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Processing Machine Product List and Ranking from 950 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

Processing Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. 宮川工機 Aichi//Industrial Machinery
  2. アマダ（アマダグループ） Kanagawa//Industrial Machinery
  3. フジ産業 Shizuoka//others
  4. 4 日本金型材 Saitama//Trading company/Wholesale
  5. 5 フコク Kanagawa//Industrial Machinery
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Processing Machine Product ranking

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. Super large cross-section CLT processing machine MPS-71 宮川工機
  2. Plastic mold steel "KTSM3M" 日本金型材
  3. Tokyo Machine and Tool Co., Ltd. Business Introduction 東京マシン・アンド・ツール
  4. 4 Amada's domestic exhibition facility アマダ（アマダグループ）
  5. 5 Line boring & overlay weldimg machine "WS Series" 大陽工機 本社

Processing Machine Product List

1951～1980 item / All 2775 items

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FPC Processing Equipment Product Lineup

FPC Processing Equipment Product Lineup

Total support from the manufacturing bear.

This catalog features various FPC processing equipment, including flexible punchers and guide hole punchers. We offer a wide range of FPC processing equipment that pursues high efficiency and high precision. You can choose from options such as proximity exposure machines and coverlay punching servo presses, tailored to your needs. 【Contents】 ■ Flexible Punchers ■ Guide Hole Punchers ■ Proximity Exposure Machines ■ Coverlay Punching Servo Presses ■ Coverlay Temporary Bonding Machines *For more details, please download the PDF or feel free to contact us.

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  • Printing Machinery
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[Equipment Introduction] Wire Electrical Discharge Machine

[Equipment Introduction] Wire Electrical Discharge Machine

Processing is possible even for items that have been sintered! The movement range is x750mm, y500mm, and z400mm.

We would like to introduce the machinery and equipment owned by Kanapresto Co., Ltd. Our company has a wire electrical discharge machine, the Sodick AQ750L. The travel range (maximum processing dimensions) is x750mm (1050), y500mm (750), and z400mm (400), and it is capable of processing hardened materials. It can accommodate key machining without cutting tools and involute machining. Please feel free to consult us when needed. 【Machine Overview】 ■ AQ750L: 1 unit ■ Travel range (maximum workpiece dimensions) ・ x750mm (1050) ・ y500mm (750) ・ z400mm (400) ■ Capable of processing hardened materials ■ Key machining without cutting tools ■ Involute machining *For more details, please refer to the PDF document or feel free to contact us.

  • Electric discharge machine
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Introduction to 3D Laser Processing

Introduction to 3D Laser Processing

Supports various sizes and shapes! 3D laser processing with freely customizable shapes.

Nikken Sangyo Co., Ltd. offers "3D Laser Processing," which realizes the reduction of material waste with optimal processing programs tailored to material shapes. Equipped with a 3D laser head that can handle complex processing, it also contributes to the expansion of product variations through tapping. Additionally, the automatic focal position adjustment function calculates the optimal focal position, enabling high-precision and quick processing of complex shapes. 【Features】 ■ Achieves laser processing at high speed and optimal conditions ■ Tapping processing is also possible (maximum tap M12) ■ High-precision integrated processing from laser processing to tapping ■ Reduces material waste with optimal processing programs tailored to material shapes ■ Streamlines handling by processing a series of operations in one go, ensuring speed *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
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Zaguri external shape processing machine "ECO-RZ series"

Zaguri external shape processing machine "ECO-RZ series"

A shape processing machine for ZAGRI that emphasizes running costs!

The "ECO-RZ Series" is an energy-efficient outer shape processing machine that focuses on running costs. We offer compatible models for various board sizes and types, and it comes standard with an automatic pin lifting function. Additionally, it is equipped with the latest CNC Sieb & Meyer (Ver. 82.00). 【Features】 ■ Emphasis on running costs ■ Proposed by application-specific series ■ User-friendly operating system *For more details, please download the PDF or feel free to contact us.

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Shape Processing Machine "ECO-R Series"

Shape Processing Machine "ECO-R Series"

Equipped with comprehensive features! An energy-efficient exterior processing machine focused on running costs.

The "ECO-R Series" is an energy-saving device that focuses on running costs. We offer compatible models based on substrate size, number of axes, and with counterbore functions. 【Features】 ■ A lineup of compatible models based on substrate size, number of axes, and with counterbore functions ■ Emphasis on running costs ■ Easy maintenance: Concentrated arrangement of CNC, control systems, air equipment, etc., by model ■ Equipped with comprehensive features *For more details, please download the PDF or feel free to contact us.

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UV laser processing machines (nanosecond, picosecond, etc.) 【contract processing, equipment sales】

UV laser processing machines (nanosecond, picosecond, etc.) 【contract processing, equipment sales】

Equipped with a high-speed UV oscillator with a wavelength of 355nm! A laser processing machine that also supports ultra-small diameter processing from 10μm to 30μm.

The "Vela UV" is a laser processing machine equipped with a high-speed UV oscillator operating at a wavelength of 355nm. It performs high-speed, high-precision micro-diameter processing of printed circuit boards and other materials. Additionally, it allows for the selection of suitable laser sources based on materials and purposes. The two-axis configuration enables high-speed processing of two workpieces simultaneously. 【Features】 ■ Ability to select suitable laser sources based on materials and purposes ■ High-speed processing of two workpieces simultaneously due to the two-axis configuration ■ Capable of micro-diameter processing from 10μm to 30μm ■ Comfortable operability with in-house developed CNC ■ Support for test processing ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

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CO2 Laser Processing Machine [Contract Processing and Equipment Sales]

CO2 Laser Processing Machine [Contract Processing and Equipment Sales]

Comfortable operability with in-house developed CNC! CO2 laser processing machine.

The "CO2 Laser Processing Machine" achieves low power consumption through a design that eliminates waste. It supports various surface treatments such as blackening, browning, and untreated, as well as various processing methods like DLD and Conformal Mask. It offers comfortable operability with our in-house developed CNC. 【Features】 ■ Achieves low power consumption through a design that eliminates waste ■ Supports various surface treatments (blackening, browning, untreated) ■ Supports various processing methods (DLD, Conformal Mask, Resin Direct) ■ Comfortable operability with our in-house developed CNC ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

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Invitation to Exhibit at the 2019 Total Solutions for Electronic Devices Exhibition

Invitation to Exhibit at the 2019 Total Solutions for Electronic Devices Exhibition

Exhibition of CO2 and UV laser processing technology, hole drilling and contour processing machines, fully automatic AOI, and X-ray inspection equipment.

The Daifune Group is engaged in the manufacturing and sales of drilling machines and profile processing machines, as well as contract processing using various laser processing machines. At the "Total Solutions for Electronic Devices Exhibition 2019," starting on June 5, we will introduce our unique processing technologies and drilling/profile processing machines. We will also display actual models of fully automatic AOI and X-ray inspection equipment, and provide detailed explanations of the features of each product. [Exhibition Content] ■ CO2 and UV laser processing (we also accept prototypes for 5G laser processing) ■ Drilling machines and profile processing machines (processing technology for base stations, communications, and automotive substrates) ■ Fully automatic AOI (also for labor-saving, IoT, inline, and cloud applications) ■ X-ray inspection equipment (for multilayer boards) *You can view related product materials from the "PDF Download" section.

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  • Exhibition planning/construction
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Introduction of Automatic Pin Punching Function [Profile Processing Machine]

Introduction of Automatic Pin Punching Function [Profile Processing Machine]

【Automatic PIN insertion and extraction function (one-of-a-kind)】 ■Improvement of dimensional processing accuracy (achieved within ±50μm) ■Streamlining of processes

【Automatic PIN Insertion and Extraction Function (One and Only)】 ■ This is an optional feature for Vela's contour machining machines. ■ It automatically performs "internal PIN hole machining," "PIN insertion," "contour machining," and "PIN extraction." ■ The manual "PIN insertion" process is eliminated, allowing for high-precision automatic PIN insertion, which reduces the wobbling of manually inserted pins and improves contour machining accuracy. ■ By performing PIN insertion simultaneously on six axes, production efficiency is also increased.

  • Circuit board processing machine
  • Processing Machine

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Introduction to Ultra-High Precision Engraving Machine Functionality

Introduction to Ultra-High Precision Engraving Machine Functionality

Achieving ultra-high precision engraving! ■ Using in-house developed high-precision touch sensors ■ Machining accuracy up to ±0.010mm (conditions negotiable)

Achieving ultra-high precision engraving processing! Using our self-developed high-precision touch sensor, processing accuracy is approximately ±0.010mm (conditions negotiable). ■ This is an optional feature of the Vela external processing machine. ■ Direct detection of contact between the tool and the inner layer copper foil. ■ No insulation required between the spindle and the housing. ■ High-precision detection of the minute current flowing through the tool.

  • Circuit board processing machine
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Introduction to examples of inner layer copper foil machining.

Introduction to examples of inner layer copper foil machining.

【Example of Inner Layer Copper Foil Engraving】 In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil, and we will introduce examples of such processing.

In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil. By using our touch-type engraving mechanism and accurately detecting the target copper foil position, we can achieve high-precision engraving processing.

  • Circuit board processing machine
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CO2 Laser Processing [Cu Direct Blind Hole Processing Results]

CO2 Laser Processing [Cu Direct Blind Hole Processing Results]

Focus on the micro-diameter processing capability of CO2 lasers and the technology for controlling resin diameter.

1. Cu Direct BH Processing Results ■No.1: Example of untreated substrate Cu direct micro-diameter processing Hole diameter φ30–60μm ■No.2-1: Improvement in quality and productivity of Cu direct φ70μm processing ■No.2-2: Improvement in quality and productivity of Cu direct φ100μm processing

  • Circuit board processing machine
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CO2 Laser Processing [ABF Resin Direct Processing Results]

CO2 Laser Processing [ABF Resin Direct Processing Results]

■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.

ABF Resin Direct Processing Results ■No.1-1: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ30–50μm ■No.1-2: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ60–120μm ■No.2-1: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ30–50μm ■No.2-2: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ60–120μm

  • Circuit board processing machine
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[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.

  • Processing Contract
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Individual Axis Drive Profile Machining Machine 'ECO-RM Series'

Individual Axis Drive Profile Machining Machine 'ECO-RM Series'

Suppresses substrate warping, enabling high-precision notching! Automatic correction for each axis independently during processing.

The "ECO-RM Series" is a contour processing machine with individually driven axes that can perform high-precision contour machining for patterns. With axis alignment correction, it automatically compensates for the expansion and rotation of the substrate on a per-axis basis (when equipped with a CCD camera). The machine itself drills reference holes and sets inner pins for substrate fixation, enabling high-precision alignment processing for each piece when used in conjunction with the axis alignment correction function. 【Features】 ■ Axis Alignment Correction - Automatically compensates for substrate expansion and rotation on a per-axis basis - Enables high-precision contour machining for patterns ■ Automatic Pin Insertion Function (Optional) - The machine drills reference holes and sets inner pins for substrate fixation - Allows for high-precision alignment processing for each piece *For more details, please refer to the PDF document or feel free to contact us.

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Laser processing machine - multipurpose single-axis laser processing machine

Laser processing machine - multipurpose single-axis laser processing machine

Multipurpose 1-axis laser processing machine! Development of processing technology for new materials and sales of production machines (custom-made available).

The multi-purpose single-axis laser processing machine was first exhibited as a real machine at "JPCA 2022" by the Japanese company Ofuna. Customers can choose the laser oscillator and table specifications according to their processing applications and materials, allowing for custom-made solutions. We own various types of multi-purpose single-axis laser processing machines, including UV (nanosecond, picosecond) and CO2, enabling us to provide consistent support from the development of processing technology for new materials to the sale of production machines. ■ Examples of processing with UV laser Processing of micro-diameter holes in ABF material (package substrate), processing of micro-diameter holes in PI material (flexible substrate), small-diameter hole processing of SI wafers and ceramics, cutting of Cu/PP multilayer boards, cutting of Cu/LCP double-sided boards, etc. ■ Examples of processing with CO2 laser TH processing of Cu 2um double-sided boards, BH processing of Cu 2um multilayer boards, and new materials compatible with high frequency and 5G such as fluororesin, liquid crystal polymer, and PPE resin. *For more details, please refer to the PDF materials or feel free to contact us. *There are also various examples of processing applications, so please check the PDF materials.

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CO2 Laser Processing Example: Package Substrate Processing

CO2 Laser Processing Example: Package Substrate Processing

Case study of small diameter hole drilling for package substrates

Using our unique technology, we can ensure high-quality hole shapes and achieve the desired taper rate. This document details the processing of materials with a thickness of 32.5μm using a CO2 laser, down to a minimum diameter of φ30μm.

  • Processing Contract
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CO2 Laser Processing Example_Cu Direct TH Processing

CO2 Laser Processing Example_Cu Direct TH Processing

Cu Direct Double-Sided Through Hole Processing

In a case where through-hole processing was performed on a double-sided plate with a thickness of φ2μm using a CO2 laser processing machine, we control the cross-sectional shape of the through-holes according to the customer's needs using our unique technology.

  • Processing Contract
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CO2 Laser Processing Example_Cu Direct BH Processing

CO2 Laser Processing Example_Cu Direct BH Processing

Cu Direct Blind Processing Examples

This is an example of using our equipment's unique features to ensure high-quality hole shapes and aim for a reduction in the number of shots. In this document, we have achieved a reduction from the usual 4 shots to 3 shots by utilizing these unique features.

  • Processing Contract
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UV & CO2 Laser Processing Case Study: Composite Processing of Cu + PP Materials

UV & CO2 Laser Processing Case Study: Composite Processing of Cu + PP Materials

Case study of UV and CO2 laser hybrid processing of Cu+PP materials

Our company has two types of processing technologies, UV and CO2, and by combining the advantages of these lasers, we are able to achieve high-quality laser drilling that reduces the burden of subsequent processes. This document discusses the processing of multilayer boards, and to avoid damaging the inner copper foil, we perform resin processing with CO2 after drilling, followed by UV processing to remove residues at the bottom of the holes.

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UV Laser Processing Examples: SI Wafers, Ceramics, Glass, etc.

UV Laser Processing Examples: SI Wafers, Ceramics, Glass, etc.

Examples of UV laser processing applications for various materials.

Our company sells in-house developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. This document includes processing examples of SI wafers, ceramics, multilayer boards, and double-sided boards using picosecond lasers.

  • Processing Contract
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UV Laser Processing Example: Package Substrate

UV Laser Processing Example: Package Substrate

Examples of micro-diameter hole processing for package substrates

Using the top-hat beam with a minimum beam diameter of φ10μm or less from our UV laser processing machine, we achieve high-quality drilling with a steep taper. This document includes processing examples with a minimum diameter of φ20μm for package material with a thickness of t25μm and a minimum diameter of φ10μm for package material with a thickness of t10μm.

  • Processing Contract
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UV Laser Various Processing Examples

UV Laser Various Processing Examples

We offer a wide range of services from the sale of UV laser processing machines to initial development and contract processing for small-scale production!

Our company sells laser processing machines developed in-house, and we also accept contract processing from prototypes to mass-produced products. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing and manufacturing sales of mass-produced items. Please feel free to consult with us.

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CO2 Laser Processing Examples

CO2 Laser Processing Examples

We offer a wide range of services from the sale of CO2 laser processing machines to initial development, contract processing for small-scale production, and manufacturing sales.

We sell our own developed laser processing machines, but we also accept contract processing from development products to mass-produced items. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing of mass-produced items and the manufacturing and sales of equipment. Please feel free to consult with us.

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Shape processing machine alignment function

Shape processing machine alignment function

High-precision contour processing is possible with recognition of the substrate shape and added alignment correction!

High-precision processing with alignment correction is possible by recognizing the shape of the substrate. 【Features】 - Position measurement is performed for each piece, allowing for high-precision processing against the substrate pattern. - By using our depth inspection sensor (DSFi sensor) in conjunction, high-precision counterboring is possible.

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Shape processing machine with high-precision counterboring function.

Shape processing machine with high-precision counterboring function.

It is a high-precision counterbore function using a high-precision height detection sensor!

The high-precision height detection sensor "DSFi Sensor" developed by our company can be used for immediate drill break detection as well as for high-precision substrate height detection in precision counterboring processes. In traditional probe methods, height errors occur between the probe and the tool, making high-precision counterboring difficult. However, by using our height detection sensor, it is possible to detect when the tool contacts the work surface, thereby reducing height errors between the work surface and the measurement surface, as well as errors for each tool, allowing for high-precision machining.

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New 4-beam CO2 laser processing machine for package substrates

New 4-beam CO2 laser processing machine for package substrates

A new type of CO2 laser processing machine for PKG materials that quickly processes at high speed with four beams.

The manufacturing of electronic circuits for CPUs, which are becoming increasingly miniaturized, requires more precise processing. Therefore, the selection of processing machines is crucial, with quality and productivity being important factors. The "ECO-TL4C" from Ofuna Corporation Japan is a new type of CO2 laser processing machine that enhances the processing quality of substrate materials for packaging, including interlayer insulating film materials, through its unique functions, enabling efficient processing with two tables and four beams.

  • Other semiconductor manufacturing equipment
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【Increased productivity with 24-hour operation through automated lines】Processing machine

【Increased productivity with 24-hour operation through automated lines】Processing machine

Automated line! Introducing laser processing machines that can operate 24 hours a day without human intervention.

Shin Nihon Kogyo Co., Ltd. is a nationwide order-receiving company specializing in laser processing, fiber laser welding, and precision sheet metal processing through IT infrastructure. We can handle everything from "design" to "precision sheet metal processing" and "painting," all the way to "assembly" and "installation." Our company owns equipment such as the 'Laser Processing Machine (F1)' capable of processing both thin and thick plates, as well as the 'Turret Punching Machine (EM)' and 'Laser Processing Machine (FO).' Not only do we "create products," but we also engage with customers from the product development stage to discuss production methods and more, allowing us to respond to customer needs from the ground up, so please feel free to consult with us. 【Equipment Features】 ■ Automated line ■ Unmanned operation 24 hours a day ■ Offered at low prices ■ Capable of processing from thin to thick plates ■ Automatic mold exchange possible ■ Automatic material supply and discharge possible *For more details, please refer to the PDF materials or feel free to contact us.

  • Special Processing Machinery
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[Processing Example] Introducing processing examples using a fiber welding machine.

[Processing Example] Introducing processing examples using a fiber welding machine.

Our company handles bending machines capable of long-length and precision processing!

At Shin Nippon Steel, we have bending machines capable of precise bending processing for long materials (4m) and servo bending machines that can express precise bending processing. You can view all of our introduced machines and sample products, including cutting-edge equipment, so please feel free to contact us. The photo is an example of a sample. By pulling half the thickness of the plate during welding, an R shape is created as if it were bent, and it can be processed with minimal burning (sometimes delivered as is). *For more details, please feel free to contact us.

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  • Welding Machine
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Semi-automatic press ginkgo processing machine 'PCM-380N'

Semi-automatic press ginkgo processing machine 'PCM-380N'

Efficiently handle albums of various sizes and thicknesses! Each mode can be selected individually!

The "PCM-380N" is a semi-automatic press and ginkgo processing machine that is simple, easy to use, and requires minimal maintenance. You only need to input the thickness of the album to be processed via the touch panel. It supports a maximum press size of 380×360mm and thicknesses from 8 to 65mm. With touch panel and PLC control, it efficiently processes albums of various sizes and thicknesses, allowing for small-batch, diverse processing. 【Features】 ■ Switchable between press, ginkgo, and heater modes ■ Simple operation by just inputting the book thickness on the touch panel ■ Maximum size: 380×360mm, maximum thickness: 8–65mm ■ Ideal for processing after binding with the case-in machine "ACI-360N" *For more details, please refer to the PDF document or feel free to contact us.

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