Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies

Dissimilar copper thick coexistence substrate

A high-current substrate suitable for miniaturized power devices!

The "Hybrid Copper Thickness Coexistence Substrate" is a high-current substrate that allows for the coexistence of 300μm thick copper foil and 70μm thin copper foil within the same layer, enabling switching between them. It achieves a reduction in assembly processes and component count, making it suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 ■ Switchable between 300μm and 70μm ■ 300μm and 70μm can be interwoven ■ Combination of copper inlays is possible *For more details, please download the PDF or feel free to contact us.

Company：大陽工業プリント回路カンパニー
Price：Other

Printed Circuit Board
Substrate

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High current substrate

With a rich lineup of copper foil thicknesses, we can accommodate current values from a few amperes to several hundred amperes!

The "High Current Substrate" is a printed circuit board that can carry large currents ranging from several tens to several hundred amperes, featuring thick copper foil. We offer "Ultra Thick Copper High Current Substrates" that use copper thicknesses of 300μm, 400μm, and 500μm, exceeding the conventional copper thickness of 105 to 240μm, as well as "Irregular Copper Thickness Coexisting Substrates" suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 - In the case of 300μm, coexistence with 50μm thin copper foil is possible in the same layer. - For thicknesses of 500μm or more, it is possible to draw copper foil out of the substrate from the inner or outer layers. - Exposure within the substrate is also possible. - Terminal processing, bending processing, and three-dimensional shaping of the substrate are possible. *For more details, please download the PDF or feel free to contact us.

Company：大陽工業プリント回路カンパニー
Price：Other

Printed Circuit Board
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Copper inlay substrate

A high-current, high-heat-dissipation substrate that achieves effective heat dissipation!

The "copper inlay substrate" is used in a wide range of fields and is particularly adopted as a critical component related to human life in automotive applications, being a high-current and high-heat-dissipation substrate. It achieves an excellent cost-performance heat dissipation method. By pressing copper directly beneath heat-generating components, it effectively dissipates heat. Additionally, eliminating the need for screw fastening for each heat-generating component enhances reliability, reduces costs, and decreases assembly labor. 【Features】 ■ Compared to aluminum heat dissipation substrates, the lower coefficient of thermal expansion of copper improves the reliability of solder joints. ■ Compared to aluminum heat dissipation substrates, it allows for the use of high multilayer substrates and double-sided mounted substrates, increasing design flexibility. ■ Increased circuit efficiency due to greater freedom in component placement. ■ Miniaturization. ■ Both SMD and lead components can adopt the same heat dissipation structure. *For more details, please download the PDF or feel free to contact us.

Company：大陽工業プリント回路カンパニー
Price：Other

Printed Circuit Board
Substrate

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BN substrate (substrate for high heat-resistant printed circuit boards)

Substrate for high-temperature printed circuit boards with excellent insulation reliability.

At Print Tech Co., Ltd., we handle substrates for printed circuit boards that excel in heat resistance. We offer "BN300," which is used as a substrate for semiconductor substrates due to its high heat resistance characteristics, and "BN-LX," a high-reliability substrate for printed circuit boards that achieves environmental compatibility, high heat resistance (TG = 300°C), and low warpage (CTE = 6ppm). Please feel free to consult us if you have any requests. 【Product Lineup】 ■ BN300 ■ BN-LX *For more details, please download the PDF or feel free to contact us.

Company：プリンテック
Price：Other

Printed Circuit Board
Other electronic parts
Other machine elements
Substrate

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High multi-layer, large printed circuit boards (PCBs) and backplanes manufactured overseas.

Our company's circuit board manufacturing specializes in high-layer and large circuit boards up to 60 layers. We will develop solutions for your interconnection issues.

For over 30 years, our technological advancements in PCBs and backplanes have enabled several key innovations in high-speed networking and computing products. 【Services Offered】 ■ PCB layout, CAD, design for manufacturability and cost ■ Quick-turn PCB prototyping for PCBs, backplanes, and flex circuits ■ Mass production and global manufacturing in North America and Asia ■ Advanced technologies: laminated boards, HDI, any layer through structure, multiple sequential laminations ■ Manufacturing services utilizing SVP (Simultaneous Via Partitioning™) and intellectual property licensing opportunities ■ Manufacturing of high-layer-count and large PCBs *For more details, please refer to the PDF document or feel free to contact Sanmina.

Company：サンミナーSCIシステムズ・ジャパン本社
Price：Other

Contract manufacturing
Substrate

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Overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, etc.

We have strengths in advanced technology for high multilayer and ultra-fine pitch developed for aerospace applications, and we respond to the needs for procuring advanced substrates overseas.

We would like to introduce our overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, and more. Our company is a PCB manufacturing company with a long track record of providing PCB solutions for major markets in high-speed telecom, networking, computing, ATE, mission-critical defense and aerospace (MIL-PRF-31032, AS9100), automotive, and medical sectors. 【Features】 ■ Global footprint (two locations in the U.S., four factories in Singapore and China) ■ Design for PCB layout, CAD, productivity improvement, and cost reduction ■ Complete NPI support ■ Material technology ■ Technical leadership (multilayer boards, HDI, etc.) 【We will be exhibiting at NEPCON Japan 2025!】 Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (Booth # E28-17) *Please register your visit via the link below and stop by our booth! (No waiting time)

Company：サンミナーSCIシステムズ・ジャパン本社
Price：Other

Circuit board design and manufacturing
Substrate

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High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

The cup angle and bottom size can be freely selected! After implementation, the height of the board can be kept low.

This product is a "high-precision device substrate" that allows for a low profile of the board after mounting by installing an IC in the seat groove. It is designed for LED light reflectors, and the cup angle and bottom surface size can be freely selected. In addition, we also offer "high heat dissipation device substrates" and "ultra-thin glass cloth multilayer substrates." 【Features】 <High-Precision Device Substrate> ■ Enables a low profile of the board after mounting ■ Cup angle and bottom surface size can be freely selected <High Heat Dissipation Device Substrate> ■ Combines various heat dissipation technologies to meet advanced requirements ■ Copper pillars do not damage through-hole plating as they are not press-fitted *For more details, please refer to the PDF materials or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Substrate

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Heat-dissipating substrate "Thick Copper Special Substrate"

A thick copper three-layer substrate with a total thickness of 0.35mm! Suitable for applications such as mobile phone camera flash substrates.

We handle "heat dissipation structure substrates" with built-in copper. We use a thick copper three-layer substrate (inner layer copper thickness 0.2mm, total board thickness 0.35mm) and ultra-thin PP (0.03mm). These are used for applications such as mobile phone camera flash substrates. 【Required Performance】 ■ Circuit and SR alignment tolerance of 0.04mm ■ Surface treatment for gold wire bonding (electroless NiPdAu plating) ■ Deviation tolerance between the outer shape centerline and the component pad centerline of ±0.075mm *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other electronic parts
Substrate

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High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

We meet advanced requirements through the combination of high-precision machining and high heat dissipation structures!

Our company handles the heat dissipation substrate "High Precision Heat Dissipation Via." The applicable substrate methods include general through-hole TH, BVH, IVH, and build-up methods. The finishing plating options include electroless NiAu, bonding NiAu, and other impedance control solutions. By combining high-precision machining with a high heat dissipation structure, we meet advanced requirements. 【Features】 ■ Applicable substrate methods: Compatible with general through-hole TH, BVH, IVH, and build-up methods ■ Finishing plating: Electroless NiAu, bonding NiAu 　　　　　　　　Other impedance control compatible ■ Resin dam structure compatible with both high and low standards *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Substrate

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Heat dissipation substrate "Heat dissipation Via"

Multilayering of thick copper substrates is also possible! We can handle filling of blind vias and vacuum filling in-house.

Our company handles the heat dissipation substrate "Heat Dissipation Via." With the increasing heat generation due to the high performance and miniaturization of electronic components, there is a growing need for heat dissipation pathways that allow the heat generated by components to escape from the space to the pattern, in order to maintain the performance of electronic devices and extend their lifespan. We propose solutions to these issues as heat dissipation measures. It is also possible to create multilayer thick copper substrates, allowing for the development of new applications that have not been seen before. 【Features】 ■ Thick copper substrate with copper foil thickness of 210μm ■ Copper paste VIA hole filling (thermal conductivity 0.58–7.8W/mk) - Small diameter VIA φ 0.15 is supported, - Bottom-filled VIA hole filling can also be handled in-house with vacuum filling. *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Substrate

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Special processing for substrates used in high-precision devices.

Special processing such as ZAGRI processing, laser processing, and high-precision processing for pattern alignment is possible!

Our company handles special processing of "high-precision substrates for high-precision devices." The accuracy of the counterbore processing is ±20μm, the high-precision outer diameter processing by laser is ±10μm, and the high-precision processing for pattern alignment is ±50μm. By installing ICs in the counterbore section, it is possible to keep the height of the substrate low after mounting. 【High-Precision Processing】 ■ Counterbore processing accuracy: ±20μm ■ High-precision outer diameter processing by laser: ±10μm ■ High-precision processing for pattern alignment: ±50μm *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Other electronic parts
converter
Substrate

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Metal base substrate

A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.

A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.

Company：モリマーエスエスピー本社
Price：Other

High frequency/microwave parts
Substrate

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Stretchable circuit board

Follows uneven surfaces and curves! A circuit board that serves as electrodes for various sensors and maintains conductivity even when stretched.

The "stretchable circuit board" conforms to uneven surfaces and curves, maintaining conductivity even during stretching. It allows for circuit formation on any material depending on the application, while ensuring elasticity. As a stretchable pressure sensor, it can be utilized in various applications such as monitoring beds and shoe insoles, and it does not break even under load. Additionally, the stretchable biosensor detects weak biological signals using Ag/AgCl electrodes. 【Features】 ■ Conforms to uneven surfaces and curves ■ Maintains conductivity during stretching ■ Supports various batch sizes ■ Can serve as electrodes for various sensors ■ Does not break under load *For more details, please refer to the PDF materials or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Substrate

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[Information] Current Status of Stretchable Substrates Reaching Practical Levels

Meeting a wide range of user needs! An introduction to the current status of the development of stretchable substrates.

This document introduces the current status of the development of stretchable substrates. It includes information on material development, improvements in construction methods, and the expansion of application uses. Our company has been able to provide variations of standard connection methods, allowing for more diverse proposals for application development on the customer side. [Contents] ■ Preface ■ Material Development ■ Improvements in Construction Methods ■ Expansion of Application Uses ■ Future Developments *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Substrate

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[Information] Various Measures for Heat Dissipation in Circuit Board Design

Introducing new heat dissipation technology in circuit board design! It is already widely adopted in various mass-produced circuit boards.

The miniaturization of devices, the high-frequency characteristics of circuits, and the increase in the current being handled have led to concerns about heat generation from the devices and circuits mounted on the substrate. This document provides detailed information on substrate design techniques that can accommodate everything from small-scale prototypes to mass production. We explain various new technologies for heat dissipation measures in substrate design. We encourage you to read it. 【Contents】 ■ Trends in devices ■ High heat dissipation measures for specific devices ■ Improving heat dissipation with surface structures ■ Metal core and metal base substrates ■ Thick copper substrates *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Circuit board design and manufacturing
Printed Circuit Board
Substrate

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High-frequency compatible substrate

Hybrid structure of PTFE material and general-purpose materials achieves both performance and cost! Introduction of composite material substrates.

When focusing on cost and availability, FR4 becomes a material with significant losses at high frequencies, while PTFE, which has issues with cost, is highlighted when considering high-frequency characteristics. Additionally, the reality is that high-frequency material substrates are often difficult to obtain, and it is not easy to find manufacturers that can accommodate small-scale prototypes. The "composite material substrate" uses PTFE material for the layers that form high-frequency circuits. General circuits and power circuits are constructed with FR-4 or high Tg materials, providing multilayer substrates that are compatible with high frequencies while keeping total costs down. 【Composite Material Substrate Features】 ■ PTFE + General-purpose materials ■ PTFE material is used for the layers that form high-frequency circuits ■ General circuits and power circuits are constructed with FR-4 or high Tg materials ■ Multilayer substrates compatible with high frequencies that keep total costs down *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Substrate

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Heat management of mounted components on the substrate.

The thermal conductivity of copper inlay is 390 W/mK! It can efficiently dissipate heat to the heat sink.

With the increase in signal high frequency, there is a tendency for the heat generation from components to increase, and the heat generated from individual circuit components also rises due to the increase in electrical power of the circuit. If these components are used without sufficient heat dissipation, issues such as unstable operation, reduced output, and decreased reliability may occur. By embedding a copper inlay, which is a metal with good thermal conductivity, directly beneath the mounted components, it is possible to efficiently dissipate heat to the heat sink. Our company can accommodate everything from double-sided boards to multilayer boards, and we can use materials such as FR-4, high Tg materials, and high-frequency materials. Please contact us for details regarding configuration and materials. 【Features】 ■ Directly dissipates heat from mounted components to the heat sink ■ Thermal conductivity of copper inlay: 390W/mK ■ Compatible with double-sided boards to multilayer boards ■ Materials available include FR-4, high Tg materials, and high-frequency materials *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Substrate

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Hamamatsu Pulse Co., Ltd. Business Introduction

If you are considering outsourcing manufacturing for circuit board assembly, semi-finished products, and finished product assembly and packaging, primarily related to consumer goods machinery and industrial equipment, please contact us!

Our company is entrusted with the manufacturing of printed circuit board assembly, semi-finished module unit assembly, and finished product assembly and packaging, based on strong trust and a proven track record from major manufacturers, including small lot and diverse production. We have numerous orders for PCB assembly, not only for domestic production but also for the implementation of prototype boards intended for mass production overseas. If desired, we can also provide technical proposals regarding issues encountered during prototype assembly and the manufacturing process for mass production. We have established a comprehensive production system, so we strive to meet customer requests by offering high-value-added semi-finished module units that incorporate not only PCB assembly but also sheet metal parts and resin-molded components, along with proposals for Q.C.D. We actively accept orders for semi-finished module assembly and finished product assembly, even if PCB assembly is not involved, so please feel free to contact us. *Please consult us regarding prototype-only or limited-time cases. 【Business Content】 ■ Manufacturing, assembly, and packaging related to electronic musical instruments and industrial control devices ■ Development, manufacturing, and sales of LED film light-related products ■ Other related businesses *For more details, please download the PDF or feel free to contact us.

Company：浜松パルス都田工場
Price：Other

Circuit board design and manufacturing
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Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Adoption of precision total extraction mold! High accuracy in outer shape and hole pitch, improved finish on the burr surface and shear surface!

We handle "base plates" and "heat sinks." Thanks to our precision progressive dies, the accuracy of the outer shape and hole pitch has significantly improved, resulting in enhanced finish quality on both the edge and shear surfaces. With the adoption of progressive dies for coil materials, continuous processing is possible for thicknesses up to 5mm, contributing to lower costs and shorter delivery times. We also utilize UV printing. Additionally, we can accommodate micron-level flatness and specified warp processing, as well as resist baked printing. 【Features】 ■ High accuracy of outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil materials up to 5mm thickness with the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

Company：三昌製作所
Price：Other

Processing Contract
Substrate

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NFC Magnetic Field Driven Motor Control Circuit <Under Development>

We are developing a circuit that drives a motor using the magnetic field of a smartphone's NFC!

We have published a video of the experiment to unlock a thumb turn (key) on our company website.

Company：RFイノベーション
Price：Other

IC tag
Other security
Substrate

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Aluminum foil etching processing and circuit board

It is possible to reduce costs compared to copper foil etched circuit boards.

We will form circuits using composite materials such as aluminum foil and PET film through etching processing. Our unique aluminum foil etching method enables the formation of precise circuits for applications such as aluminum heater products, antennas, or sensors using aluminum foil.

Company：Heat Lab. Corporation
Price：Other

aluminum
Sensors
Aluminum heater
Substrate

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High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

Company：HNS
Price：Other

others
Printed Circuit Board
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Printed circuit board "Silicone-based substrate (Silicone)"

Utilizing the flexibility of the substrate, it can be implemented without a heat sink even on curved surfaces!

The "Silicone-based substrate" is a flexible printed circuit board that uses high thermal conductivity silicone sheets. Silicone resin is highly flexible and can be expected to prevent solder cracks during heat cycles. Additionally, by utilizing the flexibility of the substrate, it can be implemented without a heat sink on curved surfaces. 【Features】 ■ Flexible printed circuit board ■ Uses high thermal conductivity silicone sheets ■ Prevents solder cracks during heat cycles ■ Can be implemented without a heat sink on curved surfaces *For more details, please refer to the PDF document or feel free to contact us.

Company：HNS
Price：Other

others
Printed Circuit Board
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Introduction to Techno Staff Support Services

Support the development of young and mid-career technicians and skilled workers who will become the driving force behind Japan's manufacturing capabilities!

Techno Staff Co., Ltd. is a support company for human resource development and manufacturing that nurtures successors in mechanical, mold, and electrical technology and skills. We realize the aspirations of young people who want to acquire more advanced technology and skills, apply their improved abilities to their daily work, and contribute to Japan's manufacturing by participating in skill tests and skill Olympics. Our "professional instructors," who possess the technology and skills that supported Japan's rapid economic growth, will assist you in inheriting your "technology and abilities." [Support Services] ■ Processing, Assembly, Adjustment ■ Design, Drafting ■ Management, Operations *For more details, please refer to the PDF materials or feel free to contact us.

Company：テクノスタッフ高槻工場
Price：Other

others
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Introduction to Liquid Resist Screen Printing (Photo Developing Type Solder Resist)

A manufacturing method that corresponds to the evolution of printed circuit boards from rough designs to those with fine structures.

Abe Print Circuit Board Co., Ltd. is focusing on liquid resin screen printing technology as its main method to adapt to the evolution of printed circuit boards, which range from coarse structures to fine structures, in response to the advancement of electronic devices. In this method, resin is applied in a thin film using screen printing, and light is partially irradiated to change its solubility, allowing for the removal of unnecessary parts through development. The process concludes with drying and printing of characters, and it has been adopted in many factories. *For more details, please feel free to contact us.*

Company：阿部プリント基板
Price：Other

Printing/Publishing
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"Design, manufacturing, and sales of printed circuit boards" Business Introduction

If you are having trouble with printed circuit boards, please contact us! We can also accommodate prototypes.

Stay Electronics Co., Ltd. is engaged in the design, manufacturing, and sales of printed circuit boards. Our company has built up expertise based on the craftsmanship spirit: STAY-ISM, fueled by the thoughts, requests, and expectations we have received from many customers over the years. Our motto is "Creating products that respond to the developer's thoughts and commitments." At Stay Electronics, we are dedicated to answering the developer's question, "What should I do in this situation?" We aim to be the company you turn to in times of trouble. 【Business Description】 ■ Design, manufacturing, and sales of printed circuit boards 【Products Offered】 ■ Flexible printed circuit boards ■ Rigid printed circuit boards 【Main Inspection Equipment】 ■ AOI/AVI ■ Image dimension measuring instruments/projectors ■ Ultra-depth multi-angle lenses ■ Microscopes ■ Two-dimensional automatic length measuring devices ■ Others: Equipment for prototype support available Please contact us if you want to reduce tool costs such as molds. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi

Company：ステイ電子機器本社
Price：Other

Wiring materials
Substrate

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Image Analysis Using a Microscope / Flexible Substrate Mock Production

It is possible to create a simple mock-up of the base for those who want to analyze the internal structure of FPC products, troubleshoot issues, or pre-verify complex product shapes.

We would like to introduce the services provided by Stay Electronics Co., Ltd. The "Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter" is a service that creates simple mock-ups of flexible circuit boards using polyimide film for those who have never handled flexible circuit boards before or wish to pre-validate complex product shapes. Additionally, the "Image Analysis using a Super Depth Multi-Angle Lens Microscope" can be utilized for internal structure analysis and defect analysis of FPC products. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi [Service Operations] ■ Image Analysis using a Super Depth Multi-Angle Lens Microscope ■ Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter *For more details, please refer to the PDF document or feel free to contact us.

Company：ステイ電子機器本社
Price：Other

Microscope
Substrate

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[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

Examples of superconducting devices (for superconducting circuit evaluation) operating at ultra-low temperatures of -269℃. *Source: Yokohama National University

We would like to introduce a case study of the fabrication of a superconducting device flex that operates at an ultra-low temperature of -269°C. Using flex materials that operate in a superconducting environment, we produced flex for superconducting devices, including single flux quantum circuits (SFQ circuits) and adiabatic quantum flux parametron (AQFP), for the purpose of verifying the operation of superconducting circuits. Laser processing was applied due to the tolerances required for the device electrode parts. [Case Overview] ■ Materials Used - 2-layer materials (2 types) - 3-layer materials (2 types) *Materials were determined after verification experiments. ■ Laser processing was applied due to the tolerances required for the device electrode parts. *For more details, please refer to the PDF document or feel free to contact us.

Company：ステイ電子機器本社
Price：Other

Piezoelectric Devices
Substrate

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[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

Company：ステイ電子機器本社
Price：Other

Contract manufacturing
Substrate

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[Case] Flexibility case for substrate + wire products

Improved integrated flex! There are application examples for dental examination table devices and EEG measurement sensor devices.

We would like to introduce a case of flexing our substrate and wire products. We improved a product that was composed of a rigid substrate and wire into an integrated flex design. There are application examples for dental examination tables and EEG measurement sensor devices. 【Application Examples】 ■ Dental Examination Table ■ EEG Measurement Sensor Device *For more details, please refer to the PDF document or feel free to contact us.

Company：ステイ電子機器本社
Price：Other

Circuit board design and manufacturing
Other contract services
Substrate

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