List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

1081~1125 item / All 5021 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

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  • Other safety and hygiene products

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Ideal for punching seals, high-performance films, electronic components, automotive parts, and gaskets.

  • Other semiconductor manufacturing equipment

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It is suitable for cutting resin products such as rubber products. For inquiries and quotes regarding machine blades, please contact Arus.

  • Other semiconductor manufacturing equipment

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Increase production efficiency! Cost reduction with carbide metal saws too!

  • Other semiconductor manufacturing equipment

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We have introduced our proposed industrial blades, such as ultra-hard round knives made from ultra-fine particle alloys, in various industries.

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  • Other semiconductor manufacturing equipment

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ASMPT is a backend equipment manufacturer based in Singapore.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment

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Leave it to us for polishing machines!

  • Wafer processing/polishing equipment

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Maximum size up to 1,200mm × 3,600mm can be produced. Can be made in either glass or resin.

  • Semiconductor inspection/test equipment
  • Other physicochemical equipment
  • others

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Leave the problem of transitioning from manual work to semi-automated and automated processes in each project to us!

  • Other semiconductor manufacturing equipment
  • Other inspection equipment and devices
  • dispenser

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Compact and versatile! This is a high-performance device that can also be adapted for device evaluation processes.

  • Other semiconductor manufacturing equipment

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The industry's smallest, designed and manufactured in France, compatible with 2 to 12-inch wafers by simply replacing the wafer tray, Corial 300 and 500 series.

  • Etching Equipment

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Expanded lineup from 3 to 6 types: Thin cable protection tubes compatible with ISO Class 1, designed for clean environments. High wear resistance and efficient cable replacement.

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  • Other semiconductor manufacturing equipment
  • Other cable related products
  • Wiring materials

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[Press Release] Demonstrating top-class cleanroom cleanliness even after 60 million round trips.

Igus (headquartered in Germany) has demonstrated the very high wear resistance and reliability of its energy supply system for clean rooms, the e-skin flat series, through its own testing. In manufacturing processes such as displays and semiconductors, even small particles that are not visible to the naked eye can have a serious impact on electronic components. Therefore, it is crucial to establish an environment that meets the highest standards of clean rooms, and all system components must meet strict requirements. We have developed the e-skin flat, a high-performance plastic cable guide system with excellent wear resistance, to comply with the stringent Class 1 clean room standards as defined by ISO 14644-1 (which allows no more than 10 particles of 0.1μm in 1m3 of air). After continuous use for about a year and a half, with 60 million cycles of back-and-forth movement, it was confirmed that the system maintained the highest level of clean room cleanliness, ISO Class 1, after operating for over 100 minutes in a clean room testing facility.

The grinding machine with a whetstone shaft is a direct rotation chip saw grinding machine powered by a special motor.

  • Wafer processing/polishing equipment

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With a special motor, horsepower boost control prevents the grinding wheel rotation from dropping according to the load!

  • Wafer processing/polishing equipment

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Easy to operate with a touch screen! A chip saw body grinder that allows you to adjust the chip height as you wish.

  • Other processing machines
  • Wafer processing/polishing equipment

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Sharpening saw teeth with a chip saw grinding machine dedicated to high-precision finishing!

  • Other processing machines
  • Wafer processing/polishing equipment
  • Other abrasives

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Servo 3-axis control! Introducing a dedicated breaker polishing machine that can be checked with a magnifying glass during polishing!

  • Wafer processing/polishing equipment

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Adopting a saw-cutting method! A dedicated notch grinding machine with easy, precise, and rapid 3-axis servo control.

  • Wafer processing/polishing equipment

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Widely adopted by domestic and international saw manufacturers and regrinding companies. A rich lineup ranging from dedicated machines to multifunctional machines.

  • Wafer processing/polishing equipment
  • Other abrasives

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Four types of products are lined up: CB type, VD type, CSH type, and SP type!

  • Wafer processing/polishing equipment

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A new idea from "painting and sticking" to "polishing"!

  • Wafer processing/polishing equipment

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Minimize aggressiveness towards the rim! There are plenty of clamp options available, compatible with various rims and vehicles.

  • Tester

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Light Manufacturing Company Product Introduction

  • Other semiconductor manufacturing equipment

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Cam and gear software

  • Other machine tools
  • gear
  • Semiconductor inspection/test equipment

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Close and intimate engineering support! Application of a uniquely designed efficient manufacturing process! Wedge bonding type wire bonder.

  • Bonding Equipment

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By suppressing the physical aggregation between particles such as ceria, zirconia, alumina, and GC, it leads to stability in performance and reduces scratches.

  • Other semiconductor manufacturing equipment

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<Free rental of processed samples> Issues such as taking too long to clean photomasks and poor visibility of CCD cameras can be resolved with surface processing!

  • Photomask

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<Semiconductor-related Masks - Basic Information Release> A must-see for those who are handling various masks for the first time due to departmental transfers or job changes! A detailed explanation of...

  • Photomask

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If you have a desired size in addition to the stock size, please contact us.

  • Wafer processing/polishing equipment

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Recommended for those who get scratches on chips with metal collets and feel that rubber collets lack strength.

  • Bonding Equipment

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You can choose the floor finish according to your purpose! It is also possible to use a polished floor as a design element!

  • Wafer processing/polishing equipment

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Removal of crimped leaves and rust from the rail head surface! Lightweight and compact electric small grinder.

  • Wafer processing/polishing equipment

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By conducting a complete visual inspection of the chips before implementation, we can reduce losses in subsequent processes and improve yield! Ideal for acceptance inspection and screening in module a...

  • Semiconductor inspection/test equipment

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Clean drying using high-purity IPA is possible for devices, wafers, glass, components, etc., regardless of material or shape.

  • Other semiconductor manufacturing equipment

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Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

  • Bonding Equipment

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Thank you for attending: IEEE 3DIC@Sendai 9/25-9/27

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We are honored to have the opportunity to exhibit at the IEEE International 3D Systems Integration Conference (3DIC). We hope to engage with many guests while participating in this platform for presenting cutting-edge technologies related to semiconductor processes.

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

  • Bonding Equipment

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Thank you for attending: IEEE 3DIC@Sendai 9/25-9/27

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We are honored to have the opportunity to exhibit at the IEEE International 3D Systems Integration Conference (3DIC). We hope to engage with many guests while participating in this platform for presenting cutting-edge technologies related to semiconductor processes.

High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

  • Bonding Equipment

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キャプチャ.PNG

Thank you for attending: IEEE 3DIC@Sendai 9/25-9/27

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We are honored to have the opportunity to exhibit at the IEEE International 3D Systems Integration Conference (3DIC). We hope to engage with many guests while participating in this platform for presenting cutting-edge technologies related to semiconductor processes.

Introducing how to minimize mistakes and press the edit button without hesitation.

  • Wafer processing/polishing equipment

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This is an integrated frame for semiconductor equipment.

  • Other semiconductor manufacturing equipment

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It is also possible to impart water-repellent properties to the tapered surface on the outer circumference to improve ESI efficiency!

  • Analytical Equipment and Devices
  • Other machine elements
  • Semiconductor inspection/test equipment

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We create tapered capillaries with a consistent inner diameter using our unique manufacturing technology.

  • Analytical Equipment and Devices
  • Other machine elements
  • Semiconductor inspection/test equipment

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We create tapered capillaries with a constant inner diameter using our unique manufacturing technology.

  • Analytical Equipment and Devices
  • Other machine elements
  • Semiconductor inspection/test equipment

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We create tapered capillaries with a consistent inner diameter using our unique manufacturing technology.

  • Analytical Equipment and Devices
  • Other machine elements
  • Semiconductor inspection/test equipment

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We create tapered capillaries with a consistent inner diameter using our unique manufacturing technology.

  • Analytical Equipment and Devices
  • Other machine elements
  • Semiconductor inspection/test equipment

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