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Substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.

  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. アイン 本社工場 Nagano//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 null/null
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Substrate Product ranking

Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.

  1. Molded cast products [We propose the selection of resins tailored to the required characteristics]. 共栄電資
  2. ceramics substrate(DPC substrate) アイン 本社工場
  3. Thin film circuit board (under development) アイン 本社工場
  4. 4 Tokyo Machine and Tool Co., Ltd. Business Introduction 東京マシン・アンド・ツール
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

Substrate Product List

1921～1938 item / All 1938 items

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[Research Material] Global Market for Semiconductor and IC Packaging Materials

[Research Material] Global Market for Semiconductor and IC Packaging Materials

Global Market for Semiconductor and IC Packaging Materials: Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Automotive Industry ...

This research report (Global Semiconductor & IC Packaging Materials Mark) investigates and analyzes the current state and future outlook of the global semiconductor and IC packaging materials market over the next five years. It includes information on the overview of the global semiconductor and IC packaging materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor and IC packaging materials market include organic substrates, bonding wires, lead frames, and ceramic packages, while the segments by application cover the automotive industry, electronics industry, telecommunications, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of semiconductor and IC packaging materials. It also includes the market share of major companies in semiconductor and IC packaging materials, product and business overviews, and sales performance.

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[Research Material] World Market for Single-Sided FPC Coverlays

[Research Material] World Market for Single-Sided FPC Coverlays

Global Market for Single-Sided FPC Coverlays: Yellow Coverlays, Black Coverlays, Consumer Mobile Devices, Medical, Industrial, Avionics...

This research report (Global Single Sided FPC Coverlay Market) investigates and analyzes the current state and outlook for the global single-sided FPC coverlay market over the next five years. It includes information on the overview of the global single-sided FPC coverlay market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided FPC coverlay market include yellow coverlay, black coverlay, and others, while the segments by application cover consumer mobile devices, medical, industrial, avionics, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of single-sided FPC coverlay. It also includes the market share of major companies in the single-sided FPC coverlay market, product and business overviews, and sales performance.

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[Research Material] World Market for Single-Sided Printed Circuit Boards

[Research Material] World Market for Single-Sided Printed Circuit Boards

World Market for Single-Sided Printed Circuit Boards: Glass Fiber, Metal, Ceramics, Others, Computers, Phones, Faxes, Automotive Electronics, Others

This research report (Global Single Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of single-sided printed circuit boards over the next five years. It includes information on the overview of the global single-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided printed circuit board market focus on glass fiber, metal, ceramics, and others, while the segments by application cover computers, phones, faxes, automotive electronics, and others. The regional segments calculate the market size of single-sided printed circuit boards by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. The report also includes the market share of major companies in the single-sided printed circuit board market, product and business overviews, and sales performance.

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5G base station antenna compatible printed circuit board (PCB)

5G base station antenna compatible printed circuit board (PCB)

We would like to propose a printed circuit board for 5G base station antennas!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Solving the following concerns】 ■ I would like to consider high-frequency application substrates for next-generation 5G communication ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to reduce the cost of high-speed, high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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400Gbps switch-compatible printed circuit board (PCB)

400Gbps switch-compatible printed circuit board (PCB)

We would like to propose a printed circuit board compatible with 400Gbps switches!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Currently, as ultra-high-speed network environments are in demand, do you have any concerns such as wanting to consider high-frequency application substrates for 400G switches? We will support you in solving issues towards product commercialization. We will provide proposals tailored to your needs, including the adoption of new high-frequency materials and joint evaluations. [We solve the following issues] ■ I want to consider high-frequency application substrates for next-generation switches. ■ I want to consider high-frequency application substrates for 5G communication. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match the characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. Our article has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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High-speed transmission printed circuit board

High-speed transmission printed circuit board

We provide high-precision simulations compatible with various low-loss substrates both domestically and internationally!

We provide printed circuit boards that support high-speed transmission, such as 5G infrastructure and high-frequency device test boards. We accommodate various low-loss materials both domestically and internationally, with high-precision impedance control for multilayer boards. We offer high-precision simulations based on the back data of our manufactured boards. 【Features】 ■ Manufacturing Process - High-precision impedance control - Back drill processing accuracy ■ Board Design - Support for various simulations *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Printed Circuit Boards for the Manufacturing Industry

Printed Circuit Boards for the Manufacturing Industry

Supports quality control in manufacturing with high-quality printed circuit boards.

In quality control within the manufacturing industry, the quality of printed circuit boards is crucial to ensure product reliability. Especially in electronic devices and industrial machinery, defects in printed circuit boards can affect the overall performance of the product. High-quality printed circuit boards contribute to the longevity and stable operation of products. Chino Giken Co., Ltd. offers printed circuit boards with 2 to 12 layers tailored to customer needs, supporting quality control in the manufacturing industry. 【Usage Scenarios】 - Manufacturing of electronic devices - Manufacturing of industrial machinery - Inspections in quality control departments 【Benefits of Implementation】 - Improved product reliability - Reduction of defective products - Cost savings

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Printed Circuit Board for Space Development

Printed Circuit Board for Space Development

Reliable printed circuit boards that support data collection in outer space.

In the field of space development, the reliability of electronic devices is extremely important for data collection in harsh environments. In particular, it is necessary to minimize the risk of electronic component failure due to factors such as temperature changes, radiation, and vibration. Printed circuit boards serve as a foundation that provides stable performance in these environments and supports accurate data collection. The printed circuit boards from Chino Giken Co., Ltd. are essential for enhancing the reliability of data collection in space development. 【Usage Scenarios】 - Artificial satellites - Space probes - Observation rockets 【Benefits of Implementation】 - High reliability in harsh environments - Stable operation of data collection systems - Reduction of long-term operational costs

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Printed Circuit Board for Disaster Prevention

Printed Circuit Board for Disaster Prevention

We provide printed circuit boards tailored to your needs.

In the field of disaster prevention, rapid and accurate information gathering is essential for damage prediction. High-performance electronic devices are crucial for this purpose, and the reliability of the printed circuit boards that support them is important. Particularly during emergencies such as earthquakes and floods, malfunctions of electronic devices can delay the understanding of damage conditions and hinder appropriate responses. Our printed circuit boards provide 2 to 12-layer boards tailored to the needs of computer peripherals and industrial machinery, supporting damage prediction in disaster prevention. 【Usage Scenarios】 - Disaster monitoring systems - Damage situation analysis - Evacuation route guidance 【Benefits of Implementation】 - Improved system reliability - Rapid information transmission - Accurate understanding of damage conditions

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Printed Circuit Board for Energy Equipment Maintenance

Printed Circuit Board for Energy Equipment Maintenance

We provide printed circuit boards tailored to your needs.

In the maintenance of energy equipment, stable power supply and long-term operation of the system are required. Printed circuit boards are critical components that support these systems, and high reliability and durability are essential. If a malfunction occurs, it may lead to equipment shutdown or interruption of power supply. Chino Giken Co., Ltd.'s printed circuit boards support 2 to 12 layers and contribute to the stable operation of equipment by being designed and manufactured according to customer needs. 【Usage Scenarios】 * Power plants * Substations * Transmission equipment * Control panels 【Benefits of Implementation】 * Stable operation of equipment * Reduction in maintenance costs * Increased longevity of the system

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Printed Circuit Board for Space Development

Printed Circuit Board for Space Development

Reliable printed circuit boards that support data collection in outer space.

In the field of space development, the reliability of electronic devices is extremely important for data collection in harsh environments. In particular, printed circuit boards require high durability and stability due to factors such as temperature changes, radiation, and vibrations. Malfunctions can lead to data loss or mission failure. Chino Giken Co., Ltd.'s printed circuit boards support 2 to 12 layers and can accommodate small quantities and a variety of rapid prototypes. Our printed circuit boards contribute to enhancing the reliability of data collection in space development. 【Usage Scenarios】 * Satellites * Space probes * Observation rockets 【Benefits of Implementation】 * High reliability in harsh environments * Stabilization of data collection * Contribution to mission success

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Printed Circuit Board for Disaster Prevention

Printed Circuit Board for Disaster Prevention

Reliable printed circuit boards that support situational awareness.

In disaster prevention scenarios, rapid and accurate situational awareness is essential. Various electronic devices, such as communication equipment and sensors, are utilized, and their reliability is crucial for ensuring people's safety. Printed circuit boards are core components of these electronic devices and must operate stably even in harsh environments. Chino Giken Co., Ltd.'s printed circuit boards support situational awareness in disaster prevention, accommodating small quantities and diverse types, as well as urgent prototypes. 【Usage Scenarios】 - Communication equipment at disaster sites - Surveillance camera systems - Various sensors 【Benefits of Implementation】 - Rapid information transmission - High reliability - Improved situational awareness capabilities

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Toho Electric Industrial Co., Ltd.

Toho Electric Industrial Co., Ltd.

"Quality is our guarantee" is our motto, supporting everything from electronic circuit design to assembly.

Toa Electric Co., Ltd. is a company that provides consistent support from electronic circuit design to assembly. It handles a wide range of products, including wire harnesses, panel modules for construction machinery, in-vehicle control controllers, and various printed circuit boards. With bases in China and Vietnam, it leverages its overseas production system to maintain cost competitiveness and accommodate diverse, small-lot production. Utilizing technology in machinery, electrical, electronic circuits, and software design, it prioritizes quality in its product offerings.

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DX Simple Diagnosis Service

DX Simple Diagnosis Service

By presenting appropriate measures, we achieve an increase in the success rate of DX and maximize its effectiveness!

The "DX Simple Diagnosis Service" is a service where professionals in digital transformation quickly diagnose highly specialized and often unclear challenges and risks. Based on inputs such as DX project proposals and hearing results, analysis is conducted from the perspectives of "management," "operations," and "administration," and the DX diagnosis results are presented. This service objectively evaluates your company's DX strategy and policies from multiple perspectives, identifying areas that require further consideration. Additionally, it quickly scores individual DX themes and assesses promising themes with high priority. [Diagnosis Goals] ■ Formulating strategies and actions that lead to results ■ Identifying improvement points for generating outcomes ■ Understanding project status and identifying challenges and risks *For more details, please download the PDF or feel free to contact us.

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