List of Sputtering Equipment products
- classification：Sputtering Equipment
46～90 item / All 217 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
![[Device Production Example] Film Fo...](https://image.mono.ipros.com/public/product/image/2063560/IPROS14926181795092471963.jpg?w=280&h=280){kind=small}
From design to after-service of the equipment! We can offer various equipment proposals.
- Sputtering Equipment
![[Device Production Example] Design ...](https://image.mono.ipros.com/public/product/image/2063560/IPROS6387341858822702427.jpg?w=280&h=280){kind=small}
Support for the entire lifecycle from device design to after-sales service!
- Sputtering Equipment
- Plasma surface treatment equipment
Under the management philosophy of 'pursuing customer satisfaction and technical expertise to the utmost and contributing to society,' we develop our business.
- Vacuum Equipment
- Evaporation Equipment
- Sputtering Equipment
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
- Other semiconductor manufacturing equipment
- Sputtering Equipment
Multi-Target Sputtering Device [MiniLab-125] Compatible with Φ8" SiC Coating Equipped with 1000℃ Heater Stage! Compact Size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Simultaneous deposition of three components + one component Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to three cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed on the touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber type can also be manufactured. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
From site surveys to design and construction, experienced engineers will handle it!
- Other electronic parts
- Sputtering Equipment
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
- Sputtering Equipment
- Etching Equipment
- CVD Equipment
Providing mass production solutions for high-speed and flexible substrate film deposition applications!
- Sputtering Equipment
- Etching Equipment
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environm...
- CVD Equipment
- Sputtering Equipment
- Resist Device
Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.
- Sputtering Equipment
- Etching Equipment
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
- Sputtering Equipment
- Etching Equipment
Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.
- Sputtering Equipment
- Etching Equipment
Evatec officially enters the next-generation packaging market in Japan with CLUSTERLINE 600 - Expanding business development towards the era of Panel-Level Packaging for AI and HPC.
Evatec AG (headquartered in Switzerland) is intensifying the deployment of its large panel-compatible coating platform "CLUSTERLINE 600" in the Japanese market and will fully enter the rapidly growing next-generation packaging market for AI (artificial intelligence) and high-performance computing (HPC). In the global semiconductor ecosystem, the transition to new manufacturing architectures such as large interposers, ultra-high-density RDL (Redistribution Layer), glass core substrates, and panel-level packaging is accelerating. In particular, with the increasing size of AI packages, the shift from traditional 300mm wafer-based manufacturing to 600mm class panel processes is gaining attention as a next-generation manufacturing technology. Evatec positions this change as one of the most important growth opportunities in the semiconductor industry over the next decade. By making the CLUSTERLINE 600 its core product, the company aims to expand its advanced packaging business in the Japanese market and support customers' technology development and mass production in areas such as panel-level packaging, advanced IC substrates, and glass core substrates.
We have achievements such as 'sputtering equipment with GB for organic EL' and 'IBS equipment for research and development'!
- Sputtering Equipment
Achieving a substrate temperature of 900℃! Equipped with a 3-axis mechanism on the substrate stage to realize a uniform film thickness distribution.
- Sputtering Equipment
For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!
- Sputtering Equipment
For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!
- Sputtering Equipment
Space-saving and large capacity! Custom-made options are also available to meet various requests!
- Sputtering Equipment
We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
- Sputtering Equipment
Achieve high coverage in three-dimensional object film formation! Equipped with up to three sputter cathodes, it enables the layered deposition of metal films, oxide films, and more!
- Sputtering Equipment
Consultations are welcome! We handle everything in-house from design to manufacturing and assembly! If you are having trouble with various equipment manufacturing, please feel free to consult with us....
- Sputtering Equipment
For engineers in the wear-resistant coating industry! Precise control of film stress.
- Sputtering Equipment
Difficult materials, various substrate shapes, and applications! Capable of accommodating a very wide range of substrate sizes.
- Sputtering Equipment
We propose value-added products with antibacterial and deodorizing properties through vacuum sputtering processing on fibers and films.
- Sputtering Equipment
Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond ...
- Sputtering Equipment
Various high-precision pressure sensors necessary for flow control in semiconductor manufacturing equipment. Customization of modules is also possible.
- Semiconductor inspection/test equipment
- Etching Equipment
- Sputtering Equipment
Would you like to introduce the pressure controller PACE for measurement testing/line inspection of semiconductor manufacturing equipment and MEMS pressure sensors?
- Semiconductor inspection/test equipment
- Etching Equipment
- Sputtering Equipment
Would you like to introduce the PACE series for pressure calibration testing on the manufacturing line? It is also possible to reduce production costs!
- Etching Equipment
- Sputtering Equipment
- Pressure
Electrode formation processes and mounting processes for various devices such as LEDs, LDs, and FETs are possible.
- LED Module
- Sputtering Equipment
- Wafer processing/polishing equipment
![Production achievements [2] / Semic...](https://image.mono.ipros.com/public/product/image/ee9/2000412310/IPROS09238320213951143733.jpeg?w=280&h=280){kind=small}
Shortest half-day estimate / From metal parts to resin products, we introduce components related to semiconductor manufacturing equipment based on our track record!
- Sputtering Equipment
[Design/Customization] Winding Machine
We only accepted customization and modification design of the equipment. Customer / Precision Machinery Parts Manufacturer End User / Electronic Equipment Manufacturer Request Details / Modification design using existing equipment Main Specifications Transporting small lithium-ion battery components / Cutting from transport fixtures Reel taping / Laser marking / Reel winding Equipment Dimensions / W3,500mm × D1,200mm × H1,000mm This time, we only undertook the mechanical and equipment design. We were responsible for the mechanical design of the work transport fixture supply section, the work cutting / extraction / feeding section, and the reel winding section. The customer handled parts procurement, assembly, and other aspects outside of mechanical design. We also accept design-only projects. We can flexibly respond to customer requests, whether for custom equipment or, as in this case, using existing equipment. Our greatest strength is our ability to provide a one-stop service for the entire process from design to installation in equipment and fixture manufacturing. Please feel free to share any concerns related to equipment and fixtures, such as transport, robotics, and production facilities.
Shortest half-day estimate / We have accepted the production of equipment parts made of aluminum material.
- Sputtering Equipment
We will be exhibiting at the International Frontier Industry Messe 2021.
We are pleased to announce that we will be exhibiting at the "International Frontier Industry Messe 2021" on September 2nd (Thursday) and 3rd (Friday). 【Exhibition Booth Location】 D-63 (Hall 2) "International Frontier Industry Messe 2021" ________________ 〈Dates〉 September 2nd (Thursday) and 3rd (Friday) 〈Location〉 Kobe International Exhibition Hall 1 and 2 This is one of the largest comprehensive industrial exhibitions in Western Japan, focusing on the introduction of advanced technologies and product displays that serve as a foundation for new business creation, as well as facilitating technical exchanges and business matching. ______________________________________________________ At this exhibition, the organizers will implement measures to prevent the spread of COVID-19. Additionally, our staff will conduct health management through temperature checks, wear masks at all times, ensure thorough hand sanitization, and maintain social distancing during customer interactions as part of our infection prevention measures. Admission is free. We sincerely look forward to your visit. We will continue to strive to meet your expectations, and we kindly ask for your continued support. Thank you very much.
This processing requires a significant amount of positioning. We maintain a guarantee of ±0.05.
- Sputtering Equipment
A new PVD device proposed by a company that knows Endura inside and out.
- Sputtering Equipment
Equipped with three sources of cathodes in a compact tabletop size. It is also possible to produce insulating thin films, oxide, and nitride thin films.
- Sputtering Equipment
Information on major suppliers! Sputtering target market and supply chain.
- Sputtering Equipment
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
- Sputtering Equipment
- Evaporation Equipment
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
![[Hot Stage] Ultra High Temperature ...](https://image.mono.ipros.com/public/product/image/671/2000002653/IPROS21404174246949592221.png?w=280&h=280){kind=small}
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
- Sputtering Equipment
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
- Sputtering Equipment
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
☆★☆【nanoETCH】Soft Etching Device☆★☆
<30W Low Power Control for Damage-Free Etching Achieves delicate etching processes with an output control precision of 10mW. A jointly developed product with the graphene research group at the University of Manchester, led by Nobel Prize winners who discovered graphene in 2010. 【Features】 • 2D (Transition Metal Chalcogenides, graphene delamination after material transfer): Surface modification cleaning • Removal of polymer resists such as PMMA and PPA • Surface modification and etching on substrates prone to damage, such as Teflon substrates • h-BN sidewall etching (*Option for "Fluorine Gas Supply Module," requires SF6 gas system) • SiO2 etching (*Option for "Fluorine Gas Supply Module," requires CHF3 gas system) 【Specifications】 ◉ Compatible substrates: Up to Φ6 inches ◉ Easy operation with a 7" touch panel and PLC automatic sequencing ◉ Automatic pressure control (APC) ◉ One Ar gas line (standard) + up to three additional lines for N2 and O2 ◉ Connects to a Windows PC with a USB port for automatic etching recipe creation and storage. Data logging on PC.
Suitable for the film formation of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics)!
- Sputtering Equipment
High-end sputtering process for optical films used in aerospace engineering and medical/bio applications is possible!
- Sputtering Equipment
Ion beam sputtering equipment for research and development as well as small-scale production!
- Sputtering Equipment
DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!
- Sputtering Equipment
We apply hard DLC (diamond-like carbon) through sputtering, suitable for medical supplies and automotive parts! *Demo tests are currently being conducted.
- Sputtering Equipment
DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.
- Sputtering Equipment