Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
1531～1560 item / All 1948 items
![Function expansion board [DC/DC unit] Easily set your preferred voltage!](https://image.mono.ipros.com/public/product/image/0a5/2000548189/IPROS87175881946781499248.jpeg?w=280&h=280)
DC power supply available from DC 6V to 24V when needed.
Useful when a small power supply is needed. We offer a "DC/DC unit" that can output up to 24V. *For more details, please refer to the PDF document or feel free to contact us.
[Piezoelectric Type] Compliant with RoHS2! It is a contactless type that generates sound by vibrating through an electronic circuit.
The "ESZ-11-A/ESZ-11N-A" is a compact, high-volume, low-current, and long-life buzzer. It is a non-contact type that generates sound by bonding a piezoelectric element to a metal diaphragm and vibrating it using an electronic circuit. Additionally, the "ESZ-11N-A" can be mounted to panels and other surfaces using the body nut. 【Features】 ■ Compact, high-volume, low-current, and long-life ■ Non-contact type that generates sound by bonding a piezoelectric element to a metal diaphragm and vibrating it using an electronic circuit ■ Can be mounted to panels and other surfaces using the body nut (ESZ-11N-A) ■ Compliant with RoHS2 *For more details, please refer to the PDF document or feel free to contact us.
LED board that can be installed in places where power cannot be obtained from an outlet.
This is an LED board that lights up continuously for 30 days using three D batteries. Since it does not use a power outlet, it can be used anywhere without restriction. It has a built-in timer that repeats a cycle of 12 hours on and 12 hours off after being turned on. 【Features】 ■ Lights up for 30 days with three D batteries ■ Does not use a power outlet ■ Can be used anywhere without restriction ■ The light turns on in a flowing manner repeatedly
The main materials for cutting are (glass epoxy, phenolic, CFRP, acrylic, polycarbonate, POM, and various others) as well as (aluminum, copper).
Our company primarily focuses on machining printed circuit boards and various types of resin and metal plates, mainly using NC router processing for contour machining. We can accommodate orders starting from just one piece under material supply conditions. Additionally, our trained operators and our continuously improved, streamlined work standards and environments ensure "on-time delivery without delays." 【Features】 ■ Specialized production equipment allows for a wide range of orders from small to medium lots with various types. ■ High-precision counterboring (depth adjustment), small piece processing, and large-format processing are possible. ■ Quick response for short delivery times and urgent processing of new models, including the creation of machining data. ■ High-precision measurement using image processing technology (capable of measuring irregular shapes and heights). ■ Various resin plate processing is also possible, leveraging our circuit board processing technology. *For more details, please download the PDF or feel free to contact us.
Simplified prototyping of the circuit board! If the conditions are limited, such as a prototype of a prototype and specific verification items, this method is also possible!
The substrate is created by cutting copper foil. There are constraints on pattern width and insulation distance to omit circuit formation in the general printing process, and it is mainly for prototyping purposes. It is effective for shortening delivery times and cost reduction until completion.
Complete total support from development to design, assembly, and completion of electronic devices!
We would like to introduce our "Electronic Equipment Business." We provide complete total support from development to assembly and completion in various fields, including home appliances, industrial equipment, and medical health devices. Utilizing our unique prototype-focused manufacturing network, we aim for efficiency and cost reduction, not only domestically but also internationally. 【Features】 ■ Consulting for electronic equipment design and development ■ Shortening of design and development periods and lead times through comprehensive full support ■ Advanced CAD design using tools like Zuken CR8000 ■ Manufacturing of printed circuit boards from single-sided to 20 layers, as well as flexible circuit boards ■ High-density surface mounting of jumpers, axial, radial, and chip, IC, BGA, etc. *For more details, please feel free to contact us.
It is also possible to create a conversion board that reflects the customer's intentions!
We offer an emergency response component mounting service using conversion boards. The "CVB Series" is an original conversion board that resolves issues such as design errors and component procurement mistakes. We address various concerns, such as: - "The components I had arranged for are unavailable, and work is stalled." - "I mistakenly purchased unnecessary components with the wrong shape, resulting in excess inventory." 【Examples of Solutions】 - Re-arranging the components that are actually needed. - The board was manufactured, but the component pads do not match, making it impossible to mount. - It was specified for discrete components. - The board was designed for surface-mount components, but it was specified for discrete components. - Unable to mount on the board due to differences in component sizes, etc. *For more details, please download the PDF or feel free to contact us.
Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!
"FGHP" is a flat heat pipe-type heat spreader that forms a sealed space and wick (capillary structure) inside an ultra-thin metal sheet. It supports the reduction of thermal density and efficient heat dissipation by uniformly spreading the high-density heat generated by a small, high-output heat source across the surface through its excellent thermal diffusion capability. 【Features】 ■ Excellent thermal diffusion (heat pipe structure) ■ Thin design (micro-etching technology) ■ Lightweight (hollow structure) ■ High reliability (high-strength sealed structure) ■ Can be installed vertically (internal microstructure) *For more details, please download the PDF or contact us.
A problem-solving and proposal-based company that provides high-quality, high-performance electronic circuit boards!
At the Nasu Factory of Tokushu Seiki Co., Ltd., we manufacture electronic devices, communication equipment, and precision instruments. Our company began manufacturing circuit boards in the 1970s when printed circuit boards started to become widespread in Japan. We have produced high-quality circuit boards for various fields, including communication base stations, medical devices, and automotive applications. With a quality control system centered around five inspection processes, we will continue to provide high-quality and high-performance electronic circuit boards. 【Our Strengths】 ■ High mounting technology and quality control system ■ A reliable partner for electronic circuit board prototyping ■ "Quality" is built from the upstream *For more details, please download the PDF or feel free to contact us.
We will upgrade the old 2kW data center to be equivalent to the latest model.
The "NX120V" is an advanced ICT device that enables the continued operation of facilities built around the year 2000 without the need for complete updates or renting space from other centers, allowing for operation with the current equipment as is. In an old data center with a 2kW specification, it is possible to operate at the equivalent of 4-6kW without changing the facility equipment. 【Features】 ■ Improved overall performance with better peak power extraction compared to average power ■ Power consumption is less than half that of conventional Xeon servers (Ave 50w) ■ CPU options include Intel XeonD with 4/6/8/12/16 cores, and memory can be maxed out at 128GB (ECC) ■ Storage includes M.2-512GB for system use (transfer speed 2GB/S) ■ Capable of operation in high-temperature environments up to 45℃, among other features *For more details, please download the PDF or feel free to contact us.
The printed circuit boards will be shipped tomorrow. Industry-leading ultra-short delivery times! Please give it a try!!
We have been in the printed circuit board business for over 30 years. We have steadily and diligently accumulated know-how for short lead-time manufacturing with honesty and sincerity. We have absolute confidence in our express and short lead-time manufacturing. Please feel free to consult with us.
![[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board](https://image.mono.ipros.com/public/product/image/7c0/2001120580/IPROS81776454173382698581.png?w=280&h=280)
Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.
We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.
Forming guard patterns! Introducing examples of manufacturing and processing long slit TH substrates.
We would like to introduce an example of manufacturing and processing of the "Long Slit TH substrate." By providing a pattern on the edge of the substrate, a guard pattern is formed. Please feel free to contact us when you need assistance. 【Overview】 ■ Long Slit TH substrate ■ Similar processing technology (edge TH) *For more details, please refer to the PDF document or feel free to contact us.
Using high-frequency materials for specific interlayers while employing different materials for other interlayers! Here are some examples of manufacturing processes.
We would like to introduce an example of the manufacturing process for "hybrid structure substrates." Specific interlayers are made of high-frequency materials, while other interlayers use different materials (such as FR-4). Please feel free to contact us when you need assistance. 【Composition Example】 ■ High-frequency material (core material) ■ FR-4 (PP) ■ FR-4 (core material) *For more details, please refer to the PDF document or feel free to contact us.
Used in a wide range of fields as a general-purpose substrate! The interlayer connection of the double-sided board is formed by TH.
We would like to introduce the "single-sided and double-sided PCBs" handled by Matsuwa Sangyo Co., Ltd. These printed circuit boards have conductor patterns formed on one or both sides of an insulating board. They are widely used in various fields as general-purpose substrates, and the interlayer connections of double-sided boards are formed by TH (through-hole) technology. We offer materials such as FR-4, CEM-3, FR-1, halogen-free materials, high heat-resistant materials, aluminum materials, and low dielectric constant materials, with board thicknesses ranging from t0.1mm to t3.2mm. We also accommodate various copper foil thicknesses from 9μm to 175μm. 【Fastest Delivery Record】 ■ 1 layer ⇒ 1 day (data by 8 AM ⇒ same-day shipment) ■ 2 layers ⇒ 1.05 days (data by 8 PM ⇒ shipment the next day) *For more details, please refer to the related links or feel free to contact us.
Multi-stage builds, stackable vias, filled vias plating, all handled with in-house integrated manufacturing!
We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.
We propose appropriate line widths, clearances, and layer configurations during pattern design!
We would like to introduce the "Impedance Control Compatible Boards" handled by Matsuwa Sangyo Co., Ltd. In recent years, there has been a significant increase in the demand for boards that require impedance control for the purpose of stabilizing signal quality and reducing noise due to high-speed communication in circuits. With our extensive manufacturing experience and achievements cultivated over many years, we support various impedance simulations such as characteristic, differential, common, and coplanar, as well as TDR measurements, and we propose appropriate line widths, clearances, and layer configurations during pattern design. 【Features】 ■ Supports various impedance simulations including characteristic, differential, common, and coplanar, as well as TDR measurements ■ Proposes appropriate line widths, clearances, and layer configurations during pattern design *For more details, please refer to the related links or feel free to contact us.
By increasing the finished copper thickness to around 210μm, it can also accommodate high current circuits!
We would like to introduce the "thick copper substrate" handled by Matsuwa Sangyo Co., Ltd. The typical copper foil thickness for printed circuit boards is 18μm or 35μm, but by increasing the finished copper thickness to about 210μm, it can accommodate high current circuits. In recent years, thick copper substrates (high current substrates) have been increasingly required, particularly for automotive and power electronics applications, and the demand is growing. [Example of Thick Copper Substrate Manufacturing Specifications] ■ Copper foil thickness: 70μm, 105μm, 140μm, 175μm (excluding copper foil thickness below 35μm) ■ Finished copper thickness after plating: can be 210μm or more *For more details, please refer to the related links or feel free to contact us.
By directly contacting heat-generating components with copper, which has a high thermal conductivity, excellent heat dissipation is achieved!
We would like to introduce the "Copper Inlay Substrate" handled by Matsuwa Sangyo Co., Ltd. This substrate is designed to partially improve heat dissipation characteristics by using copper pins pressed directly under heat-generating components. By making direct contact with heat-generating components, it achieves high heat dissipation due to the high thermal conductivity of copper. Compared to metal-based substrates, it can reduce weight, and it is also advantageous that the existing layer structure of substrates can be applied as is. 【Features】 ■ A substrate aimed at partially improving heat dissipation characteristics ■ Achieves high heat dissipation by making direct contact with heat-generating components using high thermal conductivity copper ■ Reduces weight compared to metal-based substrates ■ Existing layer structures of substrates can be applied as is *For more details, please refer to the related links or feel free to contact us.
Effective when it is required to make contact between the substrate pad and mounted components at a high position!
We would like to introduce the "copper bump substrate" handled by Matsuwa Sangyo Co., Ltd. Thanks to a special plating method, it is possible to form bumps of approximately 30 to 100 μm in the necessary areas of the pattern. This is effective in cases where it is required to make contact between the substrate pad and mounted components at a high position. 【Copper Bump Substrate Manufacturing Specifications Example】 ■Bump Diameter/Bump Size: φ0.4mm/0.3mm×0.25mm ■Bump Height: 100μm *For more details, please refer to the related links or feel free to contact us.
Cool down the substrate!
In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.
【Zero Waiting Time for Estimates!】 By simply filling out the necessary information, you can achieve an estimate response with "zero waiting time." We won't keep you waiting for PCB manufacturing estimates!
"Oh no~ I can't reach the sales representative!" "I want the estimate as soon as possible!" "When will the estimate come?" Matsuwa Sangyo responds to such words. Matsuwa Sangyo prides itself on being the fastest in domestic circuit board manufacturing. Of course, we confidently respond with "Fast!" to various inquiries, including estimates, but we are also striving to further shorten the response time for estimates by providing the automatic estimate system "Saku! to SHOWA." Just enter the necessary items from the URL below and click! Now, let's get those estimates quickly! Saku! to SHOWA https://www.showanet.jp/estimate/
We will be exhibiting at the JPCA Show 2024 from June 12 to 14! Here’s a sneak peek of our timely delivery response.
Don't you have experience wanting a circuit board by tomorrow? The greatest strength of Matsuwa Industries is undoubtedly our ultra-short delivery times. We deliver everything from through-hole boards to build-up boards, FPC boards, and rigid FPC boards at the industry's fastest levels! 2-layer to 10-layer through-hole boards in as little as 1.05 days! Through-hole resin-filled boards in as little as 2.1 days! 1-2-1 build-up boards in as little as 3 days! 1-layer and 2-layer FPC boards in as little as 2 days! 4-layer rigid FPC in as little as 5 days! Not only are our delivery times fast, but we also ensure that we deliver on your requested deadline (with a compliance rate of 99.94%). Naturally, our inspection system is equipped with the latest facilities, so you can rest assured about quality. We will thoroughly promote the secrets of our delivery times and more at the exhibition. If you are attending, please stop by the Matsuwa Industries booth at [5F-23]! Register for the JPCA Show here ⇓
We will be exhibiting at the Nepcon Japan Autumn Exhibition at Makuhari Messe from September 4 to 6! Please feel free to consult us about anything related to circuit boards!
Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory with a fully integrated process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Through-hole substrates ⇒ as short as 1.05 days! Through-hole resin-filled substrates ⇒ as short as 2.1 days! 1-2-1 build-up substrates ⇒ as short as 3 days! FPC substrates ⇒ as short as 2 days! 4-layer rigid FPC substrates ⇒ as short as 5 days! Surface treatment with gold flash is also handled in-house, so there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even for materials we have no processing experience with, we are flexible in our response! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate..." Why not start with a light consultation? We will be exhibiting at the Nepcon Japan Autumn Exhibition held at Makuhari Messe from September 4 (Wed) to September 6 (Fri)! On the day, members who can consult on technology will be gathered at our booth, so please stop by the Matsuwa Sangyo booth [6-37]! Pre-registration for your visit can be done here↓!
Because the era is high frequency.
Matsuwa's high-frequency substrates are very speedy! We always have low Dk and low Df materials in stock. We can accommodate everything from multilayer boards to hybrid laminated structures and back drilling, even for small quantities and short delivery times. We are also actively working on new materials and welcome inquiries not only for regular projects but also for various research and development purposes. Matsuwa Industries is here for high-frequency substrates! Thank you.
With the "Breakthrough Course," you can ship printed circuit boards in as little as 12 hours! Let's make circuit boards this year and welcome a refreshing New Year!
The year 2024 is about to come to an end in the blink of an eye. Are there any circuit boards you are about to give up on arranging for delivery by the end of the year? If you consult with Matsuwa Sangyo, known for its ultra-short delivery times, we can accommodate your desired schedule even with tight timelines. Common year-end and New Year’s issues can be resolved with Matsuwa, making us a strong ally for your company! - Through-hole boards ⇒ as fast as 1.05 days! - Through-hole resin-filled boards ⇒ as fast as 2.1 days! - 1-2-1 build-up boards ⇒ as fast as 3 days! - FPC boards ⇒ as fast as 2 days! - 4-layer rigid FPC boards ⇒ as fast as 5 days! Furthermore… with our unbeatable <Limit Break Course>, - 4-layer through-hole boards ⇒ 17 hours - 6-layer through-hole resin-filled boards ⇒ 24 hours - 1-2-1 build-up ⇒ 48 hours - 6-layer 2-2-2 build-up ⇒ 72 hours to complete the boards! Our impressive delivery capabilities are made possible by Matsuwa Sangyo’s fully in-house manufacturing and 24-hour factory operations. Additionally, our compliance rate of 99.94% is another attractive feature. We guarantee delivery by the promised deadline. For more details, please refer to our catalog or feel free to contact us through our website.
