List of Bonding Equipment products
- classification：Bonding Equipment
1～45 item / All 147 items
A single YAG laser can be switched to a maximum of five optical output ports, achieving flexibility and space-saving throughout the entire process.
- Bonding Equipment
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
- Bonding Equipment
Close and intimate engineering support! Application of a uniquely designed efficient manufacturing process! Wedge bonding type wire bonder.
- Bonding Equipment
Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
- Bonding Equipment
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
- Bonding Equipment
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
- Bonding Equipment
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
- Bonding Equipment
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
- Bonding Equipment
Anode bonding support device
- Semiconductor inspection/test equipment
- Bonding Equipment
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
- Bonding Equipment
Achieving stable tension force using a unique ceramic nozzle.
- Bonding Equipment
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
- Bonding Equipment