List of 基板 products
8776~8820 item / All 15042 items
We support product development without setbacks by implementing noise countermeasures from the early design stage.
- Printed Circuit Board
One-stop proposal for EMS and ODM! Development design, PCB assembly/assembly.
- Product Development
- Other contract services
Fundamental Knowledge of Web APIs and Examples of Applications
- Embedded Board Computers
- Embedded system design service
- Communications
We will introduce a case where it became possible to prevent Au plating deposition and suppress variation in plating between terminals.
- jig
- Other contract services
Measuring the strain behavior of the sealing resin under thermal cycling using a strain gauge!
- Other measurement, recording and measuring instruments

Strain measurement of power module package resin.
We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.
Industry's smallest class substrate-type AC/DC power supply LFA series
- power supply
Introduction to the specific sintering cleaning process! Discussion of the differences from flux cleaning, etc.
- Cleaning agents

A page titled "Cleaning Technology Required for Sintered Joint Devices" has been added.
This document explains the cleaning techniques required for sintered joining devices. It discusses the background for the need for cleaning in sintered joining devices and the differences from flux cleaning, as well as introducing specific cleaning processes. It also includes information on the selection of cleaning agents and methods, as well as cleanliness analysis after cleaning. We encourage you to read it.
A fundamental transformation is required for cleaning methods and cleaning agents! Introducing cleaning know-how.
- Technical and Reference Books
This explains the principle of a counter that quickly and accurately measures the number of items such as postcards, envelopes, tickets, efficacy documents, cards, booklets, circuit boards, gaskets, a...
- Counting Machine
It has been upgraded to the latest housing, equipped with a new electronic circuit board and improved probes. For cans.
- Data Logger
Sampling using capillaries through surface tension! FT-IR analysis has become possible.
- Other contract services

Introduction to Micro FT-IR
At Aites Co., Ltd., we have newly introduced "Microscopic FT-IR" this fiscal year. The "Microscopic FT-IR," which combines FT-IR and optical microscopy, allows for the measurement of tiny substances on the order of several tens of micrometers, which are difficult to measure with conventional FT-IR, using an aperture (field of view diaphragm). There are three main measurement methods for Microscopic FT-IR: "transmission method," "reflection method," and "ATR method." While the transmission method is the basic measurement method in Microscopic FT-IR measurements, the reflection method or ATR method may be more suitable depending on the shape of the sample and the feasibility of sampling.
Automation is possible at various points! Instant measurement of copper film thickness and the potential for increased production efficiency through advanced statistical processing is here!
- Coating thickness gauge

June 7-9, 2017 [Notice of Participation in JPCA Show 2017]
Therma Precision Co., Ltd. will be exhibiting at the world's only and largest electronic circuit-related industry exhibition, the "JPCA Show (Semiconductor Packaging and Embedded Components Technology Exhibition)." 【Details】 ■ Exhibition: JPCA Show 2017 (47th International Electronic Circuit Industry Exhibition) Semiconductor Packaging and Embedded Components Technology Exhibition ■ Dates: June 7 (Wednesday) - 9 (Friday), 2017, 10:00 AM - 5:00 PM ■ Location: Tokyo Big Sight ■ Booth Number: East Hall 5, 5F-26 ■ Exhibited Products: Plating solution analysis equipment, projection exposure equipment, warpage measurement equipment, chemical processing equipment, etc. ■ Exhibition Homepage: JPCA Show http://www.jpcashow.com/show2017/index.html
We offer two types of products with the motor mounting position on the right side and the left side!
- fan
It is a "development tool" that allows you to master everything from the basics of liquid crystals to drawing methods in a short time.
- controller

Attention small lot and long-term production set manufacturers!! We are currently releasing a demo video of our small LCD using our LCD controller!!
We are currently releasing demo videos of small LCD displays using the Kenik System's LCD controller. We hope that by viewing actual display examples, you can imagine what kind of displays can be achieved with our controller. The videos currently available are as follows: - 3.5-inch LCD demo video - 4.3-inch LCD demo video - WVGA LCD demo video - Overview video of Kenik System's LCD controller *Please view the videos from the link below. If you have any questions regarding the details or the videos, please feel free to contact us.
Environmentally friendly, heat-resistant water-soluble copper discoloration inhibitor.
- Non-ferrous metals
- Printed Circuit Board
Right Angle DIP Implementation Receptacle
- Automotive Connectors
Using 18,000 types of coating designs and 7,000 types of substrates!
- Laser Components
- Other optical parts
Behind the scenes of 5G development by the responsible company! Introducing cleaning know-how.
- Technical and Reference Books
All-in-one new model with both ultrasound and CT functions in a deskless design!
- X-ray inspection equipment
It is a low water absorption, low dielectric, and low dielectric loss tangent urethane acrylate! We have technical materials and free samples available!
- plastic
We also offer weakly adhesive and lightly adhesive types! Introducing surface protection tape that can accommodate various surface conditions.
- Adhesive tape
- Other consumables
- Printed Circuit Board
Ease of use is the biggest feature! What is PID control, which allows you to find the perfect control method just by adjusting parameters?\For precise control, choose Nippo!/
- Temperature and Humidity Control
We will introduce the basic knowledge necessary for accurate temperature measurement! Leave accurate temperature measurement and control to Nippo!
- Sensors
By selecting cleaning solder paste and flux, you can ensure more reliable cleanliness!
- Technical and Reference Books
Selectable size with a resin cover, no need to worry about contact with other parts!
- Other electronic parts
- Printed Circuit Board
We will conduct failure analysis of electronic components and observe and analyze the failure locations through material analysis.
- Other contract services
- Contract Analysis
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
- Bonding Equipment
What are the types of display devices and the design concepts? You can also select components, design circuits, and create artwork for display devices! Development is available at Nippo.
- Circuit board design and manufacturing
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.
- Bonding Equipment
Significant cost reduction, environmentally friendly Air model.
- Plasma surface treatment equipment

We will exhibit at the Connection Joining EXPO in Makuhari.
FUJI is a leading company in atmospheric pressure plasma devices. In recent years, the introduction of atmospheric pressure plasma as a pre-treatment device to improve adhesive strength and quality has been progressing in manufacturing sites. FUJI's plasma device, Tough Plasma, has world-class processing capabilities and can perform continuous processing at high speeds. At this exhibition, we will showcase the latest model of the Tough Plasma series, "ATOM," which operates solely on air and electricity. Please come and see its world-class capabilities, quality, and safety monitoring features. We will also have a corner where you can experience the effects of plasma treatment firsthand with adhesive sample experiences. If you are having trouble with adhesion, please feel free to stop by our booth. During the exhibition, our engineers will be stationed at the booth. They will be happy to answer any questions you may have, from basic knowledge of plasma to the types of materials that can be processed and processing speed estimates, so please feel free to visit us. You can complete pre-registration from the link below [Details & Application].
Leave your industrial electronic equipment needs to us.
- Contract manufacturing
XRD measurements in micro areas are possible.
- Contract Analysis
Especially resistant to high temperatures and high concentrations of alkali! A label expressing a barcode image.
- label
- Food Cleaning Equipment
- Plate and tray related equipment and devices
We can handle semiconductor manufacturing equipment, printed circuit board manufacturing equipment, high-speed press machine peripheral devices, and more!
- Other services
- EMS
- Embedded system design service
Using a sample board, we will implement the BGA! I will explain each defect!
- Contract manufacturing
A case where advanced technology and know-how were utilized to achieve high reliability and durability!
- Circuit board design and manufacturing
- Temperature and Humidity Control
- controller
Providing waterproof mounting solutions by using adhesive and O-rings for sealing to the substrate!
- filter
A rich lineup with a long model cycle.
- Other electronic parts
It is a composite material that combines the lightness of aluminum with the rigidity of steel, low thermal expansion, and excellent heat dissipation due to high thermal conductivity.
- Fine Ceramics
- Other machine elements
- Other semiconductor manufacturing equipment

Exhibited at the 2017 High-Performance Ceramics Exhibition at Tokyo Big Sight from April 5 to 7.
Thank you to everyone who visited us. We will be exhibiting at the "High-Performance Ceramics Exhibition" held at Tokyo Big Sight in April. At our booth, we will showcase: - A new product that further enhances the fracture resistance of silicon nitride ceramics and improves thermal conductivity. - A new material that does not bend like iron, utilizing the lightweight properties of aluminum, known as "composite materials of metals and ceramics." - "Ceramic substrates" characterized by thin film and film formation technology. If you have any concerns regarding equipment design, component design, thermal design, or anything else, please feel free to stop by our booth for a consultation. We look forward to seeing you.
All series are compliant with the RoHS directive! We introduce a variety of capacitors with different operating temperature ranges and operating voltages.
- Capacitor
KWS-A series ultra-compact ACDC on-board switching power supply with all-in-one design that eliminates the need for external components.
- Switching Power Supply
- Other power sources
High-precision band gap evaluation is possible through combined analysis of XAFS and XPS.
- Contract Analysis

Technical Information "Evaluation of Band Gap for Oxide and Nitride Thin Films (C0462)" and one other item published.
We have published the following two analysis case studies on the MST website: - Band gap evaluation of oxide and nitride thin films (C0462) - Evaluation of organic contamination of wafers in wafer cases (C0461) For more details, please visit the MST website. http://www.mst.or.jp/
We will introduce methods for heat dissipation in printed circuit boards.
- Wiring materials
Realization of the production of cells with wide gaps. Capable of accommodating various gap sizes from 200μm to 1.1mm.
- others
World-class high-efficiency DC/DC converter for power amplifiers.
- power supply