Bump adhesive
Special processing on the adhesive side of the adhesive sheet! Introducing our unique technology that controls adhesive strength.
The "Bump Adhesive" developed by our company is a technology that applies special processing to the adhesive surface of adhesive-coated products, allowing for partial variability in adhesive strength. It enables the creation of adhesive sheets that have a low initial tack for easy alignment, yet adhere firmly when pressure is applied. Additionally, it is possible to control part of a strong adhesive sheet to have "medium tack," while another part can have "weak tack" or "micro tack." Please feel free to contact us for inquiries. 【Features】 ■ Ability to variably adjust adhesive strength in specific areas. ■ Forming a thick film on the adhesive surface allows for micro tack. ■ Forming a thin film on the adhesive surface allows for medium tack. ■ Not forming a film on the adhesive surface allows for strong tack. ■ By adjusting the film thickness, adhesive sheets with low initial tack that are easy to align can be achieved. ■ Firm adhesion when pressure is applied makes it possible to create adhesive sheets for temporary fixing, etc. *For more details, please refer to the PDF document or feel free to contact us. *This is a developed product.
- Company：日榮新化
- Price：Other
