神港精機 List of Products and Services

Expanding a chamber configuration with a proven track record in advanced thin film devices for cleaning applications. Achieving high cleaning effectiveness across various substrates. Flexible hardware configuration and high process capability tailored to the substrate and production volume. Supporting cleaning, descumming, ashing, hydrophilic treatment, hydrophobic film treatment, and various other applications. A large plasma device with extensive experience from substrate mounting to material surface treatment.

• Plasma surface treatment equipment
• Etching Equipment
• Ashing device

A dense oxide film with a thickness of 10 μm is formed at low temperatures using a newly developed arc filament-type ion plating method. This method enables the deposition of yttria films with excellent plasma resistance, suitable for semiconductor manufacturing equipment components. A simple process using ion plating achieves a dense film quality. Not only yttria films but also various reactive films such as SiC, TiC, and CrN can be formed from solid metal materials. The uniquely developed ion plating method opens up new applications for surface treatment.

• Other machine tools
• Other processing machines
• Other semiconductor manufacturing equipment

Commonization of high-reliability upper models with vacuum chambers and exhaust systems. Cost reduction achieved through manual operation methods. Various components (cathodes, substrate holders, etc.) can be selected according to the type of film and purpose. The efficiency and quality of research and development work can be improved with the well-established mechanisms and stable film deposition performance.

• Other physicochemical equipment
• Sputtering Equipment

Covers all performance, cost, and technical support required for basic research, and can be customized according to individual requirements.

• Evaporation Equipment
• Other physicochemical equipment
• Other surface treatment equipment

Supports full film formation of long-length resin molded products over 1 meter. Features high-speed exhaust and low-temperature deposition. Compatible with mass production lines through short takt processing. Achieves high film adhesion through ion bombardment treatment before film formation. Supports high-speed deposition of various metals by using multiple electron guns. Realizes stable fully automatic film formation of discontinuous films through control with a quartz crystal oscillation thickness gauge. Fully automatic deposition system with high stability.

• Other painting machines
• Evaporation Equipment
• Plating Equipment

High-speed formation of dense and highly plasma-resistant yttria and SiC films. Achieves a denser film quality at lower temperatures than CVD and spray methods through a reactive process using high-density plasma. Realizes a clean film formation process applicable to semiconductor-related components. Easy maintenance and low cost due to the PVD method. High-speed formation of insulating films (oxide films and carbide films). High-speed formation of dense thick films. Overcomes the weaknesses of conventional ion plating methods. A state-of-the-art PVD system for creating new surface functionalities.

• Plasma surface treatment equipment
• Other processing machines
• Evaporation Equipment

This is a batch-type sputtering device that achieves both processing capacity for mass production and excellent film thickness uniformity by adopting multiple self-rotation substrate stages. Despite being a chamber system exceeding 1 meter due to the side sputtering method, it enables easy attachment and detachment of substrates and targets, as well as simplified maintenance within the vacuum chamber. It incorporates essential considerations for mass production equipment, such as a data logging system optimal for mass production and control interface software that facilitates device control and management. It balances quality and throughput for large substrates represented by 300 mm wafers, as well as for the mass production of small electronic components like resistors and sensors.

• Sputtering Equipment

A super high vacuum sputtering device with exhaust performance of 10⁻⁷ Pa. It is equipped with a cassette chamber, transfer chamber, etching chamber, and multiple sputtering chambers in a standard configuration. It achieves efficiency in research and development work through fully automated operation using a fully automatic CtC method. You can also choose deposition mechanisms such as high-efficiency ferromagnetic cathodes and wide erosion cathodes, and we can accommodate individual requirements based on substrates and purposes. It can also support a simple device configuration, achieving reasonable cost solutions. As an advanced specification, a cluster-type transfer chamber can be equipped, and it is an evolved sputtering device capable of incorporating different process chambers such as annealing and deposition.

• Sputtering Equipment
• Plasma surface treatment equipment

Achieving mass production of flexible electronic devices represented by FPC with proven results. Reliable response to various individual requirements through process support using in-house demonstration equipment. Proven results with a wide range of substrates, including not only general resin films but also metal foils. Stable operation is realized through a high-utilization cathode developed in-house and a well-established transport mechanism. Equipped with a variety of optional mechanisms such as plasma pre-treatment electrodes, cathodes for magnetic materials, and main rolls for substrate heating, it can be operated as a multipurpose continuous film processing device. Flexible realization of hardware and software according to purpose and application, including small machines for R&D and batch-type equipment compatible with sheets.

• Other processing machines
• Sputtering Equipment
• Plasma surface treatment equipment

High-density plasma generated by surface wave excited plasma is completely shielded from ions using an ion shielding trap. Only radicals are supplied to the substrate. Achieves damage-free ashing equivalent to wet processes with high-density radicals. Balances high rate and damage-free ashing. Compact batch type suitable for small substrates, compound semiconductors, and MEMS devices. Demonstrates excellent effectiveness in removing organic film sacrificial layers in MEMS manufacturing processes. An essential resist ashing device for high-end MEMS devices.

• Ashing device

Realization of the capabilities of a higher-end model capable of small-scale production using a manually operated simple experimental machine. An 8-inch compatible multi-frequency RF sputtering device. Supports fundamental research in MEMS, compound semiconductors, and electronic devices due to high-speed exhaust and excellent process performance. A series of batch-type sputtering devices with a proven track record in mass production of electronic components.

• Sputtering Equipment

Supports etching of submicron Si oxide films in batch type. Compatible not only with SiN and Si-based thin films but also with high melting point metals and difficult-to-etch materials. Ideal for processing niche devices such as vertical etching of quartz and fine processing of thick photoresist. Actively supports a wide range of applications from ashing to cleaning through a multi-step process enabled by plasma mode switching.

• Etching Equipment
• Other physicochemical equipment
• Plasma Generator

A standard batch-type sputtering series that incorporates a three-element cathode into a compact housing. It covers the film deposition process for various electronic devices and related materials from basic development to mass production, thanks to a wide uniform range of film thickness distribution and an automatic control mechanism. Our film deposition processes and options, supported by numerous delivery records, will reliably meet your requirements.

• Sputtering Equipment
• Plasma surface treatment equipment

Uniform heating in a clean vacuum. Ideal for processes requiring high cleanliness and low oxygen concentration. Vertical quartz tube annealing device. Compatible with wafers up to 8 inches and various substrates. Automation and clean system achieved through the use of a CtO-C system. Stable temperature distribution performance from medium to high temperatures, with a rapid processing mechanism for short cycle times. A multifunctional heat treatment device capable of processing not only in vacuum but also in various atmospheres (inert, oxidation, reduction).

• Annealing furnace

High uniformity hot air heating in a low oxygen atmosphere (N2) after vacuum replacement. Heating treatment of 300mm wafers in cassette units. Compatible with system LSI polyimide curing and flexible printed circuit board curing/annealing. Achieving both high quality and mass production with curing of 300mm wafer cassette units.

• Annealing furnace

Equipped with a unique substrate mechanism ideal for double-sided film deposition on small substrates and small-diameter wafers, edge film deposition on ceramic substrates, and mask film deposition. A standard horizontal deposition device with a large processing capacity in a compact chamber. Various options for evaporation sources, heating temperatures, and exhaust systems are available. Capable of handling a wide range of applications from resin decoration to mass production of electrode formation for electronic components with a proven unique mechanism.

• Evaporation Equipment

Simplifying and reducing the cost of semiconductor manufacturing equipment chambers for application in plasma cleaning. Achieving unprecedented surface treatment through plasma mode switching mechanisms (RIE, DP) and multi-gas (Ar, N2, O2, H2) processes. Substrate cleaning (removal of oxides, organic materials, and fine foreign substances). Hydrophilic treatment (pre-treatment for plating, improving solder wettability). Hydrophobic treatment (pre-treatment before wet processes). Proven results in reflow pre-treatment with significant improvements in solder wettability. Extensive track record in mass production lines for high-end products (high-density mounting substrates, flexible substrates, power device modules). Inline and sheet-type options are available in the standard lineup to match substrate and line configurations.

• Other mounting machines

Batch-type vacuum soldering equipment that achieves high-reliability soldering. High-speed and uniform soldering in a low-oxygen atmosphere through vacuum evacuation. Achieves a high level of void-free soldering through combinations of vacuum, atmospheric pressure, and various atmospheres (reduction, inert). A basic model of the standard process for high-reliability power modules for automotive applications. A new model has been introduced to increase processing capacity and performance. The new model has been installed at the factory. Actively responding to equipment tours and sample tests. Conducting void-free, flux-free soldering tests, including plasma cleaning for pre-treatment. ★ We will exhibit at NEPCON Japan 2020! * For more details, please refer to the PDF document or feel free to contact us.

• Reflow Equipment
• Soldering Equipment
• Electric furnace

Fluxless reflow in a strong reducing H2 radical atmosphere of damage-free downflow-type surface wave plasma, reducing flux application and cleaning processes, as well as application and cleaning equipment. A completely dry CtoC system. Achieving a short tact reflow process for fine pitch bumps.

• Other semiconductor manufacturing equipment

Achieving flux-free bump reflow with highly reducing H2 radicals generated by high-density plasma (SWP). Reducing the application and cleaning processes of flux. Minimizing wet processes before and after reflow. An energy-saving, space-saving, and clean process that reduces the space, processing, and utilities of wet equipment. A cutting-edge mass production process compatible with 300mm wafers, suitable for batch-type hardware and niche devices with small-diameter substrates. Supporting short-tact batch processing for small-lot production and R&D applications.

• Other semiconductor manufacturing equipment

The "Lift-off Process Compatible Vacuum Deposition System" is a dedicated deposition device designed for the lift-off process, widely used in optical devices and high-frequency communication devices such as compound semiconductors and SAW devices. Equipped with an electron gun and resistance heating electrodes as evaporation sources, it enables the formation of thick films, including high-melting-point electrode films and precious metals. It excels in the verticality of the incident angle of evaporated particles onto the substrate, and low-temperature deposition is possible due to various mechanisms that prevent temperature rise of the substrate during film formation (substrate water cooling mechanism, reflective electron trap for the electron gun, radiation light prevention measures). **Features** - Verticality of the incident angle of deposition particles onto the substrate (90°±3° at 6-inch wafers) - Low-temperature deposition (below 70°C = proven value) due to the substrate water cooling mechanism - High-speed exhaust with a large-diameter exhaust system and clean background for dense film quality - Flexible hard and soft compatibility with a rich variety of options (single wafer type = CtoC conversion, load lock conversion, composite process = load lock conversion + bonding with other process chambers) - A demo unit is permanently available for sample testing. *For more details, please refer to the PDF document or feel free to contact us.*

• Evaporation Equipment

The "Vacuum Deposition Device for Wafer Processes" is a batch-type deposition device designed for forming electrode films on wafers up to 6 inches in size. It has a wealth of experience in mass production applications for discrete ICs, compound ICs, and MEMS devices. The device can stably form high-quality electrode films due to its film formation mechanism, which excels in film thickness uniformity, and an oil-free exhaust system that enables rapid evacuation. It boasts a high operational rate as a deposition device for mass production applications. 【Features】 ■ Highly reliable basic configuration ■ Abundant optional mechanisms - Evaporation sources, multi-beam electron guns (10kW), resistance heating evaporation sources, multi-source simultaneous deposition mechanisms - High-temperature heating (up to 550°C) = three-sided planetary dome - Substrate cleaning, ion guns, RF bombardment mechanisms - Substrate dome, three-sided planetary dome, revolution dome, high-temperature heating revolution dome *For more details, please refer to the PDF materials or feel free to contact us.

• Evaporation Equipment

The "Large Resin Substrate Deposition Device" is a large deposition system aimed at forming thin films on large resin molded parts for automotive exterior components. Equipped with multiple electron gun evaporation sources, it enables high-speed film formation at low temperatures for metal films such as Al, Cu, and Ni on large resin substrates up to 1 meter in length. It has a proven track record not only for automotive parts but also for electromagnetic wave shielding in electronic devices. The combination of a large chamber (φ2000), electron gun evaporation sources, and a large exhaust system makes it suitable for the production of high-quality decorative films and electromagnetic wave shielding films through large batch processing. 【Features】 - Low-temperature formation of various metal films (below 70°C) - Short-time batch processing - High adhesion of films to resin substrates via RF bombardment - Formation of various thin films, thick films, and multilayer films (Cu/Ni Cu1μmNi0.25μm stacking) - Stable film formation of discontinuous films - Customization options allow for full-area film formation on long substrates (up to 1750mm) *For more details, please refer to the PDF document or feel free to contact us.

• Evaporation Equipment

The "High-Speed Batch-Type Resin Vapor Deposition Device" is a specialized vapor deposition device dedicated to the vapor deposition processing of resin molded products, such as automotive parts (exterior components). It achieves high-speed batch processing through a large-diameter exhaust system and a compact chamber. The simple device configuration and high-speed batch processing aim to improve productivity on mass production lines. By adopting an old-dry exhaust system and a front-door type device shape, it excels in maintenance-free exhaust systems and system maintainability, achieving a high operating rate. 【Features】 ■ High-speed batch processing for resin substrates ■ Stable film formation performance and high-speed exhaust performance ■ Maintenance-free exhaust system due to the old-dry exhaust system ■ High productivity due to compact device size *For more details, please refer to the PDF materials. *For other specifications and sample testing inquiries, please contact us.

• Evaporation Equipment

"SERIO" is a high-density plasma etching device that accommodates a wide range of applications, including deep silicon etching, vertical processing of quartz, and organic film etching. Equipped with a proven ICP plasma electrode, it achieves smooth etching surfaces and high processing precision. It enables smooth etching without scalloping, making it suitable for creating nanoimprint molds. It possesses many process capabilities required for nanoimprint molds, such as smooth etching sidewalls, verticality of the processing surface, and control of opening angles. 【Features】 ■ Smooth etching sidewalls without scalloping ■ High verticality during deep silicon etching (90°±2°) ■ Controllability of etching taper angles ■ Support for high aspect ratio etching ■ Permanent demonstration unit available ■ Sample testing available *For more details, please refer to the PDF document or feel free to contact us.

• Etching Equipment

The "ICP Metal Etching Device" is a high-density plasma etching device compatible with metal films, designed for advanced thin film processes. It actively supports not only general devices such as semiconductors and MEMS but also special processes like surface treatment for exposure masks and metal substrates. Thanks to its unique chamber structure, it achieves metal etching with low particle contamination at the nm level, characterized by high yield and operational efficiency. 【Features】 ■ Precision etching of metal films at the nm level ■ Low particle process through a unique mechanism ■ Process compatibility for a wide range of applications, including metal films and compound semiconductor substrates ■ High reliability of hardware leveraging the basic configuration of "SERIO" for nanoimprint molds ■ Active support for not only wafers but also special materials and shaped substrates *For more details, please refer to the PDF document or feel free to contact us.

• Etching Equipment
• Plasma surface treatment equipment

This product is a simple and cost-effective sputtering device that covers everything from basic research to advanced process development. We offer two models: a fully manual, low-cost batch type and a simplified load lock type equipped with a manual transport mechanism. Both models achieve significant cost reductions while maintaining the process performance of higher-end models. We provide consistent and careful support from sample testing and specification compliance to post-delivery follow-up. 【Features】 ■ Reasonable cost and high process performance ■ High reliability capable of handling small-scale production ■ A wide range of options and flexible hardware support backed by extensive track records ■ Supports process development in advanced thin film development with load lock mechanisms and pre-deposition testing ■ A demo unit is permanently available for sample testing *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment
• Plasma surface treatment equipment

The "Vacuum Deposition Device for Research and Development" is a series of compact deposition devices suitable for universities, public research institutions, and basic experiments. We offer two models: a front-door type equipped with an electronic evaporation source as standard and a simplified experimental type based on a fully manual resistance heating source. Both models (front-door type and simplified experimental type) can be flexibly customized according to purpose and cost. We have demo units available for sample testing. 【Features】 ■ Proven hardware with flexible cost options ■ A wide range of optional features tailored to specific needs (high-temperature heating, substrate cooling, multi-source simultaneous deposition, evaporation sources for organic materials, lift-off process support) ■ Support for ionization mechanisms such as plasma electrodes and RF coils, with options for additional plasma electrodes ■ Consistent customer support from sample testing to hardware customization and post-delivery follow-up *For more details, please refer to the PDF materials or feel free to contact us.

• Evaporation Equipment

Our company offers an RtoR-type "plasma treatment device" suitable for surface treatments such as cleaning and hydrophilization of flexible substrates like films and metal foils. With vacuum plasma, it is possible to select process gases and plasma modes tailored to the substrate and application, addressing processes that are difficult with atmospheric pressure plasma. We share a common basic structure with our well-established roll-to-roll sputtering equipment, aiming to improve reliability and reduce costs. It is effective for surface treatment before thin film deposition, achieving significant results in the removal of organic materials and hydrophilization. 【Features】 ■ Effective surface treatment using vacuum plasma ■ Selectable plasma modes (DC, RF / ion gun) for process optimization ■ Flexible customization options *For more details, please feel free to contact us.

• Other physicochemical equipment
• Heating device

We offer a rapid temperature rise and fall type "horizontal annealing device" that can be processed in vacuum, oxygen atmosphere (at atmospheric pressure), and reducing atmosphere (at atmospheric pressure). It is capable of processing various substrates (wafers, ceramics, glass, mounted substrates) up to 6 inches, and has a proven track record in applications such as annealing of thin films and wafers, firing of nano metal pastes, and curing of organic materials. For those who wish to evaluate our equipment, we offer sample testing. Please contact us for details on specifications and available test contents. 【Features】 ■ Uniform heating treatment in various atmospheres (vacuum, N2, O2, H2) (up to 900°C) ■ Rapid cooling through the movement of the heating furnace body ■ Processing in a clean atmosphere using quartz tubes ■ Wide range of application support *For more details, please feel free to contact us.

• Other physicochemical equipment
• Heating device

We would like to introduce our "Arc Discharge Type Magnetron Sputtering Device." By adding a low-voltage, high-current arc discharge mechanism to the front of the magnetron sputtering mechanism, the amount of ions incident on the substrate has increased tenfold compared to conventional devices, allowing for the formation of dense, hard, and smooth reaction films at an industrial level. Additionally, the elimination of the need for finishing polishing on the coating surface has improved durability and contributed to energy savings. 【Features】 - Addition of a low-voltage, high-current arc discharge mechanism to the front of the magnetron sputtering mechanism - Ten times more ions incident on the substrate compared to conventional devices - Formation of dense, hard, and smooth reaction films at an industrial level - No need for finishing polishing on the coating surface - Improved durability and contribution to energy savings *For more details, please refer to the PDF document or feel free to contact us.

• Other physicochemical equipment
• others

The "Arc Discharge Type High Vacuum Ion Plating Device" is an ion plating device capable of forming extremely dense and smooth hard films. By utilizing a unique method, it enables film formation in high vacuum without the need for argon gas, allowing for the creation of dense and highly reactive films. It primarily focuses on the formation of titanium-based films, such as TiC and TiCN, which provide high hardness and smoothness, making it suitable for surface treatment of molds. It has a wealth of experience in surface treatment applications for automotive parts molds. The system can be flexibly customized according to the size and shape of the substrate and processing requirements. It offers a wide range of options, from compact devices dedicated to precision machining tools to large-scale production types suitable for large molds. 【Features】 ■ No discharge gas required ■ Smooth hard films can be formed (no polishing required after film formation) ■ Decorative films that can replace gold plating can be formed (gold, gray, brown) ■ Proven results not only in metal surface treatment and hard films (capable of handling electronic components, metal films, oxide films) *For more details, please download the PDF document or feel free to contact us.

• Other physicochemical equipment

The "PIG-type DLC Film Formation Device" utilizes a uniquely developed PIG plasma gun, enabling the high-speed formation of extremely smooth and low-adhesive DLC films through a high-density plasma CVD system. It comes standard with a sputter cathode, achieving excellent film adhesion and high surface pressure resistance through a laminated structure with sputter films. With a wealth of experience in surface treatment applications for automotive parts, it has been adopted in many applications. Additionally, by equipping a newly developed arc discharge magnetron cathode, it is capable of forming hard films via PVD, making it easy to expand functionality into a plasma CVD + PVD composite film formation device. For those interested in evaluation, we offer sample testing. For more details on specifications and film quality, please feel free to contact us. 【Features】 ■ Extremely smooth DLC films can be formed: (Ra = 0.015μm or less) ■ Fast film formation rate: (3μm/hr or more) ■ Low-temperature film formation: (200℃ or less) ■ Thick film formation possible: (20μm) ■ DLC film removal: DLC removal can be performed within the same vacuum chamber. *For more details, please refer to the PDF document or feel free to contact us.

• Other physicochemical equipment
• Other machine tools
• Plasma surface treatment equipment

The "SD, SDB series" is an oil diffusion pump with a proven track record in metallurgy and materials. It features a robust structure that withstands long-term use and provides high-speed exhaust as a major characteristic. It has gained trust in various applications such as thin film formation devices, metallurgy, and chemistry. Additionally, it is equipped with peripheral components like water-cooled baffles and liquid nitrogen traps, ensuring stable high vacuum performance. 【Features】 ■ High exhaust speed ■ Minimal backflow of oil vapor ■ Long heater lifespan (uses aluminum cast heaters) ■ High allowable back pressure (side ejector type) *For more details, please refer to the PDF document or feel free to contact us.

• Vacuum pump
• Vacuum Equipment
• Other pumps

A polarimeter is a device that uses the polarization of light to measure the phase difference between two beams of light that occur when light passes through a distorted object, allowing us to determine the state and magnitude of the distortion.

• Spectroscopic Analysis Equipment

◆ The uniquely designed screw rotor enables stable operation even in hard processes that involve the suction of condensable gases, powders, products, and liquids, which are typically unsuitable for conventional dry pumps. ● ZEROEDGE screw With excellent discharge efficiency and a structural design focused on robustness, it allows for stable operation even in hard processes. ● Pursuit of maintainability [Cost reduction] Cleaning and disassembly can be easily performed on-site, minimizing running costs. ● Achieves excellent ultimate pressure below 1 Pa. ● The structure minimizes the accumulation of particles inside the dry pump. It excels in the discharge of powders, products, and liquids compared to conventional dry pumps. ● Due to the low rotational speed of the pump, the shaft seals, bearings, and gears have a long lifespan. ● Optional items We offer a variety of accessories to propose the optimal dry pump for your specific applications.

• Other pumps

This is a smart dry pump that maintains the robustness of the SST series, which has a wealth of achievements, while enabling energy-saving operation and featuring protective and remote functions. ● The unique design of the surface-sealed screw rotor minimizes the decrease in exhaust speed due to rotor wear, resulting in a dry pump with excellent performance. ● It allows switching between "Power Mode," which prioritizes exhaust speed, and "Economy Mode," which focuses on energy savings. ● In the case of non-corrosive gases, cooling gas, sealing gas, and purge gas are unnecessary. ● It is equipped with a pump controller, allowing for manual operation and remote control. ● It detects issues such as insufficient cooling water, overload, and abnormal heat generation. Alarm and automatic shutdown functions help prevent damage to the pump. ● The pump operates at a low rotational speed, resulting in a long lifespan for the shaft seals, bearings, gears, and other components. ● Equipped with casters.

• Other pumps

By combining with the downstream vacuum pumps (dry pumps, oil rotary vacuum pumps, water-sealed vacuum pumps), it is possible to significantly increase the exhaust speed with a small power input and reduce the ultimate pressure by 1 to 2 orders of magnitude. ● The exhaust efficiency is extremely high, allowing for energy-saving improvements in exhaust speed and ultimate pressure. ● Designed to accommodate water-sealed vacuum pumps, it can withstand high back pressure, making it very robust. ● The direction of the exhaust port can be selected from the downward or lateral position. ● It can cover the exhaust speed near the ultimate pressure where the capacity of the vacuum pump decreases. ● A vacuum switch (pressure switch) can also be included.

• Other pumps

This long-selling product has survived in a wide range of applications, including harsh environments. It has gained the trust of many users due to its high durability. ◆ It is an oil-sealed rotary vacuum pump with a wealth of proven performance in harsh environments and excellent durability. ◆ It provides a consistently low pressure. ◆ Its simple structure results in fewer breakdowns. ◆ The standard gas ballast valve allows for the exhaust of small amounts of water vapor.

• Other pumps

This is a standard model with a rich sales record. It stably exhausts various gases that can cause troubles in other systems by sealing them with water. ◆ The water-sealed vacuum pump allows for the exhaust of condensable and flammable gases by sealing with water. ◆ Due to its water-sealed design, it has high discharge capability and is not easily stopped by minor dust. ◆ For applications where corrosive gases may be present, it is possible to select materials with excellent corrosion resistance, such as stainless steel. ◆ Being a two-stage model, it achieves an excellent ultimate pressure of 2,300 Pa (at a water temperature of 15°C). Additionally, when combined with an air ejector, it can be improved to between 800 and 1,300 Pa. ◆ The shaft sealing part comes standard with gland packing, but mechanical seals can also be selected. ◆ It is equipped with a standard gas-water separation tank that also serves as a silencer. ◆ To prevent harmful gases from dissolving in the sealing water and being discharged, we also offer a "sealed liquid circulation type" water-sealed vacuum pump that circulates the sealing water without direct outflow.

• Vacuum pump

Supported by highly reliable standard hardware and a wealth of experience, Shinko Seiki has been active in many fields since launching its first machine in 1967. We provide state-of-the-art equipment that consistently leads the way with flexible and advanced software.

• Sputtering Equipment
• Printed Circuit Board
• Other semiconductors

By melting solder in a vacuum, voids within the solder are eliminated. Additionally, by preheating in a hydrogen atmosphere or formic acid atmosphere, flux-free soldering is achieved. We take pride in being the number one in domestic achievements as a standard machine in the power device manufacturing process. With a wide range of options and a rich lineup of equipment, we propose the optimal device for our customers. <Recipient of the Excellence Award at the 2nd Monozukuri Japan Awards>

• Bonding Equipment
• Reflow Equipment
• Soldering Equipment