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Sputtering Equipment Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Sputtering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
  2. 神港精機 東京支店 Tokyo//Industrial Machinery
  3. サンユー電子 Tokyo//Testing, Analysis and Measurement
  4. 4 Bühler K.K. Kanagawa//Food Machinery
  5. 5 ジャパンクリエイト Saitama//Testing, Analysis and Measurement
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Sputtering Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 【nanoPVD-S10A】Magnetron Sputtering Device テルモセラ・ジャパン 本社
  2. Desktop RF Sputtering Device 'SVC-700RFIII' サンユー電子
  3. HELIOS Sputtering Device for Optical Thin Films Bühler K.K.
  4. 4 Semi-automatic grinding device for steel samples SAB-2-200 ハルツォク・ジャパン
  5. 5 Supports multiple metals! It is an ultra-compact coater in the smallest class in the industry. サンユー電子

Sputtering Equipment Product List

91～105 item / All 136 items

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Sample transport device

Sample transport device

Sample transport device

This product, the Sample Carrying System (KSC-1000), is a transport device that also serves as a sample introduction chamber. It allows for the transportation of samples while maintaining ultra-high vacuum conditions between multiple vacuum systems, making future expansion or addition of vacuum systems easy. Additionally, it comes standard with a six-slot sample transport carrier, making it ideal as a sample stocker, and the included heating mechanism enables cleaning of the sample surface.

  • Analytical Equipment and Devices
  • Other laboratory equipment and containers

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Sputter Source "Ultra High Vacuum Compatible Magnetron RF Sputter Source"

Sputter Source "Ultra High Vacuum Compatible Magnetron RF Sputter Source"

It is possible to remove the magnet while maintaining the spatter source in ultra-high vacuum.

The "Ultra High Vacuum Compatible Magnetron RF Sputter Source" is a general-purpose compact magnetron sputter source compatible with ultra high vacuum. Since the entire body is bakeable, it enables film deposition with minimal impurities even with highly reactive targets. 【Features】 - Ultra high vacuum type that does not use O-rings - The magnet can be removed while maintaining the sputter source in ultra high vacuum - Baking up to 300°C is possible by removing the magnet - Target fixation is done with a retainer, allowing for quick target replacement - The gas inlet is integrated with the mounting flange, eliminating the need for a separate flange for gas introduction For more details, please contact us or download the catalog.

  • others

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Sputter Source "Ultra High Vacuum Compatible Magnetron Sputter Source"

Sputter Source "Ultra High Vacuum Compatible Magnetron Sputter Source"

By removing the magnet, baking up to 300°C is possible.

This sputter source is a general-purpose compact magnetron sputter source compatible with ultra-high vacuum. Since the entire body is bakeable, it allows for film deposition with minimal impurities even with highly reactive targets. 【Features】 - Ultra-high vacuum type without O-rings - The magnet can be removed while maintaining the sputter source in ultra-high vacuum - Baking up to 300°C is possible by removing the magnet - The target is fixed with a retainer, allowing for quick replacement of the target - The gas inlet is integrated with the mounting flange, so a separate flange for gas introduction is unnecessary For more details, please contact us or download the catalog.

  • Vacuum Equipment

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4-inch 3-source RF sputtering device

4-inch 3-source RF sputtering device

The substrate dimensions can accommodate up to 3 pieces with a maximum size of 3 inches! It is equipped with a heating mechanism and a reverse sputtering mechanism!

This product is a 3-source RF magnetron sputtering system designed for metal and insulating materials. The substrate features a heating mechanism and a reverse sputtering mechanism. The sputter cathodes consist of three φ4-inch magnetron cathodes, and the substrate insertion is designed for manual opening and closing of the top cover. 【Features】 ■ Substrate size: Maximum 3 inches (can accommodate 3 pieces) ■ Substrate holder: Substrate heating up to 500°C, substrate rotation, and reverse sputtering mechanism included ■ Sputter cathodes: Three φ4-inch magnetron cathodes ■ Gas system: Two systems of Ar and O2 MFC ■ Substrate insertion: Manual opening and closing of the top cover *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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Glovebox-connected organic vapor deposition and sputtering device

Glovebox-connected organic vapor deposition and sputtering device

Transport between chambers is achieved by the transfer rod! Continuous film formation is possible without releasing into the atmosphere!

This product is designed for 50×50 substrates and is a device that connects a resistance heating evaporation system for organic transistors and EL elements, as well as an RF sputtering system for oxides, to a glove box. It transports materials between chambers using a transfer rod, allowing for continuous film deposition without releasing to the atmosphere. Please feel free to contact us when you need assistance. 【Features】 ■ Compatible with 50×50 substrates ■ Continuous film deposition possible without releasing to the atmosphere ■ Connects a resistance heating evaporation system for organic transistors and EL elements, and an RF sputtering system for oxides to a glove box *For more details, please refer to the PDF materials or feel free to contact us.

  • Evaporation Equipment
  • Sputtering Equipment

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Multilayer film deposition ion beam sputtering device for optical filters

Multilayer film deposition ion beam sputtering device for optical filters

It is an ion beam sputtering device for DWDM film deposition.

This is an ion beam sputtering device for the optical field. Sputter: 16cm RF Ion Source Assist: 16cm RF Ion Source Target: 2 surfaces, oscillation function Stage: rotation Film thickness control: transmission-type wavelength-variable laser film thickness control Main exhaust: cryopump or TMP + SUPCOLD For more details, please contact us.

  • Laser Components
  • Other optical parts

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New Counter-Target Sputtering (NFTS) Device

New Counter-Target Sputtering (NFTS) Device

For applications in superconducting thin films and MEMS, it is possible to deposit films on organic substrates with low damage and low-temperature film formation.

The New Facing Targets Sputtering (NFTS) technology is a film deposition technique characterized by its principle and structure that can suppress damage to the deposited substrate caused by the impact of energy species (recoiled particles, ions, electrons) by confining high-density plasma in a box-shaped space. With NFTS technology, it is possible to form high-quality thin films at low temperatures and with low damage, which was considered difficult with conventional sputtering techniques, making it a film deposition technology with high production capabilities. **Features** - **Opposing Target Structure** - Plasma confinement between opposing targets → Suppression of high-energy particles to the substrate → Low-damage film deposition → Suppression of a large number of electrons to the substrate (suppression of Joule heating) → Low-temperature film deposition - **Box-Shaped Plasma Source** - Separation of the vacuum chamber and plasma source → Realization of miniaturization of the entire device through the downsizing of the vacuum chamber → Improved operability and maintainability of the device *For more details, please refer to the PDF document or feel free to contact us.*

  • Environmental Test Equipment
  • Other physicochemical equipment
  • Other machine elements

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Small sputtering device 'SS-DC・RF301'

Small sputtering device 'SS-DC・RF301'

Compact design yet maintains performance! A sputtering device capable of substrate heating at high temperatures.

The "SS-DC・RF301" is a compact sputtering device equipped with one 2" magnetron cathode and a substrate heating mechanism. Thanks to its simple design, it can be installed in about half the space of an office desk. It employs a substrate up-and-down mechanism, allowing for adjustable distance between the target and the substrate. In addition to being able to heat the substrate at high temperatures, it can also operate using only electricity and gas, and allows for reconfiguration between sputter-up and sputter-down. 【Features】 ■ Space-saving with a simple design ■ Adjustable distance between the target and the substrate ■ Capable of high-temperature substrate heating ■ Standard equipped with a chiller *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Sputtering Equipment

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【nanoPVD-S10A】Magnetron Sputtering Device

【nanoPVD-S10A】Magnetron Sputtering Device

High-performance, cost-effective RF/DC magnetron sputtering system for research and development.

High-Performance RF/DC Magnetron Sputtering Equipment ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pa in the fastest 30 minutes!) ● Sputter cathodes x 3: Automatic continuous multilayer film, simultaneous deposition from 2 sources ● Film uniformity ±3% ● Various options: Substrate rotation and elevation, substrate heating (Max 500℃), cathodes for magnetic materials, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 systems (MFC control), expansion of RF/DC PSU (up to 2 power supplies), continuous multilayer film, and simultaneous deposition from 2 sources (RF/DC or DC/DC only). - Insulating films - Conductive films - Compounds, etc. 【Main Features】 ◉ Compatible substrates: Up to Φ4 inch ◉ 2" cathodes x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ APC automatic pressure control ◉ High-precision process control with MFC ◉ 1 Ar gas system (standard) + N2, O2 expandable up to 3 systems ◉ USB port for connection to Windows PC, allowing the creation and storage of recipes for up to 1000 layers and 50 films. Data logging on PC ◉ Other various options available

  • Sputtering Equipment
  • Evaporation Equipment
  • Other semiconductor manufacturing equipment

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Magnetron Sputtering Device MSP-20MT

Magnetron Sputtering Device MSP-20MT

The target is a 4-inch size that can coat large samples as they are.

The Magnetron Sputtering Device MSP-20MT is a coating device for applying conductive treatment to electron microscope samples. It uses a magnetron target to minimize sample damage. It is designed for a 4-inch target size and can process large samples or multiple samples at once. For more details, please contact us or refer to the catalog.

  • Other FA equipment

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Magnetron sputtering device MSP-8 inch

Magnetron sputtering device MSP-8 inch

Equipped with a large-area sample stage compatible with 8-inch wafers.

The Magnetron Sputtering Device MSP-8 Inch features a magnetron target electrode and is equipped with a large-area sample stage compatible with 8-inch wafers. The variation in coating thickness is within 10%, effectively utilizing the entire stage area. Coating is done at a voltage of 500V or lower to reduce damage from ion impact. For more details, please contact us or refer to the catalog.

  • Other FA equipment

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HPC-20 Fully Automatic Osmium Coater

HPC-20 Fully Automatic Osmium Coater

High functionality and low price! Equipped with a touch panel full-auto coating feature, all performance has been powered up!

A new type of osmium coater for pre-treatment for electron microscope observation. We have fully automated parts that were previously difficult to operate manually. This represents a new dimension of osmium coating that allows for safer and easier operations. Equipped with a touch panel, it enables simple and clear operation. Anyone can easily create conductive films for electron microscopes. Additionally, we offer a variety of options to enhance safety and functionality. This device has been meticulously designed, yet we have achieved an astonishingly low price. If you are interested in osmium coating or have concerns about operation, please consider our osmium coater. We are also accepting requests for test coating and demonstrations at any time.

  • Other physicochemical equipment
  • Plasma surface treatment equipment
  • Plasma Generator

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Magnetron Sputtering Device MSP-40T

Magnetron Sputtering Device MSP-40T

Multipurpose, fully automatic film deposition device for experimental use. Magnetron sputtering device MSP-40T type.

The Magnetron Sputtering Device MSP-40T is a multipurpose, multi-metal, experimental ion sputtering deposition system. It features an electrode-separated sample stage to avoid sample damage, efficient deposition with high-speed exhaust and simple operation, and offers good cost performance at a low price. As a successor to the MSP-30T, it has been upgraded with full auto-coating, a touch panel, and recipe functions. For more details, please contact us or refer to the catalog.

  • Other FA equipment

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