兼松ＰＷＳ Product Lineup

In the medical device industry, the quality and reliability of products are of utmost importance. Especially for medical devices that use precise electronic components, accurate testing of ICs is essential. Low testing accuracy can lead to malfunctions or performance degradation of the devices, potentially jeopardizing patient safety. NS Technologies' IC test handler, the NS-8080SH, is equipped with high throughput and temperature management features, contributing to the efficiency and quality improvement of IC testing in medical device manufacturing. 【Usage Scenarios】 - IC testing for medical electronic devices - Sorting of precision electronic components - Inspections in quality control departments 【Benefits of Implementation】 - Reduction in testing time - Early detection of defective products - Improvement in product reliability

• Tester
• Circuit Board Inspection Equipment

As automation utilizing industrial robots advances, IC test handlers are required to have high throughput and stable operation. In particular, to maximize production efficiency, it is important to reduce the time spent on product changeovers and maintenance. NS Technologies' IC test handler NS-8080SH addresses these challenges and contributes to increased productivity. 【Usage Scenarios】 - Factories engaged in mass production of ICs - Production lines with frequent product changeovers - Companies looking to promote labor-saving and automation 【Benefits of Implementation】 - Improved production efficiency through reduced product changeover time - Reduced nozzle replacement time - Increased production volume due to high throughput

• Tester
• Circuit Board Inspection Equipment

In the field of AI, improving the accuracy and speed of learning models is a critical challenge. Therefore, it is necessary to quickly evaluate the quality of AI chips to facilitate early detection of defects and improve yield. The IC test handler NS-8080SH contributes to shortening the test time for AI chips and accelerating the development cycle. 【Usage Scenarios】 - Mass production testing of AI chips - Chip selection for collecting training data - Prototype evaluation in AI development 【Benefits of Implementation】 - Shortened development period due to reduced test time - Cost reduction through early detection of defects - Stable supply of high-quality AI chips

• Tester
• Circuit Board Inspection Equipment

In the evaluation of IoT device connectivity, it is essential to test a large number of devices quickly and accurately. As the diversity and complexity of devices increase, it is important to achieve both a reduction in testing time and high reliability. The IC test handler NS-8080SH contributes to quality management and improved development efficiency for IoT devices. 【Usage Scenarios】 - Mass production testing of IoT devices - Connectivity evaluation testing - Quality management 【Benefits of Implementation】 - Reduction in testing time - Assurance of high reliability - Increased productivity

• Tester
• Circuit Board Inspection Equipment

In the home appliance industry, the miniaturization of products is progressing, and along with this, the integration density of IC chips is also increasing. As a result, high precision and efficiency are required in the testing process of IC chips. It is particularly important to test a large number of IC chips quickly and accurately within a limited space. The IC test handler NS-8080SH addresses the challenges of testing ICs for small home appliances and supports the development of high-quality products. 【Usage Scenarios】 - IC testing process for small home appliances - Testing of densely integrated IC chips - Improvement of production efficiency 【Benefits of Implementation】 - Reduction of testing time - Decrease in defective products - Enhanced product reliability

• Tester
• Circuit Board Inspection Equipment

In the automotive industry, the quality and reliability of electronic components are crucial factors that influence the overall safety and performance of vehicles. Particularly for electronic components used in harsh environments, durability against temperature changes and vibrations is required. The IC test handler NS-8080SH provides high reliability and an efficient testing process to meet these demands. 【Usage Scenarios】 - Quality inspection of automotive electronic components - Durability testing in high-temperature environments - Support for small-batch production of various types 【Benefits of Implementation】 - Reduced testing time due to high throughput - Provision of a stable testing environment - Improved quality through early detection of defects

• Tester
• Circuit Board Inspection Equipment

In the telecommunications industry, especially in the inspection of high-frequency devices, high throughput and reliability are required. As devices become smaller and more high-performance, accurate temperature management and a stable testing environment are essential. The IC test handler NS-8080SH addresses these challenges with high throughput, precise temperature management, and easy setup. 【Usage Scenarios】 - Mass production testing of high-frequency devices - Prototype evaluation in research and development - Sampling inspection in quality control departments 【Benefits of Implementation】 - Increased productivity due to reduced testing time - Improved reliability through a stable testing environment - Enhanced work efficiency due to easy setup

• Tester
• Circuit Board Inspection Equipment

In the semiconductor industry, there is always a demand for improved product quality and increased productivity. In particular, in the IC testing process, reducing test time and increasing efficiency are crucial. Delays in test time can lead to delays in product delivery and increased costs. NS Technologies' IC test handler, the NS-8080SH, achieves high-speed operation and contributes to solving challenges in semiconductor manufacturing. 【Usage Scenarios】 - Speeding up the IC testing process - Reducing changeover time for different product types - Reducing nozzle exchange time 【Benefits of Implementation】 - Increased throughput (14,500 units/hour) - Reduced setup time - Improved productivity

• Tester
• Circuit Board Inspection Equipment

NS Technologies NS8080MT is a tri-temp handler that supports device measurements at low, high, and room temperatures. It employs a cooling system that does not require liquid nitrogen, achieving low running costs and stable operation.

• Tester
• Other semiconductor manufacturing equipment

The WSH5600 is a high-performance mixed-signal test platform proudly developed by Aemulus. To flexibly meet the testing requirements of today’s complex semiconductor devices, it adopts an innovative architecture centered around FPGA technology. It integrates digital, analog, RF, and power test resources in a high-density manner, enabling the testing of a wide variety of ICs with a single unit. This significantly reduces the introduction and operational costs of testers, optimizing your capital investment. Furthermore, the AI-powered Moridaru engine intelligently optimizes the testing process, contributing to reduced test times and improved yields. In the rapidly changing semiconductor market, the WSH5600 will be a reliable partner that dramatically enhances your development efficiency and productivity.

• Semiconductor inspection/test equipment

The AMB5600 is a high-performance mixed-signal test platform proudly developed by Aemulus. To flexibly meet the testing requirements of today's complex semiconductor devices, it adopts an innovative architecture centered around FPGA technology. It integrates digital, analog, RF, and power test resources in a high-density manner, enabling the testing of a wide variety of ICs with a single unit. This significantly reduces both the initial and operational costs of testers, optimizing your capital investment. Furthermore, the AI-powered Moridaru engine intelligently optimizes the testing process, contributing to reduced test times and improved yields. In the rapidly changing semiconductor market, the AMB5600 will be a reliable partner that dramatically enhances your development efficiency and productivity.

• Tester
• Testing Equipment and Devices

Amoeba AMB1831 is a multi-site open/short tester that achieves the industry's fastest test time (2.5ms between pins). It provides a highly cost-effective solution for testing open circuits and short circuits at device pins at package or wafer level. It supports up to 4096 channels, making it ideal for measuring multi-pin devices.

• Tester
• Testing Equipment and Devices

A mid-range model that balances performance and cost-effectiveness - Easy setup (automatic transport adjustment feature): The transport adjustment time for supply/recovery robots during variety setting or variety switching can be reduced from about 1 hour to approximately 10 minutes. - Easy changeover: The nozzle replacement time can be shortened by about 30 minutes. Due to the magnetic fixation, no tools are required, leading to a reduction in setup time. *1: Time for parameter setting work to reduce jams *2: Compared to conventional models from NS Technology Co.

• Tester
• Circuit Board Inspection Equipment

We can repair BROOKS/PRI wafer robots such as ATM105, 407, ABM405, and aligners like BROOKS/PRI PRE200, 300. We also handle repairs for GENMARK wafer robots and aligners, as well as other Japanese models like YASKAWA upon consultation. This includes repair work at our own factory and pre-shipment inspections.

• Transport and handling robots

Kanematsu PWS has been the domestic agent for ASMPT since 2020, primarily introducing ASMPT's die bonders and various back-end equipment to domestic customers. We also provide continuous engineering support after the equipment installation. Features of ASMPT: - A wide range of back-end equipment handling, from plating solutions to dicing, die bonding, wire bonding, molding, and SMT. - Global track record of installations. - Continuous investment of 10% of total sales into equipment research and development. - Provision of engineering support both domestically and internationally. - Particularly strong lineup in die bonding equipment, offering a wide range of equipment proposals.

• Bonding Equipment
• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment

The AD211Plus-II is a device capable of high-speed eutectic bonding of diced chips to substrates or lead frames. It has a strong track record of implementation for LEDs, including automotive lighting and outdoor lighting. Product Features: - Alignment accuracy: 7μm - Cycle time: 540ms - Mirage prevention function during heat-up - Distinctive work holder/heat-up stage - Control function with a void rate of 3% or less - Extensive domestic and international implementation track record - Applications: Automotive, photonics, LEDs, LiDAR

• LED Module
• Other optical parts
• Chip type LED

Markable wafer materials: Silicon (Si), Germanium (Ge), Sapphire (Al2O3), Lithium Tantalate (LiTaO3), Lithium Niobate (LiNbO3), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Carbide (SiC), Indium Phosphide (InP), glass, etc. To accommodate various wafer materials, we offer the following lasers: - UV (355nm), Green (532nm), IR (1064nm), IR, Carbon Dioxide (10.6μm). Options: - Motorized Beam Expander (MBE): Adjusts beam diameter, focal position, etc., according to recipe data. - Power Consumption Display Panel (DCM): Aggregates and displays line power supply, Galvo voltage/temperature, compressed air pressure, etc., in one location. - Additionally, we offer a variety of user-friendly options.

• Laser marker

"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.

• Other processing machines

The company's device is a customizable multi-chip die bonder that can be adjusted according to accuracy, bonding method, and cycle time. It can mount multiple types of chips on a single substrate, with a selectable accuracy range of ±2µm to ±25µm. By using options, it is possible to change the accuracy, bonding method, and cycle time. (Once the accuracy, bonding method, or cycle time has been changed, it cannot be modified again.)

• Chip type LED
• Laser Components
• diode

A mid-range model that balances performance and cost-effectiveness - Easy setup (automatic transport adjustment feature): The transport adjustment time for supply/recovery robots during variety setting or switching can be reduced from about 1 hour to approximately 10 minutes. - Easy changeover: The nozzle replacement time can be shortened by about 30 minutes. Thanks to magnetic fixation, no tools are required, resulting in reduced setup time. *1: Parameter setting work time to reduce jams *2: Compared to conventional models from NS Technology Co.

• Tester
• Circuit Board Inspection Equipment

The socket layout kit allows for immediate adjustments to socket pitch and the number of simultaneous measurements. It is a high-end model that balances flexibility and high-speed processing. - Easy Setup (automatic adjustment function for easy transport): The transport adjustment time for supply/recovery robots during variety settings or variety changes can be reduced from about 1 hour to approximately 10 minutes. - Easy Changeover: The nozzle replacement time can be shortened by about 30 minutes. Since it is fixed by magnets, no tools are required, resulting in reduced setup time. *1: Parameter setting work time to reduce jams *2: Compared to conventional models from NS Technology Co.

• Tester
• Circuit Board Inspection Equipment

The socket layout kit allows for immediate adjustments to socket pitch and the number of simultaneous measurements. It is a high-end model that balances flexibility and high-speed processing. - Easy Setup (automatic transport adjustment feature for easy handling): The transport adjustment time for supply/recovery robots during variety setting or switching can be reduced from about 1 hour to approximately 10 minutes. - Easy Changeover: The nozzle replacement time can be shortened by about 30 minutes. Due to the magnetic fixation, no tools are required, resulting in reduced setup time. *1: Time for parameter setting work to reduce jams *2: Compared to conventional models from NS Technology Co.

• Semiconductor inspection/test equipment
• Tester

NS Technologies offers a premium flagship model equipped with an X-Y pitch opening and closing hand for supply and retrieval, achieving a maximum UPH of 20,000 units. - Easy Setup (Automatic Transport Adjustment Function): The transport adjustment time for the supply/retrieval robot during product setting or product changeover can be reduced from approximately 1 hour to about 10 minutes. - Easy Changeover: The nozzle replacement time can be shortened by approximately 30 minutes. Due to the magnetic fixation, no tools are required, resulting in reduced setup time. *1: Parameter setting work time to reduce jams *2: Compared to conventional models from NS Technologies

• Semiconductor inspection/test equipment
• Circuit Board Inspection Equipment
• Testing Equipment and Devices

"INFINITE" is a device that can bond individual chips to substrates and lead frames with ultra-high speed and precision. It is capable of controlling not only the amount and width of epoxy resin dispensed but also the amount of overflow during bonding. It also features inspection functions before and after dispensing and bonding, making it suitable for various applications such as QFN, BGA, MEMS, and SiP. 【Features】 ■ High-speed bonding of thin chips and large dies ■ Compatible with various epoxy materials, including pressureless sintering materials and high-viscosity materials ■ Alignment accuracy of ±20μm @ 3σ ■ Capable of processing at a maximum speed of 0.19 seconds per chip ■ Die size compatibility: 0.2×0.2 to 9×9mm Substrate size compatibility: Length 100 to 300mm, Width 15 to 100mm *You can view the product documentation from the <PDF download>.

• Other electronic parts

The AD838L-G2 is a device capable of high-speed bonding of individual chips to a substrate. It also supports multi-die configurations and is equipped with comprehensive inspection features. 【Device Features】 - Alignment accuracy: ±10µm @ 3σ - High-speed bonding possible at approximately 0.25 seconds per chip - Functionality to easily pick up various thin chips - Dual dispense function (supports dots and writing according to various die sizes) - Comprehensive inspection features before and after bonding 【Main Specifications】 - Alignment accuracy: ±10µm @ 3σ - UPH: 14,000 (approximately 0.25 seconds per chip) * Variations may occur depending on bonding materials and die/substrate specifications - Die size compatibility: 0.15 × 0.15 mm – 2.03 × 2.03 mm - Substrate size: Length 60 – 300 mm, Width 60 – 100 mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

• Other electronic parts

The "NANO Pro" is a bonding device that uses ASMPT's patented alignment technology to bond diced chips to wafers, substrates, and chips with ultra-high precision of ±0.2μm. It employs laser bonding, achieving localized heating and a high-speed temperature profile during the bonding process. It also features mechanisms to suppress vibrations during bonding and from external sources. 【Main Specifications】 ■ Alignment Accuracy: ±0.2μm@3σ ■ Cycle Time: 18 seconds (varies by material) ■ Die Size: 0.1mm to 25mm ■ Substrate Size: MAX 300×300mm ■ Bonding Force (Load): 3g up to 2000g ■ Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding 【Adoption Results】 ■ Optical communication ■ Silicon photonics ■ R&D and mass production facilities ■ MEMS sensors, LiDAR, VCSELs, etc. *For more details, please feel free to contact us.

• Other electronic parts

We have started handling the new ASMPT sintering equipment. The company's equipment has a proven track record for worldwide installations and provides solutions for high-power devices. The features of this equipment allow for the bonding of chips with varying sizes and thicknesses simultaneously, thanks to its uniform temperature and special bond head. Additionally, ASMPT has experience in Cu oxidation prevention measures and collaborates with many material manufacturers. Furthermore, we can offer a consistent solution for the sintering process, not only with the sintering equipment but also with multi-laser dicing machines, tacking machines, curing machines, and more. Product Types: - Manual machines for R&D - Semi-automatic machines for mass production - Fully automatic machines for mass production Please feel free to contact us for more details about the equipment.

• Charger
• Other power sources

The company's equipment is a die bonder that achieves high precision and high throughput for mass production.

• Bonding Equipment

The AD830Plus is a device capable of ultra-fast bonding of diced chips to substrates or lead frames. It has a proven track record in various applications, including LED and sensor-related fields. 【Device Features】 - Alignment accuracy: ±25.4µm - Ultra-fast bonding - Equipped with functionality to easily pick up various thin chips - Capable of handling various materials (such as long substrates and reel supply) - Dual dispense/dual stamping functionality - Comprehensive inspection features (before and after bonding) 【Main Specifications】 - Alignment accuracy: ±25.4µm - UPH: 0.16 seconds (163 milliseconds) - Die size compatibility: 0.15mm × 0.15mm – 5.08mm × 5.08mm - Substrate size compatibility: Length 110mm – 300mm, Width 12mm – 102mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

• Bonding Equipment

The DSM8/200 Gen2 is a dual-sided positioning measurement device compatible with 2 to 8-inch wafers. It is equipped with a function to eliminate TIS (tool-induced errors), achieving high-precision measurements in dual-sided patterning substrates in fields such as MEMS, power devices, and optical devices.

• Semiconductor inspection/test equipment
• Circuit Board Inspection Equipment
• Visual Inspection Equipment

The tabletop inkjet coating device 'LP50' manufactured by SUSS MicroTec is a multifunctional and high-precision product designed to allow flexible selection of print heads according to the intended purpose. (It is compatible with heads from Fujifilm, Konica Minolta, Xaar, and Canon.) It can be used for direct coating of epoxy resin, polyimide, acrylic resin, UV-curable resin, coating of resist and passivation films on wafers, and direct coating of pastes containing Ag or Cu nanoparticles. This device equipped with PiXDRO technology has the following features: 【Functions and Features】 - High-precision stage with heating function and image-based alignment system - Analysis function "Advanced Drop Analysis" for optimizing droplet conditions in a short time - Function "Automated Print Optimization" for automatically optimizing printing conditions - UV cure function and heating of ejected liquid - Excellent maintainability (automatic cleaning function and easy print head replacement) *The materials are in English. Please feel free to contact us for more details.

• Other semiconductor manufacturing equipment
• dispenser
• Circuit board processing machine

The "Manual Wire Bonder iBond5000 Series" is a successor to the "4500 Series," which boasts over 400 units delivered domestically. (The 5000 Series has over 9,000 units delivered worldwide.) Bonding can be easily performed with just a click of the mouse. Its compact size makes it suitable for research and development as well as small-scale production. You can choose from three models: "for Ball Bonding," "for Wedge Bonding," and "for Both Ball and Wedge Bonding." 【Features】 ■ Equipped with a user-friendly touch panel ■ Y-axis table motion settings can be configured with parameters, making bonding of pitch wires and parallel wires easy ■ Ergonomically designed ■ ESD coating is standard *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other processing machines
• Bonding Equipment

The IL2000 is a device that can accommodate wafers up to 200mm and is ideal for customers seeking high throughput. Inolas' wafer marking equipment uses advanced laser technology to print unique identification codes on wafers of all materials ranging from 2" to 450mm. It enables traceability throughout the entire manufacturing process. With various types of lasers and unique options, we meet the needs and applications of our customers.

• Wafer processing/polishing equipment

The ZS Microtech MJB4 is a manual mask aligner (exposure device) that can accommodate substrates up to 4 inches square. It features simple operability, high-precision alignment, and high exposure resolution. It can be used not only for research and development purposes but also for small-scale production.

• Stepper
• Ultraviolet irradiation equipment

The Zeiss Microtech MA/BA GEN4 is a semi-auto alignment exposure machine capable of handling substrates up to 8 inches square. It is equipped with optimal features for R&D and small-scale production applications in MEMS, optical components manufacturing, and compound semiconductors. The optimized alignment mark observation optical system and image processing capabilities enable precise alignment with minimal variation.

• Stepper
• Ultraviolet irradiation equipment

Achieved through a multi-laser structure: - Enables finer cutting - Reduces temperature during cutting - Minimizes impact on the substrate Applications: RFIC, discrete, thin wafer, LED, MEMS, memory, power devices 〇 Other ASM equipment handled: - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm to 25µm) 〇 ASMPT equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year

• Other semiconductor manufacturing equipment

- Non-contact measurement of wafer thickness such as silicon and indium phosphide - Measurement possible in harsh environments, such as real-time measurement during wet etching - High sensitivity measurement with a precisely controlled wavelength-variable light source - High reproducibility with a measurement accuracy of less than 0.1μm - Customizable for measurement targets, sizes, and shapes other than silicon

• Other measurement, recording and measuring instruments
• Coating thickness gauge
• Other optical parts

Features: - Automated transport system - Up to 30% improvement in UPH - Capable of bonding to balls as small as 22µm with 0.5mil wire - Dual magnification optical path, dual-color coaxial light Other ASM equipment available: - Multi-laser dicing equipment - 2D and 3D package appearance inspection equipment - Other die bonders (alignment accuracy from 0.2µm to 25µm) ASMPT equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year

• Bonding Equipment

"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ

• Bonding Equipment

CoS Alignment Accuracy: ±3µm@3σ Applications: Mainly laser applications The company's products utilize laser heating, allowing for rapid heating implementation compared to pulse heaters. Cycle Time: 5–15 sec/chip Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported. 〇 Other Die Bonder/Flip Chip Bonder Equipment Alignment Accuracy NANO ±0.3µm @ 3σ AFCplus ±1μm@3σ Nova + ±2.5μm@3σ 〇 Other ASMPT Equipment Available - Multi-laser dicing equipment - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm–25µm) 〇 ASMPT Equipment Installation Achievements (Total Domestic and International): 2000 units per year for die bonders, 4000 units per year for wire bonders.

• Bonding Equipment

"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.

• Bonding Equipment

iBond5000 is a bonding device designed based on the K&S 4500 series, which has a proven track record of leading the market for over 10 years and features an advanced graphic user interface.

• Bonding Equipment
• Other semiconductor manufacturing equipment

Benefits of Tape Edge Polisher - Minimal damage to the wafer - Removal of films (e.g., SiO2) on the wafer edge is possible - Chemical-free processing - Easy utility connection - Capable of shaping various edge geometries - Both rough grinding and fine polishing are possible - Top edge polishing is possible - Can polish difficult materials such as SiC and GaN - Compatible with notches and orifices

• Wafer processing/polishing equipment

MKE is headquartered in South Korea and boasts the second-largest shipment volume of bonding wires, solder balls, and adhesives in the world.

• Bonding Equipment
• Other consumables
• Other semiconductors