兼松ＰＷＳ List of Products and Services

The WSH5600 is a high-performance mixed-signal test platform proudly developed by Aemulus. To flexibly meet the testing requirements of today’s complex semiconductor devices, it adopts an innovative architecture centered around FPGA technology. It integrates digital, analog, RF, and power test resources in a high-density manner, enabling the testing of a wide variety of ICs with a single unit. This significantly reduces the introduction and operational costs of testers, optimizing your capital investment. Furthermore, the AI-powered Moridaru engine intelligently optimizes the testing process, contributing to reduced test times and improved yields. In the rapidly changing semiconductor market, the WSH5600 will be a reliable partner that dramatically enhances your development efficiency and productivity.

• Semiconductor inspection/test equipment

The AMB5600 is a high-performance mixed-signal test platform proudly developed by Aemulus. To flexibly meet the testing requirements of today's complex semiconductor devices, it adopts an innovative architecture centered around FPGA technology. It integrates digital, analog, RF, and power test resources in a high-density manner, enabling the testing of a wide variety of ICs with a single unit. This significantly reduces both the initial and operational costs of testers, optimizing your capital investment. Furthermore, the AI-powered Moridaru engine intelligently optimizes the testing process, contributing to reduced test times and improved yields. In the rapidly changing semiconductor market, the AMB5600 will be a reliable partner that dramatically enhances your development efficiency and productivity.

• Tester
• Testing Equipment and Devices

Amoeba AMB1831 is a multi-site open/short tester that achieves the industry's fastest test time (2.5ms between pins). It provides a highly cost-effective solution for testing open circuits and short circuits at device pins at package or wafer level. It supports up to 4096 channels, making it ideal for measuring multi-pin devices.

• Tester
• Testing Equipment and Devices

A mid-range model that balances performance and cost-effectiveness - Easy setup (automatic transport adjustment feature): The transport adjustment time for supply/recovery robots during variety setting or variety switching can be reduced from about 1 hour to approximately 10 minutes. - Easy changeover: The nozzle replacement time can be shortened by about 30 minutes. Due to the magnetic fixation, no tools are required, leading to a reduction in setup time. *1: Time for parameter setting work to reduce jams *2: Compared to conventional models from NS Technology Co.

• Tester
• Circuit Board Inspection Equipment

We can repair BROOKS/PRI wafer robots such as ATM105, 407, ABM405, and aligners like BROOKS/PRI PRE200, 300. We also handle repairs for GENMARK wafer robots and aligners, as well as other Japanese models like YASKAWA upon consultation. This includes repair work at our own factory and pre-shipment inspections.

• Transport and handling robots

Kanematsu PWS has been the domestic agent for ASMPT since 2020, primarily introducing ASMPT's die bonders and various back-end equipment to domestic customers. We also provide continuous engineering support after the equipment installation. Features of ASMPT: - A wide range of back-end equipment handling, from plating solutions to dicing, die bonding, wire bonding, molding, and SMT. - Global track record of installations. - Continuous investment of 10% of total sales into equipment research and development. - Provision of engineering support both domestically and internationally. - Particularly strong lineup in die bonding equipment, offering a wide range of equipment proposals.

• Bonding Equipment
• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment

The AD211Plus-II is a device capable of high-speed eutectic bonding of diced chips to substrates or lead frames. It has a strong track record of implementation for LEDs, including automotive lighting and outdoor lighting. Product Features: - Alignment accuracy: 7μm - Cycle time: 540ms - Mirage prevention function during heat-up - Distinctive work holder/heat-up stage - Control function with a void rate of 3% or less - Extensive domestic and international implementation track record - Applications: Automotive, photonics, LEDs, LiDAR

• LED Module
• Other optical parts
• Chip type LED

Markable wafer materials: Silicon (Si), Germanium (Ge), Sapphire (Al2O3), Lithium Tantalate (LiTaO3), Lithium Niobate (LiNbO3), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Carbide (SiC), Indium Phosphide (InP), glass, etc. To accommodate various wafer materials, we offer the following lasers: - UV (355nm), Green (532nm), IR (1064nm), IR, Carbon Dioxide (10.6μm). Options: - Motorized Beam Expander (MBE): Adjusts beam diameter, focal position, etc., according to recipe data. - Power Consumption Display Panel (DCM): Aggregates and displays line power supply, Galvo voltage/temperature, compressed air pressure, etc., in one location. - Additionally, we offer a variety of user-friendly options.

• Laser marker

"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.

• Other processing machines

The company's device is a customizable multi-chip die bonder that can be adjusted according to accuracy, bonding method, and cycle time. It can mount multiple types of chips on a single substrate, with a selectable accuracy range of ±2µm to ±25µm. By using options, it is possible to change the accuracy, bonding method, and cycle time. (Once the accuracy, bonding method, or cycle time has been changed, it cannot be modified again.)

• Chip type LED
• Laser Components
• diode

A mid-range model that balances performance and cost-effectiveness - Easy setup (automatic transport adjustment feature): The transport adjustment time for supply/recovery robots during variety setting or switching can be reduced from about 1 hour to approximately 10 minutes. - Easy changeover: The nozzle replacement time can be shortened by about 30 minutes. Thanks to magnetic fixation, no tools are required, resulting in reduced setup time. *1: Parameter setting work time to reduce jams *2: Compared to conventional models from NS Technology Co.

• Tester
• Circuit Board Inspection Equipment

The socket layout kit allows for immediate adjustments to socket pitch and the number of simultaneous measurements. It is a high-end model that balances flexibility and high-speed processing. - Easy Setup (automatic adjustment function for easy transport): The transport adjustment time for supply/recovery robots during variety settings or variety changes can be reduced from about 1 hour to approximately 10 minutes. - Easy Changeover: The nozzle replacement time can be shortened by about 30 minutes. Since it is fixed by magnets, no tools are required, resulting in reduced setup time. *1: Parameter setting work time to reduce jams *2: Compared to conventional models from NS Technology Co.

• Tester
• Circuit Board Inspection Equipment

The socket layout kit allows for immediate adjustments to socket pitch and the number of simultaneous measurements. It is a high-end model that balances flexibility and high-speed processing. - Easy Setup (automatic transport adjustment feature for easy handling): The transport adjustment time for supply/recovery robots during variety setting or switching can be reduced from about 1 hour to approximately 10 minutes. - Easy Changeover: The nozzle replacement time can be shortened by about 30 minutes. Due to the magnetic fixation, no tools are required, resulting in reduced setup time. *1: Time for parameter setting work to reduce jams *2: Compared to conventional models from NS Technology Co.

• Semiconductor inspection/test equipment
• Tester

NS Technologies offers a premium flagship model equipped with an X-Y pitch opening and closing hand for supply and retrieval, achieving a maximum UPH of 20,000 units. - Easy Setup (Automatic Transport Adjustment Function): The transport adjustment time for the supply/retrieval robot during product setting or product changeover can be reduced from approximately 1 hour to about 10 minutes. - Easy Changeover: The nozzle replacement time can be shortened by approximately 30 minutes. Due to the magnetic fixation, no tools are required, resulting in reduced setup time. *1: Parameter setting work time to reduce jams *2: Compared to conventional models from NS Technologies

• Semiconductor inspection/test equipment
• Circuit Board Inspection Equipment
• Testing Equipment and Devices

"INFINITE" is a device that can bond individual chips to substrates and lead frames with ultra-high speed and precision. It is capable of controlling not only the amount and width of epoxy resin dispensed but also the amount of overflow during bonding. It also features inspection functions before and after dispensing and bonding, making it suitable for various applications such as QFN, BGA, MEMS, and SiP. 【Features】 ■ High-speed bonding of thin chips and large dies ■ Compatible with various epoxy materials, including pressureless sintering materials and high-viscosity materials ■ Alignment accuracy of ±20μm @ 3σ ■ Capable of processing at a maximum speed of 0.19 seconds per chip ■ Die size compatibility: 0.2×0.2 to 9×9mm Substrate size compatibility: Length 100 to 300mm, Width 15 to 100mm *You can view the product documentation from the <PDF download>.

• Other electronic parts

The AD838L-G2 is a device capable of high-speed bonding of individual chips to a substrate. It also supports multi-die configurations and is equipped with comprehensive inspection features. 【Device Features】 - Alignment accuracy: ±10µm @ 3σ - High-speed bonding possible at approximately 0.25 seconds per chip - Functionality to easily pick up various thin chips - Dual dispense function (supports dots and writing according to various die sizes) - Comprehensive inspection features before and after bonding 【Main Specifications】 - Alignment accuracy: ±10µm @ 3σ - UPH: 14,000 (approximately 0.25 seconds per chip) * Variations may occur depending on bonding materials and die/substrate specifications - Die size compatibility: 0.15 × 0.15 mm – 2.03 × 2.03 mm - Substrate size: Length 60 – 300 mm, Width 60 – 100 mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

• Other electronic parts

The "NANO Pro" is a bonding device that uses ASMPT's patented alignment technology to bond diced chips to wafers, substrates, and chips with ultra-high precision of ±0.2μm. It employs laser bonding, achieving localized heating and a high-speed temperature profile during the bonding process. It also features mechanisms to suppress vibrations during bonding and from external sources. 【Main Specifications】 ■ Alignment Accuracy: ±0.2μm@3σ ■ Cycle Time: 18 seconds (varies by material) ■ Die Size: 0.1mm to 25mm ■ Substrate Size: MAX 300×300mm ■ Bonding Force (Load): 3g up to 2000g ■ Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding 【Adoption Results】 ■ Optical communication ■ Silicon photonics ■ R&D and mass production facilities ■ MEMS sensors, LiDAR, VCSELs, etc. *For more details, please feel free to contact us.

• Other electronic parts

We have started handling the new ASMPT sintering equipment. The company's equipment has a proven track record for worldwide installations and provides solutions for high-power devices. The features of this equipment allow for the bonding of chips with varying sizes and thicknesses simultaneously, thanks to its uniform temperature and special bond head. Additionally, ASMPT has experience in Cu oxidation prevention measures and collaborates with many material manufacturers. Furthermore, we can offer a consistent solution for the sintering process, not only with the sintering equipment but also with multi-laser dicing machines, tacking machines, curing machines, and more. Product Types: - Manual machines for R&D - Semi-automatic machines for mass production - Fully automatic machines for mass production Please feel free to contact us for more details about the equipment.

• Charger
• Other power sources

The company's equipment is a die bonder that achieves high precision and high throughput for mass production.

• Bonding Equipment

The AD830Plus is a device capable of ultra-fast bonding of diced chips to substrates or lead frames. It has a proven track record in various applications, including LED and sensor-related fields. 【Device Features】 - Alignment accuracy: ±25.4µm - Ultra-fast bonding - Equipped with functionality to easily pick up various thin chips - Capable of handling various materials (such as long substrates and reel supply) - Dual dispense/dual stamping functionality - Comprehensive inspection features (before and after bonding) 【Main Specifications】 - Alignment accuracy: ±25.4µm - UPH: 0.16 seconds (163 milliseconds) - Die size compatibility: 0.15mm × 0.15mm – 5.08mm × 5.08mm - Substrate size compatibility: Length 110mm – 300mm, Width 12mm – 102mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

• Bonding Equipment

The Bosch Rexroth planetary roller screw assembly features a wide contact area due to the rollers, allowing it to handle loads while being compact and achieving high thrust and rigidity.

• Power Transmission Equipment
• Actuator
• shaft

The ball screw assembly from Bosch Rexroth features smooth operation due to its optimal ball circulation method. Additionally, with accuracy levels from T3 to T9 and nuts equipped with preload adjustment functions, it achieves high-precision drive performance. *Currently, standard products can be delivered in relatively short lead times.

• Power Transmission Equipment
• Actuator
• shaft

Bosch Rexroth's roller rail system achieves high permissible loads and permissible moments through unique roller arrangement for load distribution and a lubrication bypass design that minimizes losses. This improves the durability and expected lifespan of the equipment and contributes to overall cost reduction through downsizing.

• Metal bearings
• Actuator
• shaft

The Bosch Rexroth ball guide rail system achieves high permissible loads and permissible moments through load distribution based on a unique ball arrangement. This improves the durability and expected lifespan of the equipment and contributes to cost reduction for the entire system through downsizing. *Currently, standard products can be delivered in a relatively short lead time.

• Metal bearings
• Actuator
• shaft

The DSM8/200 Gen2 is a dual-sided positioning measurement device compatible with 2 to 8-inch wafers. It is equipped with a function to eliminate TIS (tool-induced errors), achieving high-precision measurements in dual-sided patterning substrates in fields such as MEMS, power devices, and optical devices.

• Semiconductor inspection/test equipment
• Circuit Board Inspection Equipment
• Visual Inspection Equipment

The tabletop inkjet coating device 'LP50' manufactured by SUSS MicroTec is a multifunctional and high-precision product designed to allow flexible selection of print heads according to the intended purpose. (It is compatible with heads from Fujifilm, Konica Minolta, Xaar, and Canon.) It can be used for direct coating of epoxy resin, polyimide, acrylic resin, UV-curable resin, coating of resist and passivation films on wafers, and direct coating of pastes containing Ag or Cu nanoparticles. This device equipped with PiXDRO technology has the following features: 【Functions and Features】 - High-precision stage with heating function and image-based alignment system - Analysis function "Advanced Drop Analysis" for optimizing droplet conditions in a short time - Function "Automated Print Optimization" for automatically optimizing printing conditions - UV cure function and heating of ejected liquid - Excellent maintainability (automatic cleaning function and easy print head replacement) *The materials are in English. Please feel free to contact us for more details.

• Other semiconductor manufacturing equipment
• dispenser
• Circuit board processing machine

The "Manual Wire Bonder iBond5000 Series" is a successor to the "4500 Series," which boasts over 400 units delivered domestically. (The 5000 Series has over 9,000 units delivered worldwide.) Bonding can be easily performed with just a click of the mouse. Its compact size makes it suitable for research and development as well as small-scale production. You can choose from three models: "for Ball Bonding," "for Wedge Bonding," and "for Both Ball and Wedge Bonding." 【Features】 ■ Equipped with a user-friendly touch panel ■ Y-axis table motion settings can be configured with parameters, making bonding of pitch wires and parallel wires easy ■ Ergonomically designed ■ ESD coating is standard *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other processing machines
• Bonding Equipment

The IL2000 is a device that can accommodate wafers up to 200mm and is ideal for customers seeking high throughput. Inolas' wafer marking equipment uses advanced laser technology to print unique identification codes on wafers of all materials ranging from 2" to 450mm. It enables traceability throughout the entire manufacturing process. With various types of lasers and unique options, we meet the needs and applications of our customers.

• Wafer processing/polishing equipment

The ZS Microtech MJB4 is a manual mask aligner (exposure device) that can accommodate substrates up to 4 inches square. It features simple operability, high-precision alignment, and high exposure resolution. It can be used not only for research and development purposes but also for small-scale production.

• Stepper
• Ultraviolet irradiation equipment

The Zeiss Microtech MA/BA GEN4 is a semi-auto alignment exposure machine capable of handling substrates up to 8 inches square. It is equipped with optimal features for R&D and small-scale production applications in MEMS, optical components manufacturing, and compound semiconductors. The optimized alignment mark observation optical system and image processing capabilities enable precise alignment with minimal variation.

• Stepper
• Ultraviolet irradiation equipment

Achieved through a multi-laser structure: - Enables finer cutting - Reduces temperature during cutting - Minimizes impact on the substrate Applications: RFIC, discrete, thin wafer, LED, MEMS, memory, power devices 〇 Other ASM equipment handled: - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm to 25µm) 〇 ASMPT equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year

• Other semiconductor manufacturing equipment

- Non-contact measurement of wafer thickness such as silicon and indium phosphide - Measurement possible in harsh environments, such as real-time measurement during wet etching - High sensitivity measurement with a precisely controlled wavelength-variable light source - High reproducibility with a measurement accuracy of less than 0.1μm - Customizable for measurement targets, sizes, and shapes other than silicon

• Other measurement, recording and measuring instruments
• Coating thickness gauge
• Other optical parts

Features: - Automated transport system - Up to 30% improvement in UPH - Capable of bonding to balls as small as 22µm with 0.5mil wire - Dual magnification optical path, dual-color coaxial light Other ASM equipment available: - Multi-laser dicing equipment - 2D and 3D package appearance inspection equipment - Other die bonders (alignment accuracy from 0.2µm to 25µm) ASMPT equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year

• Bonding Equipment

"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ

• Bonding Equipment

CoS Alignment Accuracy: ±3µm@3σ Applications: Mainly laser applications The company's products utilize laser heating, allowing for rapid heating implementation compared to pulse heaters. Cycle Time: 5–15 sec/chip Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported. 〇 Other Die Bonder/Flip Chip Bonder Equipment Alignment Accuracy NANO ±0.3µm @ 3σ AFCplus ±1μm@3σ Nova + ±2.5μm@3σ 〇 Other ASMPT Equipment Available - Multi-laser dicing equipment - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm–25µm) 〇 ASMPT Equipment Installation Achievements (Total Domestic and International): 2000 units per year for die bonders, 4000 units per year for wire bonders.

• Bonding Equipment

"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.

• Bonding Equipment

iBond5000 is a bonding device designed based on the K&S 4500 series, which has a proven track record of leading the market for over 10 years and features an advanced graphic user interface.

• Bonding Equipment
• Other semiconductor manufacturing equipment

Benefits of Tape Edge Polisher - Minimal damage to the wafer - Removal of films (e.g., SiO2) on the wafer edge is possible - Chemical-free processing - Easy utility connection - Capable of shaping various edge geometries - Both rough grinding and fine polishing are possible - Top edge polishing is possible - Can polish difficult materials such as SiC and GaN - Compatible with notches and orifices

• Wafer processing/polishing equipment

MKE is headquartered in South Korea and boasts the second-largest shipment volume of bonding wires, solder balls, and adhesives in the world.

• Bonding Equipment
• Other consumables
• Other semiconductors

We handle the "Automatic Analysis System for Semiconductor Plating Solutions" manufactured by NOVA, which is used by major semiconductor and electronic component manufacturers. *In 2023, NOVA, a measurement equipment manufacturer for semiconductors in Israel, acquired Ancosys and integrated it into the CMD division (Chemical Measurement Division). We offer the following lineup of automatic analysis systems for plating solutions in each process. Post-process, Advanced Packaging - Nova ANCOLYZER The Nova ANCOLYZER is the industry-standard fully automated online chemical measurement platform for advanced packaging processes. The Nova ANCOLYZER provides excellent analytical performance and supports various analytical techniques for process control. This platform can be configured to meet specific process analysis and replenishment requirements, designed with the most flexible and scalable structure. The Nova ANCOLYZER offers outstanding accuracy and precision, as well as uncompromising reliability and high availability. Basic information follows.

• Other semiconductor manufacturing equipment
• Analytical Equipment and Devices

"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.

• Bonding Equipment

Kanematsu PWS Corporation is a company primarily engaged in the development, design, manufacturing, and sales of semiconductor manufacturing and inspection equipment. Our main products include equipment-related units and parts such as "wafer probe cards," "polishing films," and "Post CMP Blush." In addition, we provide technical services such as the design and manufacturing of various labor-saving devices, installation and maintenance of our own equipment, and imported semiconductor manufacturing and inspection equipment. Please feel free to contact us if you have any requests. 【Business Introduction】 ■ Development, design, manufacturing, and sales of semiconductor manufacturing/inspection equipment ■ Technical services ■ Sales, brokerage, maintenance services, setup, and modification of used semiconductor manufacturing equipment *For more details, please refer to our catalog or feel free to contact us.

• Wafer
• Contract manufacturing
• Other electronic parts