We have introduced the laser processing machine ML3015HV2-R!!
From hole drilling to complex curves, highly flexible processing is possible. We will respond to our customers' requests 120%.
The SS400 series can be cut from t1.2 to t12, and the SUS series can be cut from t0.5 to t12. We can accommodate all sizes of plates from 3×6 to 5×10. *The plate thickness mentioned above is subject to consultation.
- Company:サキノ精機
- Price:Other