マック産業機器 List of Products and Services

1. By dry spraying a weakly acidic hypochlorous acid aqueous solution (50 ppm, pH 6.5) with a nozzle (manufactured by Ikeuchi), strong disinfection and deodorization against the novel coronavirus will be performed. 2. Installed at the entrance of hospitals and health centers, it automatically performs dry spraying as people pass through, providing disinfection and deodorization. 3. On June 25, 2020, it was announced that hypochlorous acid water (50 ppm, pH 6.5) is effective for disinfecting against the novel coronavirus. * (Independent) NITE 4. The spraying device is currently under patent application as a system. 5. External dimensions: W 1500 mm * H 2000 mm * D 200 mm, with casters.

• Humidification device

- It is ideal for prototype and research cutting using a diamond wire saw. - Automatic cutting is possible with an XY table using a high-precision 5-phase micro-stepping motor closed-loop system. The X-axis comes with a rotation mechanism. - Cutting under constant stress: During cutting, the deflection of the wire is detected by a high-precision position sensor, allowing for feedback to the stepping motor to control the movement speed, thus maintaining constant stress. - Simple design with easy operation via a touch panel.

• Other processing machines

- Compatible with wafer processing of small diameters up to 4 inches - Down-cut method using high-performance electroplated diamond wire - No slurry required due to fixed abrasives - Capable of processing various materials by changing wire speed - Square cutting is also possible - High-precision processing of all hard and brittle materials is possible

• Other processing machines

It is ideal for research and development purposes.

• Other processing machines

This device is a tabletop automatic spin cleaner that manually sets the target workpiece and performs ultrasonic cleaning, pure water rinsing, and air blow drying through spin rotation.

• Other semiconductor manufacturing equipment

This device is an automatic transport system that moves LSI chips one by one on an evaluation board for LSI chip evaluation tests using an XYZ 3-axis robot.

• Other semiconductor manufacturing equipment

This is a device that performs the process of sending substrates through a series of steps, including cleaning brushes, HPMJ, MS, final rinsing, and water draining, to the discharge section using a sheet-by-sheet method.

• Other semiconductor manufacturing equipment

This is a device that manually loads the substrate for spin coating, performs spin coating of the resist, cleans using an EBR device, carries out pre-bake and post-bake as well as cleaning with a bake unit, develops using a developing device, and manually retrieves the substrate.

• Coater

We will polish and regenerate used test wafers or rejected prime wafers at the customer's site, and reprocess them into wafers for solar cells. By polishing in the range of 3 to 20 mm, it is possible to remove impurities and surface scratches that cannot be achieved through chemical regeneration. For more details, please contact us or refer to our catalog.

• Processing Contract
• Surface treatment contract service

The "Porous Carbon Chuck" is a suction table that uses carbon porous material on its surface. Due to its porous nature, it can adhere to the entire surface of the workpiece, and it can also hold thin materials such as films. Additionally, it is capable of vacuum suction in environments where acid resistance and chemical resistance are required. Furthermore, because it is conductive, it can perform vacuum suction in devices that are sensitive to static electricity. It can accommodate various sizes and shapes. The workpieces include 200mm, 300mm, and 450mm wafers, glass substrates, and films. It is suitable for dicing saws, bonding machines, tape mountings, spin cleaning devices, and other semiconductor manufacturing equipment, as well as various inspection devices and printing-related equipment. For more details, please contact us or refer to the catalog.

• Other physicochemical equipment
• Other semiconductor manufacturing equipment

The "IR Oven Glass ME-9501" is a device that dries and cures glass at high temperatures. The process consists of two IR sections and one cooling section. The dimensions of the device are L7800 × W1300 × H1300 mm, with a weight of 2200 kg, and the workpiece dimensions are L470 × W370 mm × t0.4–0.7 mm. The takt time is 20 seconds per glass. For more details, please contact us or refer to the catalog.

• Drying Equipment

The "IR Oven Film ME-9001" is a device for drying and curing film at high temperatures. The process consists of two IR sections and one cooling section. The device dimensions are L9220×W1500×H1300mm, weight = 2600kg, and the work dimensions are L390×W500mm×t0.12–0.188mm and L370×W470mm×t0.4–0.7mm. The tact time is 20 seconds per glass. For more details, please contact us or refer to the catalog.

• Drying Equipment

The "Wafer Separation Cleaning Device ME-5700" is a device that manually sets wafers onto a transport arm, where they are separated one by one using a water jet in the chamber, and then manually collected. The external dimensions are L1300×W1200×H2100. For more details, please contact us or refer to the catalog.

• Separation device
• Other cleaning machines

The "Compact Spin Cleaning Device ME-510" is a manual spinner that allows the operator to set the target workpiece manually. It performs brush cleaning with detergent (such as surfactants) through spin rotation, followed by pure water rinsing and air blow drying. The maximum rotation speed is 3000 rpm, and it accommodates sample sizes ranging from 30 to 150 mm, including PET film and glass. The brush section features brush elevation, rotation, and detergent supply, while the pure water supply section operates with a rotary air cylinder for pure water delivery. The main body dimensions are W650 x D800 x H710, and it has an aluminum frame. For more details, please contact us or refer to the catalog.

• Other cleaning machines

The processing capacity is suitable for small quantities of 1-3 sheets, making it ideal for research and experimental purposes. There are no installation constraints with a 100V power supply. Its compact size allows for installation in just 1 square meter, making it economical. The pure water rinse uses a cascade system to minimize pure water consumption, resulting in low costs. The chemical temperature can be controlled. The rinse effect is assessed using a resistivity meter. The wafer cassette is designed with an incline to prevent liquid residue on the wafer surface. Space has been secured for the future addition of a second tank (including the lower tank). It comes with an air gun. The chemical tank can be easily cleaned with a shower nozzle.

• Other mounting machines

This is a device that uses a special underwater suction head to feed silicon wafers stacked together, with a thickness of 140μm to 200μm, one by one using upper and lower feeding rollers, and stores them in a wafer carrier after rough cleaning.

• Other semiconductor manufacturing equipment

This device manually sets a wafer cassette into the main body, sends the stored target work to the spin cleaning section using a robot, and performs two-fluid cleaning, ultrasonic cleaning, and N2 blow drying while spinning, before storing it back in the wafer cassette.

• Other semiconductor manufacturing equipment

This device manually sets the workpiece onto the main body, performs vacuum suction, and conducts two-liquid cleaning, ultrasonic cleaning, and N2 blow drying while spinning.

• Other semiconductor manufacturing equipment

It features a compact and cost-effective design. Cleaning nozzles are installed on both the inside and outside to completely remove dirt. The workpiece is set on the work table, which rotates and is pressure washed from the inside. The water drainage of the filter is achieved by blowing high-pressure air from the cleaning nozzles through the switching of the solenoid valve. An ultrasonic cleaning tank is also available as an option.

• others

The "ME-5000" is a single-wafer spin etcher compatible with 300mm/8.6.4 inch silicon wafers, as well as 8.6.4 inch SiC and GaN wafers, featuring a mechanical grip. The etching chamber has a movable upper and lower mechanism, allowing for rotation and vertical movement with two arms. An airflow is created inside the cleaning cover, and the chemicals are separated and recovered using five types: four types of acid-based solutions and pure water. For more details, please contact us or download the catalog.

• Other cleaning machines

This is a space-saving, double-sided washable mechanism for a sheet-type spin cleaning device. It is easy to maintain and features high-speed spin drying and N2 drying, which reduces water marks. (Patent No. 3558543)

• Other semiconductor manufacturing equipment
• Other cleaning machines

This device is a cleaning machine for glass used in LCDs, organic ELs, solar cells, etc. It receives glass supply from the upstream process to the entrance conveyor, and cleans the glass using an entrance conveyor, shower, roll brush, two-fluid, and pure water rinse (with megasonic as an option), followed by water removal and drying. After static electricity removal, the cleaned glass is sent to the exit conveyor in a sheet-fed manner.

• Other cleaning machines
• LCD display