Non-electrolytic gold plating - Development and mass production examples (plating technology)
Can be uniformly deposited on substrates with fine independent patterns! For multi-pin connectors and semiconductor ceramic substrates!
To ensure the conductivity of finely patterned substrates and connectors, gold (Au) plating is often required. In such cases, electroplating is commonly used, but there are instances where electroplating cannot be applied. "For the sake of the substrate pattern, it is not possible to ensure conductivity for plating." "The shape is complex, leading to variations in film thickness with electroplating." "Plating is desired on the terminal parts while in a resin-molded state." In such cases, electroless gold (Au) plating can be utilized. In particular, our company can deposit gold plating with almost uniform film thickness on finely patterned substrates, even on independent patterns. This means that the issues associated with traditional electroplating, such as ensuring contact, occurrence of non-deposition, and variations in film thickness, can be resolved with our electroless gold plating. The base plating is electroless nickel (Ni-p), and it is also possible to add an electroless palladium (Pd) intermediate layer, with proven results in mass production. Currently, we are engaged in technological development aimed at further enhancing functionality and performance. We can also accommodate prototype and sample creation. Please feel free to consult with us.
- Company：友電舎 本社、工場
- Price：Other
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