List of Etching Equipment products
- classification：Etching Equipment
1～45 item / All 336 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Flow spray of 2 mmlit/min or less is possible!
- nozzle
- valve
- Etching Equipment
Start of distribution of 3D CAD data for Sonia Corporation's ultrasonic spray nozzle.
We have started distributing 3D CAD data for the Sonia ultrasonic spray nozzles. Designers and equipment manufacturers can efficiently proceed with equipment design and layout considerations by confirming product shapes and mounting dimensions in advance. This time, we have also released the 3D CAD data for the ultrasonic spray nozzles "WS40K" and "WS130K," which can be used for interference checks and design simulations before implementation. Sonia's ultrasonic spray nozzles cater to a wide range of applications, including precision coating, surface treatment, humidification, and cleaning. By providing 3D CAD data, we support the reduction of design man-hours and the shortening of development periods, facilitating a smooth process from product selection to equipment development.
Ion exchange membrane electrolytic cell that achieves both high-purity oxidant production and gas separation.
- Other recycling systems
- Other surface treatment equipment
- Etching Equipment
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
☆★☆★【nanoCVD-WGP】Wafer-scale graphene/carbon nanotube synthesis device ☆★☆★
Plasma CVD equipment compatible with wafer sizes Φ3 inch and Φ4 inch. Rapid synthesis of clean, high-quality graphene while suppressing impurities. Usable with both thermal CVD and low to high temperature plasma CVD methods. The configuration can be customized according to requirements, including mass flow gas supply systems and substrate heating heaters. 【Example of equipment configuration】 - Substrate: Cu, Ni, etc. (film, foil) - Raw materials: CH4, C2H4, solids (PMMA), etc. - Process gases: H2, Ar, N2, etc. - Substrate size: Φ4 inch - 150W, 13.56MHz RF power supply - Substrate heating from 500℃ to Max 1100℃ - High precision process gas pressure APC control - Mass flow controller with a maximum of 4 channels
![Soft Etching Device [nanoETCH]](https://image.mono.ipros.com/public/product/image/e80/2000071234/IPROS34856758710167043703.jpeg?w=280&h=280){kind=small}
<30W Low power - Etching control precision 10mW Achieving damage-free and delicate etching processing.
- Etching Equipment
Lab6 Discharge Plasma Generation Heater for Thermal Electron Gun
Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800℃ (Graphite, C/C Composite) We will manufacture according to your requested specifications. This is a cylindrical heating unit that can be applied in high vacuum for various purposes. We can custom-make it for heating samples in crucibles within the cylindrical heating range, heating metal, ceramic, and wire-shaped samples, depending on the purpose. ◎ Usable Environment: In vacuum, in inert gas, etc. ◎ Heating Element: Graphite, C/C composite heater, SiC coating, PG coating, tungsten, tantalum, etc. ◎ Manufacturing Range: Heater section (up to approximately Φ150 x 100mm), introduction flange, temperature control unit ◎ Applications: Sample heating in various vacuum device process chambers, discharge plasma generation unit thermal electron gun (Lab6), rapid heating of gas supply system piping (liquid rapid vaporization) We also manufacture custom specifications according to other requests. For details, please contact us.
We will solve the shortage of outsourcing partners for precision processing due to capacity overload at existing factories, such as in semiconductors and precision components.
- Etching Equipment
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
☆★☆★【nanoCVD-WGP】Wafer-scale graphene/carbon nanotube synthesis device ☆★☆★
Plasma CVD equipment compatible with wafer sizes Φ3 inch and Φ4 inch. Rapid synthesis of clean, high-quality graphene while suppressing impurities. Usable with both thermal CVD and low to high temperature plasma CVD methods. The configuration can be customized according to requirements, including mass flow gas supply systems and substrate heating heaters. 【Example of equipment configuration】 - Substrate: Cu, Ni, etc. (film, foil) - Raw materials: CH4, C2H4, solids (PMMA), etc. - Process gases: H2, Ar, N2, etc. - Substrate size: Φ4 inch - 150W, 13.56MHz RF power supply - Substrate heating from 500℃ to Max 1100℃ - High precision process gas pressure APC control - Mass flow controller with a maximum of 4 channels
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommoda...
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
☆★☆★【nanoCVD-WGP】Wafer-scale graphene/carbon nanotube synthesis device ☆★☆★
Plasma CVD equipment compatible with wafer sizes Φ3 inch and Φ4 inch. Rapid synthesis of clean, high-quality graphene while suppressing impurities. Usable with both thermal CVD and low to high temperature plasma CVD methods. The configuration can be customized according to requirements, including mass flow gas supply systems and substrate heating heaters. 【Example of equipment configuration】 - Substrate: Cu, Ni, etc. (film, foil) - Raw materials: CH4, C2H4, solids (PMMA), etc. - Process gases: H2, Ar, N2, etc. - Substrate size: Φ4 inch - 150W, 13.56MHz RF power supply - Substrate heating from 500℃ to Max 1100℃ - High precision process gas pressure APC control - Mass flow controller with a maximum of 4 channels
Evaluation of Organic Coatings on Metals Using Electrochemical Measurement Devices Based on ISO 17463 - Paints and Varnishes
- Etching Equipment
- Wafer
- Other surface treatment equipment
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
Lab6 Discharge Plasma Generation Heater for Thermal Electron Gun
Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800℃ (Graphite, C/C Composite) We will manufacture according to your requested specifications. This is a cylindrical heating unit that can be applied in high vacuum for various purposes. We can custom-make it for heating samples in crucibles within the cylindrical heating range, heating metal, ceramic, and wire-shaped samples, depending on the purpose. ◎ Usable Environment: In vacuum, in inert gas, etc. ◎ Heating Element: Graphite, C/C composite heater, SiC coating, PG coating, tungsten, tantalum, etc. ◎ Manufacturing Range: Heater section (up to approximately Φ150 x 100mm), introduction flange, temperature control unit ◎ Applications: Sample heating in various vacuum device process chambers, discharge plasma generation unit thermal electron gun (Lab6), rapid heating of gas supply system piping (liquid rapid vaporization) We also manufacture custom specifications according to other requests. For details, please contact us.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
Lab6 Discharge Plasma Generation Heater for Thermal Electron Gun
Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800℃ (Graphite, C/C Composite) We will manufacture according to your requested specifications. This is a cylindrical heating unit that can be applied in high vacuum for various purposes. We can custom-make it for heating samples in crucibles within the cylindrical heating range, heating metal, ceramic, and wire-shaped samples, depending on the purpose. ◎ Usable Environment: In vacuum, in inert gas, etc. ◎ Heating Element: Graphite, C/C composite heater, SiC coating, PG coating, tungsten, tantalum, etc. ◎ Manufacturing Range: Heater section (up to approximately Φ150 x 100mm), introduction flange, temperature control unit ◎ Applications: Sample heating in various vacuum device process chambers, discharge plasma generation unit thermal electron gun (Lab6), rapid heating of gas supply system piping (liquid rapid vaporization) We also manufacture custom specifications according to other requests. For details, please contact us.
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
Lab6 Discharge Plasma Generation Heater for Thermal Electron Gun
Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800℃ (Graphite, C/C Composite) We will manufacture according to your requested specifications. This is a cylindrical heating unit that can be applied in high vacuum for various purposes. We can custom-make it for heating samples in crucibles within the cylindrical heating range, heating metal, ceramic, and wire-shaped samples, depending on the purpose. ◎ Usable Environment: In vacuum, in inert gas, etc. ◎ Heating Element: Graphite, C/C composite heater, SiC coating, PG coating, tungsten, tantalum, etc. ◎ Manufacturing Range: Heater section (up to approximately Φ150 x 100mm), introduction flange, temperature control unit ◎ Applications: Sample heating in various vacuum device process chambers, discharge plasma generation unit thermal electron gun (Lab6), rapid heating of gas supply system piping (liquid rapid vaporization) We also manufacture custom specifications according to other requests. For details, please contact us.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
☆★☆★【nanoCVD-WGP】Wafer-scale graphene/carbon nanotube synthesis device ☆★☆★
Plasma CVD equipment compatible with wafer sizes Φ3 inch and Φ4 inch. Rapid synthesis of clean, high-quality graphene while suppressing impurities. Usable with both thermal CVD and low to high temperature plasma CVD methods. The configuration can be customized according to requirements, including mass flow gas supply systems and substrate heating heaters. 【Example of equipment configuration】 - Substrate: Cu, Ni, etc. (film, foil) - Raw materials: CH4, C2H4, solids (PMMA), etc. - Process gases: H2, Ar, N2, etc. - Substrate size: Φ4 inch - 150W, 13.56MHz RF power supply - Substrate heating from 500℃ to Max 1100℃ - High precision process gas pressure APC control - Mass flow controller with a maximum of 4 channels
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
☆★☆★【nanoCVD-WGP】Wafer-scale graphene/carbon nanotube synthesis device ☆★☆★
Plasma CVD equipment compatible with wafer sizes Φ3 inch and Φ4 inch. Rapid synthesis of clean, high-quality graphene while suppressing impurities. Usable with both thermal CVD and low to high temperature plasma CVD methods. The configuration can be customized according to requirements, including mass flow gas supply systems and substrate heating heaters. 【Example of equipment configuration】 - Substrate: Cu, Ni, etc. (film, foil) - Raw materials: CH4, C2H4, solids (PMMA), etc. - Process gases: H2, Ar, N2, etc. - Substrate size: Φ4 inch - 150W, 13.56MHz RF power supply - Substrate heating from 500℃ to Max 1100℃ - High precision process gas pressure APC control - Mass flow controller with a maximum of 4 channels
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
Lab6 Discharge Plasma Generation Heater for Thermal Electron Gun
Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800℃ (Graphite, C/C Composite) We will manufacture according to your requested specifications. This is a cylindrical heating unit that can be applied in high vacuum for various purposes. We can custom-make it for heating samples in crucibles within the cylindrical heating range, heating metal, ceramic, and wire-shaped samples, depending on the purpose. ◎ Usable Environment: In vacuum, in inert gas, etc. ◎ Heating Element: Graphite, C/C composite heater, SiC coating, PG coating, tungsten, tantalum, etc. ◎ Manufacturing Range: Heater section (up to approximately Φ150 x 100mm), introduction flange, temperature control unit ◎ Applications: Sample heating in various vacuum device process chambers, discharge plasma generation unit thermal electron gun (Lab6), rapid heating of gas supply system piping (liquid rapid vaporization) We also manufacture custom specifications according to other requests. For details, please contact us.
Processing speed is 0.6 to 5.0 m/min (variable)! We provide cleaning equipment for organic EL manufacturing lines.
- Other cleaning machines
- Etching Equipment
Automatically mixes the chemical solution and delivers the required amount to the etching tank! It uses a sequencer control method.
- Etching Equipment
Advanced horizontal etching for PCB/PCM. VACU-Etch technology ensures 1-mil line uniformity by eliminating the puddle effect.
- Etching Equipment
Supports aviation, medical, and fuel cell applications. Achieves high-precision titanium surface processing using hydrofluoric acid control technology, with a focus on safety and environmental conside...
- Other processing machines
- Etching Equipment
It enables extremely precise flow control, achieving a very low pulsation and smooth flow of liquid.
- Coater
- Etching Equipment
- CMP Equipment
JACLaS EXPO 2026 Exhibition
◆◇◆ We introduce contract development and manufacturing services for diagnostic and medical devices, as well as precision pumps and robotic arms for OEM purposes. ◆◇◆ Tekan utilizes reliable liquid handling and robotic technology to provide a variety of OEM equipment and components in the fields of clinical testing and life sciences. From optimal equipment concept development for the global market to compliance with regulations in various countries and local services, Tekan leverages its extensive resources to provide support. If you have challenges or goals such as the following, please visit the Tekan booth: - You want to develop or improve preprocessing devices or next-generation devices for your current systems. - You want to launch high-quality in-house preprocessing and automated analysis devices. - You want to achieve development that exceeds market expectations through strategic industrial and UI/UX design.
Are you struggling with fading or peeling text on nameplates in harsh outdoor or oil-soaked environments? We offer custom-made, high-durability nameplates produced from a single drawing.
- Etching Equipment
- Nameplate
Expansion to advanced packages: Processing is possible on a 510×515mm substrate.
- Sputtering Equipment
- Etching Equipment
- Annealing furnace
A slim and high-performance syringe pump that simplifies the design of flow path systems and their integration into devices.
- Coater
- Resist Device
- Etching Equipment
JACLaS EXPO 2026 Exhibition
◆◇◆ We introduce contract development and manufacturing services for diagnostic and medical devices, as well as precision pumps and robotic arms for OEM purposes. ◆◇◆ Tekan utilizes reliable liquid handling and robotic technology to provide a variety of OEM equipment and components in the fields of clinical testing and life sciences. From optimal equipment concept development for the global market to compliance with regulations in various countries and local services, Tekan leverages its extensive resources to provide support. If you have challenges or goals such as the following, please visit the Tekan booth: - You want to develop or improve preprocessing devices or next-generation devices for your current systems. - You want to launch high-quality in-house preprocessing and automated analysis devices. - You want to achieve development that exceeds market expectations through strategic industrial and UI/UX design.
![[Tooling-Free Mass Production] Mach...](https://image.mono.ipros.com/public/product/image/2000158412/IPROS4317513488585082420.JPG?w=280&h=280){kind=small}
Fast and flexible low-volume production
- Contract manufacturing
- Etching Equipment
- Engine parts
High-durability PTFE hoses achieve both high flexibility and durability due to their fine wave PTFE structure. They are suitable for chemical supply lines and movable piping sections in semiconductor ...
- hose
- Other semiconductor manufacturing equipment
- Etching Equipment
![[For Semiconductors] High voltage r...](https://image.mono.ipros.com/public/product/image/2074022/IPROS3851412570407366522.jpeg?w=280&h=280){kind=small}
High-pressure resistant PTFE hoses adopt a fine wave PTFE corrugation structure. They achieve both high pressure resistance and low reaction force, making them suitable for high-purity chemical lines ...
- hose
- Other semiconductor manufacturing equipment
- Etching Equipment
UHP/UHV, ultra-high purity, ultra-high vacuum, advanced metal sealing solutions for ultra-low temperature.
- Sealing
- CVD Equipment
- Etching Equipment
Delta Seal (HNV HELICOFLEX(R) DELTA) achieves ultra-high vacuum! [Standardized for JIS V-groove flanges]
- Sealing
- CVD Equipment
- Etching Equipment
[Standardized for JIS V Groove Flange] Low Tightening Pressure Y 'Ultra High Vacuum Delta Seal' for Semiconductor Field
The Delta Seal (HNV HELICOFLEX(R) DELTA) has two delta-shaped protrusions on the contact side of the cross-section. The delta-shaped protrusions are designed to collapse and disappear during the compression of the outer casing when the flange groove is assembled. The design tightening pressure of the Delta Seal is lower compared to the Helicoflex seal, allowing for replacement with elastomer O-rings. Leak rate: *For circular shapes, 10⁻¹² Pa·m³/sec. (10⁻¹¹ atm·cm³/sec.) *Depends on the quality of the installation side. 【Features】 ■Two delta-shaped protrusions on the contact side of the cross-section ■Achieves ultra-high vacuum ■Has excellent elasticity and can be used at high temperatures ■Can be replaced with elastomer O-rings *For more details, please refer to the PDF document or feel free to contact us.
![[Case Study] Plasma Analysis of "Pa...](https://image.mono.ipros.com/public/product/image/aec/2000679537/IPROS56625809199193232139.jpeg?w=280&h=280){kind=small}
Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case
- Etching Equipment
- Wafer
- Ashing device
Total support for the installation and maintenance of semiconductor manufacturing equipment, from precision equipment installation compatible with clean rooms! Additional information.
- CVD Equipment
- Etching Equipment
- Resist Device
We propose specifications that consider cost reduction through wet etching.
- Etching Equipment
The mid-infrared wavelength tunable laser OPPO MIR is a picosecond pulse laser that can be adjusted in the wavelength range of 2.8 to 4.2 µm, with a maximum output of over 1W.
- Etching Equipment
As an automatic device for chemical polishing of thin glass substrates for LCDs, it is suitable for thinning processes up to the G6 generation.
- Other processing machines
- Etching Equipment
- Other surface treatment equipment
High corrosion-resistant and durable rollers suitable for the etching process.
- Etching Equipment
Round hole filters and honeycomb mesh, etc.! You can create freely shaped designs.
- Etching Equipment
Technological capabilities that contribute to the development and practical application of advanced materials.
- Etching Equipment
- Plating Equipment
- Other surface treatment equipment
Design of the arrangement of transport components (rolls) developed independently by our company! Stable transport without corner bends or dents is possible.
- Etching Equipment
We respond to strict requirements for small lots! Etching processing.
- Etching Equipment
Compact yet professional! Reproducing realistic etching tests with a small amount of liquid.
- Etching Equipment
The film is transported to ensure that the load does not exceed a certain value! This achieves high spray efficiency.
- Etching Equipment
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
- Sputtering Equipment
- Etching Equipment
- CVD Equipment
Providing mass production solutions for high-speed and flexible substrate film deposition applications!
- Sputtering Equipment
- Etching Equipment
Pre-treatment for metal structure inspection will be carried out due to surface corrosion caused by chemicals.
- Other services
- Processing Contract
- Etching Equipment