selectively scanning and bonding only the areas that require bonding, such as flow paths, using a programmed pattern bonding software. Furthermore, it is also capable of bonding electrode-embedded microfluidic chips, allowing for easy production of functional microchips at your fingertips.
Achieving intelligent welding control! Promising stable ultrasonic welding with high strength and high airtightness.
Our company has developed a fully digitalized servo press as an ultrasonic welder. Ultrasonic welding requires micron-level high responsiveness for pressure application, but our unique control circuit utilizing the servo press enables precise ultrasonic welding. The smooth operation of the ultrasonic welder servo press digitizes speed control during ultrasonic welding, allowing us to suppress the previously unavoidable clouding phenomenon and ensuring stable ultrasonic welding with high strength and high airtightness at accurate welding sizes. 【Product Lineup】 ■ 20KHz Ultrasonic Servo Welder ■ 40KHz Ultrasonic Servo Welder ■ Servo Press Ultrasonic Welder *For more details, please refer to the PDF materials or feel free to contact us.
A compact and highly rigid pressurized actuator! Cost reduction is possible.
We would like to introduce our "Ultrasonic Welder Dedicated Kit" that we handle. You can choose specifications tailored to your automatic machine, allowing for cost reduction. Additionally, a single ultrasonic oscillator can switch between multiple horns in sequence, enabling further cost savings. Please feel free to contact us when you need assistance. 【Features】 ■ Stack that connects the converter, booster, and horn ■ Oscillator unit that can be integrated into the control panel *For more details, please refer to the PDF document or feel free to contact us.
Capture various challenges related to the use of geospatial information and provide comprehensive support for problem-solving!
Aisan Technology has established the "G Space Data Solution Center." We will address various challenges related to the use of geospatial information and actively participate in research and development as well as demonstration experiments to comprehensively support problem-solving, aiming for high-precision and smooth data production. 【Features】 ■ Support for demonstration of quasi-zenith satellite utilization ■ Position alignment ■ Map quality evaluation ■ Geodetic considerations and publication *For more details, please refer to the PDF materials or feel free to contact us.
A room temperature wafer bonding device that opens new horizons in the bonding process. Supporting device development with high reliability, bonding quality, and bonding support services!
Joining is performed by activating the surface of the joining materials with an ion beam in a vacuum. ■Application in MEMS wafer-level packaging - Packaging can be done at the wafer level before dicing, simplifying subsequent processes. - Since no heating is involved, thermal distortion is eliminated even for fine structures. - Increased productivity as there is no need for heating and cooling time. - Ideal for the development of stacked high-integration MEMS. ■Application to other high-functionality devices - Capable of joining a wide range of materials such as metals, quartz, sapphire, and oxide single crystals. - High yield is achievable due to the absence of thermal distortion. - Dissimilar materials can also be joined at room temperature, enabling previously impossible joints and enhancing design flexibility for devices. A lineup of equipment that maximizes the benefits of the room temperature joining process (all-in-one setup including alignment equipment, wafer transport robots, and bonding mechanisms). For more details, please contact us or download the 'catalog' for confirmation.
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
The fully automatic ultrasonic metal bonder "REBO-Metal-S2" achieves optimal bonding conditions for various workpieces (such as power module terminal sections, bus bars, and metal foils) through a variety of oscillation triggers. It is equipped with X, Y, Z, and θ axes, allowing for automatic recognition and bonding at any desired point. 【Features】 ○ Achieves clearance for bonding power module terminal sections by adopting a tool-type horn. ○ Bonding tools can be easily replaced with a single screw. ○ Capable of saving and evaluating waveform data for all bonding points. ○ Bonding conditions can be set for each bonding point. ○ Equipped with X, Y, Z, and θ axes, allowing for automatic recognition and bonding at any desired point.
Ideal for precision joining experiments such as micro work and thin material bonding. The waveform during joining is output via a BNC terminal, allowing monitoring by connecting external devices.
Equipped with the vibration system of the REBO series wire bonder, it supports spot welding. Monitoring of four types of waveforms during welding is possible. Note: Measurement devices such as oscilloscopes are required for monitoring. It achieves a lower pressure setting compared to air press type metal joining machines (compared to our company). The joining horn uses interchangeable tools, allowing access to deep workpieces (approximately 58 mm from the horn to the tool tip). The Z-axis lifting stroke is approximately 20 mm. External control via PLC enables integration into automated systems and repurposing for mass production machines.
Ultrasonic seam welding machine that transforms manufacturing with rotary ultrasonic welding.
The ultrasonic seam welding machine 'SB200/400CE' is ideal for the lamination of power device materials and the butt connection of materials. By rotating the joint point, it enables large area welding and allows for continuous welding of roll-shaped materials and other continuous materials. 【Features】 - Achieves large area welding - Enables continuous welding - Equipped with joint quality management functions For more details, please contact us or download the catalog.
In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!
The "UB2000/3000/5000SA" is an ultrasonic welding machine suitable for secondary batteries and power-related devices. Equipped with comprehensive process monitoring functions, it allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. Additionally, the built-in linear encoder and rigid clamp in the welding head accurately control the position of the weld joint with a high-rigidity ultrasonic horn unit. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-performance load control ■ Comprehensive process monitoring functions *For more details, please refer to the PDF materials or feel free to contact us.
Ideal for power devices! The ultrasonic head is highly rigid and compact!
The ultrasonic metal joining device 'UB2000/3000/5000LS' is an ultrasonic metal joining device suitable for power devices. The ultrasonic horn is directly clamped by a rigid clamp. This results in the ultrasonic head being highly rigid and compact. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining. The joining capability is enhanced by linear pressurization that increases the load as the joining progresses. 【Features】 ■ High rigidity horn clamp mechanism ■ High precision position control ■ High functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.
From research and development of next-generation secondary batteries to mass production. Providing ultrasonic joining devices/ultrasonic cutters!
In the manufacturing of "next-generation secondary batteries," including all-solid-state batteries, various forms of joining and material cutting are required to meet high quality standards. Additionally, when performing joining or cutting processes, measures must be taken in the manufacturing equipment to prevent the generation of hydrogen sulfide due to reactions with moisture in the air. Our company offers "ultrasonic bonding devices and ultrasonic cutters" designed for next-generation secondary battery specifications, aimed at the joining/cutting of electrode foils, joining between battery terminals, and cutting of green sheets. Each device utilizes our unique technology based on ultrasonic waves, enabling high-quality direct bonding at room temperature and cutting without dragging the material. We also provide a dry environment where the evaluation conditions and equipment specifications can be verified with actual machines, allowing for consideration of implementation. 【Features of the Equipment】 <Joining> ■ Ultrasonic bonding device capable of wide-ranging foil bonding and compatible with dry environments <Cutting> ■ Ultrasonic cutter capable of straight/shape cutting and suitable for dry environments ■ Can cut negative electrode foils, positive electrode foils, Li foils, etc. <Fusing> ■ Can continuously and freely fuse separator materials through programming For more details about the products, please refer to the materials. Feel free to contact us with any inquiries.
Directly forming heat dissipation fins (pin fins/ribbon fins) on the back of the substrate achieves a high thermal conductivity (approximately 34 times that of TIM and about 7 times that of solder).
The Adwells ultrasonic pin bonding device PB2000MS and ribbon bonder RB0300SS can directly form heat dissipation pins and substrate mounting pins on ceramic substrates and organic substrates. With ultrasonic bonding, it is possible to form heat sinks without using TIM or solder, achieving a thermal conductivity approximately 34 times that of TIM and about 7 times that of solder. (Figure 1) The formation of heat sinks through ultrasonic bonding comes in two types: pin bonding and ribbon bonding. In pin bonding, simultaneous bonding of up to 4 pins can be achieved at once, allowing for programmable heat sink formation. (Photo 1) In ribbon bonding, Cu ribbons or Al ribbons are continuously bonded to form heat sinks. The device is equipped with a multi-feeder, allowing for automatic switching of ribbon materials and thicknesses. (Photo 2) ~ For more details, please download the PDF document and check it out ~ *) We also accept evaluation tests using demo machines, so if you are interested, please contact us using the form below.
In the data settings, the pin connection position can be freely changed! It is possible to create heat sinks with a high degree of freedom.
The "PB2000MS" is an ultrasonic bonding machine for forming heat sinks compatible with Cu pins, Al pins, and hollow pins. With a dedicated horn for pin bonding, it allows for simultaneous bonding of up to 4 pins. It forms heat sinks at a rate of 4800 UPH. It efficiently bonds metal pins onto the substrate while picking up metal pins from a tray that holds the pins. 【Features】 ■ Simultaneous bonding of multiple pins ■ Programmable pin formation ■ Tray pin supply ■ Parts feeder pin supply (optional) *For more details, please download the PDF or feel free to contact us.
Welding is possible under low joining conditions! It is possible to join materials with a large area and thickness.
We would like to introduce our technology, "DMB Joining Application using Ultrasonic Welding." With Adwells' ultrasonic welding devices "UB2000/3000/5000LS," we achieve the joining of DMB sheets made from copper (Cu) and aluminum (Al) for power devices and areas requiring low thermal conductivity. The fine protrusions on the DMB sheets serve as the joining points, making it easier for materials to bond together and allowing for adaptation to various applications. 【Features】 ■ Can join materials that can only withstand low loads and low power ■ Does not scratch the surface of materials ■ Can join materials with a large surface area ■ Can join thicker materials ■ Can join devices that are molded *For more details, please download the PDF or feel free to contact us.
