プレシテック・ジャパン List of Products and Services

This is a contour control device for Precitec cutting heads. It integrates the "EG8010," "EG8030," or "EG8050" contour sensor amplifiers and the "I/O board" for laser focus position control into a single unit. The GUI functionality, which can be operated via a web browser, allows for easy management and monitoring of the head's status. The BeamTech function automatically corrects the laser focus position to mitigate the adverse effects of thermal focus shift phenomena, which are a major concern in high-power laser cutting, enabling cutting at the correct laser focus at all times. Communication between the NC or PLC and the CutBox will be via bus control communication using EtherCAT or ProfiNet. Unlike digital I/O, it allows for the exchange of multiple pieces of information.

• Other machine tools

■ Improvement of productivity and quality of cut surfaces: The laser always remains on without compromising the expansion rate. ■ Direct maintenance can be performed while the device is installed: Reduces downtime and allows for quick and easy repairs. ■ Easy and quick maintenance is possible: Engineering components are placed at the front. Designed to prevent contamination. ■ Supports 24/7 production: Equipped with various sensors to ensure process stability. ■ Cutting with variable magnification: Superior performance compared to fixed optical systems. ■ Compatible with 30kW and beam shaping lasers.

• Other machine tools

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.

• Coating thickness gauge

This is a single-point sensor using a chromatic aberration confocal method from Pretech, characterized by high precision and high-speed measurement. It has a proven track record in reducing measurement time for thickness and shape, as well as in full inspection. Due to the chromatic aberration confocal method, it is also possible to use probes with a large angular tolerance. There is also a budget sensor lineup available, starting from approximately 800,000 yen. *For more details, please refer to the materials. Feel free to contact us as well.*

• Distance measuring device

This is an application document for vial measurement using a chromatic aberration confocal sensor. It features high speed and high precision, enabling the automation of thickness and shape inspection with PreciTech's optical sensors. There is a lineup of single-point, dual-point, and line sensors available. It offers Z resolution from a few nanometers and high-speed measurement up to 70 kHz. *For more details, please refer to the document. Feel free to contact us with any inquiries.*

• Distance measuring device

The coaxial wire supply method laser cladding welding "CoaxPrinter" is a laser cutting head capable of handling a wide range of applications in additive manufacturing, from filigree structures to complex shapes and designs. It can be used for 3D printing, prototype manufacturing, and protection against wear, achieving uniform cladding quality that is independent of direction. 【Features】 ■ Coaxial laser processing head that focuses a ring-shaped laser around the wire ■ No need for alignment between the wire and laser... reduces labor for skilled technicians ■ The head is slim, with no restrictions on welding direction... non-directional processing ■ Reduces waste of wire that was previously discarded during alignment... lowers material costs ■ Eliminates leftover wire at the end of welding, so there is no need to cut the wire with nippers after each processing... reduces workforce ■ The wide tolerance in the Z direction makes it less likely for processing defects due to focal shift... reduces defective products ■ The approaching laser focuses on the wire, warming it before processing... dramatically increases processing speed *For more details, please download the PDF or contact us directly.

• Welding robot
• Welding Machine

High-quality laser welding of copper and aluminum is essential for e-mobility applications. Despite the challenges posed by these highly reflective and thermally conductive materials, achieving precise welding results is crucial for optimal conductivity and stable circuits. In collaboration with Cailabs, we provide innovative beam shaping solutions that enhance laser interaction with these materials. By using beam shaping technology, the laser output is divided into points and rings, allowing for an even distribution of laser output. Due to the low thermal load, the seams become more homogeneous, and the amount of spatter is significantly reduced. This system is easy to implement, as all optical components are integrated, ensuring long-term stability, reliability, and maintenance-free operation. All components enable the use of high laser output through a fully reflective design and optimized cooling, guaranteeing a stable process. Additionally, an online quality management system can also be integrated.

• Welding Machine

■ Optical Measurement Sensors ・Enovsaense - Measurement of thickness of opaque materials Thickness of graphite coating on batteries ・Field Sensor - Internal defect inspection Area inspection of defects inside welds (Cracks, blowholes, pinholes, etc.) ・Dual Point Sensor (DPS) - Measurement of electrode thickness High-speed and high-precision measurement using two distance sensors ・FSS - Measurement of insulation layer thickness Combination of galvanometer mirror and OCT to quickly obtain thickness profiles ・CVC (Line Camera) - Burr inspection Automatic inspection of burrs after cutting battery foil ・CLS (3D Line Sensor) - Battery weld joint shape Shape measurement using a high-speed 3D line sensor ■ Welding Monitoring ・LWM - Laser welding In Process monitoring Good product determination based on three types of light during welding Over 15,000 units in operation ■ Laser Welding ・Scan Master - Laser welding Welding head incorporating various functions

• Defect Inspection Equipment

1. Area sensor for internal defect inspection in welding - Field sensor Capable of simultaneous measurement of 110,000 points with image output. Replaces electron microscopes that require X-ray, CT scans, and work cuts. 2. Non-contact thickness measurement sensor for opaque materials - Enovasense Capable of measuring the thickness of resins, coatings, and metal coatings. Measurement range is 10nm to 1mm, with a measurement speed of 1 second or more, and measurement variation is approximately 0.5% to 3%. 3. Line camera for burr inspection after battery foil cutting - CVC A line camera with a maximum of 100kHz, capable of inline burr detection. 4. Insulation layer thickness measurement sensor - FSS Measures the thickness profile of battery insulation layers inline with a resolution of a few nm. 5. Dual point sensor for electrode thickness measurement - DPS Enables high-precision thickness measurement with a distance sensor of a few nm resolution. ■ Others 6. Line sensor for 3D shape measurement of battery can welds - CLS 7. - LWM

• Defect Inspection Equipment

Our optical distance sensor/thickness sensor 'CHRocodile C / CHRocodile Mini' from PreciTech Japan is a compact non-contact sensor with a wide measurement range. It is robust against slopes and offers high resolution in the distance direction starting from 20nm, all at an affordable price of approximately 1 million yen (excluding tax). 【Examples of Use Cases】 ● Complete inspection through height and distance measurement of manufactured products within equipment ● Quality improvement through thickness management of glass, film, and graphite coatings ⇒ Adopted by manufacturers of production equipment, inspection equipment, and integrators. 【Features】 ・Combines high resolution with a price point that lowers the purchasing barrier ・Non-contact measurement of film and coating thickness ・Strong against slopes with an angle tolerance of up to ±45 degrees ・Distance direction resolution starting from 20nm ・Flexible software creation possible with the provided software development kit ・Can be embedded in equipment ・Compatible with rough and mirror surfaces, independent of surface or shape *For product details, please refer to the materials available for download in PDF format. Feel free to contact us for inquiries.

• Distance measuring device

■ For fiber transmission lasers such as fiber lasers, disk lasers, and LD lasers ■ Usable with lasers up to 6kW ■ Since the wire and laser come out coaxially, there is a wide Z-axis processing allowance ■ The wire is always supplied from the center axis of the laser, eliminating the need for delicate adjustments between the wire, laser, and workpiece ■ The laser preheats the wire, improving the shaping speed ■ Temperature monitoring with a pyrometer allows for laser power control and heat input management ■ Height monitoring before and after buildup with OCT controls wire supply and laser power for shape management

• Other machine tools

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. This new product is an area sensor that can simultaneously measure approximately 110,000 points, unlike conventional single-point sensors. It can detect not only the thickness mapping of opaque materials but also the presence of defects, chips, and delaminations beneath the surface layer. ■ Features - Non-contact measurement of the following: ☆ Thickness mapping of opaque materials ☆ Detection of defects beneath opaque surface material layers No destructive testing is required. - As an area sensor, it can measure approximately 110,000 points simultaneously in one second. - It can also be applied to detect defects in areas such as welds, where conventional X-ray or CT scans are typically required. - Measurement is possible with various combinations of materials, regardless of the base material. ■ Applications Automotive industry, aerospace industry, consumer goods, industrial products, medical industry, semiconductor field. It can be used in various applications such as coating thickness, metal plating thickness, paint films, and welds. *For more details, please check the PDF download or contact us.

• Defect Inspection Equipment

Non-contact optical thickness measurement. Applicable for thickness measurement of semiconductor wafers where high precision is required. The new product 'CHRocodile 2 SX' is a device that can measure the thickness of materials such as wafers and coatings without contact. It supports high-speed sampling of up to 5 kHz, making it suitable for inline applications. In addition to measuring the thickness of semiconductor wafers like Si, it can also measure the thickness of films, resins, glass, solar cells, and more. In particular, when thickness monitoring is desired during wafer grinding, it can measure thicknesses from 200 µm to 0.5 µm for Si wafers. 【Features】 ■ Wide range of thickness measurement, compatible with various materials With a rich lineup of probes, it can measure thicknesses from thin films (around 2 µm) to thick films (1000 µm) at optical lengths, and from 0.5 to 200 µm for Si. ■ High resolution (sub-micron, minimum 3 nm @ optical length) ■ Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for device integration ■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation.

• Coating thickness gauge

■ For IR lasers used in fiber transmission such as fiber lasers and disk lasers ■ Usable with medium power range lasers up to 6.6 kW ■ Compatible with a wide variety of laser cutting conditions from thin plates to thick plates ■ Available for 2D applications for flatbed processing machines and 3D applications for articulated robots ■ By using contour control devices, it is possible to maintain a constant distance from the workpiece to the nozzle ■ Capable of accommodating different materials and plate thicknesses with a focus position that can be adjusted dynamically and at high speed

• Other machine tools

■ For fiber transmission IR lasers such as fiber lasers and disk lasers ■ Multi-mode lasers can be used up to 4kW ■ Ideal for cutting from thin steel plates to thick plates of about 10mm ■ Available for 2D processing machines with flat beds and for 3D applications with articulated robots ■ By adding contour control devices, it is possible to maintain a constant distance from the workpiece to the nozzle

• Other machine tools

The Flying Spot Scanner 310 is an optical measuring device that can perform wide-area (up to φ310) scans using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. It can measure thickness, dimensional shapes, and inspect surface defects based on the principle of spectral interference. Additionally, due to the coaxial optical system for incident and reflected light, it is possible to obtain good results even on glossy surfaces. 【Features】 ■ Wide-area scan φ310mm ■ High resolution XY20um Beam spot diameter 40um, high Z resolution through spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit for device integration (DLL, etc.) available ■ Applications Thickness measurement of 12-inch wafer surfaces, thickness measurement of bonded wafers, void inspection *For more details, please refer to the documentation.

• Coating thickness gauge
• 3D measuring device

■ A scanner optical system equipped with all functions for tracking, monitoring, and inspection. ■ All functions are consolidated into a single control device, making control from the PLC easy. ■ All settings, editing, and management can be performed through a GUI displayed on a single monitor, making operation easy. ■ Since ScanMaster controls all functions during processing, communication time for control from the PLC is reduced, significantly shortening processing time. ■ Not only XYZ correction but also control of welding trajectories and laser power based on the workpiece's gap, steps, and shape, aiming for zero welding defects. <Representative functions equipped in ScanMaster> - 2D scanner enabling dynamic processing - Motor-driven collimator for high-precision adjustment of laser focus - OCT for accurately measuring the height of the workpiece - LPM sensor for measuring laser power passing through the processing head - LWM for assessing processing quality during laser welding using plasma, temperature, and reflected light - Sensor camera for accurately detecting welding points through images - Light to brightly illuminate the workpiece and cross jet to prevent spatter adhesion

• Welding Machine

■ Monitoring plasma light, radiation temperature, and laser reflection light during laser welding to determine product quality. ■ The software used for judgment and analysis has improved its judgment capability, performance, and functionality through over 20 years of sales experience and customer feedback. ■ Easy to add not only to new equipment but also to existing equipment. ■ Proven track record as an inspection device for various laser welding applications in the automotive industry, EVs, home appliances, and more. We have demo units available and look forward to your inquiries. Whether you are familiar with the previous LWM or are trying it for the first time, we encourage you to experience the latest LWM.

• Welding Machine

The new product "CHRocodile 2LR ver2" is a device that can non-contact measure the thickness of materials such as wafers and coatings. It adopts a new detector different from the previous "CHRocodile 2LR," allowing for approximately twice the thickness measurement range and more precise measurements. It can also be applied inline, and the CHRocodile 2LR has a proven track record with many customers. It is capable of measuring the thickness of semiconductor wafers like Si, as well as films, resins, glass, and solar cells. It supports interference film thickness of up to 16 layers. 【Features】 　■ Wide thickness measurement range, compatible with various materials 　　　With a rich lineup of probes, it covers thicknesses from thin films (around 32μm) to thick films (3900μm). (The high-precision measurement range is 16~1900μm with linearity of 0.35μm) 　■ High resolution (sub-micron, minimum 1nm) 　■ Contributes to reducing development costs and shortening development lead times, 　　　with a software development kit (DLL, etc.) available for device integration 　■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation.

• Other inspection equipment and devices
• Coating thickness gauge

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

Presitech is a German manufacturer of non-contact sensors. It develops and manufactures optical sensors using chromatic aberration confocal method and spectral interference method. At the end of 2022, it acquired the French company Enovasense, adding sensors that utilize laser heating to measure the thickness of opaque materials to its lineup. The company specializes in high-speed and high-precision thickness measurement, which is used for inspecting wafers, coatings, films, paint films, anti-corrosion coatings, and more. It offers a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. There are numerous achievements in integrating these sensors into semiconductor manufacturing equipment, and they are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. Enovasense's sensors have also demonstrated success in measuring coating thickness for aerospace-related components. *For product details, please refer to the materials available for download in PDF format. Feel free to contact us with any inquiries.*

• Sensors

Presitech is a German manufacturer of non-contact sensors. They develop and manufacture optical sensors using chromatic aberration confocal method and spectral interference method. They specialize in high-speed and high-precision thickness measurement and shape measurement, which are used for wafer thickness, edge shape, height measurement, and flatness measurement and inspection. They offer a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. They have numerous achievements in being integrated into semiconductor manufacturing equipment and are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. **Applications** Thickness measurement before and after wafer processing (such as polishing), thickness measurement of films/l coatings, glass wafer thickness inspection, wafer edge shape, TTV, flatness, wire bonding shape, micro bump shape, weld joint shape, PCB shape, non-contact distance sensors mounted on CMM, thickness of foil for batteries, glass thickness, air gaps, etc. *For more details, please refer to the PDF materials or feel free to contact us.*

• Sensors

This document describes the evaluation results of surface roughness measurements using our optical single-point sensor. It introduces the standard roughness specimens used, measurement results, conclusions, and surface roughness samples with calibration certificates. It also includes features and specifications of the "CHROMATIC LINE SENSOR (CLS)," which is equipped with interchangeable probes suitable for various applications and has an integrated setup. [Contents (excerpt)] ■ Overview ■ Standard roughness specimens used ■ Measurement results and conclusions ■ Surface roughness samples with calibration certificates - measurements at the German headquarters ■ Reference: Line sensor CHROCODILE CLS *For more details, please refer to the PDF document or feel free to contact us.

• Optical Measuring Instruments

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

Our company handles non-contact measurement devices based on the principles of chromatic aberration confocal and interference. These devices can be applied to film thickness measurement, shape measurement, roughness measurement, displacement measurement, and appearance inspection, enabling in-process measurement during manufacturing, high-speed inline inspection, and offline measurement. We offer various interfaces to accommodate embedded applications. Measurements can be performed with high resolution (minimum XY resolution of 1μm and minimum Z resolution of 0.02μm), contributing to improved product quality and reduced time and costs in manufacturing processes. For single-point sensors, we also offer two types of products aimed at lower price points (CHRcodile C, CHRocodile Mini). 【Features】 ■ Wide range of sensor lineup Sensors can be selected according to inspection requirements and materials from various sensor probes. ■ Sensors according to measurement range We provide single-point sensors, line sensor types, and area scan types. ■ Applications Can be utilized for inspection of PCB flex, wire loop inspection, wafer bump inspection, and more. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other measurement, recording and measuring instruments

The "CHRocodile Mini" is an affordable optical single-point sensor priced under 1 million yen. It enables high-speed and high-precision measurement/inspection, capable of distance measurement with nanometer resolution and simultaneous measurement of up to 4 surfaces and 3-layer thickness. It can measure regardless of surface conditions such as rough, mirror, or colored materials, and has a wide measurement range. 【Features】 ■ Wide thickness measurement range, compatible with various materials Covers thickness from (45um) to thick films (400mm) (for a refractive index of 1.5). As a distance sensor, it offers three types of probe lineups: 600um, 4mm, and 10mm. ■ High resolution (Z is sub-micron, XY is several micrometers) ■ Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for device integration. ■ Extensive track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field.

• Distance measuring device
• Testing Equipment and Devices
• Circuit Board Inspection Equipment

Our company handles non-contact type measuring instruments based on the principles of chromatic aberration confocal and interference. These instruments can be applied to film thickness measurement, shape measurement, roughness measurement, displacement measurement, and appearance inspection, allowing for in-process measurement during manufacturing, high-speed inline inspection, and offline measurement. We offer various interfaces to accommodate embedded applications. Measurements can be performed with high resolution (minimum XY resolution of 1μm and minimum Z resolution of 0.02μm), contributing to improved product quality and reductions in manufacturing process time and costs. 【Features】 ■ Wide range of sensor lineup Sensors can be selected according to inspection requirements and materials from various sensor probes. ■ Sensors according to measurement range Available in single-point sensors, line sensor types, and area scan types. ■ Applications Can be utilized for inspection of PCB flex, wire loop inspection, wafer bump inspection, and more. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other measurement, recording and measuring instruments

The "CHRocodile 2 series" is a non-contact sensor capable of in-process measurement of wafer thickness with sub-micron resolution. It is also used for quality control through sampling. In addition to the semiconductor industry, it is adopted in consumer electronics, glass manufacturing, and the medical field, making it suitable for measuring the thickness of transparent materials, coating thickness, and simultaneous measurement of multiple layers (up to 16 layers). 【Features】 - Wide range of thickness measurement, compatible with various materials A rich lineup of probes covers thickness from thin films (a few micrometers) to thick films (780 micrometers). Two principle methods can be selected according to the material. - High resolution (sub-micron, minimum 1nm) High-resolution measurements based on "chromatic aberration confocal method" and "spectral interference method." - Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for equipment integration. - Extensive track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Sensors

Our company offers a system that combines the ultra-fast optical scanner 'Flying Spot Scanner (FSS)', which can perform 3D shape measurements with a maximum diameter of 80mm at high speed, with dedicated sensors. It is capable of measuring flatness, thickness, shape, and the arrangement of layers and components both vertically and horizontally with high precision and speed. We also have a wide range of sensors available, which can be selected according to the required measurement range and accuracy. 【Features of FSS】 ■ High precision: Minimum Z-direction resolution of 5nm ■ High-speed scanning: 70,000 points/second ■ Suitable for inline measurement ■ Partial measurements can be freely conducted within the measurement range *For more details, please refer to the materials. Feel free to contact us as well.

• Sensors
• Other inspection equipment and devices

Presitech is a non-contact sensor manufacturer based in Germany. It specializes in high-speed and high-precision thickness measurement and shape measurement, and is used for measuring and inspecting wafer thickness, edge shape, height, and flatness. It offers a wide measurement range, tolerance angles, and can accommodate various materials, with line sensors and area scanners suitable for full surface measurement. There are many proven applications in semiconductor manufacturing equipment, and it is also used in LCD manufacturing equipment and inline inspection of films. Additionally, it is utilized as a sensor for desktop machines such as standalone units. **Applications** Thickness measurement before and after wafer processing (such as polishing), during processing, film and coating thickness measurement, glass wafer thickness inspection, wafer edge shape, TTV, flatness, wire bonding shape, micro bump shape, weld joint shape, PCB shape, non-contact distance sensors mounted on CMM, battery foil thickness, glass thickness, air gaps, etc. *For more details, please refer to the PDF document or feel free to contact us.*

• Sensors

This document presents applications and proposals for focus monitoring in laser welding. It clearly introduces the necessity of ensuring consistent welding quality, along with specifications and examples of embedded software, using diagrams for better understanding. We encourage you to read it. 【Contents (excerpt)】 ■ Background: The necessity of ensuring consistent welding quality ■ PRECITEC's FOCUS FINDER improves welding quality ■ APPENDIX: Correlation of defocus – NG rate in welding ■ FOCUSFINDER: Specifications ■ Interface *For more details, please refer to the PDF document or feel free to contact us.

• Optical Measuring Instruments
• Sensors

This document contains application examples and proposals for products related to the manufacturing process of consumer electronics. It introduces sub-micron precision displacement, shape, and thickness measurements using optical point sensors, as well as measurements of flatness, thickness, shape, and the arrangement of vertical and horizontal layers and components using FSS. We encourage you to read it. 【Contents (excerpt)】 ■ Applications and Products (designed for inline inspection) - Displacement and thickness measurements using optical single-point sensors and probes - Scanning the desired area for thickness, flatness, and shape - Shape and thickness inspection using color aberration line sensors - Scratch and defect dimension inspection using color aberration line scan cameras - Quality control of welding *For more details, please refer to the PDF document or feel free to contact us.

• Optical Measuring Instruments
• Sensors

In grinding operations, it is necessary to adjust the thickness of the wafer during processing. If using a non-contact, non-destructive optical measurement method, the thickness of the wafer can be monitored during processing without applying stress to the workpiece or damaging it, making it a suitable solution. Our "CHRocodile 2 DPS Chromatic Aberration Confocal Sensor" is equipped with two independent measurement channels. The sensor processes two chromatic aberration probes and synchronizes measurements and outputs in real-time, providing the final height and thickness of the wafer. 【Features】 ■ Development of chromatic aberration probes for harsh environments based on over 10 years of know-how in CMP and grinding interference measurement. ■ Non-contact measurement of wafer thickness in harsh environments. ■ Data acquisition rate of 10 kHz per probe. *For more details, please refer to the PDF document or feel free to contact us.

• Sensors

In the semiconductor industry, it is necessary to measure the physical thickness of wafers at multiple manufacturing stages, such as CMP and mechanical grinding. To monitor and optimize the entire process, it is important to have a grasp of the thickness; however, this task is currently mainly performed using mechanical contact probes. These probes have significant drawbacks, including the need for contact with the wafer, surface damage, and reference values for thickness measurement from the chuck table, and they also wear out, necessitating frequent replacements. Our "CHRocodile 2 IT sensor" can measure the thickness of wafers during processing using non-contact, non-destructive optical measurement technology. 【Features】 - Optical sensor provides more accurate results than conventional contact measurement devices. - Direct feedback improves the reproducibility of wafer thickness from several micrometers to less than 0.5 micrometers. - High-speed measurement and non-contact passive probes allow for the acquisition of a large amount of thickness data across the entire wafer area simply by moving the probe over the sample. - Variability in wafer thickness is revealed from the results, enabling the management of variability during the grinding process. *Product details can be viewed in the materials available for download in PDF format.

• Sensors

When producing container glass bottles, it is necessary to inspect the thickness of each individual bottle despite the high production speed. Currently, it is difficult to measure important parts of containers or to measure black glass and non-spherical containers with existing point probe sensors. Our "CHRocodile MPS 2L sensor" spreads along a line with measurement points up to 12.5 mm in length. With high flexibility and efficiency, it can process each channel individually, allowing configurations such as using one line probe and up to 12 additional point probes. 【Features】 ■ Data collection rate per line probe is 4.5 kHz ■ 108,000 measurements per second with CHRocodile MPS 2L ■ Inline inspection is possible even for fast-moving samples ■ Increasing the sampling rate by reducing the number of channels used ■ CHRocodile MPS 2L allows measurement of up to 24 independent channels and selection of measurement points along the probe line *For more details, please refer to the PDF document or feel free to contact us.

• Sensors

To meet the need for speeding up production processes, data from ultra-fast inline measurements is essential. Such technology requires non-contact, high precision, as well as robustness, high reliability, and high-resolution 3D imaging. Our "Chromatic Aberration Confocal Sensor" can meet these requirements. Equipped with high-performance optical lenses, our chromatic aberration confocal sensor focuses not at a single point but at multiple distances along the optical axis, allowing it to focus across all wavelengths of visible light. This multifunctional optical sensor opens up new dimensions in measurement technology. In addition, we also offer products such as the "CLS-C Line Sensor," "C Point Sensor," and "Chromatic Aberration Point Sensor." 【Features】 ■ Capable of measuring various materials: transparent/opaque, diffuse/reflective surfaces, absorbing surfaces, etc. ■ Prevention of shadowing effects through coaxial measurement ■ Wide tolerance and high NA allow for measurements at up to 45° on reflective surfaces and over 80° on diffuse surfaces ■ Ultra-fast multi-point line sensor enables parallel measurement of multiple points *For more details, please refer to the PDF document or feel free to contact us.

• Sensors

In dedicated equipment for measuring the optical properties of glass products, non-contact measurement techniques are used to prevent damage to the surface and bulk materials. By using our "CHRomatic Vision Camera (CVC)" for quality inspection, you can instantly obtain information related to glass measurement and visualize various defects in bulk materials during the production process. Due to its deep depth of field, there is no need to refocus the camera, making it a powerful and superior tool for glass inspection compared to conventional microscope systems. 【Features】 ■ Saves valuable time during quality inspection as refocusing is unnecessary ■ Integrated coaxial illumination and interchangeable optical probes allow for clear, high-contrast images at any height ■ Suitable as a tool for appearance inspection of metal parts and defect detection on wafers and OLED masks ■ Incredible speed of up to 200,000,000 pixels/second ■ Equipped with a 44° light reception angle Camera Link/Ethernet interface to ensure reliable image recording ■ Camera can be used in harsh industrial environments *For more details, please refer to the PDF document or feel free to contact us.

• Sensors

This document introduces the performance of various sensors for component inspection handled by PreciTech Japan Co., Ltd. It includes the measurement principles, compatible sensors, and ease of use for each sensor, such as the "Chromatic Aberration Confocal Single Point Sensor" and "Optical Point Sensor." Our company provides intelligent and reliable solutions for laser material processing and optical measurement technology. [Overview] ■ Measurement with the Chromatic Aberration Confocal Single Point Sensor ■ Shape and thickness measurement inspection with the Chromatic Aberration Line Sensor ■ Quality control of welding ■ Area scan measurement of thickness, flatness, and shape in specified areas *For more details, please refer to the PDF document or feel free to contact us.

• Sensors
• Welding Machine

This document introduces the CHRocodile series. It includes information on "the measurement principle of CHRocodile," as well as "interference sensors" and "CHROMATIC VISION CAMERA." Please take a moment to read it. 【Contents (excerpt)】 ■ About the measurement principle of CHRocodile ■ Principle 1: Confocal position measurement mode (surface shape and roughness measurement) ■ CLS appearance ■ Probe for CLS ■ CLS controller *For more details, please refer to the PDF document or feel free to contact us.

• Optical Measuring Instruments
• Sensors

This document provides information about non-contact thickness and shape measurement sensors. It introduces topics such as "The Principle of the CHROMATIC VISION CAMERA," "Measurement Examples," and "Features and Advantages of CHRocodile." Please take a moment to read it. 【Contents (Excerpt)】 ■ White Light Sensor ■ CHRocodile C ■ Interference Sensor ■ CHROMATIC VISION CAMERA ■ FLYING SPOT SCANNER *For more details, please refer to the PDF document or feel free to contact us.

• Optical Measuring Instruments
• Sensors

The "Flying Spot Scanner" is an optical measuring device that can perform wide-area scans (up to φ80) using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. Thanks to the principle of spectral interference, it can measure thickness, dimensional shapes, and inspect surface defects. Additionally, because the incident and reflected light are in a coaxial optical system, good results can be obtained even on glossy surfaces. 【Features】 ■ Wide-area scanning ~φ80mm ■ High resolution XY 6.5μm~, Z 1nm~ Minimum beam spot diameter 13μm, high Z resolution due to spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit (DLL, etc.) available for device integration ■ Applications Thickness measurement of glass substrates for FPD and LCD, measurement of wafer warp (distortion), lens shape inspection, PCB board shape inspection, height measurement of small precision parts, etc. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Optical Measuring Instruments
• Other inspection equipment and devices

The "CHRocodile MPS2L" is a new color aberration confocal sensor (MPS) that can measure 24 points simultaneously. The wavelength difference corresponds to a constant thickness. It can handle multiple points with a single probe head. There is no damage, deformation, or impact on the shape of the sample. 【Features】 ■ Optical and non-contact ■ No consumables required ■ No damage, deformation, or impact on the shape of the sample ■ Capable of measuring inclined workpieces ■ Compatible with hot end processes *For more details, please refer to the PDF document or feel free to contact us.

• Optical Measuring Instruments
• Sensors

This document provides information about wafer thickness measurement sensors. We introduce the "CHRocodile 2 Series," which is suitable for replacement with contact gauges, as well as the design of optical measurement heads for in-process semiconductor applications. Please take a moment to read it. 【Contents】 ■ CHRocodile 2 Series ■ Design of optical measurement heads for in-process semiconductor applications ■ Advantage: Use of chromatic aberration confocal principle ■ Advantage: Use of spectral interference principle ■ Si thickness measurement data during wafer in-process *For more details, please refer to the PDF document or feel free to contact us.

• Optical Measuring Instruments
• Sensors

The "CHRomatic Vision Camera" is a line camera for high-speed appearance inspection. Utilizing the principle of chromatic aberration confocal, it has a wide depth of field of up to 3mm. Focusing is unnecessary, allowing for high-contrast images to be captured even on uneven surfaces. It can obtain two-dimensional images. Additionally, with a high-speed scan of up to 140kHz, inline appearance inspection (for shape defects such as cracks and scratches, as well as foreign object inspection) is possible. 【Features】 ■ High resolution XY 0.9um~2.9um (the 3mm depth of field type is 2.9um) ■ High contrast for various materials ■ High speed and resistant to vibration ■ Contributes to reduced development costs and shortened development lead times, with a software development kit (DLL, etc.) available for device integration. Interfaces such as CameraLink and GigE are supported. ■ Proven results in appearance inspection for semiconductors, consumer electronics, and glass. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Optical Measuring Instruments
• Sensors

"CHRocodile C" is a chromatic aberration confocal sensor that measures displacement or thickness due to chromatic aberration using white light. It has a compact size of under 440g. It is compatible with all surfaces, including "rough," "mirror," and "colored materials." The probe head is available in sizes from 200μm to 10mm. 【Features】 ■ Compact ■ Surface-independent ■ Accurate and stable measurements even at inclinations of up to ±45° ■ Shape-independent ■ Probe heads available from 200μm to 10mm *For more details, please refer to the PDF document or feel free to contact us.

• Optical Measuring Instruments
• Sensors