List of Wafer products

  • classification:Wafer

226~270 item / All 290 items

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The image is an example of a Cu blanket wafer!

  • Other semiconductors
  • Wafer

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Available in 200mm and 300mm! Please consult us regarding the types of films available as per your request.

  • Other semiconductors
  • Wafer

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We would like to provide information about test wafers supplied to semiconductor material manufacturers and equipment manufacturers.

  • Other semiconductors
  • Wafer

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Basic Knowledge of Test Wafers: What is a Test Wafer?

A test wafer is a wafer used for the evaluation of devices and materials necessary for next-generation semiconductor process development. Semiconductor manufacturers are tirelessly developing new process technologies, striving to enrich people's lives. Supporting this effort are material manufacturers and semiconductor equipment manufacturers, who conduct experiments and research daily to develop next-generation technologies. In this process, data collection using actual wafers is essential to improve the uniformity of processes on the wafer. Our company manufactures and sells test wafers for next-generation semiconductor development in a "custom-made" format that meets our customers' needs. Among the test wafers, we supply wafers that incorporate advanced technologies necessary for research and development in film formation, CMP, cleaning, etching, and TSV.

Supports ELO (epitaxial lateral overgrowth) as well!

  • Wafer
  • Wafer processing/polishing equipment
  • Piezoelectric Devices

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Bubbles-free application possible! Non-contact type for patterned surfaces can also be produced.

  • Wafer
  • Wafer processing/polishing equipment

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Adopts motor drive! Dust-free and suitable for clean rooms.

  • Wafer
  • Wafer processing/polishing equipment

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It is possible to grasp 6-inch and 8-inch wafers with the same non-contact tweezers.

  • Wafer
  • Etching Equipment
  • Industrial Furnace

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Back grinding protective tape for semiconductor wafers

  • Wafer
  • Other polymer materials
  • Adhesive tape

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Tape (UV-curable) for protecting and securing wafers during the semiconductor dicing process.

  • Wafer
  • Other polymer materials
  • Adhesive tape

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Support for sterilization of various products such as medical and hygiene supplies, and improvement of the properties of polymer materials.

  • Other services
  • Other contract services
  • Wafer

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A consistent production system that includes wafer testing and final inspection.

  • Transistor
  • Wafer
  • Dedicated IC

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◆Surface roughness Ra1nm or less◆

  • Sensors
  • Wafer
  • Optical Experimental Parts

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We have uploaded TDC YouTube Exhibition part 7!

Title: "Introduction of TDC Original Products" This time, we would like to introduce the TDC original product, the mirror paperweight. At first glance, it seems like an ordinary mirror, but we, the employees, call it "the mirror that reflects inconvenient truths." Since there is absolutely no distortion, it clearly shows unwanted pores and blemishes compared to commercially available mirrors. Additionally, this mirror can also be used as a paperweight. As a lucky paperweight, we create each one with the sentiment of "no problem, it's okay, let's overcome it." If you are interested, please feel free to contact us. You can view it through the related links below.

Non-contact suspension transport of workpieces using air jets! Bernoulli chuck.

  • Wafer
  • CVD Equipment
  • Articulated Robot

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It is a tape that does not have to worry about paper dust from paper rolls, even when brought into a clean room.

  • Wafer

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<High precision, high speed, high rigidity> We offer specifications of all sizes for both atmospheric and vacuum applications!

  • Other industrial robots
  • Wafer

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Establishing innovative grinding technology! Achieving ultimate surface roughness and TTV in a short time and at low cost.

  • Wafer processing/polishing equipment
  • Wafer

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We have uploaded TDC YouTube Exhibition part 7!

Title: "Introduction of TDC Original Products" This time, we would like to introduce the TDC original product, the mirror paperweight. At first glance, it seems like an ordinary mirror, but we, the employees, call it "the mirror that reflects inconvenient truths." Since there is absolutely no distortion, it clearly shows unwanted pores and blemishes compared to commercially available mirrors. Additionally, this mirror can also be used as a paperweight. As a lucky paperweight, we create each one with the sentiment of "no problem, it's okay, let's overcome it." If you are interested, please feel free to contact us. You can view it through the related links below.

Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.

  • Chip type LED
  • Wafer
  • diode

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Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.

  • Chip type LED
  • Wafer
  • diode

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Ultra-thin high-precision processing of W tungsten and its alloys.

  • Chip type LED
  • Wafer
  • diode

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Bernoulli chuck for non-contact transfer of high-temperature workpieces.

  • Evaporation Equipment
  • Wafer
  • Other industrial robots

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Compatible with lenses of a wide range of curvature using a Bernoulli chuck for one model of lens.

  • Wafer
  • Pneumatic Equipment
  • Other machine elements

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Weight control is possible from seeding to rotation lifting and completion of the ingot for the CZ method single crystal growth apparatus.

  • Instrumentation and Control Systems
  • Wafer
  • Other semiconductor manufacturing equipment

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The compound semiconductor wafers (GaAs, InP, GaP) are supplied through gas operation, and the wafers are non-contact suctioned and detached at a specified position.

  • Evaporation Equipment
  • Other physicochemical equipment
  • Wafer

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It can grasp and transfer fragile films and ultra-thin sheets non-contact.

  • Wafer
  • Actuator
  • Glass

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For matters related to steel, recycled materials, electronic materials, and semiconductor manufacturing equipment, please contact us.

  • Steel
  • magnet
  • Wafer

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Clean room compatible Bernoulli chuck that does not scatter debris.

  • Actuator
  • Wafer

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Bernoulli chuck "Float Chuck SAC type" adopting a gas vertical jet method that reduces airflow friction loss.

  • Wafer
  • Other semiconductor manufacturing equipment
  • Wafer

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Plastic containers (Placon) that can be used in clean rooms - can be produced in small quantities.

  • Wafer
  • Memory
  • Transistor

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Non-contact chuck of the vertical gas jet method at the Solar Research Institute.

  • Wafer
  • Pneumatic Equipment
  • Other machine elements

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For precision machining of aluminum, stainless steel, and other materials using machining processes and 5-axis machining centers, contact Hayashi Seiki.

  • Machining Center
  • Milling machine
  • Wafer

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After cleaning on a dedicated line, it is shipped in a clean pack, making it easy to use without any hassle! A wafer transport case that also helps reduce costs!

  • Other semiconductors
  • Other electronic parts
  • Wafer

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Fully automatable! A device that enables comprehensive mapping.

  • Wafer
  • Other measurement, recording and measuring instruments

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Measurement range up to 4 inches! A device capable of high-speed, high-density mapping.

  • Wafer
  • Other measurement, recording and measuring instruments

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Safely and cleanly transporting wafers, the foundation of semiconductor technology!

  • Other semiconductors
  • Other electronic parts
  • Wafer

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We will create products with unique perspectives and ideas that contribute to the development of society!

  • Steel
  • Wafer
  • crane

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We offer single crystal lithium niobate (LN / LiNbO3) ingots, wafers, and special processing.

  • Wafer
  • Fine Ceramics
  • filter

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Dramatically increase the cleaning power of ultrasonic cleaning!

  • Ultrasonic Cleaner
  • Plating Equipment
  • Wafer

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Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.

  • Wafer
  • LCD display
  • Fine Ceramics

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Information on Exhibiting at CEATEC JAPAN 2016

Samsung Diamond Industrial Co., Ltd. will be exhibiting at the exhibition "CEATEC JAPAN 2016," which will be held at Makuhari Messe from Tuesday, October 4 to Friday, October 7, 2016. Until now, our company has cultivated the technology for breaking brittle materials in the glass substrate and flat panel display markets. This time, we will refine our conventional scribe & break technology for various substrates in new fields such as electronic components and semiconductors, and propose the following new process ("High Speed & Dry") that overturns existing industry concepts. ■ High-quality & high-precision scribing processing with next-generation diamond cutting edges (for ceramics, sapphire, glass, etc.) ■ Chip separation (breaking) processing using V-Motion Separation ■ Scribing/drilling/patterning processing using original laser technology We invite you to visit our booth and experience the new era of scribing & breaking technology. ● Contact Information ● Samsung Diamond Industrial Co., Ltd. EC Business Division, Sales Group TEL: 072-648-5013 FAX: 072-648-5206

Curing applications for wafer dicing tape, featuring stable long lifespan with UV-LED adoption.

  • Wafer

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China-made GaAs single crystal GaAs wafers high purity GaAs poly

  • Other polymer materials
  • Wafer

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The jig produced by our company was used in Suntory's commercial!

  • Other industrial robots
  • Wafer
  • bracket

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For low-cost, high-performance wet processing equipment, please leave it to us.

  • Wafer
  • lens
  • Wafer processing/polishing equipment

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