We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. DAIKIN FINETECH, LTD. Nara//Resin/Plastic
  4. 4 null/null
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  2. Handbook for Circuit Board Noise Countermeasures グロース
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 FPC - "Technical Information" - Updated September 2025 太洋テクノレックス 本社　和歌山
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

Substrate Product List

61～75 item / All 1837 items

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Metal base CCL substrate for high-power LEDs

Metal base CCL substrate for high-power LEDs

Metal base CCL substrate for high-power LEDs

Standard indicator LEDs (bulb-type LEDs) have been primarily used with resin substrates (glass cloth epoxy substrates) due to their low heat generation. However, power LEDs used for lighting applications generate more heat, making metal-based substrates effective for improving LED performance and reliability against heat, as well as extending their lifespan due to their excellent thermal conductivity and cost performance. Well's MCCL substrate is based on a ferrous alloy with excellent heat dissipation, designed to keep the temperature rise of high-power LED elements within a certain range. By utilizing the ferrous alloy base material as a heat sink, it is possible to significantly disperse and dissipate heat generated from the LED, thereby reducing the heat generated by the LED itself and minimizing the decrease in LED lifespan. Additionally, by combining this with Well's heat sink coated with carbon nanotubes, we achieve further improvements in heat dissipation characteristics, leading to an extended lifespan for the LEDs.

  • Other electronic parts

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Technical Data: Circuit Board

Technical Data: Circuit Board

A patterning manufacturer that provides solutions tailored to customers by utilizing abundant resources.

This document introduces the circuit boards of Toyo Seimitsu Kogyo. We propose suitable processing by combining a wide range of resources such as sputtering, plating, etching, screen printing, sandblasting, and laser processing. By utilizing our extensive in-house processes, we achieve short delivery times and can accommodate various reliability tests. We provide a stable supply of high-quality, highly reliable products. 【Contents (partial)】 ■ Thin film circuit process image ■ Standard design rules ■ Inspection support ■ Reliability testing support ■ Thick film circuit process image *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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[Examples of Circuit Board Manufacturing] Metal Base Circuit Board

[Examples of Circuit Board Manufacturing] Metal Base Circuit Board

Meeting the needs for heat resistance! Can be applied as a heat dissipation substrate for power semiconductors and as a base substrate for LED mounting.

This is a manufacturing example of metal-based circuit boards that meet the increasing demands for heat dissipation and heat resistance in applications such as high-power LEDs, automotive, and power supply uses. Metal-based circuit boards can be applied as heat dissipation substrates for power semiconductors and as base substrates for LED mounting. Please feel free to consult us when needed. 【Case Overview】 ■ Base materials: Aluminum, copper, etc. ■ High heat dissipation insulating layer: Thermal conductivity 4.4 W/mk, insulation withstand voltage: 4 kV or more ■ Conductor layer: Ag, Ag/Ni/Au, etc. ■ High reflectivity insulating layer (for LEDs): Reflectivity over 90% *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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[Circuit Board Manufacturing Example] Thin Film Circuit Board

[Circuit Board Manufacturing Example] Thin Film Circuit Board

We can accommodate a wide range of processing variations! We can also handle processing on supplied materials or only specific processes.

This is a manufacturing example of thin film circuit substrates that combines vacuum film formation through sputtering and deposition with photolithography. We can accommodate a wide range of processing variations, including hole drilling and contour cutting using lasers and dicing, as well as thin film resistor formation, providing high-quality thin film circuit substrates with a high degree of design flexibility. We can also process supplied materials or handle only specific processes. 【Case Overview】 ■Materials: Alumina, Aluminum Nitride, Quartz Glass, etc. ■Thickness: 0.1 to 1.0 mm ■Conductor Films: Ti/Pd/Au, Ti/Pd/Cu/Ni/Au, Ti/Pt/Au, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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Polaris Chuck

Polaris Chuck

It is suitable for transporting wafers with warping or those that leak with a suction chuck.

It is suitable for transporting wafers with warping, as well as wafers that leak with suction chucks and thin wafers. The chuck body is made of high-purity alumina ceramics, and only the workpiece suction surface uses porous ceramics. With an average pore diameter of 20μm, it can distribute the suction pressure concentrated in the grooves, which are typically about 1.5mm deep in conventional suction surfaces, thereby minimizing deformation of thin workpieces during suction. Mesh particle sizes can be selected from grades #100, #220, and #400. A conductive Teflon coating treatment can also be applied to the workpiece suction surface.

  • Other semiconductor manufacturing equipment

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Suiko Co., Ltd. "Printed Circuit Board"

Suiko Co., Ltd. "Printed Circuit Board"

We can provide reliable products even from just one piece with a short delivery time!

At Suiko Co., Ltd., we have introduced plating equipment to accommodate a wide variety of products, small lots, and short delivery times, delivering reliable products through a consistent production line. We respond to various requests for printed circuit boards, from single-sided boards to double-sided boards and multilayer boards. With the know-how in printed circuit board manufacturing that we have cultivated over many years, we will solve your concerns, so please feel free to contact us. 【Features】 ■ Quick delivery ■ Consistent production line ■ Capable of handling various printed circuit boards *For more details, please refer to our catalog or feel free to contact us.

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