We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 576 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 20, 2026～Jun 16, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 20, 2026～Jun 16, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 北一電気 Niigata//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:May 20, 2026～Jun 16, 2026
This ranking is based on the number of page views on our site.

  1. Printed circuit board 北一電気
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. FPC for the space industry 太洋テクノレックス 本社　和歌山
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室

Substrate Product List

781～810 item / All 1947 items

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Low Dissolution Countermeasure Filter "EPP Series"

Low Dissolution Countermeasure Filter "EPP Series"

Various filtration precisions are selectable! A depth pleat filter with excellent cost performance.

The "EPP Series" uses high-purity polypropylene resin and employs thermal welding technology, which means it does not use adhesives, resulting in a leaching of metal ions that meets the requirements of the electronics industry. With a nanofiber filter medium, it achieves high flow rates and long service life. It has excellent chemical resistance and is suitable for filtering various acids, alkalis, and solvents. Additionally, a wide range of filtration precision from 0.1μm to 25μm is available. 【Features】 ■ Uses high-purity polypropylene resin ■ Leaching of metal ions meets the requirements of the electronics industry ■ Achieves high flow rates and long service life with nanofiber filter medium ■ Excellent cost performance and chemical resistance ■ Suitable for filtering various acids, alkalis, and solvents *For more details, please refer to the PDF document or feel free to contact us.

  • Filtration Equipment
  • Solid-liquid separation filter
  • Substrate

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Banknote handling machine manufacturing service

Banknote handling machine manufacturing service

We pursue low costs and improved reliability through thorough production efficiency!

Our company manufactures banknote handling machines. In addition to actively advancing the automation of our production department, we have also implemented an internal LAN system. By thoroughly streamlining production management, inventory management, and indirect operations such as general affairs, we are working to solve the conflicting propositions of cost reduction to meet customer demands and profit sharing for employees. Please feel free to contact us if you have any requests. 【Features】 ■ Thorough pursuit of production efficiency through automation and LAN implementation ■ Skilled assembly and adjustment department with experienced craftsmanship ■ Established mass production system through automation of industrial printed circuit boards *For more details, please download the PDF or feel free to contact us.

  • Contract manufacturing
  • Mechanical Design
  • Substrate

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Surface Mount Device 'YSM20'

Surface Mount Device 'YSM20'

High-speed mounting performance with the TACT 90000 CPH! Introducing the production equipment of VEMS Corporation.

The "YSM20" is a surface mount machine equipped with a high-efficiency modular system. It offers high-quality mounting with a repeatability accuracy (3σ) of ±0.025mm. It supports board sizes ranging from a maximum of L810×W490 to a minimum of L50×W50. Please feel free to contact us when you need assistance. 【Features】 ■ High-efficiency modular surface mount machine ■ High-quality mounting with a repeatability accuracy (3σ) of ±0.025mm ■ High-speed mounting performance with a mounting rate of 90,000 CPH ■ Supports board sizes from a maximum of L810×W490 to a minimum of L50×W50 *For more details, please refer to the PDF document or feel free to contact us.

  • Company：VEMS
  • Price：Other
  • Other mounting machines
  • Substrate

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[Comprehensive Catalog] Accessories for Printed Circuit Boards

[Comprehensive Catalog] Accessories for Printed Circuit Boards

A wide variety of accessories for printed circuit boards are available!

This catalog is the comprehensive catalog of M.Y.G Co., Ltd., which engages in the sale and import/export of accessories for printed circuit boards. We offer a wide variety of products, including spacers, washers, bushes, screws, and nuts. [Contents] ■ User Guide ■ Spacers ■ Washers and Bushes ■ Screws and Nuts ■ Data Index *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Other machine elements
  • Substrate

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Heat dissipation substrate (aluminum, copper base, thick copper)

Heat dissipation substrate (aluminum, copper base, thick copper)

Can protect components from heat with high thermal conductivity and heat dissipation! Widely usable from LED lighting to automotive applications.

The "heat dissipation substrate" we handle is a printed circuit board that has enhanced heat dissipation compared to standard substrates. It is necessary when using components that generate a large amount of heat, such as LEDs and power devices, and it is a substrate that can protect components from heat with high thermal conductivity and heat dissipation. Additionally, by using thick copper, it can quickly dissipate heat in the lateral direction where the electrodes are located, making it widely used from LED lighting to automotive applications. 【Features】 ■ Necessary when using components that generate a large amount of heat, such as LEDs and power devices ■ A substrate that can protect components from heat with high thermal conductivity and heat dissipation ■ Can quickly dissipate heat in the lateral direction where the electrodes are located by using thick copper ■ Widely used from LED lighting to automotive applications *For more details, please refer to the related links or feel free to contact us.

  • ip　4. 放熱基板　銅厚比較 k2 4.jpg
  • Printed Circuit Board
  • Substrate

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Thin substrate

Thin substrate

We will accommodate from 0.1t! By using printing methods, we also contribute to cost reduction.

The "thin substrates" we handle are rigid substrates with a thickness of 0.1 mm or more that can be mounted on curved surfaces. By making them thin, they can be used while maintaining the curve without breaking, and by reducing the thickness of the base material, they facilitate heat transfer, providing heat dissipation effects and reducing thermal resistance. Additionally, it allows for thinner and lighter products, and by using printing methods, we contribute to cost reduction. 【Features】 ■ Can be mounted on curved surfaces ■ Can be used while maintaining the curve without breaking ■ Facilitates heat transfer, providing heat dissipation effects and reducing thermal resistance ■ Allows for thinner and lighter products ■ Contributes to cost reduction by using printing methods *For more details, please feel free to contact us.

  • ip　5-薄物基板【0.1tから】　会議室のテーブルとPCB 5.jpg
  • Printed Circuit Board
  • Substrate

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Prototype on an expedited basis.

Prototype on an expedited basis.

We also support overseas shipping! Both single-sided and double-sided options are available, and we can accommodate urgent requests.

Our company is able to respond with expedited prototyping, with a standard delivery time of 1 business day for single-sided board prototypes. We also accommodate international shipping. For single-sided expedited service, orders received by 9:00 AM will be shipped the same day, and for double-sided expedited service, orders received by 9:00 AM can be shipped the next day. Additionally, for single-sided super expedited service, orders received by 2:00 PM will be shipped the same day. Please feel free to contact us when you need our services. 【Features】 ■Expedited Service ・Single-sided expedited service: Orders received by 9:00 AM will be shipped the same day. ・Double-sided expedited service: Orders received by 9:00 AM will be shipped the next day. ■Single-sided super expedited service ・Single-sided super expedited: Orders received by 2:00 PM will be shipped the same day. *For more details, please feel free to contact us.

  • Prototype Services
  • Substrate

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V-groove substrate for fiber array in optical communication

V-groove substrate for fiber array in optical communication

Customizable according to your requirements such as material, shape, and dimensional accuracy. We will respond flexibly from development products to mass-produced products.

V-groove substrate for optical communication fiber arrays High-precision V-groove processing possible with groove pitch deviation of '±0.0003 mm' or less.

  • Circuit board design and manufacturing
  • Substrate

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Printed Circuit Board 'PS-020'

Printed Circuit Board 'PS-020'

This is a printed circuit board for power distribution. It is compatible with connectors made by Japan Crimped Terminal and Japan Aviation Electronics Industry.

The PS-020 is a power distribution board that allows for the connection of a 3-terminal regulator. It can accommodate connectors and regulator mounts, and there is also a free area available. The connectors are intended for use with Japan Crimp Terminal's VH and PH series, as well as Japan Aviation Electronics Industry's IL-G series. Please feel free to consult us if you have any requests. 【Specifications】 External dimensions: approximately 63.5mm x approximately 43.2mm *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts
  • Substrate

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Printed Circuit Board "RV-012"

Printed Circuit Board "RV-012"

This is a board optimized for volume fixation for the RK09L1120 series manufactured by Alpro Electric.

The "RV-012" is a board optimized for fixing the volume of the RK09L1120 series manufactured by Alps Electric. This board does not have mounting holes, so the volume is fixed to the board using a nut. The expected components are the RK09L1120 series from Alps Electric and the B3P-PH-K-S from Japan Crimp Terminal. 【Specifications】 Outer dimensions: Width approximately 12mm, Height approximately 21mm *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts
  • Substrate

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GNSS High Gain LNA NJG1187A-A

GNSS High Gain LNA NJG1187A-A

AEC-Q100 grade 2 and VDA 6.3 automotive component standard compliant GNSS high-gain LNA

We have strengthened our lineup of products that comply with AEC-Q100*1 grade 2 and VDA6.3*2, capable of realizing GNSS multi-band. The NJG1187A-A is a low noise amplifier (LNA) product characterized by high gain and low noise figure, supporting the 1.5 GHz band (1559–1610 MHz) and the 1.1–1.2 GHz band (1164 MHz–1300 MHz), contributing to improved reception sensitivity and reduced positioning time for GNSS receivers. Additionally, since the matching of the first and second stage LNAs is done outside the package, the circuit configuration can be flexibly changed according to the application. The package of this product adopts a wettable flank package, making it easier to implement automatic visual inspection. *1 AEC-Q100 is a global standard for the reliability of automotive electronic components. *2 VDA6.3 is a process audit standardized by the German Automotive Industry Association.

  • Other semiconductors
  • Substrate

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PTFE buildup

PTFE buildup

It is a fluororesin substrate with excellent high-frequency performance!

We offer a fluoropolymer substrate with excellent high-frequency performance, called 'PTFE Build-Up.' It features an AnyLayer configuration using laser vias and employs thermosetting BF, making it possible to achieve with standard multilayer methods. Please feel free to consult us if you have any requests. 【Other Products】 ■ Fluoropolymer Substrate (PTFE) ■ PPE Substrate - Low Dielectric Constant Substrate ■ Ceramic Substrate ■ High-Frequency Hybrid Substrate *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts
  • Other machine elements
  • Circuit board design and manufacturing
  • Substrate

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Mesh-type secure connection board 'tailscale'

Mesh-type secure connection board 'tailscale'

Seamlessly integrate with existing ID providers, such as single sign-on and multi-factor authentication!

"Tailscale" is a mesh secure connection platform that allows you to build a secure private network in just a few minutes without the hassle of configuration. By adopting the advanced WireGuard protocol, it solves the issues of traditional VPNs such as "decreased communication speed" and "complex device settings." It connects devices directly and securely, regardless of location or network environment. 【Our Strengths】 ■ We solve the challenges of using overseas SaaS, such as "credit card payments in USD," by supporting invoicing in Japanese yen (qualified invoice issuance). ■ We provide implementation support from web performance measurement experts and technical support in Japanese, assisting companies in a safe and secure implementation. *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Technical challenges of embedded substrates

Technical challenges of embedded substrates

Electronic Patent Technology Trend Survey Report on Technical Issues of Embedded Boards

You can view patent information categorized by the following technical classifications: - Mechanical properties - Electrical properties - Thermal properties - Reliability

  • others
  • Substrate

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We also accept various custom orders.

We also accept various custom orders.

For custom ceramics, choose Serize.

【Custom-made Ceramic Products Available★】 For custom ceramic items, choose Cerize. We accept custom-made orders. We can produce in any genre. 【Features of Cerize】 No molds required, from prototypes to short delivery times, from 1 piece to mass production (custom orders available). Cerize is a company that handles everything from material procurement to assembly. 【Ceramic Kenzan】 The photo above shows a ceramic kenzan (flower frog). There is no worry about rust or metal stains. It is aesthetically pleasing and white, and it also offers deodorizing and filtering effects unique to ceramics.

  • nut
  • Substrate

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Achieve automation and efficiency of various business processes with V7!

Achieve automation and efficiency of various business processes with V7!

V7 utilizes image analysis technology to achieve automation and efficiency in business processes such as quality control and inventory management across various industries, including manufacturing and logistics.

V7 is a platform designed to solve the challenges of AI development in the manufacturing industry. In manufacturing, many operations such as quality control, inventory management, production planning, and fault detection are based on visual judgments. However, automating these operations requires a large amount of high-quality training data. V7 provides features to streamline the creation and management of training data, including: - Detection of defective products and automatic classification of packages - Fast automatic labeling using generative AI - Support for multiple annotation types and pixel-perfect labels - Version control and filtering of datasets - Library management of personal models and pre-trained models - Workflows that enable combinations of humans and models, as well as automatic quality control - Collaboration with experts and professional labelers V7 is characterized by high-accuracy annotations, making it well-suited for AI utilization in manufacturing.

  • Company：B7
  • Price：Other
  • Image analysis software
  • Substrate

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Polycrystalline super high thermal conductivity optical grade diamond substrate

Polycrystalline super high thermal conductivity optical grade diamond substrate

Optimal for laser output windows, etc.

The diamond window not only has excellent light transmittance at pump wavelengths, but its thermal conductivity is unmatched by other materials. The ultra-high thermal conductivity of CVD diamond allows for the rapid dispersion of heat generated by the laser medium into the surrounding environment. The precise polishing process enhances thermal conduction by ensuring close contact between the diamond window and the laser crystal, improving the efficiency and accuracy of laser output.

  • Fine Ceramics
  • Substrate

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[Demo Unit Rental] Control Panel 'Membrane Display'

[Demo Unit Rental] Control Panel 'Membrane Display'

Introducing an ultra-thin control panel that integrates everything: 7SEG LED, CPU, sensors, LCD, and more!

The "Membrane Display" we handle is a product that integrates original components into a thin panel of around 4mm. It supports multilayer circuit boards that allow for a slim design, as components can be mounted on both sides. Additionally, the thin 7-segment display allows for flexible size selection. Height adjustment of the mounted components is unnecessary, and the surface embossing and tact switches provide a clear operational feel and high durability. 【Features】 ■ Ultra-thin (standard 3.6mm, minimum 2.0mm) ■ Excellent switch with no uneven click sensation ■ High reliability (switch durability of 3 million cycles) ■ Waterproof specification equivalent to IP64, customers can "just stick it on" ■ No height adjustment needed for mounted components ■ Components can be mounted on both sides *【Demo units available for loan!】Please contact us through "Inquiries" if you would like to request one. *For more details, feel free to contact us.

  • Touch Panel
  • Substrate

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High-frequency fluororesin FPC substrate

High-frequency fluororesin FPC substrate

Effective in millimeter wave bands such as 5G communication! Products with low transmission loss, low dielectric constant, and high flexibility.

The "High-Frequency Fluororesin FPC Substrate" manufactured by Sumitomo Electric Industries enables low-loss data transmission of high-frequency signals ranging from 20GHz to 100GHz. As a type of flexible substrate, it allows for wiring in tight spaces, contributing to the miniaturization and lightweight design of devices. When used with millimeter-wave planar antennas, it can achieve either antenna miniaturization or enhanced performance per antenna size. 【Features】 ■ Low Transmission Loss: Can be utilized as a wiring material that achieves low transmission loss in high-frequency signal transmission. ■ Thinness and Narrow Pitch: Achieves both thinness and narrow pitch, while offering high design flexibility, contributing to airflow within enclosures and high-density designs. ■ Excellent Gain: By routing antenna circuits on a fluororesin substrate, it can be utilized as an antenna with efficient space usage and excellent gain. *For more details, please download the PDF or feel free to contact us.

  • 高周波用フッ素樹脂製FPC基板2.jpg
  • Printed Circuit Board
  • Substrate

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Cyclone-type soldering iron cleaner "Senpujin"

Cyclone-type soldering iron cleaner "Senpujin"

Usable without selecting the tip shape. Reduces deterioration of the tip without contact.

"Wash Wind Rapid" is a cyclone-type soldering iron cleaner that generates a vortex airflow through air blows from multiple directions, allowing for non-contact removal of dirt from the soldering tip. Even with repeated use, it consistently delivers stable cleaning power. It is maintenance-free with no consumable parts like cleaning brushes, and cleaning simply involves removing the accumulated solder debris from the drawer. 【Features】 ■ Non-contact design reduces deterioration of the soldering tip ■ Maintains cleanliness on-site and the shine of the soldering tip ■ Maintenance-free with no consumables like cleaning brushes ■ Extends the lifespan of the soldering tip ■ Minimal temperature variation of the soldering tip allows for quick transition to work ■ Reduces cleaning time *For more details, please download the PDF or feel free to contact us.

  • Solder
  • Substrate

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Support for high-density build-up structures

Support for high-density build-up structures

We can accommodate high-density build-up structures, such as 4-layer full-stack prototypes!

Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing
  • Substrate

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Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board
  • Substrate

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Millimeter-wave radar compatible printed circuit board (substrate)

Millimeter-wave radar compatible printed circuit board (substrate)

We would like to propose a printed circuit board equipped with a millimeter-wave antenna!

Our company will realize products that support the millimeter wave frequency range of 30 to 300 GHz. Do you have any concerns such as "I would like to consider next-generation millimeter wave radar-equipped devices"? We will support you in solving challenges for product commercialization. We will make proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. [We solve the following concerns] ■ I would like to consider substrates for millimeter wave radar applications. ■ I would like to consider substrates for next-generation high-frequency applications. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. An article about our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

Supports high frequency and millimeter wave frequency bands from 30 to 300 GHz! "I want to consider high frequency printed circuit boards, but it's difficult." We will solve such problems!

Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.

  • Circuit board design and manufacturing
  • Substrate

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Things You Can't Ask Now! Basic Knowledge of Printed Circuit Boards

Things You Can't Ask Now! Basic Knowledge of Printed Circuit Boards

OKI, which handles various printed circuit boards, provides a thorough explanation of the basics of printed circuit boards (wiring boards)! [Free handbook available now]

OKI, which handles custom specifications of printed circuit boards (PCBs) with various functions such as high multi-layering, heat dissipation, and high-frequency compatibility, will explain the basics of printed circuit boards. From the basics like "What is a printed circuit board?" to accommodating high current, high voltage, and high heat dissipation specifications, as well as supporting high-speed and large-capacity transmission, this guidebook is filled with valuable knowledge that we encourage you to read. [Contents (partial)] ■ What is a printed circuit board? ■ Types of printed circuit boards ■ Support for high-speed and large-capacity transmission ■ Support for high-density build-up structures, etc. *For more details, please download the PDF or contact us.

  • Circuit board design and manufacturing
  • Substrate

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Simulation case study

Simulation case study

Applied simulation to third-party designed boards! We redesigned it from a three-layer to a one-layer build-up.

We would like to introduce a case where we achieved cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer. By applying simulation to a competitor's designed circuit board, we redesigned it in-house from a 3-layer to a single-layer build-up without compromising electrical and noise characteristics. Additionally, in a case where we utilized our small-diameter drilling technology to reduce crosstalk, the BGA extraction via section experienced reduced crosstalk. We proposed in advance that the coupling in the Z-axis direction between vias, which occurs in high-thickness boards, could be reduced through small-diameter φ0.15 drilling. [Case Studies] ■ Cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer ■ Utilization of our small-diameter drilling technology to reduce crosstalk *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Simulation-based substrate design

Simulation-based substrate design

If you provide the required specifications, we will propose suitable board specifications and designs.

We will solve various issues related to printed circuit boards through simulation. We provide one-stop solutions for printed circuit boards that balance performance and cost. If you provide us with your required specifications, we can propose suitable board specifications and designs, leveraging our extensive background data and manufacturing technology unique to PCB manufacturers to suggest optimal characteristics. [Issues] - Non-functional, distorted waveforms, do not meet standards - Unstable operation under high load - Time-consuming cause investigation and countermeasures - Do not meet EMC standards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High board thickness and narrow pitch printed circuit board manufacturing technology.

High board thickness and narrow pitch printed circuit board manufacturing technology.

Applicable to semiconductor tester substrates! Achieving narrow pitch printed circuit boards in even higher multilayer and thicker board areas.

Based on the FITT (Fine pitch Through via Technology) method, we are promoting high-precision technology to achieve narrow pitch printed circuit boards in even higher multilayer and thicker board areas. With a board thickness of 7.65mm and a φ0.20 drill through processing, we can accommodate 0.50mm pitch BGA. This technology can be applied to semiconductor tester boards such as load boards, socket boards, and probe cards. 【Features】 ■ Accommodates 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing - Up to 76 layers ■ Accommodates 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing - Up to 26 layers with sequential structure possible ■ Achieves narrow pitch BGA compatible boards in even higher multilayer and thicker board areas *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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