We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 426 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 20, 2026～Jun 16, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 20, 2026～Jun 16, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  3. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 北一電気 Niigata//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:May 20, 2026～Jun 16, 2026
This ranking is based on the number of page views on our site.

  1. Printed circuit board 北一電気
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. FPC for the space industry 太洋テクノレックス 本社　和歌山
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム

Substrate Product List

751～780 item / All 1516 items

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Small-scale production of flex rigid.

Small-scale production of flex rigid.

We are happy to accept small-scale production! We have a wide variety of materials for both PCBs and FPCs in stock, and we can make proposals that meet our customers' needs!

We accept small-scale production of flexible rigid boards. We can assist those who are struggling with "how to create flexible rigid boards or consider specifications" and those who are facing difficulties with "small lot production of flexible rigid boards." Our company has internalized most of the processes, making us suitable for small lot production. We can produce from just one piece. We can also procure materials that are not regularly stocked, so please feel free to consult with us. 【Features】 ■ Most processes are internalized, making us suitable for small lot production ■ Production is possible from one piece ■ We have extensive knowledge of both FPC and PCB production methods ■ A wide variety of materials for both PCB and FPC are readily available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Substrate "Dielectric Substrate for Microwave Use"

Substrate "Dielectric Substrate for Microwave Use"

It has a stable temperature characteristic with a high Q value in the high frequency range, achieving a wide range of inductance!

The "dielectric substrate for microwave applications" can be used for electronic components for mobile phones, microwave communication devices, microwave integrated circuit (MIC) substrates, stripline resonators, Bluetooth, and other applications. This product features stable temperature characteristics with a high Q value in the high-frequency range, achieved through our unique ceramic material technology, and realizes a wide range of permittivity. Precision processing such as surface polishing and slicing is also available upon request. Please feel free to contact us. 【Features】 ■ High Q value in the high-frequency range ■ Stable temperature characteristics ■ Realizes a wide range of permittivity *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components
  • Substrate

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Phonon Meiwa Co., Ltd. Business Introduction

Phonon Meiwa Co., Ltd. Business Introduction

We will flexibly respond to everything from new product development and prototype production to mass production!

Phonon Meiwa Co., Ltd. is a company that mainly deals with products such as ferrite cores and ceramic cores for inductors (coils), ceramic substrates for chip resistors, and ceramic insulators for fixed resistors. With advanced specialized technology and the latest equipment, we respond to various needs. We look forward to your inquiries regarding products related to ceramics and ferrites. Please feel free to contact us. 【Product Line】 ■ Ferrite cores and ceramic cores for inductors (coils), ceramic substrates for chip resistors, ceramic insulators for fixed resistors, and more. *For more details, please refer to our catalog or feel free to contact us.

  • Electronic Components
  • Other electronic components and modules
  • Other contract manufacturing
  • Substrate

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LTCC substrate

LTCC substrate

LTCC substrate

LTCC stands for Low Temperature Co-fired Ceramics, which refers to low-temperature sintered ceramics. The low firing temperature allows the use of metals with low resistance as conductors, making it ideal for high-frequency applications due to its low loss. Its ease of multilayering and flattening, along with minimal shrinkage variation, enables high-precision and high-density mounting. By using DPC (Direct Plating Copper), it can also be utilized in applications that require high thermal conductivity and excellent heat dissipation. Thus, LTCC is expected to be used in various fields such as circuit boards and semiconductor packages.

  • others
  • Substrate

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DUV photolithography substrates, components

DUV photolithography substrates, components

◆For DUV photolithography ◆Various components using high-quality synthetic crystal quartz substrates ◆A product line that can withstand semiconductor-grade reliability requirements

Synthetic crystal quartz is an excellent material recognized for its high transmittance in the UV wavelength range, crystallographic properties, optical uniformity, chemical resistance, and durability against long-term exposure. Tydex manufactures various DUV components using precision optical grade synthetic crystal quartz equivalent to Class A1. Photolithography technology using DUV (deep ultraviolet) wavelength lasers is utilized in various industrial applications, including semiconductors and nanotechnology, making it indispensable in our lives. With further demands for higher density and narrower linewidths, KrF excimer lasers (248nm) and ArF excimer lasers (193nm) are widely used, leading to an increased demand for high-performance optical components surrounding these light sources.

  • Other optical parts
  • Other physicochemical equipment
  • Substrate

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Glass ceramics: solid substrate / laminated substrate

Glass ceramics: solid substrate / laminated substrate

We also accommodate custom designs for size, thickness, and glass materials! We can handle prototypes even in small quantities of a few pieces.

At Yamamura Photonics, we handle LTCC and alumina solid substrates, as well as multilayer substrates with formed conductor wiring circuits. We can produce various sizes and shapes, and we also accommodate custom designs according to customer requests. In recent years, we have been considered for a wide range of applications, including infrastructure such as antennas, various semiconductor packages, automotive use, medical applications, and semiconductor devices. 【Features】 ■ Providing LTCC solid substrates and alumina solid substrates ■ Prototype development of LTCC multilayer substrates ■ Material development and custom support *For more details, please refer to the PDF document or feel free to contact us.

  • Glass
  • Substrate

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High-speed response wireless microcontroller board WCU-C series

High-speed response wireless microcontroller board WCU-C series

Faster response compared to other wireless modules like Zigbee! Response speed < 1ms, wireless transfer rate Max 2Mbps.

We have added a 2.4GHz wireless module with high responsiveness that cannot be supported by Zigbee, wireless LAN, or Bluetooth to our lineup. By adopting a simple proprietary communication protocol, we expand the applications of wireless technology with responsiveness not found in other wireless modules. Of course, customization is also possible. We can propose communication methods tailored to your system in scenarios where Zigbee has response speed issues, Bluetooth has channel limitations, or Wi-Fi has concerns regarding battery life and size. It is also possible to evaluate and select wireless devices and sensors according to your needs and design them fully customized.

  • Remote Control
  • Communications
  • Embedded Board Computers
  • Substrate

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[Document] TCS3-100 Calibration Board Instruction Manual

[Document] TCS3-100 Calibration Board Instruction Manual

Equipped with a high-precision load pad with an accuracy of ±0.3%! Introducing the product's applications and the position of the elements.

This document presents the specifications of the custom calibration board "TCS3-100" that can be manufactured with a dedicated calibration kit in a tabular format. The arrangement is GSGSG, the pad size is 50μm × 50μm, and the pad pitch is 100μm. It is a simple and easy-to-reference booklet. Please take a moment to read it. 【Contents (partial)】 ■ Pattern name ■ Mounted component symbols ■ Applications ■ Component positions *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[Document] TCS3-125-2 Calibration Board Manual

[Document] TCS3-125-2 Calibration Board Manual

Manufacturing of a dedicated calibration kit is possible (custom)! Introducing the specifications of TCS3-125-2.

This document includes the pattern names and other details of the calibration board "TCS3-125-2," which is equipped with a high-precision load pad of ±0.3%. It is a SOLT/TRL calibration device with a pad pitch of 125μm. It is a simple and easy-to-reference book. Please take a moment to read it. 【Contents (partial)】 ■ Pattern names ■ Component symbols ■ Applications ■ Component positions *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[Document] TCS3-200 Calibration Board Instruction Manual

[Document] TCS3-200 Calibration Board Instruction Manual

Pad pitch 175–225μm! Introducing the element symbols and positions of the TCS3-200.

This document contains the specifications for the calibration board "TCS3-200" handled by Techno Probe Inc. We introduce pattern names such as Loop-Back Thru1 and Cross Thru1. It is a simple and easy-to-reference book. Please take a moment to read it. 【Contents (partial)】 ■ Pattern List ■ Substrate Top View *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[Document] TCS4-200/250 Calibration Board Manual

[Document] TCS4-200/250 Calibration Board Manual

Pad size 65μm × 50μm! Introducing the substrate top view and pattern list.

This document includes the calibration board "TCS4-200/250" handled by Techno Probe Inc. It introduces the arrangement, pad pitch, applications, and positions of the components. It is a simple and easy-to-reference booklet. Please take a moment to read it. 【Contents (partial)】 ■ Pattern Name ■ Mounted Component Symbols ■ Applications ■ Positions of Components *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Printed circuit board

Printed circuit board

We respond to all requests regarding delivery times, costs, and more! Custom printed circuit board manufacturing tailored to your needs.

At Chotong Co., Ltd., we accept printed circuit board manufacturing tailored to our customers' needs. From software development and circuit design to assembly, we manage the entire process and deliver the finished product with just one invoice, handling all aspects of PCB manufacturing. 【Features】 ■ Artwork design by experienced design specialists ■ Established network of partner manufacturers ■ Capable of manufacturing from prototypes and small lot diverse products to mass production ■ Support for various substrate materials ■ Consultation available for short lead times on prototypes and mass production *For more details, please refer to our catalog or feel free to contact us.

  • Processing Contract
  • Substrate

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LED circuit board

LED circuit board

LED circuit board

This is an example of a custom product with numerous red chip LEDs arranged on a printed circuit board.

  • Lighting for image processing
  • Contract manufacturing
  • Other optical parts
  • Substrate

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Introduction to Quartz Glass Micro-Hole Formation and Metal Filling Technology (Developed Product)

Introduction to Quartz Glass Micro-Hole Formation and Metal Filling Technology (Developed Product)

It is suitable for applications such as high-frequency low transmission loss substrates (5G communication) and MEMS/sensor substrates!

We would like to introduce our technology for "Quartz Glass Micro-Hole Formation and Metal Filling." It is possible to achieve glass vias without micro-cracks and glass vias with metal filling that are voidless. We can provide flatness for both the glass top surface and the metal top surface. This technology is suitable for applications such as high-frequency low transmission loss substrates (5G communication), high-density flip chip mounting substrates, and MEMS/sensor substrates. 【Features】 ■ Glass vias without micro-cracks ■ Glass vias with voidless metal filling ■ Flatness of glass top surface and metal top surface ■ Wiring patterns on both sides of the glass and multilayer wiring can also be produced *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Substrate

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Development Board Example: "High-Speed Optical Serial to Parallel Conversion Board"

Development Board Example: "High-Speed Optical Serial to Parallel Conversion Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "High-Speed Optical Serial to Parallel Conversion Board" rapidly converts optical serial data into parallel format and sets information to other boards. Our company supports everything from circuit design to embedded software development, providing development tailored to customer needs. 【Features】 ■ External Interfaces - Optical Input/Output SFP (3.125Gbps) × 3 channels - Parallel Input/Output × 10 channels - Ethernet × 1 channel ■ Equipped with FPGA *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Embedded Board Computers
  • Substrate

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Development Board Example: "High-Speed Optical Data Processing Board"

Development Board Example: "High-Speed Optical Data Processing Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "High-Speed Optical Data Processing Board" samples large amounts of data from the upper layer at high speed and converts and transmits it into optical data according to requirements. Our company supports everything from circuit design to embedded software development, providing development tailored to customer needs. 【Features】 ■ External Interface - Optical Input/Output SFP (3.125Gbps) × 3 channels - PCI Express Gen1 × 4 ■ Equipped with FPGA *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Embedded Board Computers
  • Substrate

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Substrate Remake Service Abirika × Meiko Electronics

Substrate Remake Service Abirika × Meiko Electronics

Circuit board remake service: Revise long-selling circuit boards that you want to continue producing! We will assist you in achieving further long-term supply!!

Even if you want to redesign... The developers from 20 years ago are no longer available. There are no resources allocated for redesign. There is no software specification document. We can solve those problems! We propose products that can be supplied for a longer term, not just microcontrollers! Please consult us when replacing microcontrollers from other companies with Renesas! *For more details, please refer to the PDF document or feel free to contact us.

  • Prototype Services
  • Substrate

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Solenoid Control Board "Solekit Multi Controller"

Solenoid Control Board "Solekit Multi Controller"

Can be connected to a 5V board-mounted solenoid! You can operate up to 4 solenoid kits with a switch.

We handle the solenoid control board "Solekit Multi Controller." It can operate up to 4 Solekits with a switch and is also compatible with 5V board-equipped solenoids (SSAH0830, SSBH0830). Additionally, when the cover is removed, it can be used as a "Multi Controller USB." 【Features】 ■ Can operate up to 4 Solekits with a switch ■ Compatible with 5V board-equipped solenoids ■ Can be used as a "Multi Controller USB" when the cover is removed *For more details, please refer to the PDF document or feel free to contact us.

  • Solenoid Actuators
  • Other machine elements
  • Substrate

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Orientation CNT substrate

Orientation CNT substrate

Vertically oriented CNTs are produced by depositing a catalyst on a heat-resistant substrate such as metal or ceramics and heating the substrate to 650-800°C in a carbon source CVD gas.

We offer samples of vertically aligned CNT substrates (for a fee) and can also prototype samples that grow vertically aligned CNTs on your desired substrate. We can grow on various three-dimensional shapes, not just flat substrates, but also meshes, fibers, and more. Additionally, we respond to various requests such as selective growth of CNTs on mask patterns and the fabrication of honeycomb CNT films.

  • Other polymer materials
  • Substrate

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AlN slice substrate

AlN slice substrate

Various types of metallization are possible! Introducing AlN substrates with unique firing and processing technologies.

We would like to introduce the "AlN Slice Substrate" handled by Furukawa Electric. It has high electrical insulation properties and supports various metallizations. It has a thermal expansion coefficient that matches silicon, making it resistant to thermal shock and capable of withstanding rapid heating and cooling. 【Features】 ■ High thermal conductivity and emissivity, providing excellent heat dissipation ■ Thermal expansion coefficient that matches silicon ■ Resistant to thermal shock and capable of withstanding rapid heating and cooling ■ High electrical insulation properties ■ Supports various metallizations *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Substrate

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厚銅基板　大電流基板

厚銅基板　大電流基板

大電流への対応を可能とした厚銅基板

一般的なプリント基板の回路厚が35μmであるのに対し、2000μmまでの厚銅による回路を実現することにより、大電流への対応を可能とした厚銅基板です。 通常のエッチング工程による回路形成の場合、回路断面は“台型”をしていますが、弊社の大電流基板は“そろばん型”をしているのを特徴としており、 設計値に対してトップ寸法と断面積をより広く確保できます。

  • Printed Circuit Board
  • Substrate

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Printed circuit board, metal substrate

Printed circuit board, metal substrate

Metal core substrate with excellent heat dissipation and heat resistance.

By machining the substrate to expose the metal core and directly mounting heat dissipation components such as heat sinks, it is possible to efficiently release the heat from components that operate at high temperatures to the outside.

  • Printed Circuit Board
  • Substrate

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EL light-emitting display technology

EL light-emitting display technology

EL light-emitting display technology

【Features】 This is a light-emitting display substrate directly formed with inorganic EL elements (Electro Luminescence) on a substrate. The thickness of the display section is formed to be less than 0.1mm, achieving an ultra-thin design by making the printed circuit board thinner. While the brightness is not particularly high, it allows for soft lighting information in dark places. It can convey various messages without disrupting the mood in places like movie theaters and bars. 【Applications】 ● Blinking animations ● Mood clocks ● Dot matrix displays ● 7-segment displays 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓

  • Printed Circuit Board
  • Substrate

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Glass substrate

Glass substrate

Glass substrate

【Features】 The glass substrate not only has excellent transparency but also exhibits minimal warping and dimensional changes, resulting in superior flatness. It has high stability in material coefficients such as dielectric constant, excellent chemical resistance and heat dissipation, and is a cost-effective and easy-to-handle product that offers high precision and performance compared to ceramic substrates. Additionally, by using thin-film metal formation technology for circuit formation, not only the substrate but also the circuit itself achieves high smoothness, making it optimal for high-frequency signal transmission. For these reasons, our company believes that glass substrates are the leading candidates for next-generation high-performance substrates. 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓

  • Printed Circuit Board
  • Substrate

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3D metal substrate, flexible heat dissipation substrate

3D metal substrate, flexible heat dissipation substrate

Industry first! We can manufacture bendable metal substrates!

Curved lighting substrates, LED lighting, and light source substrates that match the casing and design are optimal. It is possible to bend a single substrate to fit the curves of automotive and scooter turn signals and tail lamps. The basic specifications as a heat dissipation substrate are equivalent to those of standard aluminum substrates, with the added performance of being bendable, making it the latest metal substrate.

  • Printed Circuit Board
  • Substrate

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Insulated substrate

Insulated substrate

This is a high heat dissipation, high insulation metal substrate that achieves "thin film high insulation" by applying a 20μ thick layer of Nippon Paint's "Insulid" using ED electrophoretic coating.

Insulreed is applied to the base metal plate during the bath to form an electroplated coating, creating an insulation layer. The 20μ thick Insulreed insulation layer has an insulation performance of over 5kV and is the highest specification resin layer for thin film high insulation. On top of the insulation layer, circuits can be low-temperature fired with a highly conductive paste, allowing all processes to be completed through printing. Since it does not require treatment with strong acids or strong alkalis involved in substrate manufacturing, it is possible to directly print circuits onto die-cast molded products or heat sinks exceeding 200mm in height as an integrated heat dissipation substrate. As everything is manufactured using printing methods, it is also an eco-friendly substrate that is gentle on the environment.

  • Printed Circuit Board
  • Substrate

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Substrate "High Heat Resistance and High Thermal Conductivity Insulating Resin Substrate"

Substrate "High Heat Resistance and High Thermal Conductivity Insulating Resin Substrate"

A DBC alternative substrate ideal for applications such as power device circuit boards and high-brightness LED boards!

The substrate is a metal base substrate made of high heat-resistant and high thermal conductivity resin. It is mainly used for power device circuit substrates and high-brightness LED substrates. The substrate consists of copper foil with a thickness of 18μm to 800μm, an insulating layer, and a base metal. 【Features】 ■ Uses high heat-resistant and high thermal conductivity resin ■ Suitable for power devices *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Special Printed Circuit Board "Metal Substrate"

Special Printed Circuit Board "Metal Substrate"

Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.

A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • Substrate

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Special Printed Wiring Board "Mirror Cavity Substrate"

Special Printed Wiring Board "Mirror Cavity Substrate"

We will solve all the problems related to the decrease in reflectivity due to aging degradation and countermeasures against sulfide!

The "Mirror Surface Cavity Substrate" is a substrate that achieves sulfurization countermeasures and high reflectivity. It eliminates the need for silver plating, preventing the occurrence of reflectivity reduction due to sulfurization. Furthermore, the circuit improves bonding performance through gold plating, achieving a stable reflectivity of 95%. 【Features】 ■ Achieves sulfurization countermeasures and high reflectivity ■ No need for silver plating ■ No occurrence of reflectivity reduction due to sulfurization ■ Improved bonding performance through gold plating in the circuit ■ Stable reflectivity of 95% *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • Substrate

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