We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 null/null
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Substrate Product ranking

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社　和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム

Substrate Product List

1891～1920 item / All 1948 items

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[Case Study] Request for duplication of a circuit board that cannot receive manufacturer support.

[Case Study] Request for duplication of a circuit board that cannot receive manufacturer support.

We also support circuit board repairs for discontinued products (EOS/EOSL products)!

We would like to introduce a case where we handled a request for the duplication of a circuit board that could not receive manufacturer support due to bankruptcy! 【Inquiry Details】 We received a request for a spare circuit board for a production line circuit board from a manufacturer that has already gone bankrupt and can no longer provide support. 【Response】 The circuit board was sent to us, and we used PinPoint in-house to analyze and restore the circuit board. We completed this in approximately one month! If you have any concerns, please feel free to contact us first.

  • Printed Circuit Board
  • Substrate

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Impedance control board

Impedance control board

Impedance control board

We will design to match the necessary impedance values and ensure compatibility during the circuit board manufacturing process.

  • others
  • Substrate

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IVH substrate

IVH substrate

IVH substrate

In prototype boards, the IVH method may be cheaper and have shorter lead times than build boards. We can provide a proposal in the quotation materials.

  • others
  • Substrate

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Electrode growth substrate

Electrode growth substrate

Electrode growth substrate

It is a substrate that allows the terminal area on the substrate to grow thicker and taller than other terminals.

  • others
  • Substrate

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Copper inlay substrate

Copper inlay substrate

Copper inlay substrate

By pressing copper directly under the heat-generating component, a significant heat dissipation effect can be achieved.

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  • Substrate

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Tester board (performance/probe/semiconductor evaluation)

Tester board (performance/probe/semiconductor evaluation)

Tester board (performance/probe/semiconductor evaluation)

We have a track record of various custom boards for semiconductor testers.

  • others
  • Substrate

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Ultra-low transmission loss substrate (MEGTRON6)

Ultra-low transmission loss substrate (MEGTRON6)

Ultra-Low Transmission Loss Substrate (MEGTRON6)

Design will be conducted using high-frequency substrates and high-speed transmission substrates.

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  • Substrate

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Prototyping and implementation achievements of various charger-related printed circuit boards.

Prototyping and implementation achievements of various charger-related printed circuit boards.

We would like to introduce our achievements in the production of various charger-related printed circuit boards. *For waterproof and dustproof measures for mounted boards!

Our company has a wealth of experience in manufacturing handheld processing equipment, charger circuit boards, memory card charger circuit boards, EV charging device control circuit boards, and more. Tojo Manufacturing offers one-stop total support from prototype printed circuit boards to final assembly. Please feel free to consult us if you have any concerns regarding delivery times or quality. 【Manufacturing Achievements】 ■ Handheld processing equipment and charger circuit boards ■ Memory card charger circuit boards ■ EV charging device control circuit boards, etc. *For more details, please refer to the external link page or feel free to contact us.

  • Printed Circuit Board
  • Processing Contract
  • Substrate

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Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Achievements in high-speed transmission lines, analog, and power-related areas! We also introduce CAD tools for design resources.

We would like to introduce our company's "Design Resources and Achievements." We have design achievements in high-speed transmission lines such as USB 3.0, SDI, HDMI, and LAN, as well as analog systems for various sensors, inverter boards for three-phase motors for electric bikes, UPS, and power supplies like AC adapters. Additionally, our design resources include CAD tools "CR-8000 Design Force" and "CR-5000 Board Designer." 【Design Resources (Partial)】 ■ CAD Tools ・CR-8000 Design Force ・CR-5000 Board Designer ・Options *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Technical Document on Solder Resist Formation for Drones

Technical Document on Solder Resist Formation for Drones

Presenting technical documentation on solder resist technology that contributes to improving the environmental resistance of drones!

In the drone industry, high durability and reliability are required, making the environmental performance of circuit boards crucial. In particular, circuit boards that can withstand harsh environments such as temperature changes, vibrations, and humidity are essential. The proper selection and formation of solder resist contribute to solving these challenges. Our materials on solder resist formation technology are helpful in improving the reliability of drones. 【Usage Scenarios】 - Outdoor flight - Environments with significant temperature fluctuations - Environments with high vibrations 【Benefits of Implementation】 - Improved protection performance of circuit boards - Extended product lifespan - Reduced risk of failure

  • Printed Circuit Board
  • Substrate

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[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.

[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.

We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!

In the aerospace industry, it is essential to achieve both product reliability and weight reduction. This is particularly important for electronic devices used in harsh environments, where ensuring heat dissipation is crucial. Insufficient heat dissipation can lead to component failure or performance degradation. Our "faster heat-dissipating substrate" contributes to improving product reliability by enhancing heat dissipation. 【Application Scenarios】 - Electronic devices in aircraft and spacecraft - Electronic devices requiring weight reduction 【Benefits of Implementation】 - Improved heat dissipation - Enhanced product reliability - Contribution to weight reduction

  • Printed Circuit Board
  • Substrate

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【For Medical Devices】Understand in 3 Minutes! A Substrate That Releases Heat Faster

【For Medical Devices】Understand in 3 Minutes! A Substrate That Releases Heat Faster

Explanation of the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling material inside the TH!

In the field of medical devices, there is a simultaneous demand for miniaturization and high performance. In particular, it is necessary to pack many electronic components into a limited space, making the heat dissipation performance of the circuit board crucial. Inadequate heat dissipation can lead to equipment malfunctions and a decrease in lifespan. Our materials on "circuit boards that dissipate heat faster" address these challenges. 【Application Scenarios】 - Miniature medical devices - Portable medical devices - High-density mounted circuit boards 【Effects of Implementation】 - Improved reliability of devices - Extended product lifespan - Achieving miniaturization

  • Printed Circuit Board
  • Substrate

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【For Home Appliances】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

【For Home Appliances】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!

In the home appliance industry, there is a demand for longer product lifespans. In particular, heat is one of the major factors that accelerate the deterioration of electronic components. High heat dissipation performance substrates enhance product reliability and contribute to longevity. Our "faster heat-dissipating substrate" addresses this challenge. 【Usage Scenarios】 * Design of home appliances * Improvement of product reliability * Longevity 【Effects of Implementation】 * Reduced risk of product failure * Improved product durability * Increased customer satisfaction

  • Printed Circuit Board
  • Substrate

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A substrate that dissipates heat faster for industrial robots.

A substrate that dissipates heat faster for industrial robots.

Presentation of thermal via and copper pin thermal conductivity comparison materials! Contributing to high precision.

In the industrial robot industry, thermal management of circuit boards is crucial for achieving high-precision movements. In particular, densely mounted electronic components tend to generate heat, which poses risks of performance degradation and failure due to heat. If thermal management is insufficient, the accuracy of the robot's movements may decline, negatively impacting product quality and production efficiency. Our "faster heat-dissipating circuit board" provides materials explaining the structural comparison of thermal vias and copper pins, as well as the effects of changing TH fillers, supporting the high precision of industrial robots by offering high thermal conductivity circuit boards. 【Usage Scenarios】 - Robot arms requiring high-precision positioning - Welding robots needing precise control - Conveying robots requiring high-speed operation 【Benefits of Implementation】 - Solving thermal issues of circuit boards to achieve stable robot operation - Improving product quality and yield - Reducing maintenance costs

  • Printed Circuit Board
  • Substrate

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A substrate that dissipates heat faster for power electronics.

A substrate that dissipates heat faster for power electronics.

Presentation of thermal via and copper pin thermal conductivity comparison materials! Supporting high output.

In the power electronics industry, increasing output power is essential for improving product performance and miniaturization. However, with higher output power, the heat dissipation performance of the substrate becomes a challenge. Inadequate heat dissipation raises the risk of performance degradation and failure due to temperature rise in the device. Our products provide materials that explain the comparison of thermal conductivity between thermal vias and copper pins, as well as the effects of changing the filling material within the thermal vias, supporting the design of substrates with high heat dissipation. This contributes to improved product reliability and longevity. 【Usage Scenarios】 - High-output power devices - High-density mounting substrates - Use in high-temperature environments 【Benefits of Implementation】 - Improved heat dissipation performance - Enhanced product reliability - Increased device longevity

  • Printed Circuit Board
  • Substrate

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【For Wearable Devices】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

【For Wearable Devices】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

Explaining the comparison of thermal conductivity between thermal vias and copper pins! Materials are being distributed.

In the wearable device industry, miniaturization and lightweight design are important challenges. With the enhancement of device performance, heat dissipation measures for the circuit board are essential, and thermal design significantly affects the reliability and performance of the product. Poor heat dissipation can lead to device malfunctions and reduced lifespan. The materials we provide regarding "circuit boards that dissipate heat faster" explain the structural comparison of thermal vias and copper pins, as well as the effects of changing the filling material in through-holes, contributing to the miniaturization and high performance of wearable devices. 【Usage Scenarios】 - High-density mounted circuit boards - Devices requiring miniaturization - Electronic equipment needing thermal management 【Benefits of Implementation】 - Improved heat dissipation - Enhanced device reliability - Extended product lifespan

  • Printed Circuit Board
  • Substrate

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【For Game Consoles】Understand in 3 Minutes! A Circuit Board that Dissipates Heat Faster

【For Game Consoles】Understand in 3 Minutes! A Circuit Board that Dissipates Heat Faster

Explanation of the comparison of thermal conductivity between thermal vias and copper pins, as well as the effects of changing the filling material inside the TH!

In the gaming console industry, as performance increases, heat dissipation measures for circuit boards have become an important issue. Particularly when performing high-load processing, it is essential to mitigate the risks of performance degradation and failure due to heat. Our "circuit board that dissipates heat faster" provides materials that explain the structural comparisons of thermal vias and copper pins, as well as the effects of changing the filling material within through-holes, supporting the realization of high heat-dissipating circuit boards. This material will help understand the key points in circuit board design aimed at enhancing the performance of gaming consoles. 【Usage Scenarios】 - Development of high-performance gaming consoles - Circuit board design requiring heat management 【Benefits of Implementation】 - Reduces the risk of performance degradation due to heat - Improves product reliability - Streamlines circuit board design

  • Printed Circuit Board
  • Substrate

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A substrate that dissipates heat faster for EV chargers.

A substrate that dissipates heat faster for EV chargers.

Presentation of thermal conductivity comparison materials between thermal vias and copper pins! For thermal management of rapid chargers.

In the EV charger industry, heat generation during rapid charging is a significant issue. Particularly during high-power charging, the heat dissipation performance of the substrate becomes a crucial factor that affects charging efficiency and product lifespan. Inadequate heat dissipation can lead to component degradation or failure, potentially compromising the reliability of the charger. Our "faster heat-dissipating substrate" provides materials that explain the structural comparisons of thermal vias and copper pins, as well as the differences in thermal conductivity due to variations in TH fillers, supporting thermal management for EV chargers. 【Usage Scenarios】 - Rapid chargers - High-power charging - Electronic devices requiring thermal management 【Benefits of Implementation】 - Improved heat dissipation - Extended product lifespan - Enhanced charging efficiency

  • Printed Circuit Board
  • Substrate

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Presentation of substrate materials for electrical characteristic measurement for automobiles.

Presentation of substrate materials for electrical characteristic measurement for automobiles.

We present materials for a measurement substrate that contributes to improving the reliability of automobiles!

In the automotive industry, the reliability of electronic components is extremely important. In areas related to vehicle safety, particularly high quality is required. Measurement boards for electrical characteristics are necessary to evaluate important factors for ensuring reliability, such as impedance management and measurement method compatibility. Our materials explain the differences between measurement boards and general boards, as well as key points for matching impedance. This material will help improve the quality and ensure the reliability of automotive electronic components. 【Usage Scenarios】 - Design and development of in-vehicle electronic devices - Inspections in quality control departments - Evaluations at component manufacturers 【Effects of Implementation】 - Increased efficiency in electrical characteristic measurements - Improved accuracy in reliability evaluations - Shortened product development periods

  • Printed Circuit Board
  • Substrate

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Data sheet for electrical characteristic measurement boards for medical devices.

Data sheet for electrical characteristic measurement boards for medical devices.

Presentation of materials for measurement boards that enhance the safety of medical devices!

In the medical device industry, product safety is the top priority. Accurate measurement of electrical characteristics is essential to ensure the reliability of devices and protect patient safety. Measurement errors can lead to incorrect diagnoses or treatments, potentially causing serious issues. Our documentation on electrical characteristic measurement boards provides information to enhance safety, including error factors in impedance management and the differences between measurement boards and standard boards. We encourage you to download and read it. 【Usage Scenarios】 - Electrical characteristic evaluation of medical devices - Confirmation of compliance with safety standards - Quality control in product development 【Benefits of Implementation】 - Improved safety through accurate measurements - Development of reliable medical devices - Compliance with regulations

  • Printed Circuit Board
  • Substrate

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Data sheet for electrical characteristic measurement board for high-speed communication.

Data sheet for electrical characteristic measurement board for high-speed communication.

Presentation of materials for substrates used in electrical characteristic measurements supporting high-speed communication!

To meet the demand for higher speeds in the telecommunications industry, accurate electrical characteristic measurements are essential. Particularly when dealing with high-frequency signals, impedance matching and signal integrity significantly affect performance. Measurement errors can lead to system malfunctions or performance degradation. Our materials on electrical characteristic measurement boards explain the importance of impedance management and how to utilize measurement boards, supporting the development of high-speed communication systems. 【Usage Scenarios】 * Development of high-speed communication devices * High-frequency circuit design * Systems requiring impedance matching 【Benefits of Implementation】 * Improved system performance through accurate electrical characteristic measurements * Ensured signal integrity through optimized impedance management * Enhanced development efficiency through information provided in the materials

  • Printed Circuit Board
  • Substrate

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Substrate materials for electrical characteristic measurement for semiconductors

Substrate materials for electrical characteristic measurement for semiconductors

We are pleased to present materials for measurement substrates that correspond to miniaturization!

With the advancement of miniaturization in the semiconductor industry, the accuracy of electrical characteristic measurements is becoming increasingly important. In particular, the evaluation of high-frequency characteristics and signal integrity is a crucial factor that influences product performance. To minimize measurement errors and conduct accurate evaluations, the selection of appropriate measurement substrates is essential. Our materials regarding electrical characteristic measurement substrates explain the importance of impedance management and the differences between measurement substrates and general substrates, providing useful information for consideration during implementation. 【Usage Scenarios】 - High-frequency characteristic evaluation - Signal integrity evaluation - Impedance matching 【Benefits of Implementation】 - Improved measurement accuracy - Shortened product development time - Reliable product evaluation

  • Printed Circuit Board
  • Substrate

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【For Home Appliances】Understand in 3 Minutes! Substrate for Electrical Characteristic Measurement

【For Home Appliances】Understand in 3 Minutes! Substrate for Electrical Characteristic Measurement

We present measurement substrate materials to accelerate the development of energy-saving home appliances!

In the home appliance industry, accurate measurement of electronic circuits is essential for improving energy efficiency. Particularly in the evaluation of electronic components that influence power efficiency, precise impedance measurement is crucial. Measurement errors can affect product performance evaluation, potentially leading to delays in development timelines and increased costs. Our document on "Understanding Electrical Characteristic Measurement Boards in 3 Minutes!" explains the sources of error in impedance management and the differences between measurement boards and general boards. We hope it will assist you in improving the efficiency of energy-saving appliance development. 【Usage Scenarios】 - Energy efficiency evaluation - Electronic circuit design - Characteristic evaluation in product development 【Benefits of Implementation】 - Shortened development timelines through accurate measurements - Improved energy efficiency of products - Cost reduction

  • Printed Circuit Board
  • Substrate

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[For the Energy Industry] Substrate for Electrical Property Measurement [Materials Provided]

[For the Energy Industry] Substrate for Electrical Property Measurement [Materials Provided]

Presenting materials for measurement substrates that contribute to energy efficiency!

In the energy industry, efficient power supply and stable system operation are essential for cost reduction and minimizing environmental impact. Particularly in the field of renewable energy, such as solar and wind power, optimizing power conversion efficiency has become a critical issue. Measurement substrates for electrical characteristics contribute to solving these challenges by identifying error factors in impedance management and ensuring compatibility with measurement methods. Our materials explain the differences between measurement substrates and general substrates, as well as key points for matching impedance. We encourage you to download and read it. 【Usage Scenarios】 - Performance evaluation of solar power systems - Measurement of power conversion efficiency in wind power equipment - Characteristic evaluation of smart grid-related devices 【Benefits of Implementation】 - Improved efficiency of power systems - Reduced product development time - Cost savings

  • Printed Circuit Board
  • Substrate

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【For Defense】Understand in 3 Minutes! Substrate for Electrical Characteristic Measurement

【For Defense】Understand in 3 Minutes! Substrate for Electrical Characteristic Measurement

Presenting substrate materials for electrical characteristic measurement aimed at the defense sector that require high durability!

In the defense sector, high durability that can withstand harsh environments is required. For electrical characteristic measurement substrates, impedance management and compatibility with measurement methods are crucial to obtaining reliable measurement results. Inappropriate substrate selection can lead to measurement errors and equipment failures. Our document "Understanding Electrical Characteristic Measurement Substrates in 3 Minutes!" explains the key points for substrate selection to achieve high durability in the defense sector. Please download it and take a look. 【Usage Scenarios】 * Performance evaluation of electronic devices in harsh environments * Characteristic evaluation of communication devices requiring high reliability * Quality control of military electronic equipment 【Benefits of Implementation】 * Acquisition of reliable measurement results * Reduction of equipment failure risks * Improvement of product quality

  • Printed Circuit Board
  • Substrate

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Multilayer substrate

Multilayer substrate

We have a manufacturing record of up to 22 layers, and we can accommodate various specifications for board thickness and copper foil thickness!

We would like to introduce the "multilayer circuit boards" handled by Matsuwa Sangyo Co., Ltd. These are formed by stacking multiple layers of insulation and conductor layers, resulting in printed circuit boards with three or more conductor patterns. The interlayer connections are formed by through-holes (TH) just like in double-sided boards, and we offer a variety of substrates including FR-4, halogen-free materials, high heat-resistant materials, and low dielectric materials. 【Shortest Delivery Record】 ■ 4 to 10 layers ⇒ Shipped on the 1.05th day (data by 8 PM ⇒ shipped the next day) ■ 12 to 14 layers ⇒ Shipped on the 1.1th working day (data by 4 PM ⇒ shipped the next day) ■ 16 to 18 layers ⇒ Shipped on the 2.1th working day (data by 4 PM ⇒ shipped the day after next) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Rigid-flexible substrate

Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

Anyway, it's fast! Leave the printed circuit boards to 【SHOWA】!

Our company is one of Japan's leading ultra-fast printed circuit board manufacturers. We possess top-level equipment and specialize in the production of high-difficulty circuit boards. With over 30 years of industry experience, we currently have business dealings with more than 2,200 companies in Japan. Of course, in addition to circuit board manufacturing, we can also accommodate customer requests for AW design and component mounting. 【Build-up Boards】⇒ We can handle narrow pitch BGA mounting, multi-layer builds, and any layer configurations. 【Heat Dissipation】⇒ We can accommodate aluminum base boards, high thermal conductivity CEM-3, and copper inlay boards. 【Thick Copper Boards】⇒ We can handle high current boards, thicker plating in through holes, and automotive boards. 【Flexible Boards】⇒ We can accommodate FPC, multi-layer FPC, rigid FPC, and transparent polyimide FPC. 【High Frequency】⇒ We have standard stock of Megtron 6 (manufactured by Panasonic) and have processing experience with many low dielectric constant materials. 【Special Processing】⇒ We can also accommodate bump formation and back drilling. ↓ Please also visit our website https://www.showanet.jp/ We look forward to hearing from you.

  • Printed Circuit Board
  • Substrate

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