We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 563 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Understand in 3 minutes! Solder Resist Formation Technology [Materials Provided] プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  2. Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm] 共栄電資
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室

Substrate Product List

1501～1530 item / All 1927 items

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PuriKen Co., Ltd. - A substrate that dissipates heat faster from printed circuit boards.

PuriKen Co., Ltd. - A substrate that dissipates heat faster from printed circuit boards.

A suitable design! We propose a substrate that dissipates the heat from the heating element more quickly.

We would like to introduce our "substrate that dissipates heat faster." With the emergence of high-output power semiconductors, new implementation methods and thermal management strategies are required. From the perspective of printed circuit board manufacturing, we propose a substrate structure that can dissipate heat more quickly. Additionally, we customize the substrate to optimize the arrangement and shape of thermal vias according to usage, allowing for greater heat dissipation. 【Features】 ■ Simple thermal calculations conducted from the perspective of substrate manufacturing ■ Suitable designs presented based on calculation results ■ Proposals for substrate structure and heat dissipation strategies by our technical department *For more details, please download the PDF or feel free to contact us.

  • 3-2.PNG
  • 3-4.PNG
  • 3-3.PNG
  • Printed Circuit Board
  • Substrate

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Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].

Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].

We are currently offering materials that explain the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling materials inside TH.

We are pleased to present materials introducing "substrates that dissipate heat faster." This document provides a detailed comparison of the structural differences between thermal vias and copper pins, noting that while their cross-sections may appear similar, the filling materials inside the thermal vias differ. It also includes information on "high thermal conductivity substrates" and more. The explanations are supported by graphs, tables, and formulas, making the content easy to reference. We encourage you to download it and read through it. [Contents] ■ Structural comparison of thermal vias and copper pins ■ What are high thermal conductivity substrates? ■ Comparison of thermal conductivity between thermal vias and copper pins ■ Effects of changing the filling material in thermal vias *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Kit "Pressure Sensor Evaluation Kit"

Kit "Pressure Sensor Evaluation Kit"

Pressure sensor and a control board that processes the signals from the sensor and displays the data signals.

The "Surface Pressure Sensor Evaluation Kit" is a kit consisting of a surface pressure sensor that detects load with 128 arranged cells, a control board that processes the signals from the sensor, and a PC application that displays the data signals. Each cell of the sensor is divided into 8 blocks, with each block consisting of 16 cells. 【Features】 ■ A surface pressure sensor that detects load with 128 arranged cells and a control board that processes the signals from the sensor and displays the data signals ■ A kit that includes a PC application ■ Each cell of the sensor is divided into 8 blocks ■ Each block consists of 16 cells ■ Cell size is 2×3mm *For more details, please refer to the PDF document or feel free to contact us.

  • EAI/ETL/WEB application server
  • Other machine elements
  • Substrate

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Leave the "microscopic inspection and visual inspection" of printed circuit boards and precision parts to us!

Leave the "microscopic inspection and visual inspection" of printed circuit boards and precision parts to us!

Eliminate unexpected defective product leaks and delays in delivery due to complaint handling. We will respond with automatic inspection equipment and facilities, as well as experienced microscope inspectors!

Are you struggling with a shortage of personnel for inspection work related to printed circuit boards and precision components? Our employees, who are well-versed in printed circuit boards, will help solve your problems. We can assist with only the parts you need, from design (domestic) and manufacturing (domestic and overseas) by partner companies to quality control at our company. We have extensive experience in inspecting defective products for printed circuit board manufacturers and handling complaints for trading companies dealing with overseas boards. We also offer procurement and assembly of circuit boards utilizing our network, so please feel free to consult with us. 【Common Issues】 ■ Unable to conduct microscope inspections… ■ There are items that cannot be inspected with our own equipment… ■ Relying on temporary staff or part-timers for inspection processes… ■ Shortage of inspectors, making training difficult… ■ Our company does not have an inspection process… etc. 【Implementation Results】 - Automotive parts trading companies ⇒ By switching from temporary and part-time staff, we reduced total costs and decreased the outflow of defective products. - Overseas circuit board trading companies ⇒ By outsourcing complaint handling to us, we resolved delivery delays and stopped complaints. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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LED Round Light Emitting Board (Signal Light)

LED Round Light Emitting Board (Signal Light)

This is an LED round light-emitting board (signal light) used for displays such as counts in baseball and softball (B, S, O). There is also a dimming controller board available.

This is a round-shaped light-emitting substrate (signal light) used for displays such as counts in baseball and softball (B.S.O). There are four sizes of the light-emitting part: Φ100mm, Φ150mm, Φ250mm, and Φ300mm, and three colors of light: red, yellow, and green. <Functions> - Lightweight - Long lifespan - Low power consumption - The substrate mounting surface has an insulated structure, allowing for direct fixation to metal housings, etc. - An optional dimming controller board is available to adjust brightness.

  • LED Module
  • Substrate

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Function expansion board [Voice Call Unit] Double-check while conversing!

Function expansion board [Voice Call Unit] Double-check while conversing!

With a cable checker, you can make calls with a distant party.

The "Voice Call Unit" is an expansion board that uses a cable connected between two cable checkers to enable communication with a distant party. By utilizing the buzzer function of the cable checker, it is also possible to call the other party. 【Features】 ■ Hands-free calling is possible using earphones with a microphone ■ The buzzer function can be used to call the other party *For more details, please refer to the PDF document or feel free to contact us.

  • Routers, Switches, and Hubs
  • Other network tools
  • Expansion Boards
  • Substrate

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Function expansion board [DC/DC unit] Easily set your preferred voltage!

Function expansion board [DC/DC unit] Easily set your preferred voltage!

DC power supply available from DC 6V to 24V when needed.

Useful when a small power supply is needed. We offer a "DC/DC unit" that can output up to 24V. *For more details, please refer to the PDF document or feel free to contact us.

  • Routers, Switches, and Hubs
  • Substrate

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Piezoelectric Buzzer (DC) 'ESZ-11-A/ESZ-11N-A'

Piezoelectric Buzzer (DC) 'ESZ-11-A/ESZ-11N-A'

[Piezoelectric Type] Compliant with RoHS2! It is a contactless type that generates sound by vibrating through an electronic circuit.

The "ESZ-11-A/ESZ-11N-A" is a compact, high-volume, low-current, and long-life buzzer. It is a non-contact type that generates sound by bonding a piezoelectric element to a metal diaphragm and vibrating it using an electronic circuit. Additionally, the "ESZ-11N-A" can be mounted to panels and other surfaces using the body nut. 【Features】 ■ Compact, high-volume, low-current, and long-life ■ Non-contact type that generates sound by bonding a piezoelectric element to a metal diaphragm and vibrating it using an electronic circuit ■ Can be mounted to panels and other surfaces using the body nut (ESZ-11N-A) ■ Compliant with RoHS2 *For more details, please refer to the PDF document or feel free to contact us.

  • Sound Parts
  • Substrate

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Timer-type LED board that lights up for 30 days on dry batteries.

Timer-type LED board that lights up for 30 days on dry batteries.

LED board that can be installed in places where power cannot be obtained from an outlet.

This is an LED board that lights up continuously for 30 days using three D batteries. Since it does not use a power outlet, it can be used anywhere without restriction. It has a built-in timer that repeats a cycle of 12 hours on and 12 hours off after being turned on. 【Features】 ■ Lights up for 30 days with three D batteries ■ Does not use a power outlet ■ Can be used anywhere without restriction ■ The light turns on in a flowing manner repeatedly

  • LED lighting
  • others
  • Substrate

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Printed circuit boards, compatible with various resin boards! 【Router processing】

Printed circuit boards, compatible with various resin boards! 【Router processing】

The main materials for cutting are (glass epoxy, phenolic, CFRP, acrylic, polycarbonate, POM, and various others) as well as (aluminum, copper).

Our company primarily focuses on machining printed circuit boards and various types of resin and metal plates, mainly using NC router processing for contour machining. We can accommodate orders starting from just one piece under material supply conditions. Additionally, our trained operators and our continuously improved, streamlined work standards and environments ensure "on-time delivery without delays." 【Features】 ■ Specialized production equipment allows for a wide range of orders from small to medium lots with various types. ■ High-precision counterboring (depth adjustment), small piece processing, and large-format processing are possible. ■ Quick response for short delivery times and urgent processing of new models, including the creation of machining data. ■ High-precision measurement using image processing technology (capable of measuring irregular shapes and heights). ■ Various resin plate processing is also possible, leveraging our circuit board processing technology. *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Printed Circuit Board
  • Substrate

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Copper foil cutting substrate

Copper foil cutting substrate

Simplified prototyping of the circuit board! If the conditions are limited, such as a prototype of a prototype and specific verification items, this method is also possible!

The substrate is created by cutting copper foil. There are constraints on pattern width and insulation distance to omit circuit formation in the general printing process, and it is mainly for prototyping purposes. It is effective for shortening delivery times and cost reduction until completion.

  • Printed Circuit Board
  • Substrate

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Electronics business

Electronics business

Complete total support from development to design, assembly, and completion of electronic devices!

We would like to introduce our "Electronic Equipment Business." We provide complete total support from development to assembly and completion in various fields, including home appliances, industrial equipment, and medical health devices. Utilizing our unique prototype-focused manufacturing network, we aim for efficiency and cost reduction, not only domestically but also internationally. 【Features】 ■ Consulting for electronic equipment design and development ■ Shortening of design and development periods and lead times through comprehensive full support ■ Advanced CAD design using tools like Zuken CR8000 ■ Manufacturing of printed circuit boards from single-sided to 20 layers, as well as flexible circuit boards ■ High-density surface mounting of jumpers, axial, radial, and chip, IC, BGA, etc. *For more details, please feel free to contact us.

  • Other CAD
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Conversion Board "CVB Series"

Conversion Board "CVB Series"

It is also possible to create a conversion board that reflects the customer's intentions!

We offer an emergency response component mounting service using conversion boards. The "CVB Series" is an original conversion board that resolves issues such as design errors and component procurement mistakes. We address various concerns, such as: - "The components I had arranged for are unavailable, and work is stalled." - "I mistakenly purchased unnecessary components with the wrong shape, resulting in excess inventory." 【Examples of Solutions】 - Re-arranging the components that are actually needed. - The board was manufactured, but the component pads do not match, making it impossible to mount. - It was specified for discrete components. - The board was designed for surface-mount components, but it was specified for discrete components. - Unable to mount on the board due to differences in component sizes, etc. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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High Thermal Conductivity Substrate "FGHP"

High Thermal Conductivity Substrate "FGHP"

Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!

"FGHP" is a flat heat pipe-type heat spreader that forms a sealed space and wick (capillary structure) inside an ultra-thin metal sheet. It supports the reduction of thermal density and efficient heat dissipation by uniformly spreading the high-density heat generated by a small, high-output heat source across the surface through its excellent thermal diffusion capability. 【Features】 ■ Excellent thermal diffusion (heat pipe structure) ■ Thin design (micro-etching technology) ■ Lightweight (hollow structure) ■ High reliability (high-strength sealed structure) ■ Can be installed vertically (internal microstructure) *For more details, please download the PDF or contact us.

  • Board to Board Connectors
  • Substrate

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Special Precision Machinery Co., Ltd. Nasu Factory

Special Precision Machinery Co., Ltd. Nasu Factory

A problem-solving and proposal-based company that provides high-quality, high-performance electronic circuit boards!

At the Nasu Factory of Tokushu Seiki Co., Ltd., we manufacture electronic devices, communication equipment, and precision instruments. Our company began manufacturing circuit boards in the 1970s when printed circuit boards started to become widespread in Japan. We have produced high-quality circuit boards for various fields, including communication base stations, medical devices, and automotive applications. With a quality control system centered around five inspection processes, we will continue to provide high-quality and high-performance electronic circuit boards. 【Our Strengths】 ■ High mounting technology and quality control system ■ A reliable partner for electronic circuit board prototyping ■ "Quality" is built from the upstream *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • EMS
  • Substrate

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Supercapacitor "NX120V"

Supercapacitor "NX120V"

We will upgrade the old 2kW data center to be equivalent to the latest model.

The "NX120V" is an advanced ICT device that enables the continued operation of facilities built around the year 2000 without the need for complete updates or renting space from other centers, allowing for operation with the current equipment as is. In an old data center with a 2kW specification, it is possible to operate at the equivalent of 4-6kW without changing the facility equipment. 【Features】 ■ Improved overall performance with better peak power extraction compared to average power ■ Power consumption is less than half that of conventional Xeon servers (Ave 50w) ■ CPU options include Intel XeonD with 4/6/8/12/16 cores, and memory can be maxed out at 128GB (ECC) ■ Storage includes M.2-512GB for system use (transfer speed 2GB/S) ■ Capable of operation in high-temperature environments up to 45℃, among other features *For more details, please download the PDF or feel free to contact us.

  • Other server related
  • server
  • Substrate

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Printed Circuit Board Manufacturing Delivery Schedule

Printed Circuit Board Manufacturing Delivery Schedule

The printed circuit boards will be shipped tomorrow. Industry-leading ultra-short delivery times! Please give it a try!!

We have been in the printed circuit board business for over 30 years. We have steadily and diligently accumulated know-how for short lead-time manufacturing with honesty and sincerity. We have absolute confidence in our express and short lead-time manufacturing. Please feel free to consult with us.

  • Printed Circuit Board
  • Substrate

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[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.

We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-frequency substrate manufacturing example: Long slit TH substrate

High-frequency substrate manufacturing example: Long slit TH substrate

Forming guard patterns! Introducing examples of manufacturing and processing long slit TH substrates.

We would like to introduce an example of manufacturing and processing of the "Long Slit TH substrate." By providing a pattern on the edge of the substrate, a guard pattern is formed. Please feel free to contact us when you need assistance. 【Overview】 ■ Long Slit TH substrate ■ Similar processing technology (edge TH) *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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High-Frequency Substrate Manufacturing Example: Hybrid Structure Substrate

High-Frequency Substrate Manufacturing Example: Hybrid Structure Substrate

Using high-frequency materials for specific interlayers while employing different materials for other interlayers! Here are some examples of manufacturing processes.

We would like to introduce an example of the manufacturing process for "hybrid structure substrates." Specific interlayers are made of high-frequency materials, while other interlayers use different materials (such as FR-4). Please feel free to contact us when you need assistance. 【Composition Example】 ■ High-frequency material (core material) ■ FR-4 (PP) ■ FR-4 (core material) *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Single-sided board / Double-sided board

Single-sided board / Double-sided board

Used in a wide range of fields as a general-purpose substrate! The interlayer connection of the double-sided board is formed by TH.

We would like to introduce the "single-sided and double-sided PCBs" handled by Matsuwa Sangyo Co., Ltd. These printed circuit boards have conductor patterns formed on one or both sides of an insulating board. They are widely used in various fields as general-purpose substrates, and the interlayer connections of double-sided boards are formed by TH (through-hole) technology. We offer materials such as FR-4, CEM-3, FR-1, halogen-free materials, high heat-resistant materials, aluminum materials, and low dielectric constant materials, with board thicknesses ranging from t0.1mm to t3.2mm. We also accommodate various copper foil thicknesses from 9μm to 175μm. 【Fastest Delivery Record】 ■ 1 layer ⇒ 1 day (data by 8 AM ⇒ same-day shipment) ■ 2 layers ⇒ 1.05 days (data by 8 PM ⇒ shipment the next day) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Build-up substrate

Build-up substrate

Multi-stage builds, stackable vias, filled vias plating, all handled with in-house integrated manufacturing!

We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Impedance control compatible board

Impedance control compatible board

We propose appropriate line widths, clearances, and layer configurations during pattern design!

We would like to introduce the "Impedance Control Compatible Boards" handled by Matsuwa Sangyo Co., Ltd. In recent years, there has been a significant increase in the demand for boards that require impedance control for the purpose of stabilizing signal quality and reducing noise due to high-speed communication in circuits. With our extensive manufacturing experience and achievements cultivated over many years, we support various impedance simulations such as characteristic, differential, common, and coplanar, as well as TDR measurements, and we propose appropriate line widths, clearances, and layer configurations during pattern design. 【Features】 ■ Supports various impedance simulations including characteristic, differential, common, and coplanar, as well as TDR measurements ■ Proposes appropriate line widths, clearances, and layer configurations during pattern design *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Thick copper substrate

Thick copper substrate

By increasing the finished copper thickness to around 210μm, it can also accommodate high current circuits!

We would like to introduce the "thick copper substrate" handled by Matsuwa Sangyo Co., Ltd. The typical copper foil thickness for printed circuit boards is 18μm or 35μm, but by increasing the finished copper thickness to about 210μm, it can accommodate high current circuits. In recent years, thick copper substrates (high current substrates) have been increasingly required, particularly for automotive and power electronics applications, and the demand is growing. [Example of Thick Copper Substrate Manufacturing Specifications] ■ Copper foil thickness: 70μm, 105μm, 140μm, 175μm (excluding copper foil thickness below 35μm) ■ Finished copper thickness after plating: can be 210μm or more *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Copper inlay substrate

Copper inlay substrate

By directly contacting heat-generating components with copper, which has a high thermal conductivity, excellent heat dissipation is achieved!

We would like to introduce the "Copper Inlay Substrate" handled by Matsuwa Sangyo Co., Ltd. This substrate is designed to partially improve heat dissipation characteristics by using copper pins pressed directly under heat-generating components. By making direct contact with heat-generating components, it achieves high heat dissipation due to the high thermal conductivity of copper. Compared to metal-based substrates, it can reduce weight, and it is also advantageous that the existing layer structure of substrates can be applied as is. 【Features】 ■ A substrate aimed at partially improving heat dissipation characteristics ■ Achieves high heat dissipation by making direct contact with heat-generating components using high thermal conductivity copper ■ Reduces weight compared to metal-based substrates ■ Existing layer structures of substrates can be applied as is *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Copper bump substrate

Copper bump substrate

Effective when it is required to make contact between the substrate pad and mounted components at a high position!

We would like to introduce the "copper bump substrate" handled by Matsuwa Sangyo Co., Ltd. Thanks to a special plating method, it is possible to form bumps of approximately 30 to 100 μm in the necessary areas of the pattern. This is effective in cases where it is required to make contact between the substrate pad and mounted components at a high position. 【Copper Bump Substrate Manufacturing Specifications Example】 ■Bump Diameter/Bump Size: φ0.4mm/0.3mm×0.25mm ■Bump Height: 100μm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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