List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
451～495 item / All 4994 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Evaluation of Organic Coatings on Metals Using Electrochemical Measurement Devices Based on ISO 17463 - Paints and Varnishes
- Analytical Equipment and Devices
- Etching Equipment
- Wafer
From site surveys to design and construction, experienced engineers will handle it!
- Other electronic parts
- Sputtering Equipment
Designed a high-efficiency dryer using near-infrared halogen lamps! By promoting drying and effects from the inside, it reduces un-dried and un-cured areas! Energy-saving and long-lasting!
- Other semiconductor manufacturing equipment
Near Infrared Dryer Promo Series
Customize the "Near Infrared Dryer Promo" to fit your purpose and size! The "Promo Series" includes: - Paint dryers - Dryers for inkjet printers Both can be customized to fit your factory layout, purpose, environment, and desired performance!! - Existing dryers lack power... - They don't fit the size of conveyors... - There is nothing that can be used in the available space... etc... We can create an original design tailored to your needs. Please feel free to consult with us. You can check the basic specifications on our website.
Contributing to the reduction of chemical usage and the lowering of wastewater treatment loads! A wide lineup of functional water devices.
- Other semiconductor manufacturing equipment
- Other cleaning machines
Advanced electrical resistivity control technology suppresses static electricity in ultra-pure water!!
- Other semiconductor manufacturing equipment
Full package of RO + EDI! Environmentally friendly pure water system (pure water production system)
- Other semiconductor manufacturing equipment
- others
Easily in places where pure water is needed!
- Other semiconductor manufacturing equipment
Precision temperature control, cleanroom manufacturing. Heaters supporting next-generation semiconductors.
- Heating device
- Other heaters
- Other semiconductor manufacturing equipment
No soldering required. The new standard for cooling plates.
- Other semiconductor manufacturing equipment
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Solving Gas Solidification Troubles! Case Study of Temperature Improvement Using High-Performance Mica Heaters
- Heater
- Other heaters
- Other semiconductor manufacturing equipment
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
- Sputtering Equipment
- Etching Equipment
- CVD Equipment
Providing mass production solutions for high-speed and flexible substrate film deposition applications!
- Sputtering Equipment
- Etching Equipment
The illumination distribution of the exposure light source is within ±5%! A lineup of desktop and standalone models is available.
- Wafer processing/polishing equipment
We offer sizes of 4 inches and 8 inches! It has high versatility compatible with round and square samples.
- Other semiconductor manufacturing equipment
Simultaneous processing of stainless materials such as SUS316 using CNC lathes and machining centers. Manufacturing high-precision ring parts for semiconductor production.
- Other semiconductor manufacturing equipment
- Processing Contract
Safe even at 1000℃. An insulating material suitable for thermal design.
- Other machine elements
- Other processing machines
- Other semiconductor manufacturing equipment
Flagship model: A handler that thoroughly pursues excellent stability and significant reductions in working time.
- Semiconductor inspection/test equipment
- Circuit Board Inspection Equipment
- Testing Equipment and Devices
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environm...
- CVD Equipment
- Sputtering Equipment
- Resist Device
Pre-treatment for metal structure inspection will be carried out due to surface corrosion caused by chemicals.
- Other services
- Processing Contract
- Etching Equipment
Polishing equipment (Edge Polish) that performs mirror polishing, rough polishing, and cleaning using filtered water and pure water as the medium without slurry.
- Other semiconductor manufacturing equipment
Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.
- Sputtering Equipment
- Etching Equipment
Correction of sensitivity coefficients and sputtering rates across all depths in response to changes in the sample matrix, enabling high-precision depth profile analysis.
- Contract Analysis
- Secondary ion mass spectrometer
- Ion implantation equipment
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
- Sputtering Equipment
- Etching Equipment
Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.
- Sputtering Equipment
- Etching Equipment
Introducing the BAK deposition platform that allows for various chamber sizes and process automation options.
- Evaporation Equipment
It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!
- Tester
The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!
- Tester
A unique LED UV curing solution with numerous patents obtained! Applying UV resin curing in electronics, industry, medical, and optics!
- Other semiconductor manufacturing equipment
- LED Module
- Ultraviolet irradiation equipment
Expanding UV LED products to strengthen response to the growing and diversifying needs for ultraviolet curing.
Excelsius Noble Light Japan Co., Ltd. (Headquarters: Bunkyo-ku, Tokyo, President: Masahiko Suzuki, hereinafter referred to as "the Company") will expand its product portfolio of UV LEDs, one of the light sources for UV curing, and strengthen the provision of UV curing process solutions in new growth areas. In January 2024, the Company was absorbed by Excelsius Technologies, headquartered in the United States (hereinafter referred to as "Excelsius"), and is now handling UV LED products previously managed by its predecessor, Heraeus Noblelight Japan Co., Ltd., and Foseon Technology Japan Co., Ltd., as well as Excelsius. These products encompass a wide range of UV LED light sources for line and area irradiation as well as spot irradiation, regardless of cooling methods. As market demands become increasingly diverse, the Company has established a system that enables more detailed proposals to a broad range of industries through this product expansion.
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
- Analytical Equipment and Devices
- Wafer
- Semiconductor inspection/test equipment
Achieving thin film coating in micrometer units with a coater head (slot coat) application device.
- Coater
Used for temporary fixing and bonding with hot melt adhesive!
- Molding Equipment
OptiSeal VSE is a versatile external pressure face seal. It features low friction, excellent chemical resistance, and can be used in environments ranging from extremely low temperatures to high temper...
- Sealing
- Other machine elements
- Other semiconductor manufacturing equipment
We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!
- Semiconductor inspection/test equipment
- Semiconductors and ICs
- Microcomputer
Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?
The spread of 5G communication, the electrification of the automotive industry, the intensification of US-China trade friction represented by certain semiconductor manufacturers leading to supply stoppages, and the rapid increase in digital products due to the impact of the COVID-19 pandemic are various social phenomena that are increasing the demand for semiconductors. Along with these developments, the acceleration of semiconductor supply risks is progressing. In addition to the adoption of new products, evaluation of existing and distributed products is also necessary... However, the personnel involved in new adoption and product evaluation are limited. Do you have any of these concerns? - Lack of know-how to evaluate semiconductor components - Want to evaluate alternative products but lack personnel and equipment - Want to use stock items and market products but have concerns about reliability - Unable to determine whether the delivered semiconductor products are counterfeit or genuine At Eurofins FQL, we leverage our years of experience in component evaluation and failure analysis to provide not only semiconductor evaluations but also failure analysis services. Additionally, we offer evaluations of distributed products to assist in determining the authenticity of counterfeit, imitation, or long-term stored items. Please feel free to contact us.
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Automating the concentration process involving neutralization and matrix removal in ion chromatography to measure impurities in high-purity ammonium hydroxide used in semiconductor manufacturing.
- Analytical Equipment and Devices
- Ion Chromatography
- Semiconductor inspection/test equipment
Processing S45C quenched and tempered steel using high-precision CNC machining technology. Manufacturing ring components for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Processing Contract
Using SUS304 stainless steel and utilizing NC lathes, machining centers, and cylindrical grinding, we manufacture high-precision ring components for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Processing Contract
Measurement of hydrogen peroxide trimethylamine and standard cations for semiconductor manufacturing using ion chromatography.
- Ion Chromatography
- Semiconductor inspection/test equipment
- Analytical Equipment and Devices
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
- Sputtering Equipment
- Evaporation Equipment
- CVD Equipment
Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations with precisely adjusted process gas pressure (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
- Annealing furnace
- Heating device
- Electric furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.