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Sputtering Equipment Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Sputtering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
  2. 神港精機 東京支店 Tokyo//Industrial Machinery
  3. サンユー電子 Tokyo//Testing, Analysis and Measurement
  4. 4 Bühler K.K. Kanagawa//Food Machinery
  5. 5 ジャパンクリエイト Saitama//Testing, Analysis and Measurement
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Sputtering Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 【nanoPVD-S10A】Magnetron Sputtering Device テルモセラ・ジャパン 本社
  2. Desktop RF Sputtering Device 'SVC-700RFIII' サンユー電子
  3. HELIOS Sputtering Device for Optical Thin Films Bühler K.K.
  4. 4 Semi-automatic grinding device for steel samples SAB-2-200 ハルツォク・ジャパン
  5. 5 Supports multiple metals! It is an ultra-compact coater in the smallest class in the industry. サンユー電子

Sputtering Equipment Product List

121～135 item / All 136 items

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Ferromagnetic film and solid electrolyte film formation solutions

Ferromagnetic film and solid electrolyte film formation solutions

Ion beam sputtering equipment for research and development as well as small-scale production!

The "TFE New Ion Beam Sputtering Series" is a research and development system for small-scale production with a variety of functions, particularly a sputtering solution for ferromagnetic films and solid electrolytes that allows for the formation of ferromagnetic thin films, such as MTJ devices, without plasma damage. Additionally, it is an ion beam sputtering device that achieves good film thickness distribution for solid fuel cell electrolytes. Furthermore, it is a sputtering device that offers the option of manual or automatic load lock, and features complete automatic control via PLC and PC, as well as remote control via the internet. 【Features】 ■ A plasma damage-free process applicable for the deposition of thin films for ferromagnetic elements (MTJ) ■ Excellent film thickness uniformity for solid fuel cell electrolytes (can be equipped with a glove box) ■ Outstanding film thickness uniformity (<2%: 3σ, 200mm wafer) *For more details, please feel free to contact us.

  • Sputtering Equipment

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Multi-source simultaneous magnetron sputtering device "FRS-HG Series"

Multi-source simultaneous magnetron sputtering device "FRS-HG Series"

Easy discharge operation! Compact design with automatic matching for RF power supply.

The "FRS-HG Series" is a multi-source simultaneous magnetron sputtering device equipped with dual-source/three-source simultaneous sputtering capabilities for research and development. Despite being a fixed type, it features a compact and stylish design. There are three film source introduction ports available, allowing for the installation of film sources that can synergize with sputtering, such as sputtering cathodes and arc plasma deposition sources. 【Features】 - Compact and stylish design despite being a fixed type - Auto-matching is employed for the RF power supply, making discharge operation easy - Simultaneous film deposition with two or three sources allows for fine-tuning of thin film functions and performance *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment

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Vertical Sputtering Device LLS EVO II

Vertical Sputtering Device LLS EVO II

Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.

The "LLS EVO II" is a versatile batch sputtering system with a vertical and dynamic concept, capable of accommodating up to five different materials, and features a device that separates the substrate load chamber and process chamber (LC, PC). It supports various substrate sizes and shapes up to 200×230mm. It can be equipped with configurable power supplies to enhance process flexibility. The degassing and etching of substrates in the load chamber ensure high-purity processes in the process chamber, allowing for easy conversion to various substrate sizes in under five minutes, making it a flexible manufacturing device. 【Features (partial)】 ■ Up to five sputter sources with DC, DC pulse, RF, and RF/DC ■ Simultaneous sputtering from up to three cathodes ■ Reactive sputtering with oxygen and nitrogen ■ High vacuum system configuration with turbo pump, cryo pump, and water trap *For more details, please refer to the related links or feel free to contact us.

  • Sputtering Equipment
  • Etching Equipment

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Ultra-high-speed sheet-type sputtering device SOLARIS family

Ultra-high-speed sheet-type sputtering device SOLARIS family

Providing mass production solutions for high-speed and flexible substrate film deposition applications!

The "SOLARIS Family" is a high-speed film deposition system that enables film formation in as fast as 3 seconds per sheet, with a maximum disk diameter of 430mm. Combining the know-how gained from delivering over 5,000 high-speed optical disk systems and experience from more than 3,000 semiconductor PVD systems, it allows for ultra-fast thin film deposition. It can be applied to various sputter deposition processes, including optical filters, reflective films, transparent electrodes, scratch-resistant coatings, decorative coatings, and corrosion-resistant coatings, with the possibility of combining surface cleaning etching. It is also applicable for protective coatings for fuel cell metal separators, decorative coatings for automotive interior parts, and anti-reflective transparent electrode coatings for in-vehicle displays. 【Features】 - Introduces a "high-speed inline" sheet-type architecture for substrate film formation - Improves throughput and eliminates manual processing through robotic handling - Provides high-speed production solutions for various film deposition processes Additionally, Evatec offers PVD, ALD, PECVD, and etching solutions for metals, piezoelectric films, insulating films, etc., for semiconductor wafers, advanced packaging, MEMS, and wireless filters.

  • Sputtering Equipment
  • Etching Equipment

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Sputter Source "Ultra High Vacuum Compatible Magnetron DC Sputter Source"

Sputter Source "Ultra High Vacuum Compatible Magnetron DC Sputter Source"

It is possible to remove the magnet while maintaining the spatter source in ultra-high vacuum.

This sputter source is a general-purpose compact magnetron sputter source compatible with ultra-high vacuum. Since the entire body is bakeable, it allows for film formation with minimal impurities even with highly reactive targets. 【Features】 - Ultra-high vacuum type that does not use O-rings - The magnet can be removed while maintaining the sputter source in ultra-high vacuum - Baking up to 300°C is possible by removing the magnet - The target is fixed with a retainer, allowing for quick replacement of the target - The gas inlet is integrated with the mounting flange, eliminating the need for a separate flange for gas introduction For more details, please contact us or download the catalog.

  • others

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Sputtering device 'nanoPVD-S10A'

Sputtering device 'nanoPVD-S10A'

High-performance, cost-effective RF/DC magnetron sputtering device for research and development.

High-performance RF/DC magnetron sputtering system ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pa in as fast as 30 minutes!) ● Sputter sources x 3: Continuous multilayer film control, simultaneous film deposition ● Film uniformity ±3% ● Various options: Up/down rotation, heater, cathode for magnetic materials, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 systems (MFC control), expansion of RF/DC PSU (up to 2 power supplies), continuous multilayer film, and simultaneous deposition from 2 sources (RF/DC or DC/DC only). - Insulating films - Conductive films - Compounds, and more 【Main Features】 ◉ Compatible substrates: 2" (1 to 3 sources) or 4" (1 source) ◉ 2" cathode x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ High-precision process control with MFC ◉ 1 Ar gas system (standard) + up to 3 additional systems for N2, O2 ◉ Connect to a Windows PC via USB port to create and save recipes for up to 1000 layers and 50 films. Data logging on PC. ◉ Other various options available.

  • Other semiconductor manufacturing equipment
  • Sputtering Equipment

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Sputtering Equipment Multifunctional Sputter Device MiniLab-S060A

Sputtering Equipment Multifunctional Sputter Device MiniLab-S060A

Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.

4 units of Φ2 inch cathodes installed Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen with the plasma relay switch 3 systems of MFC (Ar, O2, N2) for reactive sputtering Plasma etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coat) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● It is also possible to configure a mixed specification for resistance heating deposition, organic material deposition, EB deposition, etc.

  • Sputtering Equipment
  • Evaporation Equipment
  • CVD Equipment

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Plasma Quest Limited Company Introduction

Plasma Quest Limited Company Introduction

Remote source ion beam sputtering device manufacturer for remote plasma sources.

PlasmaQuest is a reputable company with a 25-year history in the development and sales of helicon-type high-density ion sources and related application products. The gridless helicon plasma source generates high-density plasma and continues to provide OEM supply to many equipment manufacturers. Utilizing this high-quality plasma source as an ion source, the groundbreaking "HiTUS" system applies bias to the target, enabling sputtering under various conditions and with different targets. It allows for sputtering of high magnetic targets and high dielectric targets, which are considered difficult with conventional magnetron sputtering devices, as well as co-sputtering using heterogeneous targets such as metals and ceramics, making it suitable for a wide range of applications. The company is equipped to flexibly respond to both research applications and production-scale equipment.

  • 20170928_160044.jpg
  • Sputtering Equipment

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Pressure gradient sputtering device capable of forming high-quality thin films through a high route.

Pressure gradient sputtering device capable of forming high-quality thin films through a high route.

The "PGS model" is a sputtering device capable of forming low damage, high-quality thin films through a high route.

The "PGS model" is a groundbreaking sputtering device that employs the pressure gradient phenomenon. It enables sputter deposition in a high vacuum environment. Additionally, it allows for the formation of low-damage, high-quality thin films through a high route. This product is the result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science. 【Features】 ■ Utilizes the pressure gradient phenomenon ■ Enables sputter deposition in a high vacuum environment ■ Result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment

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Ion beam sputtering device

Ion beam sputtering device

It is an ion beam sputtering (IBS) device that uses an RF ion source and is equipped with a single stage or planetary stage.

We will design the equipment for research and development or mass production according to customer needs. 【Equipment Features】 - Process operating pressure of 10^-2 Pa (around 10^-4 Torr) Capable of high vacuum film deposition - Low contamination - Non-heated film deposition possible - High-density films - Reactive film deposition possible - Ion beam assist can be added - Good control over film thickness and other parameters

  • Sputtering Equipment
  • Other semiconductors
  • magnet

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Multivariate Multi-Sputtering Device [MiniLab-S125A]

Multivariate Multi-Sputtering Device [MiniLab-S125A]

High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)

Continuous multilayer film, simultaneous film formation (2-6 elements simultaneous film formation: RF, DC can be freely switched from HMI) High-power RF, DC power supplies, and pulse DC power supplies can be flexibly configured for multi-cathode using our unique 'Plasma Switching Relay' module, allowing for various applications. High-temperature substrate heating stage (double jacket water-cooled) options: -1) Max 600℃ (lamp heating) -2) Max 1000℃ (C/C composite) -3) Max 1000℃ (SIC coating) Reverse sputtering stage inside the load lock: -1) 300W, or -2) Soft-Etching (<30W) System main control: 'IntelliDep' control system Windows PC (or TP HMI) interface All operations are centrally managed from a single HMI screen.

  • Sputtering Equipment
  • Evaporation Equipment
  • Etching Equipment

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Sputtering device "MiniLab-060"

Sputtering device "MiniLab-060"

A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.

Compact/Space-saving, High-spec Thin Film Experiment Device Combination possible from the following deposition sources: - Resistance heating deposition source x up to 4 - Organic deposition source x up to 4 - Electron beam deposition - 2-inch sputtering cathode x 4 (or 3-inch x 3, 4-inch x 2) - Plasma etching: Can be installed in either the main chamber or the load lock chamber 【Small Footprint/Space-saving】 - Dual rack type (MiniLab-060): 1200(W) x 590(D)mm 【Excellent Operability/Intuitive Operation Screen】 Windows PC or 7” touch panel. Easy operation regardless of skill level, with maximum safety considerations.

  • Evaporation Equipment
  • Sputtering Equipment
  • Annealing furnace

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Sputtering device 'MiniLab-026'

Sputtering device 'MiniLab-026'

Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.

This is a flexible thin film experimental device for R&D that achieves minimal waste, compact size, simple operation, and high cost performance by integrating the necessary minimum modules and controllers into a 19" compact rack with a Plug&Play feel. It supports magnetron sputtering (up to 3 sources) or resistance heating evaporation (metal sources up to 4, organic materials x4), and can also be equipped with a substrate heating stage, allowing for the production of annealing devices and plasma etching. A glove box storage type is also available (*specifications to be discussed). We offer a wide range of optional components that can be flexibly customized. ◉ Maximum substrate size: Φ6inch ◉ Resistance heating evaporation source filament, crucible, boat type (up to 4 sources) ◉ Organic evaporation source: 1cc or 5cc ◉ Φ2inch magnetron cathode (up to 3 sources) ◉ Dry etching ◉ Glove box compatible (optional, specifications to be discussed) ◉ Other options: simultaneous deposition from 2 sources, HiPIMS, automatic thin film controller, custom substrate holders, substrate rotation/lifting, substrate heating, and more options available. *Please first contact us with your required specifications, and we will configure the system according to your needs.

  • Evaporation Equipment
  • Sputtering Equipment
  • Etching Equipment

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Contract film formation services (test film formation of high-quality reaction films, etc.)

Contract film formation services (test film formation of high-quality reaction films, etc.)

We will support the exploration of new materials and the development of film formation processes.

HiTUS Technology Independent current control is performed for the ion source, target, and substrate. With independent control, it becomes possible to freely control not only the sputter rate but also various reactive sputtering processes such as oxide films and nitride films. We strongly support advanced materials research and process development for applications that have been considered difficult with conventional sputtering equipment, such as ferromagnetic film deposition, co-sputtering of metal and ceramic targets, and dielectric/insulating film deposition from metal targets.

  • 20170928_160044.jpg
  • Other metal materials
  • alloy
  • Surface treatment contract service

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Multilayer film sputtering device 'S800'

Multilayer film sputtering device 'S800'

Contributing to the enhancement of electronic component quality and improvement of productivity through the improvement of multi-layer and stacked film deposition processes.

● Improved device performance through high-quality, high-precision film deposition ● Achieving the desired film deposition process with a multi-chamber system capable of accommodating various units

  • Other inspection equipment and devices

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