Heat conduction device "3D Vapor Chamber"
The heat diffusion direction is three-dimensional (volumetric)! Make the most of the space available for heat dissipation.
The "3D Vapor Chamber" is a thermal conduction device that allows steam to spread throughout a 3D-shaped housing, enabling heat diffusion not only in the X and Y directions but also in the Z direction. By utilizing a 3D vapor chamber in the NVIDIA H100 GPU, heat is diffused in three dimensions, transmitting heat across the entire fin and maximizing the use of space available for heat dissipation. This achieves a level of heat dissipation that was previously managed with water cooling, now accomplished with air cooling. Additionally, in the case of optical transmission devices, there are challenges such as insufficient space for heat dissipation near heat-generating elements and the small size of these elements. To address this, the 3D vapor chamber has been adopted to diffuse the heat from small elements across a flat plate and transport it via a pipe shape to a space where heat can be dissipated. 【Specifications】 ■ Maximum thermal transport capacity: 4,000W/mK ■ Thermal resistance value: 0.10℃/W ■ Heat diffusion direction: Three-dimensional ■ MOQ: Standard products from 500 units, custom products from 1,000 units *For more details, please download the PDF or feel free to contact us.
- Company：ザワード
- Price：Other
