List of Sputtering Equipment products
- classification：Sputtering Equipment
61～90 item / All 217 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Information on major suppliers! Sputtering target market and supply chain.
- Sputtering Equipment
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
- Sputtering Equipment
- Evaporation Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
![[Hot Stage] Ultra High Temperature ...](https://image.mono.ipros.com/public/product/image/671/2000002653/IPROS21404174246949592221.png?w=280&h=280){kind=small}
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Suitable for the film formation of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics)!
- Sputtering Equipment
High-end sputtering process for optical films used in aerospace engineering and medical/bio applications is possible!
- Sputtering Equipment
Ion beam sputtering equipment for research and development as well as small-scale production!
- Sputtering Equipment
DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!
- Sputtering Equipment
We apply hard DLC (diamond-like carbon) through sputtering, suitable for medical supplies and automotive parts! *Demo tests are currently being conducted.
- Sputtering Equipment
DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.
- Sputtering Equipment
It is a device that can be transitioned from a pilot line to a mass production line.
- Sputtering Equipment
There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.
- Sputtering Equipment
Reduce damage to the substrate by over 60%! Improve film formation speed while maintaining low damage characteristics.
- Sputtering Equipment
Announcement of Exhibition at Kansai Metal Japan by Keihin Ramtech
We sincerely thank you for your continued patronage. We are pleased to announce that, following last October, our company will be exhibiting at Kansai Metal Japan held in Osaka. We will showcase the upgraded technologies and lineup of Ramtech, which have been enhanced to withstand the challenges posed by the new coronavirus. We kindly ask for your consideration in visiting us. We look forward to seeing you there.
Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!
- Sputtering Equipment
Leave the manufacturing of semiconductor sputtering targets to us.
- Sputtering Equipment
![[Example of Use] Sputtering Target ...](https://image.mono.ipros.com/public/product/image/f42/2000180520/IPROS14162266355367390576.jpeg?w=280&h=280){kind=small}
You are using SiC/Si composite materials as the target material.
- Sputtering Equipment
- Other metal materials
- Fine Ceramics
Remote source ion beam sputtering device manufacturer for remote plasma sources.
- Sputtering Equipment
Information on commissioned test film formation services (test film formation of high-quality reaction films, etc.)
Research on Co-sputtering of different materials, such as ferromagnetic targets and metal and ceramic targets, which are considered difficult to film using conventional sputtering devices. We strongly support advanced material research and process development, including the deposition of AlScN, which is attracting attention for next-generation MEMS applications. This is a groundbreaking technology that uses a helicon ion source as a plasma source, accelerating high-density ions obtained from it by applying a bias voltage to the target. Since it is an ion beam-type deposition method using a remote plasma system, stable film formation can be achieved even with ferromagnetic and dielectric targets, which are challenging for magnetron sputtering devices. By individually controlling the ion source and target application, it is possible to accommodate a wide range of deposition conditions while also achieving high deposition rates. Independent gas supply near the target and substrate allows for the deposition of various multilayer thin films, including oxide and nitride films. Since the substrate surface is not exposed to plasma, it is possible to maintain a low temperature during film formation.
High-throughput roll-to-roll sputtering equipment for the manufacture of FCCL (Flexible Copper Clad Laminate).
- Sputtering Equipment
FHR Star.100-Tetra Co is a very compact sputtering device designed for MEMS and high-performance optical products.
- Sputtering Equipment
Production ion beam milling equipment that achieves high rate and high reliability.
- Sputtering Equipment
The "FHR.Star.600-EOSS" is a high-performance magnetron sputtering device developed for precise optical filter film deposition.
- Sputtering Equipment
Highly acclaimed high-precision optical filter deposition magnetron sputtering device
This is a device specialized in optical thin films, such as high-performance optical filters that require multilayering and high reproducibility, particularly for applications like LiDAR, which are expected to see significant demand in the future. It demonstrates strong capabilities for high-quality and stable production. - Film formation that eliminates the influence of film quality changes due to target consumption using a cylindrical cathode. - Stable film formation of oxide films achieved by incorporating a reactive ion source. - Film formation of a wide range of multilayer films enabled by the installation of up to four cathodes.
High-spec compact coater compatible with various metals such as Ni, Cr, W, Ti, and Al!
- Sputtering Equipment
This is an ion coater ideal for full coating of large samples. Models are available for sizes ranging from 4 to 8 inches.
- Sputtering Equipment
Customizable to fit experimental purposes. Small RF sputtering device.
- Sputtering Equipment
Fully automatic ion coater suitable for sample preparation for SEM.
- Sputtering Equipment
Full automatic sputter coater with magnetron cathode to reduce ion damage.
- Sputtering Equipment
Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.