We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. DAIKIN FINETECH, LTD. Nara//Resin/Plastic
  4. 4 null/null
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors

Substrate Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  2. Handbook for Circuit Board Noise Countermeasures グロース
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 FPC - "Technical Information" - Updated September 2025 太洋テクノレックス 本社 和歌山
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

Substrate Product List

1786~1800 item / All 1852 items

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Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm in outline and pattern positioning. For pattern formation, we utilize the LDI (Laser Direct Imaging) method, and for outlines, we can perform high-precision outline processing tailored to the pattern using CCD technology. We improve hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling devices and X-ray length measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Implementation on through-holes is possible with flat plugs (pad-on-via) ○ Support for narrow pitch patterns with landless through-holes ○ Extremely fine printing is possible (1 character: vertical 0.28mm × horizontal 0.15mm) Please contact us for more details.

  • Printed Circuit Board

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Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Introducing heat dissipation technology! Heat dissipation is possible through pattern design, selection of heat dissipation materials, and setting conductor thickness.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies for implementing devices with high heat generation. If it is necessary to lower the junction temperature of the mounted devices, heat dissipation can be achieved through pattern design, selection of heat dissipation substrates, and setting of conductor thickness. We also offer a wide variety of materials for substrates, including metal, CEM3, and multilayer heat dissipation materials. 【Features】 - Heat dissipation through thermal vias filled with copper paste in through-holes is possible. - Heat dissipation using heat sink pins inserted into through-holes is also possible. - Outline processing can be done using V-cut, routing, and pressing. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Magnetic Reduction Technology"

Introducing magnetic reduction technology for printed circuit boards! A method to reduce magnetism using flash gold plating.

At Sato-Sen Co., Ltd., we can propose methods to reduce magnetism with flash gold plating. It is possible to reduce magnetism by selecting the appropriate nickel plating solution. Additionally, we also offer special gold plating to completely eliminate magnetism. 【Advantages of Sato-Sen Co., Ltd.】 ○ Development and production system ○ Experience and know-how ○ Advanced equipment ○ Collaborative capabilities Please contact us for more details.

  • Printed Circuit Board

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BMW i3 Disassembly Investigation Report Detailed Contents

A complete disassembly investigation of the electronic circuit boards used in the BMW i3.

The BMW i3, an electric vehicle, is referred to in various ways as a carbon fiber car, but efforts have been made to reduce weight in every possible part to lighten the body. In this instance, there are about 70 electronic circuit boards used in this model, and we have disassembled and investigated all of these boards, compiling a report on the types of components, model numbers, technologies, and the nature of the costs involved. The downloadable materials include details on the content of each report, along with pricing information. Furthermore, for customers who contract to purchase all of these reports by September 30, 2015, we are offering an exceptional price of $25,000. Purchases can also be made in Japanese yen, and it is more affordable than buying a single BMW i3, while also allowing for an easy understanding of what components are used and their associated costs.

  • Other electronic parts

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Face's Wisdom Bag: "Screws and Tightening Torque"

There are various types of screws, and their intended use differs depending on the application. This page explains the types of screws and torque.

For more details, please refer to the PDF document or feel free to contact us.

  • EMS

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Face's Wisdom Bag: "Basic Elements of Cost Reduction"

By designing circuit boards from the perspective of the assembly site, customers can achieve benefits such as reduced labor costs and improved quality.

This explains the basic elements of cost reduction as points to consider during circuit board design. *For more details, please refer to the PDF materials or feel free to contact us.*

  • EMS

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Face's Wisdom Bag: "Points to Note When Releasing Materials (2)"

We will propose points of caution and countermeasures from the perspective of the manufacturing site regarding the material outbound process.

This item introduces precautions for parts shipping (parts packaging) and examples that can lead to manufacturing defects. *For more details, please refer to the PDF document or feel free to contact us.

  • EMS

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[Example of Use] Sensor 99.9% Alumina Substrate

A high-purity, high-strength alumina substrate that can be made thin and resistant to cracking. Its thinness maximizes sensor performance.

A high-purity alumina substrate created from our unique ceramic thin plate manufacturing technology. Its high strength, resulting from high purity, makes it less prone to cracking and allows for thinner substrates, making it suitable for high-performance sensors.

  • Printed Circuit Board
  • Fine Ceramics
  • Other electronic parts

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[Performance Introduction] Measures for Longevity Using Ceramics

By changing metal parts to ceramics, significant improvements in lifespan are expected. Here are some examples of improvements.

Ceramics are lightweight materials with excellent wear resistance and corrosion resistance compared to metals, and their adoption is progressing for extending the lifespan of equipment parts and addressing wear issues. By replacing metal components of equipment with ceramics such as silicon carbide or silicon nitride, the lifespan of the parts is extended, significantly reducing maintenance work for part replacements. JFC offers a lineup of five types of silicon carbide and two types of silicon nitride. Silicon nitride SNP03 is a high-strength type with enhanced fracture toughness and bending strength compared to the standard SNP02. Please consider JFC's ceramics for the long lifespan of your equipment parts. *For more details, please download the catalog. Additionally, JFC also manufactures and sells composite materials made of ceramics and metals. For example, SA701, featured in the PDF materials, is a composite of SiC ceramics and aluminum. It is effective when a material that is resistant to cracking is required.

  • Ceramics
  • Fine Ceramics
  • Composite Materials

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High thermal conductivity substrate "Copper Inlay Substrate" *Includes comparison materials for thermal dissipation state.

We offer a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Business Introduction: Printed Circuit Board Design

25 qualified national certification holders in printed circuit board manufacturing skills! Introducing available circuit board designs!

We would like to introduce the types of circuit board designs that our company can handle in "Printed Circuit Board Design." We can accommodate circuit board designs such as "high-speed digital" and "performance boards for semiconductor testing equipment." Based on small-lot production of various types, we handle the design and manufacturing of high-density, multi-layer printed wiring boards, as well as component mounting, assembly, and performance testing. 【Supported Circuit Board Designs】 ■ High-speed digital ■ Mixed digital & analog ■ High voltage, high current boards ■ Performance boards for semiconductor testing equipment *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Cross-reference table for other companies' EOL piezo buzzers (July updated version)

A cross-reference table with many equivalent products for discontinued items, where you can also compare specifications.

At Same Sky, we continuously manufacture and sell magnetic buzzers and piezo buzzers. Among them, we have received numerous inquiries regarding the EOL products of Murata Manufacturing's piezo buzzers, so we have listed our products that are believed to be as close as possible.

  • Sound Parts

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Significantly reduce inventory time! X-ray reel part counter 'Assure'

Count the number of electronic components in the reel just by placing it in the device! No more winding mistakes or measurement errors! Achieve accurate and rapid inventory management.

The X-ray reel component counter is a device that automatically measures the number of chip components within packages such as reels and trays using X-rays. It allows for easy operation by simply placing the object inside the device and pressing a button, making inventory tasks more efficient. 【Features】 ■ Measures the number of components in about 10 seconds ■ Measurement accuracy of 99.9% ■ Simultaneous counting of up to 4 reels (up to 7 inches) ■ No need to register component information in advance ■ Self-teaching (automatic component recognition) ■ Standard equipped with label printer ■ Integrates with factory management systems (ERP, etc.) Already linked with various companies' component towers and storage cabinets *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Assure001.jpg
  • Assure002.jpg
  • Assure003.jpg
  • Assure101.jpg
  • Assure102.jpg
  • Assure103.jpg
  • Assure104.jpg
  • X-ray inspection equipment

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Simulation-based substrate design

One-stop service! Abundant background data and manufacturing technology unique to a circuit board company.

We support the resolution of various issues related to printed circuit boards. We provide one-stop solutions for printed circuit boards that balance performance and cost. Additionally, if you provide us with your required specifications, we can propose suitable board specifications and designs. We offer characteristic improvements utilizing our extensive background data and manufacturing technology unique to PCB manufacturers. 【For concerns like these】 ■ Waveforms that do not operate, distortion, non-compliance with standards ■ Not functioning under high load ■ Time-consuming cause investigation and countermeasures ■ Failing to meet EMC standards *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Endo's Strength: Development of Engineers

For the growth of the company and skill enhancement! Increase investment in employee training to accelerate support for employee development.

We would like to introduce our strength in "nurturing engineers." Our training system mainly consists of new employee training, career recruitment training, e-learning education aimed at improving business skills, and external courses focused on enhancing expertise. Additionally, we respect our employees' desire to learn and provide support for individual learning, such as obtaining qualifications. 【Features】 ■ Education and training system ■ Support for obtaining qualifications and self-improvement ■ Skills certification acquisition *For more details, please download the PDF or feel free to contact us.

  • Distance learning/E-learning
  • Distance learning/E-learning

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