Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
106～120 item / All 136 items
The management innovation plan has been approved for the small roll coater.
For anything related to spatter devices, please leave it to Fuji R&D Corporation. For more details, please contact us.
Coating equipment for manufacturing functional films for Flexible Displays.
The Roll to Roll Sputter System is a coating equipment for the production of functional films such as flexible display films, capable of high-speed coating while maintaining the thickness of the coating film on thin films.
Film thickness distribution: Achieved ±1.2% within the tray and ±1.5% between trays.
Showa Vacuum has fully revamped its bestselling device, the SPH-2500, which boasts approximately 15 years of proven performance. The load-lock type sputtering device "SPH-2500-II" inherits the features of the previous model while incorporating the latest technology, achieving performance that surpasses the conventional model in every aspect. 【Features】 ○ Dimensions: W1200×D2500×H1440, maintaining the same footprint while significantly reducing height ○ By improving the cathode, target usage efficiency has been greatly increased to 44% ○ Adopting a rack and pinion system eliminates transport issues caused by roller slippage For more details, please contact us or download the catalog.
Continuous measurement is possible without opening the sample cover! Automatic sample stage unit.
The "TP-TRM-1" is an automatic sample stage unit that can be mounted on the terahertz spectrometer "TeraProspector." By attaching six samples to the sample mounting plate installed on the stage, continuous measurement of samples can be performed without opening the sample cover. This reduces the number of times the sample cover needs to be opened, improving measurement efficiency and minimizing the influx of water vapor. Additionally, we also offer the reflective automatic sample stage unit "TP-RFL-1." 【Features】 ■ Attach six samples to the plate (One location is used for reference measurement. The number of samples can be changed as an option.) ■ Continuous measurement of samples can be performed without opening the sample cover ■ Improves measurement efficiency and minimizes the influx of water vapor *For more details, please refer to the PDF document or feel free to contact us.
Equipment for manufacturing coating films for in-vehicle sensors under the Strategic Base Technology Advancement Support Project.
The "High-Performance Coating Film Manufacturing Sputtering Device" is a device used to produce anti-reflective films for onboard cameras and sensors installed in next-generation vehicles, making it ideal for the strategic foundation technology enhancement support project for onboard sensors. We are developing a sputtering device that incorporates the latest technology into conventional sputtering methods to obtain high-performance optical thin films. 【Features】 ■ Control of film deposition rate and film quality through transition area control ■ Plasma densification using HIPIMS power supply *For more details, please refer to the catalog or feel free to contact us.
A small sputtering device for research and development that allows for the exchange of substrates and targets in an inert gas atmosphere.
The "SSP2500G Sputtering Device with Glove Box" is a compact sputtering device designed for research and development that achieves high quality at a low price, allowing for substrate and target exchanges in an inert gas atmosphere. Despite its small size, it is equipped with two 2-inch cards and can change the distance between target substrates without breaking the vacuum, enabling substrate rotation and film deposition while heating. Additionally, the front hatch and substrate chucking mechanism allow for easy substrate exchange. A simple glove box with a vacuum-replaceable pass box is directly connected to the front hatch of the sputtering chamber, enabling substrate and target exchanges without exposing them to the atmosphere. *For more details, please download the PDF or feel free to contact us.*
It is a device for applying a conductive film treatment to samples for electron microscopy.
The "Magnetron Sputtering Device" utilizes the principle of using a powerful magnet behind the target to promote ionization at the cathode surface layer, and by applying an electric field, it causes ions to collide with the target, releasing metal molecules. This device, manufactured by Vacuum Device Co., Ltd., is characterized by extremely low damage to samples. Additionally, we offer a variety of sputtering target types, sample sizes, and prices to meet our customers' needs. Please feel free to contact us with your requests. 【Product Lineup】 ■MSP-mini ■MSP-1S ■MSP-20-UM ■MSP-20-MT ■MSP-20-TK, etc. *For more details, please download the PDF or feel free to contact us.
Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!
The "VS-R400G" is a sputtering device that adopts a unique LIA (Low Inductance Antenna) plasma source, achieving ultra-fast and high-quality vacuum deposition. Thanks to the assist effect of the LIA method's inductively coupled plasma (LIA-ICP), it reduces damage without lowering the deposition speed, resulting in high-quality film formation. Additionally, it can also accommodate reactive sputtering by leveraging the characteristics of high-density plasma. 【Features】 ■ A sputtering device suitable for experiments, research, evaluation, and prototyping ■ Reduces damage without lowering deposition speed, achieving high-quality film formation ■ Capable of reactive sputtering by utilizing the characteristics of high-density plasma ■ Enables faster deposition speeds by incorporating a rotary cathode ■ Easy to expand into production machines *For more details, please refer to the related links or feel free to contact us.
From surface modification to catalyst utilization! Introducing high-adhesion powder sputtering technology with examples of film formation!
This document introduces the "Powder Sputtering Technology" handled by A.S.D. Corporation. It includes comparisons between plating (wet method) and sputtering (dry method) in powder coating, as well as examples of film formation (optical microscope observation images) and exterior diagrams of powder sputtering equipment. [Contents] ■ Comparison between plating (wet method) and sputtering (dry method) in powder coating ■ Expansion of applicability ■ Exterior diagram of powder sputtering equipment ■ Examples of film formation - Optical microscope observation images - Cross-sectional SEM observation images ■ Specifications of demo experimental equipment *For more details, please refer to the PDF document or feel free to contact us.
High-throughput roll-to-roll sputtering equipment for the manufacture of FCCL (Flexible Copper Clad Laminate).
This is a roll-to-roll sputtering device for the manufacturing of FCCL (Flexible Copper Clad Laminate). Features: 1. High degree of freedom in equipment configuration 2. High temperature stability 3. Proper seed layer formation 4. Chrome-free adhesive layer available as an option 5. Achieves high peel strength For more details, please contact us.
High-rate and high-quality film formation of dielectric and ferromagnetic materials.
This is a high-speed ion beam sputtering (IBD) device that excels in the deposition of dielectrics such as Al2O3 and SiO2, which typically have low deposition rates in conventional magnetron sputtering, as well as ferromagnetic materials like Fe. By using a helicon plasma source as the ion source and a groundbreaking method that accelerates the high-density ions obtained from it through the application of bias voltage to the target, it achieves high-rate and highly directional film deposition. It also contributes to cost reduction in deposition processes using valuable and rare targets by efficiently utilizing the entire target surface. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieving both high-speed sputtering and low contamination Reduction of running costs through improved target utilization efficiency Maintenance reduction due to gridless structure Sputtering while keeping the substrate at low temperature through remote plasma configuration ■ Wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality Uniform film thickness can be achieved with a highly directional ion beam, resulting in excellent step coverage in film deposition.
A composition distribution with several hundred conditions is formed on a single substrate. The effective film formation area is an equilateral triangle with a side length of 25 mm.
The "CMS-3200" is a three-component combinatorial magnetron sputtering device that supports binary and ternary combinatorial composition gradient film deposition. The effective area is an equilateral triangle with a side length of 25mm. It is designed to use 2-inch wafers as standard substrates, allowing for integration into post-processing steps such as patterning and etching, enabling high throughput not only for film deposition but also for analysis. 【Features】 ■ Supports binary and ternary combinatorial composition gradient film deposition ■ Effective film deposition area: equilateral triangle with a side length of 25mm ■ Equipped with three 2-inch magnetron sputter cathodes ■ Can accommodate up to six RF and DC power supplies in three sets ■ Recipe editing and fully automated combinatorial film deposition using LabView *For more details, please refer to the PDF document or feel free to contact us.
Equipped with a heater stage (1000°C)! Usable for various applications from the development process to mass production.
The S600 is a multilayer sputtering device that contributes to the enhancement of electronic component quality and productivity through improvements in multilayer and stacked film deposition processes. By achieving high-quality and high-precision film deposition, it enhances device quality. It increases cost competitiveness through high throughput, improved production yield, and optimized material utilization efficiency. With options that accommodate various deposition conditions, it is capable of supporting small-batch production of diverse products and flexible production planning. 【Features】 - Equipped with up to 5 cathodes to achieve diverse processes and high productivity - Maintains long-term uniformity of film thickness through T/S distance adjustment - Improves sputtered thin film characteristics with unique plasma control (MP sputtering) technology - Capable of high-temperature processes with a heater stage (up to 1000°C) - Usable for various applications from development processes to mass production *For more details, please refer to the PDF document or feel free to contact us.
Products that support the technical aspects of new product development in the diversified and segmented textile industry are featured!
This catalog features the textile equipment handled by Hirano K&E Co., Ltd. We introduce various products, including the compact heat setter "Simplex Tenta," which accommodates a wide range of textile materials, the "Shrink Surfer," which significantly promotes relaxation and anti-shrinkage with ultra-powerful air beating, and the "Suction Drum Dryer," which has a simple structure and is easy to maintain. [Contents] - Simplex Tenta - SST Type Jet Dryer - Shrink Surfer - Multi-stage Pin Tenta & Heat Setter - Short Loop Dryer, etc. *For more details, please download the PDF or contact us.
DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!
"ECLIPSE" is a sputtering device using a side sputtering method for front and backside metallization, as well as for the deposition of dielectrics and piezoelectric materials. It also features a uniquely developed transport mechanism that accommodates ultra-thin wafers and fragile substrates. This device is recommended for engineers facing challenges with continuous deposition and wafer transport in sputtering processes such as backside metallization and under bump metal. 【Features】 ■ Non-contact wafer transport mechanism ■ Compatible with production 150mm wafers (wafer thickness: 250μm) ■ Also compatible with production 100mm wafers (wafer thickness: 130μm) ■ Wafer self-centering capability *For more details, please feel free to contact us.
