We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:May 06, 2026~Jun 02, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:May 06, 2026~Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 null/null

Substrate Product ranking

Last Updated: Aggregation Period:May 06, 2026~Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社 和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム

Substrate Product List

1471~1500 item / All 1948 items

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[Design and Manufacturing Example] Stator Coil for Ultra-Small Motor_FPC

Base PI thickness is 25μ, Cu thickness is 18μ! A case study of coil flex design and manufacturing aimed at achieving a strong magnetic field formation.

We would like to introduce a case study of the design and manufacturing of coil flex aimed at achieving a very small yet powerful magnetic field formation, as requested by the manufacturer. Within an outer dimension of approximately 4.0mm x approximately 3.0mm, we configured a single-sided structure with L/S=35μ/35μ, 6 turns x 3 blocks. Additionally, within an outer dimension of approximately 4.0mm x approximately 10.0mm, we configured a double-sided structure with L/S=70μ/50μ, 4 turns x 3 blocks. The materials used for both the single-sided and double-sided structures are adhesive-free, with a base PI thickness of 25μ and a copper thickness of 18μ. 【Case Overview】 ■ Materials Used - Single-sided: Adhesive-free material - Double-sided: Adhesive-free material ■ Base PI Thickness: 25μ ■ Copper Thickness: 18μ *For more details, please refer to the PDF document or feel free to contact us.

  • Inductor Coil
  • Contract manufacturing
  • Other contract services
  • Substrate

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[Power Supply Design Proposal Example] Comprehensive support from circuit board production to electrical operation testing.

Even if the manufacturer goes out of business, we can still provide support! We can reduce the burden on our customers!

The manufacturer we had commissioned for the production of the power supply board has gone out of business. We received an inquiry asking if we could take on not only the board production but also the electrical operation testing. Although the initial request was for board production, we proposed the development and manufacturing of an automatic testing device, as well as conducting the electrical operation tests in-house. By providing a comprehensive solution, we were able to reduce the burden on the customer. [Case Summary] ■ Issue: Inquiry about whether we could handle not only board production but also electrical operation testing ■ Proposal: Development and manufacturing of an automatic testing device, and conducting electrical operation tests in-house ■ Result: We were able to reduce the customer's burden through a comprehensive solution *For more details, please refer to the related link page or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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[Free Handbook] "Key Points of Pattern Design in Power Supply Boards"

We are currently offering a technical document that explains the key points of circuit board layout to maximize the performance of power ICs, based on specific examples!

"The Essentials of Pattern Design in Power Supply Boards" is a document compiled for power design engineers, summarizing key points in the design of power supply boards. We will explain using specific examples tailored to various situations, so please make use of this information during your actual power supply board design. [Contents] ■ The Importance of Pattern Design in Power Supply Boards ■ Examples of Pattern Design Proposals for Power Supply Boards  ◎ Connection methods for bypass capacitor lines in power ICs  ◎ Connection methods for current detection lines  ◎ Connection methods for power output bypass capacitors  ◎ Ground separation  ◎ Connection methods for power output bypass capacitors  ◎ Placement of aluminum electrolytic capacitors considering current balance  ◎ Connection methods for output feedback lines  ◎ Relationship between power input and switching lines  ◎ Noise countermeasures for high current lines  ◎ Noise generation countermeasures due to magnetic flux *For more details, please refer to the PDF document or feel free to contact us.

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • Substrate

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How to connect the output feedback line

A clear explanation of how to connect the output feedback line using diagrams!

The method of connecting the detection line for output feedback to reduce noise is fundamental to pattern design. However, in practice, this detection line is often connected inappropriately. It is important that the detection line for output feedback is configured to draw the mode from the output terminal where the voltage is to be detected. Even if considered electrically equivalent, it is necessary to take into account the line drop on the circuit board and the influence of noise. Similarly, external interfaces and output check terminals also fall under this consideration. *For more detailed information, you can view it through the related links. For further details, please download the PDF or feel free to contact us.*

  • power supply
  • Substrate

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Analog Sensor Board "TypeWEST"

You can create an analog sensor board that is resistant to damage from the start bar sensor!

The "TypeWEST" is an analog sensor board equipped with 2 analog sensors, 5 digital sensors, and 1 start bar detector. It features a structure that is resistant to damage for the start bar sensor, and also includes a ceramic capacitor for noise countermeasures. 【Specifications】 ■ Distance between analog sensors: 42mm ■ Reinforced fixation for Φ3mm infrared LED for digital sensors ■ Power supply voltage: 5.0V ■ Weight: approximately 10g *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Substrate

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Trial Repeat Manufacturing [Printed Circuit Board] Renewal Open

Leave the prototype circuit board event to Shirai Electronics!

"Prototype Repeat Manufacturing" is the REPEAT-SYSTEM that delivers the repeat manufacturing of the initial new prototype in the shortest time possible. We will ship within 4 days at the earliest. ★ We provide full support from prototyping and mass production to design and implementation. * This applies to the first new delivery date within 3 months and up to 2 times. * The surface treatment for standalone PCBs is water-soluble pre-flux, and schedules for gold plating and solder leveling will take an additional 2 days. * Orders for prototype repeats must be placed by 14:00 on the same day. * For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment
  • Printed Circuit Board
  • Substrate

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Super Express Manufacturing of Single-Sided PCBs - A Challenge to Speed - [Printed Circuit Boards]

Single-sided board (double-sided non-TH board) completed in 12 hours!

Shirai Electronics fully supports product development with our long years of experience and know-how in the EX system (for express manufacturing) and a flexible support system. We respond flexibly to a wide range of needs and realize development support in various situations. If you place a consolidated order with our company (PDS), you can complete your ordering process in one go, allowing for overall delivery schedule adjustments and reductions in lead time. 【Features】 ■ Quick-turn prototypes and small-lot, multi-variety production ■ Total support ■ Implementation available on Saturdays and Sundays 【Delivery Examples】 ■ Double-sided through-hole boards: as fast as 22 hours ■ 4-layer through-hole boards: shipped in 2 days (Note: This is for prototype-level support and may vary based on quantity, processing content, and specifications.) *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Circuit board design and manufacturing
  • Other contract services
  • Substrate

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Waterproofing and long-life enhancement of the implementation substrate: "Resin potting application."

[Waterproof and Dirt Prevention] Are you having trouble with making your circuit board waterproof, vibration-resistant, or preventing dirt accumulation? Achieve a longer lifespan for your board with resin potting.

The challenge with implementation boards is the reduced lifespan due to various environmental factors. - Damage from vibration and impact - Accumulation of water droplets, dust, and dirt In response to the above, we recommend "resin potting" for enhancing the water resistance, seismic resistance, and longevity of the boards. By injecting urethane resin into cases, dust, dirt, and water can be completely shut out. Additionally, since the board is fixed by the resin, it can also be protected from vibrations. **Benefits of Resin Potting:** - No worries about dust or dirt adhering to the board - Excellent waterproof and moisture-proof properties - Strong against vibrations and impacts as the case can be filled and fixed with resin - Can extend the component replacement cycle, proving effective for products aimed at overseas markets In this way, Astom, with over 20 years of experience, offers various solutions to the challenges and concerns related to boards. Please feel free to consult us regarding any issues related to implementation boards.

  • Contract manufacturing
  • Testing Equipment and Devices
  • Circuit Board Inspection Equipment
  • Substrate

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Printed circuit board

Leave the design and production of printed circuit board patterns to us!

Kobayashi Electronic Industry Co., Ltd. primarily manufactures printed circuit boards for industrial equipment, responding to customer needs from pattern design to printed circuit board assembly. Additionally, through a thorough quality control system and production management system, we deliver "peace of mind" to our customers. 【Business Description】 ■ Design, manufacturing, and sales of printed circuit boards for industrial equipment *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Contract manufacturing
  • Substrate

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Thorough quality control and production management at Kobayashi Electronics!

We have implemented our own production management system, managing everything from order receipt to delivery with barcode tracking.

Since our establishment in 1970, we have been delivering "peace of mind" to many customers. We have implemented our unique production management system, which allows us to manage the entire process from order receipt to delivery using barcode management, ensuring reliable delivery date management. Not only do we manage delivery dates, but we also carefully manage customer information to reduce the hassle for repeat customers.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Voices from the Development Manufacturer: Avery Corporation

Evaluation board for medium to high voltage ICs. Our flexible response to customer needs and ongoing support have been well received.

Kai Electronics Co., Ltd. has been involved in the design and manufacturing of printed circuit boards and the overall development of electronic devices, working with many development manufacturers. Within the company, there are three engineers specializing in system design, enclosure design, and printed circuit board design. We can pursue designs that consider requests from other processes and seek optimal solutions from multiple perspectives. This time, we would like to share feedback from a development representative at Averyk Co., Ltd. They have entrusted us with the design and manufacturing of evaluation boards for high-voltage ICs. [Customer Feedback] - They responded flexibly to the situation while maintaining close communication even after the specification document was submitted. - They contributed to quality improvement and accelerated development. - They are expected to provide support for the increasingly complex IC specifications. *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • Substrate

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NBC's Electronics Division

We strive for quality with a reliable system. We also manufacture high thermal conductivity metal substrates, which have received positive feedback from our customers.

Introducing NBC's "Electronic Business Division." This division plays a role in automotive electronics through the design, manufacturing, and sales of printed circuit boards, with a motto of "creating reliable products" required in automotive electronics. Recently, we have also started manufacturing metal substrates aimed at improving reliability against heat, which has been well received by our customers. 【Features】 - Primarily focused on automotive products, but also provides a wide range of products for communications and industrial equipment. - Capable of handling small lot products from single-layer to high multilayer. - Addresses thermal measures with metal-based substrates and high heat-resistant materials. - Committed to creating high-quality, highly reliable products to meet diverse customer needs. *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Substrate

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Expansion board "Raspberry Pi(R)"

We provide teaching materials and reference books that can be used in actual embedded business.

We offer the expansion board "Raspberry Pi(R)" as our own product. We provide teaching materials and reference books that can be used in actual embedded work. Please feel free to contact us if you have any requests. 【Lineup】 ■ Basic image processing programs: face recognition, color recognition, centroid determination, etc. ■ Japanese speech recognition ■ Japanese speech synthesis ■ Digital input/output: AD conversion input support ■ Embedded-compatible power configuration ■ Internet-based remote communication ■ 24-channel servo motor control: teaching operation possible *For more details, please download the PDF or contact us.

  • Circuit board design and manufacturing
  • Substrate

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Ultra-small, high-precision flexible substrate

Custom-made support for narrow pitch high-definition and ultra-high-definition substrates! Leave flexible substrates (high-definition FPC) to us!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We utilize advanced techniques such as micro-hole processing using chemical etching, BVH connections, and polyimide micro-hole processing technology that allows for simultaneous hole drilling to meet our customers' needs. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Micro-hole processing and BVH connections using chemical etching ■ Introduction of polyimide micro-hole processing technology that allows for simultaneous hole drilling *For more details, please download the PDF or contact us.

  • Board to FPC connector
  • Substrate

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Mountaineer "My Data MY15"

A compact feeder that allows for the removal of setup time! The tip tape can be set even if it is short.

"My Data MY15" is a mounter suitable for implementing various types and small lot sizes. It allows for the mounting of components on multiple types of printed circuit boards at once and can also handle irregularly shaped boards. Additionally, the feeder allows for quick setup by simply inserting the tip of the reel component, reducing work time. By scanning the barcode on the feeder and setting it in the magazine, the component setup is completed. 【Features】 ■ Capable of mounting components on multiple types of printed circuit boards at once ■ Capable of mounting components on irregularly shaped boards (no need for dummy boards) ■ Can mount circular, trapezoidal, star-shaped, and other types of printed circuit boards ■ Short changeover time ■ Can be set even with short tape on the tip of reel components *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Substrate

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FPC

With our extensive experience and production technology, we provide timely FPCs that satisfy everyone at any stage of development cooperation, prototyping, and mass production.

Single-sided FPC, double-sided FPC, multi-layer FPC, low-rebound FPC, used in various applications such as space and aerospace equipment, medical devices, industrial equipment and robots, car electronics, mobile devices and computer-related equipment, cameras and movie equipment, and electronic components.

  • Board to FPC connector
  • Substrate

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Aluminum base substrate [Noise and heat countermeasures with aluminum grounding]

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream options are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. To address this, our company has developed a unique method of bonding the substrate to aluminum, allowing us to create aluminum base substrates using the desired substrate and aluminum. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material to aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Large high multi-layer / large substrate

Production of ultra-large size boards such as motherboards and long boards for LED lighting is possible!

At Kyoei Denshi Co., Ltd., we are capable of producing long and large substrates exceeding 1,000mm in length. We accommodate various specifications such as high frequency, thick copper, and high multilayer. We support ultra-large size "large high multilayer substrates" for motherboards used in information and communication devices and for BTB applications, as well as "long substrates" up to a maximum of 1,000mm for LED lighting and A0 print heads. 【Features】 ■ Capable of producing ultra-large sizes ■ Vacuum forming press machine / heating plate size 750×1,100 ■ Supports up to 24 layers ■ Products up to a maximum of 1,000mm for LED lighting and A0 print heads *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Hybrid substrate (honeycomb material laminated substrate)

By combining different substrate materials in horizontal and vertical directions, we can reduce assembly man-hours and save space!

Hybrid substrates integrate multiple substrate materials with different characteristics by combining them in horizontal and vertical directions (layering), allowing for the unification of what was previously divided into multiple boards, thus achieving a reduction in assembly labor and space-saving. Additionally, we offer "honeycomb substrates" that are ultra-lightweight and have excellent electrical properties through a composite technology that incorporates honeycomb materials into the substrate and layers them. Honeycomb materials are particularly effective when bonded with fluoropolymer (Teflon) substrates. Fluoropolymers are used as materials for high-frequency substrates due to their low dielectric constant, but the base material itself is soft, making it difficult to handle. When scaled up, thin substrates can bend or break, while making the substrate thicker can lead to warping due to its own weight. Honeycomb materials are lightweight and have high strength, allowing for reinforcement of the substrate when bonded, which helps to reduce warping. Furthermore, not only does it contribute to weight reduction, but the air within the honeycomb also serves as an insulating layer, making it effective when a lower dielectric constant is desired. Moreover, because the honeycomb material provides reinforcement, handling becomes easier compared to when using the substrate alone, thus improving work efficiency. *For more details, please refer to the PDF document or feel free to contact us.*

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Molded cast products [We propose the selection of resins tailored to the required characteristics].

Product creation tailored to needs: ・High voltage resistance (proven up to 30kV) ・Custom resin formulation to match desired performance.

Molded cast products can conform to any shape for mold production and ensure insulation performance. They also excel in electrical properties, mechanical strength, dimensional stability, and chemical resistance. Leveraging our unique position as both a manufacturer and a trading company, we propose the optimal resin from multiple options based on the usage environment and the most important performance criteria you prioritize. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve the desired properties. Resins come with various performance characteristics. If you want to use them outdoors or need something resistant to chemicals, please feel free to consult us. 【Cast Products】 ■ High-strength resins ■ Low thermal expansion resins ■ Thermal conductive resins 【Applications and Examples】 ■ Switching devices ■ Circuit breakers ■ Power conditioners ■ Gap spacers 【Quality Control】 ■ Dielectric strength testing ■ Corona discharge testing *For more details, please refer to the PDF document or feel free to contact us using the form below.

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  • Vacuum Equipment
  • Resin mold
  • Substrate

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Heat-dissipating molded cast products [Resin molded products that combine heat dissipation and insulation properties]

Proposals for EV vehicles with increasing heat dissipation requirements, high-efficiency motors, power devices, etc.

We solve heat problems caused by the miniaturization of devices with the power of resin. We offer proposals for applications such as EV vehicles, high-efficiency motors, and power devices, where the demand for heat dissipation is increasing. Leveraging our unique position as both a manufacturer and a trading company, we suggest suitable resins from multiple manufacturers based on the usage environment and other factors. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve desired properties. Please feel free to consult us with any other requests. 【Features】 ■ Achieves thermal conductivity of 2.6 W/m·K ■ Breakdown voltage of 17 kV/mm *For more details, please refer to the PDF document or feel free to contact us.

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  • Other Auto Parts
  • Substrate

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Bus bar (bus bar) high current substrate

By substrate-izing the busbar, high insulation and compactness are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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[Equipment Introduction] Leave implementation technology and circuit board assembly to us.

We offer a lead-free compatible line, discrete component inserters, inspection equipment, and more!

We would like to introduce the equipment owned by World Electronics Co., Ltd. The SMT L6 line (lead-free compatible line) includes a cream solder printer, adhesive applicator, high-speed component mounter, odd-form component mounter, and a lead-free compatible N2 reflow oven. Additionally, the high-speed axial component inserter "AVK3" supports self-insertion for board sizes (mm) with a maximum of 508×381 and a minimum of 50×50. 【Equipment Owned (Excerpt)】 ■ Flow Soldering Line - Spray Fluxer - Automatic Soldering Equipment: 3 lines for lead-free solder, 1 line for eutectic solder *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Circuit Board Inspection Equipment
  • X-ray inspection equipment
  • Substrate

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Transaction Flow

First, please feel free to contact us via the inquiry form or by phone!

We would like to introduce the flow of transactions with World Electronics Co., Ltd. First, please contact us via the inquiry form or by phone, and we will gather necessary information such as the type of product, quantity, and delivery date. Based on the information provided, we will create and present a quotation. Once you agree to it, we will proceed with the contract. Next, we will create a prototype and respond sincerely until the desired product is completed. Once the prototype is finished, we will manufacture the product and deliver it according to the desired delivery date. 【Transaction Flow】 1. Inquiry 2. Requirements Hearing 3. Quotation 4. Contract 5. Prototype Creation 6. Manufacturing 7. Delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Substrate

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Board "SY-KUS-01"

PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.

The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Substrate

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[Solution Example] i.MX8M Mini <Differences in Patterns>

Compare the differences and start testing with four types of design and pattern variations! Please take a look.

The preliminary evaluation has been completed to some extent, and we have created four types of circuit boards with different wiring patterns for LP-DDR4. We are comparing the differences between the pattern simulations during the design phase and the actual devices, providing feedback, and adjusting detailed CPU parameter settings while confirming operation and accumulating data. We are progressing with the evaluation work to propose suitable solutions. 【Design and Patterns】 ■Standard patterns based on NXP evaluation boards ■Consideration of delay constraint relaxation for high-density design support ■Verification of crosstalk effects ■Consideration of layer reduction *Details of the case studies can be viewed via the related links. For more information, please feel free to contact us.

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[Solution Case] FPGA In-house Research Meeting vol.1

Control the ping pong balls inside the tube! Introducing research on high-speed image processing and motor control.

Our company regularly holds research meetings to improve FPGA technology in-house. This time, we are using an FPGA with an ARM core to process images captured by a camera while controlling a fan motor, and to control a ping pong ball inside a tube at the same location where the image was taken. We are advancing research that enables simultaneous processing on the ARM and FPGA, allowing for faster and more appropriate feedback. By continuing such in-house research, we are tackling new technological fields. *Details of the case can be viewed through the related links. For more information, please feel free to contact us.*

  • Embedded Board Computers
  • Development support tools (ICE, emulators, debuggers, etc.)
  • Substrate

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Printed circuit board

Developing printed circuit boards that support technology! Bringing products to life that meet various needs.

Daishin Sangyo Co., Ltd. develops printed circuit boards with a skilled and experienced design team specializing in technical expertise. We are capable of manufacturing special substrates, including build-up boards, Teflon boards, and aluminum boards. We offer a wide range of services from circuit tracing to power supply, analog, digital, high frequency, impedance, and FPGA design. 【Features】 ■ Possible to ship as soon as the next day ■ Supports small lots to mass production ■ Circuit design ■ Artwork design (pattern design) ■ Metal mask production *For more details, please refer to the PDF document or feel free to contact us.

  • IPROS51674970813232955168.png
  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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[Information] Daishin Sangyo Co., Ltd. Manufacturing Supplement

Introducing numerous examples of high-difficulty substrates, such as 0.5 pitch BGA mounted 8-layer through resin-filled boards (t0.6)!

This document is a supplementary manufacturing material from Oshin Industry Co., Ltd. It includes information such as the lineup of standard substrate materials, maximum sizes of multilayer boards, and maximum board thickness. Additionally, as examples of high-difficulty substrates, we introduce technologies such as "0.4 pitch BGA mounted 8-layer through resin-filled substrate (t1.6)" and "0.4 pitch BGA mounted 16-layer L1-2/L1-3…L1-8 continuous IVH substrate (t3.2)." We encourage you to read it. 【Contents (partial)】 ■General - Standard substrate materials - Maximum sizes of multilayer boards - Maximum board thickness ■Technology (Examples of high-difficulty substrate achievements) - 0.5 pitch BGA mounted 12-layer 2-8-2 build-up substrate (t1.6) - 0.5 pitch BGA mounted 16-layer L1-8/L9-16 IVH + through resin-filled substrate (t2.0) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Other processing machines
  • Substrate

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Printed circuit board "10-layer 3-4-3 build-up board"

Introducing a printed circuit board with a core section of 4-layer TH, resin-filled and lid-plated! It features a 0.4 pitch 256-pin BGA.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima Ward of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "10-layer 3-4-3 build-up substrate" is a printed circuit board equipped with a 0.4 pitch 256 pin BGA. It features via-on-via with via fill copper plating. The resist is exposed using DI laser, with a laser hole diameter of φ0.1. 【Features】 ■ Via-on-via with via fill copper plating ■ Core section 4-layer TH is resin-filled and covered with plating ■ L5/6 layer clearance φ0.35 (TH φ0.2 drill) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Circuit board design and manufacturing
  • Substrate

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