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plate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

plate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. 富士フィルター工業 Tokyo//others 本社
  3. ナイス Hyogo//others
  4. 4 緑川化成工業 Tokyo//Resin/Plastic 本社
  5. 5 テクノロジーサービス Nagano//robot
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plate Product ranking

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. No piping work required! Hose-free base plate for easy maintenance.
  2. Fuji Plate 富士フィルター工業 本社
  3. Wear-resistant hardened meat filling plate "UP Plate" ナイス
  4. 4 Capiron plate 緑川化成工業 本社
  5. 5 Force plate テクノロジーサービス

plate Product List

511～525 item / All 559 items

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High-performance imaging Aurora microplate

High-performance imaging Aurora microplate

Improved cell observation with high light transmittance! Reduced shooting time with excellent flatness.

"Aurora Microplates" are high-performance imaging microplates made from cycloolefin polymer (COP). They are high-performance and high-precision products with excellent features such as transparency, heat resistance, low autofluorescence, flatness, and chemical resistance. Cells can be observed clearly with a very low background. Additionally, we also offer "original coated plates for cell culture," which can be used immediately after opening, eliminating the need for coating. Please feel free to contact us if you have any inquiries. 【Features of Aurora Microplates】 ■ High transparency ■ Low autofluorescence ■ High flatness (within the plate surface and well surface) *For more details, please download the PDF or feel free to contact us.

  • Other laboratory equipment and containers

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Beam Plate "SKB-13"

Beam Plate "SKB-13"

For semiconductor silicon wafers and the like! Compatible with heat adhesives (such as shellac resin).

"SKB-13" is a plate primarily composed of aluminum hydroxide and unsaturated polyester resin. It has excellent workability and a material composition that suppresses the heat generated during processing. It effectively reduces wire breakage and clogging of cutting tools such as wires, making it suitable for wire saws, inner blades, and outer blades. Additionally, it has been redesigned to address the common issue of warping in general resin plates after heating, resulting in a plate that is less prone to warping even after heating and cooling. 【Features】 ■ Excellent workability ■ Low water absorption ■ Less prone to warping even after heating and cooling ■ Compatible with hot adhesives ■ Reduces wire breakage and clogging of cutting tools *For more details, please download the PDF or feel free to contact us.

  • Other machine elements

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Molded Carbon Plate "SKC-17"

Molded Carbon Plate "SKC-17"

Use semiconductor silicon wafers for small paths! You can use them just like graphite materials.

"SKC-17" is a compression-molded plate made from carbon powder and thermosetting resin, designed to match the strength characteristics of Chinese-made graphite materials. It has a density of 1.63, a bending strength of 14 MPa, and a bending modulus of elasticity of 3.65 GPa, and is used for small-diameter semiconductor silicon wafers. This plate is intended for customers who manually remove wafers from the plate after processing. 【Key Characteristics】 ■ Main Component: Synthetic graphite powder as the main component + unsaturated polyester resin ■ Manufacturing Method: Compression molding ■ Bending Strength: 14 MPa ■ Bending Modulus of Elasticity: 3.65 GPa *For more details, please download the PDF or feel free to contact us.

  • Other machine elements

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Heating process High-temperature hot plate PA-8005

Heating process High-temperature hot plate PA-8005

Maximum temperature 800℃! We offer customization for hot plates, mounting brackets, and more.

The heating process high-temperature hot plate PA-8005 has a maximum temperature of 800℃ and is an industrial hot plate with AC100V specifications. The plate can be customized with ultra-heat-resistant alloy plates, hot plates, fixed brackets, and more. Precise temperature control is possible with the MSA digital temperature controller. OEM services are available. For more details, please contact us or refer to the catalog.

  • Other physicochemical equipment
  • Heating device

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Back-mounted hot plate "PA-6010BP type"

Back-mounted hot plate "PA-6010BP type"

For applications that require heating from above and below! Customizable from size to temperature.

The "PA-6010BP model" is a high-temperature hot plate that employs a reverse heating method capable of reaching a maximum temperature of 600℃. It is suitable for applications that require heating from both the top and the usual method of use. The plate is made of an aluminum alloy type that excels in heat distribution and features a special heat-insulating case structure that allows it to be used in a reversed position. 【Specifications】 ■ Temperature control range: Room temperature to 600℃ ■ Hot plate size: 100×100mm ■ Temperature accuracy: ±1.5% (aluminum alloy specification) *For more details, please download the catalog or contact us.

  • Heating device

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Semiconductor glass plate

Semiconductor glass plate

We are standardizing the commonly used glass panel sizes in the semiconductor field.

■There are two types of glass materials: soda glass (thickness 1.1t) and non-alkali glass (thickness 0.7t). ■Sizes available include round and square shapes in 2 inches, 3 inches, and 5 inches. ■Custom sizes are also accepted.

  • Glassware and containers

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