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Substrate Product List and Ranking from 580 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Aug 05, 2026～Sep 01, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 05, 2026～Sep 01, 2026
This ranking is based on the number of page views on our site.

  1. 共立エレックス Saga//Ceramics
  2. スクリーンプロセス Kanagawa//others
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 DAIKIN FINETECH, LTD. Nara//Resin/Plastic
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Aug 05, 2026～Sep 01, 2026
This ranking is based on the number of page views on our site.

  1. Ceramic substrate for firing setters 共立エレックス
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 Tokyo Machine and Tool Co., Ltd. Business Introduction 東京マシン・アンド・ツール

Substrate Product List

1861～1890 item / All 1955 items

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High heat-resistant, low-loss LCP flexible substrate for data centers

High heat-resistant, low-loss LCP flexible substrate for data centers

Solving heat management and signal loss in high-density data centers.

In the data center industry, the high-density implementation of servers is advancing, and the increase in heat generation and losses due to faster signals are becoming challenges. High density is essential for processing more information in limited space, but it simultaneously causes issues such as performance degradation due to heat and signal attenuation. Our high-heat-resistant, low-loss all-LCP flexible circuit boards address these challenges. 【Usage Scenarios】 - High-density implementation servers - High-speed communication devices - High-frequency compatible circuit boards 【Benefits of Implementation】 - Improved long-term reliability due to high heat resistance - Maintenance of signal quality due to low-loss characteristics - Contribution to space-saving solutions

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss flexible substrate for robotics

High heat-resistant, low-loss flexible substrate for robotics

Ideal for movable parts such as robotic arms. Achieves stable operation even in harsh environments.

In the robotics industry, devices with many movable parts, such as robotic arms and sensors, require high flexibility and durability. In particular, reliability that can withstand wiring in tight spaces and repetitive motions is crucial. Conventional circuit boards may face issues such as disconnection of movable parts or performance degradation in high-temperature environments. Our high heat-resistant, low-loss flexible circuit boards address these challenges. 【Application Scenarios】 - Movable parts of robotic arms - Sensor devices - Wiring in confined spaces 【Benefits of Implementation】 - High flexibility and durability - Stable operation in harsh environments - Space-saving design

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss flexible substrate for displays

High heat-resistant, low-loss flexible substrate for displays

Flexible substrate with high heat resistance and low loss that contributes to high-quality displays.

In the display industry, there is a demand for high image quality, along with thinner products and high-density mounting. Particularly in displays that operate in high-temperature environments or use high-frequency signals, the heat resistance and low loss characteristics of the substrate are essential for maintaining product performance. Inappropriate substrates can lead to display malfunctions or performance degradation. Our high heat-resistant, low loss flexible substrates meet the demands of high-quality displays. 【Usage Scenarios】 - High-definition displays - Displays compatible with high-frequency signals - Displays used in high-temperature environments 【Benefits of Implementation】 - Achievement of high-quality display - Improvement in product reliability - Contribution to thinner designs and high-density mounting

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High-precision semiconductor manufacturing supported by high heat resistance and low loss flexible substrates.

In the semiconductor manufacturing industry, high-precision process control and stable performance are required. Particularly in situations involving high-temperature environments and high-frequency signals, the heat resistance and low-loss characteristics of substrates are crucial. Conventional substrates may suffer from deformation due to heat and signal attenuation, which can compromise manufacturing precision and product reliability. Our all-LCP flexible substrates offer high heat resistance, low-loss characteristics, and low outgassing, supporting high-precision processes in semiconductor manufacturing. 【Application Scenarios】 - Semiconductor manufacturing equipment - High-frequency circuits - Cleanroom environments 【Benefits of Implementation】 - Stabilization of manufacturing processes - Improvement in product reliability - Enhancement of yield

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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【プリント基板イニシャル費削減】～フレキ基板小ロット製造対応～

【プリント基板イニシャル費削減】～フレキ基板小ロット製造対応～

無駄なイニシャル費は払わなくていい！　独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。

株式会社ケイツーでは、独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。これによりフレキ基板製造の短納期化および大幅なイニシャルコスト費の削減が可能です。NCマシンによる加工の課題でありました加工精度・加工面につきても金型加工と遜色のない仕上がりとなっております。 通常フレキ基板を製造するには、数量の大小にこだわらず、カバーレイ加工や外形加工に金型またはトムソン型（ヴィクトリア型）が不可欠です。その結果、金型に関する時間や費用によって通常のリジッド基板と比較して納期が長く、イニシャル費も非常に高くなっておりました。当社では、カバーレイ加工や外形加工に金型を使用せずにNCマシンを使用して、金型作成に要する時間と費用を削減できます。もちろん、加工精度や仕上がり形状は金型加工と比較しても遜色のないものです。 詳しくはお問い合わせ、またはカタログをダウンロードしてください。

  • Printed Circuit Board
  • Substrate

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Advantages of K2: More cost-effective response for medium lot production of flexible materials.

Advantages of K2: More cost-effective response for medium lot production of flexible materials.

Providing medium lot products that are unsuitable for both prototype manufacturers and mass production manufacturers at low prices!

Our company offers proposals to reduce initial costs by using laser processing for the prototyping of flexible substrates. However, when it comes to medium lot production, it is more cost-effective to manufacture using molds. For large quantities that cannot be handled by prototyping manufacturers, and where the initial costs become too high for mass production manufacturers, please leave it to us. We can provide it at a low price. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[Example] Printed Circuit Board - Multi-layer Board with Different Materials

[Example] Printed Circuit Board - Multi-layer Board with Different Materials

Introducing the combination of Teflon material and different substrates using illustrations!

At Shinkou Photo Service Co., Ltd., we also accept orders for printed circuit board pattern design (digital, analog, high frequency) as well as assembly (QFP, QFN, BGA). We can take orders for either design or assembly. 【Catalog Contents】 ■Combination of Teflon materials and other substrates ■Combination of Teflon materials with aluminum or copper plates ■Combination of Teflon materials with each other 【Various Manufacturers Handled】 ■ARLON, Chuko Chemical Industrial, Nippon Pillar Industry, Panasonic Electric Works, ROGERS, and others For more details, please download the catalog or contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm in outline and pattern positioning. For pattern formation, we utilize the LDI (Laser Direct Imaging) method, and for outlines, we can perform high-precision outline processing tailored to the pattern using CCD technology. We improve hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling devices and X-ray length measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Implementation on through-holes is possible with flat plugs (pad-on-via) ○ Support for narrow pitch patterns with landless through-holes ○ Extremely fine printing is possible (1 character: vertical 0.28mm × horizontal 0.15mm) Please contact us for more details.

  • Printed Circuit Board
  • Substrate

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Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Introducing heat dissipation technology! Heat dissipation is possible through pattern design, selection of heat dissipation materials, and setting conductor thickness.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies for implementing devices with high heat generation. If it is necessary to lower the junction temperature of the mounted devices, heat dissipation can be achieved through pattern design, selection of heat dissipation substrates, and setting of conductor thickness. We also offer a wide variety of materials for substrates, including metal, CEM3, and multilayer heat dissipation materials. 【Features】 - Heat dissipation through thermal vias filled with copper paste in through-holes is possible. - Heat dissipation using heat sink pins inserted into through-holes is also possible. - Outline processing can be done using V-cut, routing, and pressing. For more details, please contact us.

  • Printed Circuit Board
  • Substrate

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Technical Introduction: "Magnetic Reduction Technology"

Technical Introduction: "Magnetic Reduction Technology"

Introducing magnetic reduction technology for printed circuit boards! A method to reduce magnetism using flash gold plating.

At Sato-Sen Co., Ltd., we can propose methods to reduce magnetism with flash gold plating. It is possible to reduce magnetism by selecting the appropriate nickel plating solution. Additionally, we also offer special gold plating to completely eliminate magnetism. 【Advantages of Sato-Sen Co., Ltd.】 ○ Development and production system ○ Experience and know-how ○ Advanced equipment ○ Collaborative capabilities Please contact us for more details.

  • Printed Circuit Board
  • Substrate

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Face's Wisdom Bag: "Screws and Tightening Torque"

Face's Wisdom Bag: "Screws and Tightening Torque"

There are various types of screws, and their intended use differs depending on the application. This page explains the types of screws and torque.

For more details, please refer to the PDF document or feel free to contact us.

  • EMS
  • Substrate

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Face's Wisdom Bag: "Basic Elements of Cost Reduction"

Face's Wisdom Bag: "Basic Elements of Cost Reduction"

By designing circuit boards from the perspective of the assembly site, customers can achieve benefits such as reduced labor costs and improved quality.

This explains the basic elements of cost reduction as points to consider during circuit board design. *For more details, please refer to the PDF materials or feel free to contact us.*

  • EMS
  • Substrate

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Face's Wisdom Bag: "Points to Note When Releasing Materials (2)"

Face's Wisdom Bag: "Points to Note When Releasing Materials (2)"

We will propose points of caution and countermeasures from the perspective of the manufacturing site regarding the material outbound process.

This item introduces precautions for parts shipping (parts packaging) and examples that can lead to manufacturing defects. *For more details, please refer to the PDF document or feel free to contact us.

  • EMS
  • Substrate

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[Example of Use] Sensor 99.9% Alumina Substrate

[Example of Use] Sensor 99.9% Alumina Substrate

A high-purity, high-strength alumina substrate that can be made thin and resistant to cracking. Its thinness maximizes sensor performance.

A high-purity alumina substrate created from our unique ceramic thin plate manufacturing technology. Its high strength, resulting from high purity, makes it less prone to cracking and allows for thinner substrates, making it suitable for high-performance sensors.

  • Printed Circuit Board
  • Fine Ceramics
  • Other electronic parts
  • Substrate

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[Performance Introduction] Measures for Longevity Using Ceramics

[Performance Introduction] Measures for Longevity Using Ceramics

By changing metal parts to ceramics, significant improvements in lifespan are expected. Here are some examples of improvements.

Ceramics are lightweight materials with excellent wear resistance and corrosion resistance compared to metals, and their adoption is progressing for extending the lifespan of equipment parts and addressing wear issues. By replacing metal components of equipment with ceramics such as silicon carbide or silicon nitride, the lifespan of the parts is extended, significantly reducing maintenance work for part replacements. JFC offers a lineup of five types of silicon carbide and two types of silicon nitride. Silicon nitride SNP03 is a high-strength type with enhanced fracture toughness and bending strength compared to the standard SNP02. Please consider JFC's ceramics for the long lifespan of your equipment parts. *For more details, please download the catalog. Additionally, JFC also manufactures and sells composite materials made of ceramics and metals. For example, SA701, featured in the PDF materials, is a composite of SiC ceramics and aluminum. It is effective when a material that is resistant to cracking is required.

  • Ceramics
  • Fine Ceramics
  • Composite Materials
  • Substrate

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High thermal conductivity substrate "Copper Inlay Substrate" *Includes comparison materials for thermal dissipation state.

High thermal conductivity substrate "Copper Inlay Substrate" *Includes comparison materials for thermal dissipation state.

We offer a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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Business Introduction: Printed Circuit Board Design

Business Introduction: Printed Circuit Board Design

25 qualified national certification holders in printed circuit board manufacturing skills! Introducing available circuit board designs!

We would like to introduce the types of circuit board designs that our company can handle in "Printed Circuit Board Design." We can accommodate circuit board designs such as "high-speed digital" and "performance boards for semiconductor testing equipment." Based on small-lot production of various types, we handle the design and manufacturing of high-density, multi-layer printed wiring boards, as well as component mounting, assembly, and performance testing. 【Supported Circuit Board Designs】 ■ High-speed digital ■ Mixed digital & analog ■ High voltage, high current boards ■ Performance boards for semiconductor testing equipment *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Cross-reference table for other companies' EOL piezo buzzers (July updated version)

Cross-reference table for other companies' EOL piezo buzzers (July updated version)

A cross-reference table with many equivalent products for discontinued items, where you can also compare specifications.

At Same Sky, we continuously manufacture and sell magnetic buzzers and piezo buzzers. Among them, we have received numerous inquiries regarding the EOL products of Murata Manufacturing's piezo buzzers, so we have listed our products that are believed to be as close as possible.

  • Sound Parts
  • Substrate

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Significantly reduce inventory time! X-ray reel part counter 'Assure'

Significantly reduce inventory time! X-ray reel part counter 'Assure'

Count the number of electronic components in the reel just by placing it in the device! No more winding mistakes or measurement errors! Achieve accurate and rapid inventory management.

The X-ray reel component counter is a device that automatically measures the number of chip components within packages such as reels and trays using X-rays. It allows for easy operation by simply placing the object inside the device and pressing a button, making inventory tasks more efficient. 【Features】 ■ Measures the number of components in about 10 seconds ■ Measurement accuracy of 99.9% ■ Simultaneous counting of up to 4 reels (up to 7 inches) ■ No need to register component information in advance ■ Self-teaching (automatic component recognition) ■ Standard equipped with label printer ■ Integrates with factory management systems (ERP, etc.) Already linked with various companies' component towers and storage cabinets *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Assure001.jpg
  • Assure002.jpg
  • Assure003.jpg
  • Assure101.jpg
  • Assure102.jpg
  • Assure103.jpg
  • Assure104.jpg
  • X-ray inspection equipment
  • Substrate

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Industrial ITX motherboard 'MIX-H810WV1' with rich I/O.

Industrial ITX motherboard 'MIX-H810WV1' with rich I/O.

Equipped with a wide range of USB, serial, and video outputs. An ideal Mini-ITX board for embedding in industrial equipment that requires multiple input/output control.

The "MIX-H810WV1" is a Mini-ITX motherboard designed for industrial equipment that requires a variety of I/O options. It comes standard with a powerful array of interfaces that can connect directly to diverse devices, including USB3.2 Gen2×2, USB2.0×4, four serial ports (RS-232/422/485), 8-bit DIO, and HDMI/DP. The CPU can be selected from the Intel Core Ultra 200S series (LGA1851). It supports DDR5 SODIMM×2 (up to 96GB), ensuring stable operation even in control and monitoring systems that require long-term operation. Additionally, with M.2, SATA, and PCIe Gen5, adding storage or dedicated cards is easy. With a DC12-24V input and an operating range of 0-60°C, it can be safely used in a wide range of environments, including manufacturing lines, FA equipment, and embedded PCs. *CPU, memory, storage, and OS are not included.

  • Embedded Board Computers
  • Substrate

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Simulation-based substrate design

Simulation-based substrate design

One-stop service! Abundant background data and manufacturing technology unique to a circuit board company.

We support the resolution of various issues related to printed circuit boards. We provide one-stop solutions for printed circuit boards that balance performance and cost. Additionally, if you provide us with your required specifications, we can propose suitable board specifications and designs. We offer characteristic improvements utilizing our extensive background data and manufacturing technology unique to PCB manufacturers. 【For concerns like these】 ■ Waveforms that do not operate, distortion, non-compliance with standards ■ Not functioning under high load ■ Time-consuming cause investigation and countermeasures ■ Failing to meet EMC standards *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Endo's Strength: Development of Engineers

Endo's Strength: Development of Engineers

For the growth of the company and skill enhancement! Increase investment in employee training to accelerate support for employee development.

We would like to introduce our strength in "nurturing engineers." Our training system mainly consists of new employee training, career recruitment training, e-learning education aimed at improving business skills, and external courses focused on enhancing expertise. Additionally, we respect our employees' desire to learn and provide support for individual learning, such as obtaining qualifications. 【Features】 ■ Education and training system ■ Support for obtaining qualifications and self-improvement ■ Skills certification acquisition *For more details, please download the PDF or feel free to contact us.

  • Distance learning/E-learning
  • Distance learning/E-learning
  • Substrate

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LED signal light circuit board unit 'MR1505-24CY' 150φ yellow

LED signal light circuit board unit 'MR1505-24CY' 150φ yellow

Wide-angle ultra-high brightness signal light board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR1505-24CY'. It has been a best-selling product for over 10 years as a specialized manufacturer of LED signal light circuit board units. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Supply Voltage: DC24V ■ Dimensions: 180mm square ■ Inner Diameter: 150φ ■ Number of LEDs: 100 ■ Emission Color: Yellow *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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LED signal lamp circuit board unit 'MR1105-24CBG' 110φ blue-green

LED signal lamp circuit board unit 'MR1105-24CBG' 110φ blue-green

Wide-angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR1105-24CBG' that we handle. It has been a best-selling product for over 10 years as a specialized manufacturer of LED signal light circuit board units. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■Supply Voltage: DC24V ■Dimensions: 135mm square ■Inner Diameter: 110φ ■Number of LEDs: 80 ■Emission Color: Blue-green *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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Corrosion prevention of electronic circuit boards through moisture-proof coating treatment for industrial machinery.

Corrosion prevention of electronic circuit boards through moisture-proof coating treatment for industrial machinery.

Protects electronic circuit boards of industrial machinery from moisture and extends product lifespan.

In the industrial machinery industry, the durability of electronic devices capable of withstanding harsh environments is required. In particular, in environments susceptible to humidity and condensation, the corrosion of electronic circuit boards is a significant factor leading to product failure and performance degradation. Our moisture-proof coating treatment protects electronic circuit boards from moisture and suppresses the effects of corrosion, contributing to the reliability and longevity of industrial machinery. 【Usage Scenarios】 - Industrial machinery used outdoors - Industrial machinery used in environments with drastic temperature changes - Industrial machinery used in high-humidity environments 【Benefits of Implementation】 - Prevents corrosion of electronic circuit boards, extending product lifespan - Improves product reliability - Reduces maintenance costs

  • Other contract services
  • Surface treatment contract service
  • Circuit board design and manufacturing
  • Substrate

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[Power Supply Design Proposal Example] Consistent Support up to Electrical Operation Testing

[Power Supply Design Proposal Example] Consistent Support up to Electrical Operation Testing

From substrate to the development of various testing devices, we provide comprehensive support! We can reduce the burden on our customers!

Traditionally, when the manufacturer we had been outsourcing the production of power boards to went out of business, we received a request for board production from them. Until now, we had only outsourced visual inspections, and no electrical operation tests were conducted. Although the request was for board production, we proposed the development and manufacturing of an automatic testing device, as well as conducting electrical operation tests in-house. By providing a comprehensive solution, we were able to reduce the burden on our customers. [Case Overview] ■ Issue: The manufacturer we had been outsourcing to went out of business. ■ Proposal: Development and manufacturing of an automatic testing device, and conducting electrical operation tests in-house. ■ Result: Reduced the burden on customers through a comprehensive solution. *For more details, please refer to the related link page or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Power Supply Circuit Board Pattern Design Handbook for the Automotive Industry

Power Supply Circuit Board Pattern Design Handbook for the Automotive Industry

Explaining the circuit board layout design that maximizes the performance of power ICs!

In the automotive industry, the miniaturization and high performance of electronic control units (ECUs) are essential for improving fuel efficiency and safety. The design of power supply boards is a crucial factor that influences the performance of ECUs, requiring noise countermeasures and efficient power supply. Appropriate pattern design is essential to solve these challenges and enhance product reliability. This document explains the key points of power supply board design for automotive power supply design engineers. 【Usage Scenarios】 - ECU design - In-vehicle electronic device design - Power supply design 【Benefits of Implementation】 - Improved product reliability through noise countermeasures - Enhanced power efficiency - Reduced design time

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • Substrate

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Power Supply Circuit Board Design Handbook for Industrial Robots

Power Supply Circuit Board Design Handbook for Industrial Robots

Explaining the know-how of power supply board design that supports the operation of high-precision industrial robots.

In the industrial robot industry, stable operation of the power supply board is essential to achieve high-precision movements. In particular, for precise operations such as positioning and force control, noise countermeasures and stable power supply are crucial. Inadequate board design can lead to malfunctions and performance degradation. Our document, "Key Points in Pattern Design for Power Supply Boards," is compiled for power design engineers, summarizing the key points in the design of power supply boards. We will explain based on specific examples, so please utilize it during the actual design of power supply boards. 【Usage Scenarios】 * High-precision positioning control * Tasks using force sensors * High-speed and high-frequency operations 【Benefits of Implementation】 * Improved operational accuracy of robots * Reduced risk of malfunctions * Enhanced product reliability

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • Substrate

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Power Supply Circuit Board Design Handbook for Home Appliances

Power Supply Circuit Board Design Handbook for Home Appliances

Condensing know-how in power supply board design to support the realization of energy-saving home appliances.

In the home appliance industry, energy-saving performance is a crucial factor that influences product competitiveness. The design of power supply boards significantly affects the power consumption of home appliances, making it essential to achieve efficient power supply. Inadequate board design can increase power loss and potentially reduce the energy-saving performance of the product. Our document, "Key Points in Pattern Design for Power Supply Boards," summarizes important considerations for board design aimed at achieving energy-efficient appliances, specifically for power design engineers. 【Usage Scenarios】 * Development of home appliances requiring energy-saving performance * When looking to improve the design efficiency of power supply boards * Aiming for product miniaturization and high performance 【Benefits of Implementation】 * Realization of energy-saving performance through improved power efficiency * Enhanced product reliability * Shortened design period

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • Substrate

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Railway Power Supply Circuit Board Design Handbook

Railway Power Supply Circuit Board Design Handbook

Condensing the know-how of power supply board design that supports the safety of railway systems.

In the railway industry, the reliability of power supply boards is extremely important for ensuring safety. Particularly in signal systems and control systems, which influence the stability of operations, design flaws in power supply boards can lead to serious accidents. This document explains the key points of board layout to maximize the performance of power ICs and contribute to safe railway operations. 【Usage Scenarios】 * Railway signal systems * Operation management systems * Emergency power supply systems 【Benefits of Implementation】 * Improved system reliability * Reduced accident risk * Realization of stable railway operations

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • Substrate

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