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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. null/null
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. Understand in 3 minutes! Solder Resist Formation Technology [Materials Provided] プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm] 共栄電資
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

Substrate Product List

871～900 item / All 1922 items

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Ceramic substrate

Ceramic substrate

We provide ceramic substrates that combine excellent smoothness, bending strength, and insulation properties!

Our company mainly handles "ceramic substrates" used for HIC substrates, thin-film circuit substrates, heat dissipation substrates, and LED mounting substrates. "Ceramic substrates" have fewer pores due to the use of fine particles, exhibiting excellent smoothness, high bending strength, and insulation even in high-temperature environments. We can accommodate requests for through-hole and scribe line processing, as well as electrode pattern formation (metallization) through printing and plating. 【Product Lineup】 ■ Thick film printing substrates ■ Alumina metallized substrates ■ Long-length substrates for thick film printing ■ Thin film printing substrates ■ Polished substrates for thin film printing, etc. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Ceramics
  • Substrate

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Optical window/substrate

Optical window/substrate

Best fit proposal for grinding substrates

Glass substrates are used for various applications, from research and testing development to incorporation into mass-produced products. Daiko Seisakusho manufactures various substrates, primarily focusing on quartz glass substrates, in its own factory. By consistently handling everything from small-scale production for prototype development to mass production for products, we solve various challenges for our customers, such as cost reduction, performance improvement, and quality stability.

  • lens
  • Processing Contract
  • lens
  • Substrate

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Experimental synthetic quartz glass substrate Labo-USQ

Experimental synthetic quartz glass substrate Labo-USQ

5 pieces or more available!! Ideal for those looking for a small quantity or high-quality items.

The "Labo-USQ," a high-purity experimental synthetic quartz glass substrate from Daikyo Manufacturing, boasts high transmittance from ultraviolet to infrared light and can be used as various experimental substrates due to its high purity. As standard products, we offer sizes of 10mm, 20mm, and 25mm, and we can ship within as little as three days (depending on stock availability). *We also accommodate sizes, thicknesses, and shapes other than standard products, so please feel free to inquire.

  • Glass
  • Substrate

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Aluminum substrate suitable for small lot production.

Aluminum substrate suitable for small lot production.

A printed circuit board using a highly heat-dissipating aluminum base! We also accommodate small lot production.

"Aluminum substrate" is a printed circuit board that uses a high thermal conductivity aluminum base. The material accommodates board thicknesses from 0.6mm to 3.0mm, and it can support copper foil thicknesses from 35um to 105um. The maximum sizes are 600mm x 400mm and 1500mm x 250mm. Small lot production can reduce initial mold costs through router processing. Mass production can lower substrate costs with mold support. 【Features】 - Uses a high thermal conductivity aluminum base - Supports various types of data - Capable of panelization for mass production from individual piece data *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Manufacturing of substrates for LED lighting is also possible! 'Printed Circuit Board'

Manufacturing of substrates for LED lighting is also possible! 'Printed Circuit Board'

Printed circuit boards compatible with LED lighting manufacturing using CEM-3 and FR-4!

Our "printed circuit boards" can manufacture LED lighting boards using CEM-3 and FR-4 without the use of aluminum substrates, thanks to the high functionality of LEDs. We also accommodate specifications for Japanese materials (substrates, resist, silk). 【Features】 ■ No use of aluminum substrates ■ Capable of manufacturing LED lighting boards ■ Accommodates specifications for Japanese materials *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[Development Case] Customization of Open Source Hardware

[Development Case] Customization of Open Source Hardware

Add functions to a single circuit board in the right place for the right purpose! You can create a product that can be programmed freely!

By synthesizing circuits that worked well on a breadboard and connecting shield boards with sockets without using them in an unstable state, we can create a stable and practical specification on a single board. Our company has development examples where we created a composite board for Arduino MEGA and ESP32 (WROOM), various relays, and a prototype joystick control device, which were then housed in a case for use in the field. Using open-source hardware, we can design and manufacture boards that serve as cost-effective alternatives to control devices with just the right size and functionality. Please feel free to contact us when you need assistance. [Development Case Overview] ■ Composite board for Arduino MEGA, ESP32 (WROOM), and various relays ■ Prototype joystick control device converted to a board and housed for field use *For more details, please refer to the PDF materials or feel free to contact us.

  • Other embedded systems (software and hardware)
  • Substrate

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Parallel plane substrate

Parallel plane substrate

We can accommodate all types of optical processing lenses.

Special processing: drilling, grooving, cutting, special free-form shapes. Precision grinding of optical lenses, prisms, cylindrical lenses, flat substrates, laser bases, optical mirror lenses, optical filter lenses, and other precision processing of laser optical systems, sensor systems, and medical/measurement optical systems.

  • others
  • Microscope
  • Glass
  • Substrate

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Wedge substrate

Wedge substrate

We support all types of optical processing lenses.

Special processing: drilling, grooving, cutting, special free-form shapes. Precision grinding of optical lenses, prisms, cylindrical lenses, flat substrates, laser bases, optical mirror lenses, optical filter lenses, and other precision machining for laser optical systems, sensor systems, and medical/measurement optical systems.

  • others
  • Microscope
  • Glass
  • Substrate

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Lead-free compatible long lead component soldering device 'LMFS-400'

Lead-free compatible long lead component soldering device 'LMFS-400'

Cost reduction of dedicated nozzles! The cast solder pot prevents corrosion from lead-free solder.

The "LMFS-400" is a soldering device that can handle processes from partial dip to full dip using a 4-axis peel-back mechanism. By adopting a high-performance (low pressure, fine particle) spray nozzle, it achieves a coating efficiency of over 70% and good through-hole fill. After soldering, cooling fans are placed in two locations: the descending lifter section and the bottom return conveyor section. 【Features】 ■ Spray Fracture ■ Preheating ■ Soldering ■ Cooling ■ Monitor *For more details, please refer to the PDF document or feel free to contact us.

  • LMFS1.PNG
  • LMFS2.PNG
  • LMFS3.PNG
  • Soldering Equipment
  • Substrate

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New feature "IPH" added to Selective Flow (such as Tacrolimus).

New feature "IPH" added to Selective Flow (such as Tacrolimus).

Solve the long-awaited issue of insufficient through-hole ups! Effectively heat the necessary areas for soldering.

The "IPH (Induction Heating Preheat Function)" is based on proven heating nitrogen (N2) and point flow methods, and combined with induction heating (IH) preheating, it can efficiently heat and solder patterns and electrodes with large thermal capacities. With heated N2, through-hole ups that typically take time can be completed in a short period. It avoids insufficient heating, reduces solder temperature bath temperatures, and allows for transition to small-diameter nozzles. 【Features】 ■ Heats (generates heat) the patterns or electrode leads that need to be heated ■ IPH On/Off settings and On time can be configured for each step ■ Significantly reduces thermal stress on surrounding components *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • Substrate

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Recording and playing back soldering videos of defective substrates Soldering EYE

Recording and playing back soldering videos of defective substrates Soldering EYE

Data search with a barcode! Record and play back soldering videos of defective circuit boards.

We would like to introduce our product, "Soldering EYE." All soldering images are recorded and saved to a NAS. Production management data can be searched using barcodes, allowing for visual selection by clicking on the desired area. Please feel free to contact us when you need assistance. 【Features】 ■ Video recording of each step with a camera ■ Data searchable by barcode ■ Click on defective areas to play the video ■ Image data is saved to NAS *For more details, please download the PDF or feel free to contact us.

  • Other image-related equipment
  • Substrate

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Large size printed circuit board manufacturing / Work size up to 1M x 1.2M

Large size printed circuit board manufacturing / Work size up to 1M x 1.2M

Are you having trouble with large-sized PCB manufacturing for small roads?

Our company specializes in the manufacturing of large-sized printed circuit boards.

  • Printed Circuit Board
  • Substrate

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AC fan controller circuit board

AC fan controller circuit board

The fixed voltage is AC100V, AC200V! The variable range can also be set arbitrarily on the board using a VR for the AC fan controller board.

This product is an AC fan controller board that allows for easy stepless speed variation of AC fan motors. The rated voltage is AC100V and AC200V. The variable range can also be set arbitrarily using the VR on the board, enabling easy speed variation for the kumatori motor. Simply insert the terminal of the lead wire into the terminal block and connect the optional potentiometer to use it. 【Features】 ■ Easily vary the speed of kumatori motors ■ Rated voltage is AC100V and AC200V ■ Variable range can be set arbitrarily using the VR on the board ■ Easy connection of power input and output with terminal block installation *For more details, please refer to the PDF document or feel free to contact us.

  • controller
  • fan
  • others
  • Substrate

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VMIVME-1129

VMIVME-1129

128-bit High-Voltage Digital Input Board

VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U

  • Embedded Board Computers
  • Substrate

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Flexible circuit board

Flexible circuit board

Flexible circuit board

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

  • Other electronic parts
  • others
  • Processing Contract
  • Substrate

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Glass substrate

Glass substrate

Glass substrate

Glass substrate compatible with the liquid crystal driver evaluation test chip "Phase 6" □Product name ... JKIT Type G1 / JKIT Type G2 / JKIT Type G3 / JKIT Type G4 / JKIT Type G5

  • Other electronic parts
  • others
  • Processing Contract
  • Substrate

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Electronic circuit board

Electronic circuit board

Thin film and thick film circuit substrates. Formation of conductors, dielectrics, resistors, and phosphor circuits.

For non-printed circuit boards, please leave it to Toyo Seimitsu Kogyo. We will propose the optimal board according to your specified requirements.

  • Printed Circuit Board
  • Organic Natural Materials
  • Ceramics
  • Substrate

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Substrate, submount substrate

Substrate, submount substrate

Substrate, submount substrate

1) If you are having trouble with heat generation and dissipation on the substrate due to the integration of heating chips, please consult Toyo Seimitsu Kogyo. 2) We will support you from development design to mass production.

  • Other semiconductors
  • Printed Circuit Board
  • Ceramics
  • Substrate

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[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

This is an introduction to a case where side patterning technology for substrates has been established.

We will introduce examples of manufacturing substrates for implementing semiconductor devices such as optical modules for optical devices (DVD/CD recorders, optical communication), semiconductor laser diodes, and semiconductor photodiodes. With the trend towards miniaturization and thinness of devices, the demand for implementing multiple elements in a low area and high density is increasing. Therefore, we have established side patterning technology for substrates. It is possible to form circuits on one to four sides of high heat dissipation ceramic substrates such as alumina and aluminum nitride. 【Case Overview】 ■ Base Material: Alumina, Aluminum Nitride, etc. ■ Conductor Film Composition (Au-based wiring, Cu-based wiring *Pt barrier film compatible) ■ Resistance Film Composition (TaN, NiCr), Solder Flow Prevention Film (Cr, Solder Resist) ■ Implementation Support: Wire/Ribbon Bond, Bump, Various Soldering Specifications Available ■ Testing/Reliability: Compatible with MIL specifications and other customer-specified specifications *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Substrate

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【Circuit Board Manufacturing Example】Side Metallization Process

【Circuit Board Manufacturing Example】Side Metallization Process

Alumina and aluminum nitride, etc.! Circuit formation is possible on one to four surfaces of high thermal conductivity ceramic substrates.

This is an introduction to a manufacturing case that involves patterning processing on the sides of substrates to enable high-density implementation. It is possible to form circuits on one to four sides of high thermal conductivity ceramic substrates such as alumina and aluminum nitride. Please feel free to consult us when needed. 【Case Overview】 ■ Material: Alumina, Aluminum Nitride ■ Conductor Film: Ti/Pt/Au ■ Chip Size: 1.72mm × 1.1mm × 0.5mm *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Substrate

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Coin mech and bill validator control board for vending machines.

Coin mech and bill validator control board for vending machines.

You can create a vending machine on a PC.

The upper control allows for the selection of a fishing calculable mode and a full control mode. Full control RS mode EZ-RS mode with change calculation capability EZ-RS_1938 mode with change calculation capability in 5 yen increments

  • Other FA equipment
  • Other PCs and OA equipment
  • Substrate

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LAN-compatible coin mech I/O control board [SX-1209A]

LAN-compatible coin mech I/O control board [SX-1209A]

Billing control and I/O control using LAN is possible.

This is a convenient control board for implementing billing control over a LAN. It allows for easy creation of billing devices using I/O control and coin mechanisms. It has scalability, such as combining I/O control with billing using a LAN. It can also control a medal vending machine from a PC.

  • Other process controls
  • Substrate

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