ソーラーリサーチ研究所 List of Products and Services

The heavy object non-contact transport device (Float Chuck SA-5C(SAN) type) adopts a new gas vertical jet method. The gas vertical jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, greater resistance to impact, and nearly halved gas consumption. New method: Explanation of the gas vertical jet method. The heavy object non-contact transport device (Float Chuck SA-5C(SAN) type) technology allows for the suspension and transport of substrates in a non-contact state by ejecting air towards the substrate, keeping it floating in the air. It is designed to handle high loads while achieving low air consumption.

• Wafer
• Press Dies

The non-contact transport device "Convex/Concave Lens Shared Bernoulli Chuck Type W" can maintain and transport items in a suspended state without contact by ejecting gas towards the lens. This is made possible by forming two types of curved surfaces, convex and concave lenses, on the operating surface opposing the lens (patent pending). When the gap between the operating surface and the lens is large, the gas ejection nozzle, cushion chamber, and the gap between the operating surface and the lens function as the nozzle, vacuum chamber, and diffuser of an ejector, respectively. As a result, a negative pressure is generated in the cushion chamber, pulling the lens closer. When the lens is drawn in and the gap with the operating surface decreases, the cushion chamber functions as a pressure chamber type air cushion (hovercraft), causing the pressure in the cushion chamber to rise sharply, which separates the lens. This maintains the lens in a non-contact suspended state in the air at a distance that automatically keeps the balanced pressure of the cushion chamber between the operating surface and the lens.

• Other semiconductors
• Other semiconductor manufacturing equipment
• Other physicochemical equipment

New method for non-contact suction of ultra-fine and long workpieces: Adoption of the vertical gas jet method (VGF method). The Bernoulli chuck "Float Chuck SA-CL series" has newly adopted the vertical gas jet method (VGFS) to efficiently suction ultra-fine and long workpieces. The vertical gas jet method reduces friction loss of the gas flow in the cushion chamber by vertically jetting the gas flow emitted from the nozzle, enhancing the effect of negative pressure generation, significantly increasing the suspension capability compared to conventional types, thereby improving the holding stability and resistance to impact, while nearly halving gas consumption.

• Wafer processing/polishing equipment
• Wafer
• Separation device

At Solar Research Institute, we have developed a "cleanroom-compatible small Bernoulli chuck" that non-contactly chucks and transports micro-work chips measuring 5.0 mm square and smaller. This device generates negative pressure through the ejector effect and Bernoulli effect by ejecting gas, as well as positive pressure through a pressure-type air cushion effect, allowing small cut wafer chips to be chucked in a non-contact state, floating in the air, and transported to a designated location. As part of this new mechanism, we have established a circuit to change the exhaust path around the suction pad, allowing for the alteration of the exhaust direction. Therefore, the exhaust does not blow away surrounding chips.

• Wafer
• CVD Equipment
• Wafer processing/polishing equipment

The non-contact transport device "Float Chuck LNA-S type" suspends and transports ceramic green sheets, through-hole substrates, non-woven fabrics, and breathable sheets without contact by ejecting air. The non-contact transport device "Float Chuck LNA-S type" is equipped with a nozzle that has a mechanism preventing high-speed air flow from directly colliding with the workpiece, allowing for the transport of thin, fragile green sheets with a thickness of 120μm and ultra-thin glass substrates over 50μm in thickness without damage or breakage. Additionally, the non-contact transport device "Float Chuck LNA-S type" has low air consumption and is highly efficient. ◎ Features 1. Transports and handles ceramic green sheets without contact. 2. Capable of transporting through-hole and perforated sheets. 3. Does not damage or break thin ceramic green sheets with a thickness of 120μm. 4. Capable of transporting ceramic green sheets without damage. 5. Low air consumption. 6. Does not pollute the environment.

• Other conveying machines
• Circuit board processing machine
• Pneumatic Equipment

- By ejecting gas, it generates negative pressure through the Bernoulli effect and the ejector effect, allowing for non-contact suction, holding, and transportation of LCOS pieces. - No scratches, dirt, or pad marks will be left. - Usable in a clean room. - Suitable for breathable workpieces, perforated workpieces, and ultra-thin flexible workpieces. - Can also be used manually.

• Wafer
• lens
• Dedicated IC

"6in・8in Dual-Use Non-Contact Tweezers" (Patent) We have adopted a new gas vertical jet method. The gas vertical jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional types. This increases the holding stability and makes it more resistant to shocks, while nearly halving the gas consumption. The non-contact transport device "Float Chuck" (patent) at the tip of the handle of the "6in・8in Dual-Use Non-Contact Tweezers" allows for the ON-OFF control of air supply through hand operation, enabling non-contact suction and detachment of wafers. ◎ Features 1. 6-inch and 8-inch wafers can be handled with the same tweezers. 2. Operated by hand. 3. No scratches or dirt attachment. 4. Simple to use. ◎ Applications 1. 6-inch and 8-inch wafers (Other wafer sizes are also manufactured.) 2. Glass substrates 3. Lenses 4. Chips 5. Solar cells

• Wafer
• Etching Equipment
• Industrial Furnace

The Bernoulli Chuck "Non-contact Transport Device for Microscopic Objects" has adopted a new vertical gas jet method. The vertical gas jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing the friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional models. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption. The "Non-contact Transport Device for Microscopic Objects" suspends and transports the workpiece in a non-contact state, floating in the air by ejecting air towards the substrate.

• Other semiconductor manufacturing equipment
• Other conveying machines
• CVD Equipment

This product is manufactured according to the usage environment temperature and chemical specifications. The quartz glass used in ultra-high temperature applications possesses numerous characteristics, such as high purity, resistance to heat and acid, and high mechanical strength. It has become possible to transport wafers non-contact in cleaning tanks, oxidation diffusion furnaces, etching devices, CVD devices, etc., in the semiconductor manufacturing process, as well as non-contact transport of glass molding lenses. Additionally, products are made to suit various environments, including aluminum, SUS, PEEK, and others. ◎ Features 1. Heat resistance up to 1000°C 2. Materials are selected based on the usage temperature environment. PTFE, PEEK, aluminum, SUS316, quartz, considering acidic, alkaline, and corrosive gases. ◎ Target Work 1. High-temperature wafers 2. Glass molded lenses and preforms 3. Compound semiconductor wafers 4. Glass substrates

• Evaporation Equipment
• Wafer
• Other industrial robots

◎Features 1. Non-contact transport of high-temperature wafers at 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible: - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers

• CVD Equipment
• Plasma surface treatment equipment
• Heating device

The "O-Ring Gripper" utilizes the ejector effect and Bernoulli effect to generate negative pressure through air ejection, as well as the pressure chamber type air cushion effect and airflow cushion effect to generate positive pressure. This allows the "O-Ring Gripper" to suspend and transport rings of various diameters using airflow. As a result, it does not scratch or dirty the surface of the rings and prevents dust generation. Additionally, the "O-Ring Gripper" can grip and transport rings of different diameters using a single model, thanks to the shape of the cushion chamber and the Coanda effect generated by the injected gas flow. This eliminates the need to change models based on ring diameter, significantly improving productivity and enabling cost-effective equipment pricing. ◎ Features 1. The gripping force allows for soft suspension and holding of the rings. 2. It does not cause scratches or dirt to adhere. 3. One model can accommodate a wide range of different diameters of O-rings, circular diameters, hollow angular rings, and damaged hollow bodies. 4. It has good holding stability.

• Substrate transport device (loader/unloader)
• Parts feeder
• Air Tools

The "Float Chuck SAC Type" series, which adopts the gas vertical jet flow system (VGFS) and reduces friction loss in the gas flow, has newly implemented this gas vertical jet flow method. The gas vertical jet flow method vertically jets the gas flow ejected from the nozzle into the cushion chamber, reducing friction loss in the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption.

• Other semiconductor manufacturing equipment
• Other machine elements
• Transport and handling robots

We will manufacture a custom-made "Bernoulli chuck - non-contact transport device" that adopts a new mechanism of the Bernoulli chuck "Float Chuck SAC type," which has the Bernoulli effect, ejector effect, and Coanda effect. The new mechanism: The non-contact transport device "Float Chuck SAC type" has been enhanced with the Coanda effect to increase the ejector effect that generates suction power. It is a high-efficiency, low gas consumption non-contact transport device that combines the Bernoulli effect. This new method employs the "vertical jet airflow method" with the Bernoulli chuck for the non-contact transport device.

• Other semiconductors
• CVD Equipment
• LCD display

◎Features 1. Non-contact transport of wafers at high temperatures of 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible. - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers

• Evaporation Equipment
• Other physicochemical equipment
• Wafer

Bernoulli chuck for SiC wafers equipped with an exhaust recovery mechanism, reducing the discharge of exhaust into the clean room and enabling its use within the clean room.

• Other semiconductor manufacturing equipment
• Pneumatic Equipment
• Wafer processing/polishing equipment

"The lens Bernoulli chuck corresponding to lenses with different curvatures" utilizes the negative pressure generation effect from the ejector effect and Bernoulli effect by blowing air, as well as the positive pressure generation effect from the pressure chamber type air cushion effect and airflow cushion effect, to suspend and transport concave and convex lenses with different curvatures in a non-contact state in the air. This prevents scratches and dirt on the lens surface and also helps to prevent dust generation. Additionally, there is no need to change models based on lens curvature, significantly improving productivity and allowing for cost-effective equipment proposals. ◎ Features 1. Can suspend and hold without contacting the surface of the lens or sphere. 2. Does not allow scratches or dirt to adhere. 3. Capable of handling a wide range of lens curvatures with a single model. 4. Good holding stability. ◎ Applications 1. Convex and concave lenses 2. Spheres 3. Lenses for optical discs 4. Aspherical lenses 5. Contact lenses

• Wafer
• Pneumatic Equipment
• Other machine elements

The "non-contact chuck" of the Solar Research Institute's vertical gas jet method can suspend and transport glass substrates in a non-contact state by ejecting air towards the glass substrate, allowing it to float in mid-air. ● Compatible with a wide variety of workpieces Users come from various industries, including semiconductors, FPD, polarizers, films, optics, electronics, paper, and textiles, with delivery records reaching several hundred. The size of the workpieces ranges from chips/lenses a few millimeters square to glass several meters square, with thicknesses also varying from a few micrometers. The characteristics of the workpieces are diverse, including warped wafers, through-holes, breathable and flexible workpieces, and surface-coated workpieces.

• Wafer
• Pneumatic Equipment
• Other machine elements

The "moist soft contact lens tweezers" for handling hydrated contact lenses in the hydration process grasp and transfer the lenses by blowing air. Additionally, during attachment and detachment, the internal pressure of the transport device is increased for the process. Therefore, there are no mechanical operations involved in the suction and detachment processes. All operations are performed by the action of airflow, allowing for the transfer of flexible contact lenses without causing damage. Thus, it is possible to transport thin and soft contact lenses without causing any harm. It is also capable of picking up and transferring hydrated lenses in the hydration process. ◎ Features 1. The suction grip and detachment of contact lenses are performed using airflow. 2. It is capable of picking up and detaching hydrated contact lenses in the hydration process. 3. Since it does not use vacuum suction, it does not deform or damage the lenses. 4. Because it does not use a mechanical peeling mechanism, it does not deform or damage the lenses.

• Other conveying machines
• Plastic utensils and containers
• Other physicochemical equipment

We transport water-containing soft contact lenses. The "soft contact lens transfer device" uses air ejection to create negative pressure through the ejector effect, Bernoulli effect, and Coanda effect for lens suction grip, and generates positive pressure through a pressure chamber air action effect to release the lens, balancing the gripping contact force to gently hold and transport the contact lenses. All operations are performed using the action of airflow, ensuring that the flexible contact lenses are transported without damage.

• Other conveying machines
• Conveyor
• Transport and handling robots

We will manufacture custom-made Bernoulli chuck systems and non-contact transport devices using the Bernoulli chuck "Float Chuck SAC type," developed through inventions at the Solar Research Institute, based on our extensive delivery track record. - Non-contact transport device for wafers - Non-contact transport device for glass substrates - Non-contact tweezers - Non-contact transport device for solar cell wafers - Non-contact transport device for wafer chips - Non-contact transport device for lenses - Non-contact transport device for films - Non-contact transport device for printed circuit boards and FPC - Non-contact transport device for non-woven fabrics - High-precision inspection table with air levitation - Sheet feeding device

• Wafer
• Other semiconductor manufacturing equipment
• Wafer

"Vulnerable film transport device" for transporting fragile films, thin sheets, flexible sheets, and breathable sheets. ◎ Features 1. Capable of transporting fragile, weak, and thin films without damage. 2. The gas jet flow does not collide with the film. 3. The suction pressure is almost uniform across the entire holding surface. 4. The suction force can be adjusted according to the fragility of the film. 5. The support spacing for the film is small.

• Wafer
• Actuator
• Glass

Non-contact transport device "Float Chuck SA-C type" theoretical calculation formula This formula is the theoretical calculation formula for the non-contact transport device "Float Chuck SA-C type" (patent) developed by Solar Research Institute Co., Ltd. Below is an overview of the "Float Chuck SA-C type." Additionally, the following assumptions are made: (1) The gap with the member is considered to be very small compared to the pad radius of the "Float Chuck SA-C type." Therefore, the flow can be approximated as one-dimensional flow. (2) The jet ejected from nozzle O either hits the cushion chamber wall or flows smoothly along the AB surface. In this case, it is estimated that secondary flow containing vortices occurs near point A and near the collision point C of the jet. However, these effects are ignored in this analysis. (3) The compressibility of the flow in the jet and within the pad is neglected.

• Pneumatic Equipment
• Semiconductor inspection/test equipment

The non-contact suction mechanism of the "50μm thick ultra-thin glass non-contact transport device LNAS type" is equipped with a gas deflector directly below the air jet nozzle. The gas deflector redirects the high-pressure air flow ejected from the nozzle at a right angle, causing it to collide directly with the ultra-thin glass without damaging it. Therefore, as shown in the pressure distribution diagram, there is no localized stress applied to the ultra-thin glass by the high-pressure ejected air (it is in a negative pressure state). As a result, thin workpieces and fragile ultra-thin glass will not be damaged.

• Stepper

The "Non-contact Insertion and Removal Device for Glass Mold Lenses" performs the following processes non-contactly: 1. The process of transferring from the case to the positioning jig for removal. 2. The process of inserting the positioned preform into the press mold. 3. The process of removing the molded glass mold lens from the press mold.

• Other conveying machines

1. Exhaust Recovery Mechanism: The cleanroom-compatible Bernoulli chuck "Float Chuck WAS type" is composed of an operating surface facing the wafer being held, a cushion chamber provided at the center of the operating surface, a nozzle located at the center of the cushion chamber, and a hood around the outer periphery of the operating surface. The high-speed air flow ejected from the nozzle flows into the gap between the operating surface and the wafer without contacting the walls of the cushion chamber or the wafer. The amount of negative pressure generated by the ejector effect in the cushion chamber also increases, allowing for efficient negative pressure generation. The exhaust air that passes through the gap between the operating surface and the wafer is captured by the surrounding hood and is drawn out through the exhaust port to a designated location. As a result, the high-speed air jet rarely flows into the cleanroom, preventing the discharge of debris and the lifting of dust. 2. Positioning Mechanism: The guide attached to the "Float Chuck WAS type" has a shape at the bottom end that contacts the outer peripheral touchable part of the held wafer, which regulates the free movement of the wafer. Therefore, positioning is possible even though the wafer is held non-contact.

• Other semiconductor manufacturing equipment

The cleanroom-compatible "Bernoulli Chuck WAS type" efficiently suspends and transports workpieces in a non-contact state by ejecting gas. The "Bernoulli Chuck WAS type" is equipped with an exhaust recovery mechanism that captures the exhaust emitted from the nozzle, preventing the exhaust from leaking into the cleanroom. Therefore, it can be used for non-contact transport of wafers, glass substrates, and other items within the cleanroom.

• Actuator
• Wafer

Breathable thin sheets. Compatible with film, non-woven fabric, and paper. Dispenses one sheet at a time. High speed.

• Circuit board processing machine

It is non-contact. It is possible to transport small workpieces non-contact. There are no scratches or dirt attached. There is no damage.

• Other semiconductor manufacturing equipment
• Other physicochemical equipment

The holding device is composed of a non-contact transport system called "Float Chuck" (patent), which suspends amorphous solar cells, silicon solar cells, polarizing plates, FPCs, and films in a non-contact state floating in the air by ejecting air. The device accurately feeds out stacked sheets of amorphous solar cells, polarizing plates, films, sheets, wafers, glass, paper, and other materials one by one using the non-contact transport system "Float Chuck" (patent). In the areas where the device interacts with the film, the non-contact transport system "Float Chuck" is used, ensuring that there are no scratches, dirt, stress, or static electricity adhesion.

• Other industrial robots
• Other semiconductor manufacturing equipment
• Other machine elements

The "non-contact injection molding extraction machine" generates negative pressure in the internal space by the ejector effect caused by the viscous action of high-speed air swirling flow created by blowing air. This negative pressure not only sucks the workpiece but also holds it non-contact through the rebound effect of a pressure chamber-type cushion. By mounting this non-contact injection molding extraction machine as a hand on an extraction robot, it becomes possible to grasp and extract the workpiece without contact.

• Injection Molding Machine
• Pneumatic Equipment

A chuck that holds and transports film, printed circuit boards, through-hole boards, paper, non-woven fabric, flexible sheets, and breathable sheets by ejecting gas.

• Other conveying machines
• Circuit board processing machine
• Other machine elements

Using a valve attached to a handle, the air supply is manually operated to turn ON and OFF, allowing the wafer, chip, lens, and solar cell substrate, as well as the glass substrate, to be grasped non-contact.

• Other physicochemical equipment
• Semiconductor inspection/test equipment
• Image Processing Equipment

A non-contact transport device that holds and conveys workpieces in a suspended manner by ejecting gas. It employs a new mechanism for the gas ejection system, with the air ejection outlet positioned at a small angle relative to the workpiece. There is no deceleration of airflow velocity caused by friction losses due to wall contact of the airflow. The amount of negative pressure generated increases, and the efficiency of load generation improves. Compared to conventional technology, the suspension capability has significantly increased, and gas consumption has nearly halved. Therefore, it is adopted for the non-contact transport of large workpieces with high loads, particularly for the eighth generation large glass substrates (2200mm x 2200mm) used in LCDs, which had previously been avoided due to air consumption issues.

• Other semiconductor manufacturing equipment
• Other conveying machines
• Transport and handling robots

Non-woven fabric (mat) for interior decoration is gripped and transported by air flow using the 'Non-woven Fabric Gripping and Transport Device.' It grips and transports ceiling materials, mats, and non-woven fabrics for interior use one by one to molding machines and presses. By ejecting air, it generates negative or positive pressure according to the gap with the non-woven fabric using a non-contact transport device called 'Float Chuck KF Type' (patented), which grips and transports the non-woven fabric. The non-contact transport device 'Float Chuck KF Type' can grip and transport breathable, thin, flexible, uneven, and fragile works without causing damage, which is impossible with vacuum suction.

• Other industrial robots
• Other machine elements
• Vehicle body parts

It grips, chucks, and transports flexible materials such as film, amorphous solar cells, paper, green sheets, non-woven fabrics, breathable materials, foams, and soft bodies. By blowing air towards the workpiece, it generates negative pressure through the Bernoulli effect, allowing it to chuck, grip, transport, stack, and handle the workpiece in a non-contact state.

• Other conveying machines
• Other semiconductor manufacturing equipment
• Other packaging machines

By ejecting gas, it generates negative pressure through the ejector effect and Bernoulli effect, and positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state, enabling transport, inversion, and tilting. It is also referred to as a Bernoulli chuck. The exhaust recovery mechanism allows for use in ultra-clean rooms. It is compatible with semiconductor wafers, LCD/PDP glass substrates, printed circuit boards, ceramic substrates, films, paper, non-woven fabrics, ultra-thin workpieces, breathable workpieces, and more.

• Other conveying machines
• Other semiconductor manufacturing equipment
• Other machine elements

1. Through-hole perforated boards and film substrates are suction-compatible. 2. Suction is possible regardless of the size of the substrate or the position of the holes. 3. Stacked substrates are suctioned one by one. 4. No need to change the setup of the suction device. 5. Does not leave scratches or dirt marks on the pads.

• Circuit board processing machine
• CVD Equipment
• Other semiconductors

The film that has been sent is accurately aligned and accumulated in a non-contact manner. This device consists of a holding mechanism called "Float Chuck," which was developed by our company, that suspends the deflection plate, FPC, and film in a non-contact state by blowing air to keep them floating in the air. It also employs a "non-contact support running device" that moves in synchronization with the work progression. It reliably and accurately accumulates thin and flexible workpieces at high speed without causing dirt adhesion or damage.

• Other conveying machines

There is no need to change the setup of the suction device based on the size of the substrate or the position of the holes. The substrate is held in a non-contact state by a negative pressure generation function that blows air, allowing for transport. Therefore, it does not leave scratches or dirt on the substrate.

• Circuit board processing machine

Non-contact chucking of wafers Made of quartz Heat resistant Suitable for use in clean rooms

• Other semiconductor manufacturing equipment

Wafers can be transported non-contact. The thin hand allows for the insertion and removal of wafers to and from the carrier. Usable in a clean room. Alignment is possible.

• Other industrial robots
• Other semiconductor manufacturing equipment
• Pneumatic Equipment

It is a "film laminating device" that accurately bonds laminated flexible films or breathable sheets to substrates in processes such as bonding solar cell substrates, liquid crystal substrates, and wafers to films, as well as bonding non-woven fabrics to single sheets. In the lamination and bonding sections, a non-contact transport device called a "float chuck" (patented) is used, which can hold flexible thin films or breathable sheets in suspension without causing scratches, dirt, or damage.

• Other processing machines

1. Features a. Stacking and layering without contact b. Does not cause scratches or dirt on the film c. High speed e. Clean 2. Applications a. Polarizing plates b. FPC (Flexible Printed Circuit) c. Plastic sheets d. Bright metallic sheets

• Other semiconductor manufacturing equipment

TAIKO wafers, ultra-thin wafers with a thickness of 20μm, and compound semiconductor wafers can be suspended and transported non-contact without damage. It does not cause stress on the wafers. Wafers with warping can also be suspended and transported non-contact without damage. The air consumption is very low, making it economical.

• Other semiconductor manufacturing equipment
• Wafer
• Semiconductor inspection/test equipment

A device that non-contact feeds, transports, and laminates amorphous solar cells, polarizing plates, light guide plates, films, paper, and sheets. It employs a non-contact transport device called "Float Chuck" (patented), which transports films non-contact by blowing air. It does not allow scratches or dirt to adhere to the workpiece. It is also suitable for weak and fragile films.

• Other industrial robots
• Semiconductor inspection/test equipment
• Other machine elements