We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 554 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Notice of Participation in "Nepcon Japan" 共立エレックス
  4. Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 4 Low thermal expansion zero alloy material LEX ZERO. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室

Substrate Product List

1786～1800 item / All 1859 items

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Liquid Flow Sensor Evaluation Kit 'EK-SLF3S-1300F'

Liquid Flow Sensor Evaluation Kit 'EK-SLF3S-1300F'

Includes a conversion adapter cable for connecting from a 6-pin connector to an SCC1-USB sensor cable!

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3S-1300F'. The interface (connector) is I2C (6-pin Molex). The response speed is <20ms, and the maximum flow rate is 40ml/min (for both aqueous and hydrocarbon liquids). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLF3S-1300F ×1 ■ SLF3x mounting clamp ×1 ■ SCC1-USB sensor cable ×1 ■ Adapter cable for connecting from 6-pin connector to SCC1-USB sensor cable ×1 ■ 6-pin ribbon cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board

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Shinshu Koden Co., Ltd. Company Profile

Shinshu Koden Co., Ltd. Company Profile

In addition to the company overview, we publish our efforts towards the environment, a list of equipment and facilities, and our history!

At Shinshu Koden Co., Ltd., we offer circuit design, printed circuit board pattern design, chip mounting, assembly, wiring, enclosure assembly and wiring, and various inspections. On our company website, we introduce not only our company profile but also our efforts towards the environment, a list of equipment, and our history. Please feel free to consult us when you need our services. 【Our Company Website - Company Information】 ■Greetings ■Company Profile ■History ■Environmental Initiatives ■List of Equipment ■Access Map *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing

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[Development Case] - Inkjet Printer Ejection Control Board [EOL Support]

[Development Case] - Inkjet Printer Ejection Control Board [EOL Support]

Replacement design for embedded systems - a new design solution fully addressing end-of-life IC measures and specification changes.

The customer faced a situation where the ICs and semiconductors in use became obsolete, making it urgent to consider alternatives. Additionally, due to changes in equipment specifications, the number of modifications needed on the circuit board increased. Furthermore, due to constraints of the equipment casing, it was not possible to change the existing board size, shape, or connector positions, necessitating a redesign that could accommodate all requirements while maintaining the conventional design. Our company carefully selected alternative components with equivalent basic functions, pin configurations, and sizes, and conducted a redesign of the circuit board patterns as needed. We eliminated unnecessary circuits and minimized changes to component placement and wiring patterns, allowing us to conduct integration verification into the equipment while maintaining the existing specifications. This ensured reliable operation checks for both the circuit board alone and the entire equipment, facilitating a smooth transition to mass production and stable supply. To the design team, procurement, and production management—please utilize our replacement design case studies as an optimal solution to enhance operational efficiency, product quality, and reliability in response to obsolete IC measures and specification changes. Feel free to contact us!

  • Embedded system design service
  • Microcomputer
  • EMS

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【プリント基板イニシャル費削減】～フレキ基板小ロット製造対応～

【プリント基板イニシャル費削減】～フレキ基板小ロット製造対応～

無駄なイニシャル費は払わなくていい！　独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。

株式会社ケイツーでは、独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。これによりフレキ基板製造の短納期化および大幅なイニシャルコスト費の削減が可能です。NCマシンによる加工の課題でありました加工精度・加工面につきても金型加工と遜色のない仕上がりとなっております。 通常フレキ基板を製造するには、数量の大小にこだわらず、カバーレイ加工や外形加工に金型またはトムソン型（ヴィクトリア型）が不可欠です。その結果、金型に関する時間や費用によって通常のリジッド基板と比較して納期が長く、イニシャル費も非常に高くなっておりました。当社では、カバーレイ加工や外形加工に金型を使用せずにNCマシンを使用して、金型作成に要する時間と費用を削減できます。もちろん、加工精度や仕上がり形状は金型加工と比較しても遜色のないものです。 詳しくはお問い合わせ、またはカタログをダウンロードしてください。

  • Printed Circuit Board

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Advantages of K2: More cost-effective response for medium lot production of flexible materials.

Advantages of K2: More cost-effective response for medium lot production of flexible materials.

Providing medium lot products that are unsuitable for both prototype manufacturers and mass production manufacturers at low prices!

Our company offers proposals to reduce initial costs by using laser processing for the prototyping of flexible substrates. However, when it comes to medium lot production, it is more cost-effective to manufacture using molds. For large quantities that cannot be handled by prototyping manufacturers, and where the initial costs become too high for mass production manufacturers, please leave it to us. We can provide it at a low price. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[Example] Printed Circuit Board - Multi-layer Board with Different Materials

[Example] Printed Circuit Board - Multi-layer Board with Different Materials

Introducing the combination of Teflon material and different substrates using illustrations!

At Shinkou Photo Service Co., Ltd., we also accept orders for printed circuit board pattern design (digital, analog, high frequency) as well as assembly (QFP, QFN, BGA). We can take orders for either design or assembly. 【Catalog Contents】 ■Combination of Teflon materials and other substrates ■Combination of Teflon materials with aluminum or copper plates ■Combination of Teflon materials with each other 【Various Manufacturers Handled】 ■ARLON, Chuko Chemical Industrial, Nippon Pillar Industry, Panasonic Electric Works, ROGERS, and others For more details, please download the catalog or contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm in outline and pattern positioning. For pattern formation, we utilize the LDI (Laser Direct Imaging) method, and for outlines, we can perform high-precision outline processing tailored to the pattern using CCD technology. We improve hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling devices and X-ray length measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Implementation on through-holes is possible with flat plugs (pad-on-via) ○ Support for narrow pitch patterns with landless through-holes ○ Extremely fine printing is possible (1 character: vertical 0.28mm × horizontal 0.15mm) Please contact us for more details.

  • Printed Circuit Board

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Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Introducing heat dissipation technology! Heat dissipation is possible through pattern design, selection of heat dissipation materials, and setting conductor thickness.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies for implementing devices with high heat generation. If it is necessary to lower the junction temperature of the mounted devices, heat dissipation can be achieved through pattern design, selection of heat dissipation substrates, and setting of conductor thickness. We also offer a wide variety of materials for substrates, including metal, CEM3, and multilayer heat dissipation materials. 【Features】 - Heat dissipation through thermal vias filled with copper paste in through-holes is possible. - Heat dissipation using heat sink pins inserted into through-holes is also possible. - Outline processing can be done using V-cut, routing, and pressing. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Magnetic Reduction Technology"

Technical Introduction: "Magnetic Reduction Technology"

Introducing magnetic reduction technology for printed circuit boards! A method to reduce magnetism using flash gold plating.

At Sato-Sen Co., Ltd., we can propose methods to reduce magnetism with flash gold plating. It is possible to reduce magnetism by selecting the appropriate nickel plating solution. Additionally, we also offer special gold plating to completely eliminate magnetism. 【Advantages of Sato-Sen Co., Ltd.】 ○ Development and production system ○ Experience and know-how ○ Advanced equipment ○ Collaborative capabilities Please contact us for more details.

  • Printed Circuit Board

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BMW i3 Disassembly Investigation Report Detailed Contents

BMW i3 Disassembly Investigation Report Detailed Contents

A complete disassembly investigation of the electronic circuit boards used in the BMW i3.

The BMW i3, an electric vehicle, is referred to in various ways as a carbon fiber car, but efforts have been made to reduce weight in every possible part to lighten the body. In this instance, there are about 70 electronic circuit boards used in this model, and we have disassembled and investigated all of these boards, compiling a report on the types of components, model numbers, technologies, and the nature of the costs involved. The downloadable materials include details on the content of each report, along with pricing information. Furthermore, for customers who contract to purchase all of these reports by September 30, 2015, we are offering an exceptional price of $25,000. Purchases can also be made in Japanese yen, and it is more affordable than buying a single BMW i3, while also allowing for an easy understanding of what components are used and their associated costs.

  • Other electronic parts

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Face's Wisdom Bag: "Screws and Tightening Torque"

Face's Wisdom Bag: "Screws and Tightening Torque"

There are various types of screws, and their intended use differs depending on the application. This page explains the types of screws and torque.

For more details, please refer to the PDF document or feel free to contact us.

  • EMS

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Face's Wisdom Bag: "Basic Elements of Cost Reduction"

Face's Wisdom Bag: "Basic Elements of Cost Reduction"

By designing circuit boards from the perspective of the assembly site, customers can achieve benefits such as reduced labor costs and improved quality.

This explains the basic elements of cost reduction as points to consider during circuit board design. *For more details, please refer to the PDF materials or feel free to contact us.*

  • EMS

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Face's Wisdom Bag: "Points to Note When Releasing Materials (2)"

Face's Wisdom Bag: "Points to Note When Releasing Materials (2)"

We will propose points of caution and countermeasures from the perspective of the manufacturing site regarding the material outbound process.

This item introduces precautions for parts shipping (parts packaging) and examples that can lead to manufacturing defects. *For more details, please refer to the PDF document or feel free to contact us.

  • EMS

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[Example of Use] Sensor 99.9% Alumina Substrate

[Example of Use] Sensor 99.9% Alumina Substrate

A high-purity, high-strength alumina substrate that can be made thin and resistant to cracking. Its thinness maximizes sensor performance.

A high-purity alumina substrate created from our unique ceramic thin plate manufacturing technology. Its high strength, resulting from high purity, makes it less prone to cracking and allows for thinner substrates, making it suitable for high-performance sensors.

  • Printed Circuit Board
  • Fine Ceramics
  • Other electronic parts

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[Performance Introduction] Measures for Longevity Using Ceramics

[Performance Introduction] Measures for Longevity Using Ceramics

By changing metal parts to ceramics, significant improvements in lifespan are expected. Here are some examples of improvements.

Ceramics are lightweight materials with excellent wear resistance and corrosion resistance compared to metals, and their adoption is progressing for extending the lifespan of equipment parts and addressing wear issues. By replacing metal components of equipment with ceramics such as silicon carbide or silicon nitride, the lifespan of the parts is extended, significantly reducing maintenance work for part replacements. JFC offers a lineup of five types of silicon carbide and two types of silicon nitride. Silicon nitride SNP03 is a high-strength type with enhanced fracture toughness and bending strength compared to the standard SNP02. Please consider JFC's ceramics for the long lifespan of your equipment parts. *For more details, please download the catalog. Additionally, JFC also manufactures and sells composite materials made of ceramics and metals. For example, SA701, featured in the PDF materials, is a composite of SiC ceramics and aluminum. It is effective when a material that is resistant to cracking is required.

  • Ceramics
  • Fine Ceramics
  • Composite Materials

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