List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
1171～1215 item / All 4991 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
This one machine handles everything from wrapping (rough polishing) to polishing, and is capable of precision polishing of compound semiconductors such as GaAs and InP.
- CMP Equipment
![[Processing Example] Main Column (E...](https://image.mono.ipros.com/public/product/image/90a/2001158646/IPROS98759389785218906824.jpeg?w=280&h=280){kind=small}
We support hole pitches within 20 microns, and the material is AC4A! Here are examples of processing for electronic circuit manufacturing equipment.
- Other semiconductor manufacturing equipment
![[Processing Example] Adhesive Case ...](https://image.mono.ipros.com/public/product/image/72f/2001158659/IPROS98500084019881578259.jpeg?w=280&h=280){kind=small}
Processing with the newly introduced large 5-axis machining center! Here we present examples of processing for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
![[Processing Example] Base Blade (El...](https://image.mono.ipros.com/public/product/image/d2d/2001158637/IPROS83289262256908551702.jpeg?w=280&h=280){kind=small}
Stabilizing quality by improving jigs! Introducing processing examples of electronic circuit board manufacturing equipment.
- Other semiconductor manufacturing equipment
![[Processing Example] Base Frame (El...](https://image.mono.ipros.com/public/product/image/c08/2001158653/IPROS32729826640945861517.jpeg?w=280&h=280){kind=small}
The size is 1060×1030×700, and the material is SS400! Here is an example of processing for electronic circuit manufacturing equipment.
- Other semiconductor manufacturing equipment
Reduce friction by smoothing the surface! We also have an in-house designed paper wrapping machine.
- Wafer processing/polishing equipment
- Hand polishing and filing
- Other abrasives
φ450 (18 inches) jig, equivalent specific gravity and Young's modulus to Si wafers! Low price!
- Fine Ceramics
- Other semiconductor manufacturing equipment
![[Example of Use] Sputtering Target ...](https://image.mono.ipros.com/public/product/image/f42/2000180520/IPROS14162266355367390576.jpeg?w=280&h=280){kind=small}
You are using SiC/Si composite materials as the target material.
- Sputtering Equipment
- Other metal materials
- Fine Ceramics
We provide high-precision SiC ceramic products with a maximum size of 800 x 40t. We will introduce the benefits of adoption through proven results, such as improved device performance and resolution o...
- Fine Ceramics
- Other machine elements
- Other semiconductor manufacturing equipment
![[Example of Use] Movable Stage Meta...](https://image.mono.ipros.com/public/product/image/9d7/2000173024/IPROS05222515210172064941.png?w=280&h=280){kind=small}
The performance of the device is improved by lightweight, high-rigidity metal-ceramic composite materials.
- Mounter
- Other semiconductor manufacturing equipment
- Other industrial robots
Customization according to experimental purposes is possible. Small RF sputtering device.
- Coater
Oxidation diffusion, injection devices, etching, etc.! Introducing the installation of manufacturing equipment carried out by our company.
- Other semiconductor manufacturing equipment
Magnetrons, ion beams, and more! You can choose from a variety of thin film deposition solutions.
- Other semiconductor manufacturing equipment
Electron beam lithography equipment, EUV exposure equipment, nanoimprint lithography applications. Two types available: powder and solution!
- Resist Device
We will be exhibiting at the "Light and Laser Science and Technology Fair 2023."
Optronics Corporation will exhibit at the "Light and Laser Science and Technology Fair 2023." 【Event Overview】 Date: November 7 (Tuesday) to November 9 (Thursday), 2023 Venue: Pacifico Yokohama (Exhibition Hall C) Booth Location: S-10 Main Exhibits: Laser power meters, compact spectrometers, integrating spheres, quantum dots, light distribution devices, high-power LEDs, resist For more details, please refer to the following link. https://www.optronics.co.jp/fair/
Video of fiber laser welding by a robotic welder.
- Other machine elements
- Other semiconductor manufacturing equipment
- Vacuum Equipment
Remote source ion beam sputtering device manufacturer for remote plasma sources.
- Sputtering Equipment
Information on commissioned test film formation services (test film formation of high-quality reaction films, etc.)
Research on Co-sputtering of different materials, such as ferromagnetic targets and metal and ceramic targets, which are considered difficult to film using conventional sputtering devices. We strongly support advanced material research and process development, including the deposition of AlScN, which is attracting attention for next-generation MEMS applications. This is a groundbreaking technology that uses a helicon ion source as a plasma source, accelerating high-density ions obtained from it by applying a bias voltage to the target. Since it is an ion beam-type deposition method using a remote plasma system, stable film formation can be achieved even with ferromagnetic and dielectric targets, which are challenging for magnetron sputtering devices. By individually controlling the ion source and target application, it is possible to accommodate a wide range of deposition conditions while also achieving high deposition rates. Independent gas supply near the target and substrate allows for the deposition of various multilayer thin films, including oxide and nitride films. Since the substrate surface is not exposed to plasma, it is possible to maintain a low temperature during film formation.
This is a lineup of devices incorporating Rise One's precision transfer technology.
- Other semiconductor manufacturing equipment
This is a high-viscosity dedicated spin coater that uniformly applies high-viscosity polyimide with a viscosity of around 10,000 cP. It also achieves material savings with a rotating cup-type chuck!
- Coater
From silicon to compound semiconductors, from manual machines to mass production machines! Here is an introduction to our products!
- Resist Device
This is a coater with minimal in-plane uniformity of the resist film and small differences in average film thickness between wafers. It supports low to high viscosity resist (up to 10,000 cP)!
- Coater
Supports low to high viscosity resist! Can produce semi-automatic machines for any wafer size!
- Coater
Research and development, manual equipment for small lot production! Equipped with a resist coating mechanism equivalent to that of automatic machines, unlike tabletop types!
- Coater
After spin coating BARC and other chemical solutions, it can be baked at a maximum of 400°C! Automatic resist coating device with high-temperature baking capability.
- Coater
Compatible with 10,000 cP polyimide and resist! ASAP is a manufacturer specialized in high-viscosity resist and chemicals.
- Coater
We have a proven track record with a variety of chemical solutions! The reason for our low prices is that we handle everything in-house, from design to sales.
- Coater
We are confident in applying high-viscosity photoresist! For 10,000 cP polyimide, the standard uniformity within the plane is within ±5%, with a proven record of within ±3%.
- Coater
Effective in reducing polyimide and expensive high-viscosity resists! It is a rotary cup-type spin coater.
- Coater
We have extensive experience (know-how) in the transport and coating of fragile and thin wafers such as GaAs, LT, and glass!
- Coater
We can create a device that accommodates both the current wafer size and the wafer size you wish to use in the future (e.g., 2-4 inches, 6-8 inches, etc.).
- Coater
Proven results with a variety of chemical solutions! The reason for our low prices is that we handle everything in-house, from design to sales.
- Resist Device
High-throughput roll-to-roll sputtering equipment for the manufacture of FCCL (Flexible Copper Clad Laminate).
- Sputtering Equipment
FHR Star.100-Tetra Co is a very compact sputtering device designed for MEMS and high-performance optical products.
- Sputtering Equipment
Production ion beam milling equipment that achieves high rate and high reliability.
- Sputtering Equipment
In response to requests from many customers, we have handled a quantity of up to 2,300 pieces.
- Photomask
The "FHR.Star.600-EOSS" is a high-performance magnetron sputtering device developed for precise optical filter film deposition.
- Sputtering Equipment
Highly acclaimed high-precision optical filter deposition magnetron sputtering device
This is a device specialized in optical thin films, such as high-performance optical filters that require multilayering and high reproducibility, particularly for applications like LiDAR, which are expected to see significant demand in the future. It demonstrates strong capabilities for high-quality and stable production. - Film formation that eliminates the influence of film quality changes due to target consumption using a cylindrical cathode. - Stable film formation of oxide films achieved by incorporating a reactive ion source. - Film formation of a wide range of multilayer films enabled by the installation of up to four cathodes.
PHT will operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling devices (peeling and cleaning machines).
- Wafer processing/polishing equipment
For cost reduction purposes, it is possible to reuse the metal shank and replace only the resin tip with a new one.
- Other semiconductor manufacturing equipment
We will exhibit at the 1st Semiconductor Industry Exhibition to be held in Kyushu in 2024.
We are Orte Corporation, a limited company. We will be exhibiting at our booth at the "1st Kyushu Semiconductor Industry Exhibition," which will be held from September 25 in the attention-grabbing region of Kyushu. In recent years, interest in semiconductor manufacturing in Japan has been rekindled against the backdrop of the establishment of semiconductor factories in Kumamoto Prefecture. We encourage you to visit the event during this opportunity. Our exhibition will feature various products, including the new "white and gray rubber collets" and "ultrasonic cleaning machines" that can be applied to various purposes and processes. Exhibition Contents: - Pickup collets (rubber/resin/metal/others) - Ultrasonic cleaning machines and ultrasonic oscillators - Consumables and maintenance parts for post-semiconductor manufacturing (third-party products) - Die bonding related parts (upward needles, dispense nozzles) - Wire bonding related parts (window clampers, finger clamps) - Outsourced parts cleaning services (capillaries, wedges, maintenance parts) - Transport parts (magazine racks, IC chip trays) - Micro 3D printer BMF MicroArch
![[Cost Reduction Case] Blade Sharpen...](https://image.mono.ipros.com/public/product/image/46e/2001140558/IPROS30734322414093399860.png?w=280&h=280){kind=small}
In response to the line stoppage date, we will take emergency measures with blade sharpening! Here are examples of cost reduction.
- Wafer processing/polishing equipment
- Hand polishing and filing