List of Evaporation Equipment products
- classification：Evaporation Equipment
46～90 item / All 214 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.
- Evaporation Equipment
Sputtering/Dual Chamber System【MiniLab-E080A/S060A】
Two thin-film experimental devices are connected via a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected through the load lock. With Moorfield's unique load lock system, connections to the left, right, and rear process chambers are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB Evaporation: 7cc crucible x 6 - Resistance Heating Evaporation x 2 - Organic Evaporation Limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron Cathode x 4 sources for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma Etching Stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique 'soft etching' technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
◇◆◇ nanoPVD-S10A Magnetron Sputtering Device ◇◆◇
This is a research and development RF/DC magnetron sputtering device. Despite its high performance and multifunctionality, it fits into limited laboratory space with a compact size and easy operation via a 7-inch front touch panel. ● Achievable pressure: 5x10^-5 Pa (*fastest 30 minutes to 1x10^-4 Pa!) ● Film uniformity: ±3% ● Various options: up/down rotation, heater, cathode for magnetic materials, and more ● 3-source cathode + 3 MFC systems, with additional RF/DC power supply, allowing for versatile applications such as multilayer films and simultaneous deposition. - Insulating films - Conductive films - Compounds, etc. 【Main Features】 ◉ Compatible substrates: 2" (up to 3 sources) or 1" (1 source) ◉ 2" cathode x up to 3 sources ◉ Easy operation via touch panel with PLC automatic program control ◉ High-precision APC process control with MFC ◉ Up to 3 MFC systems ◉ USB port for Windows PC connection, capable of creating and saving recipes for up to 1000 layers and 50 films. Live data logging on PC. ◉ Vacuum system: TMP + RP (*dry pump option) ◉ Substrate rotation, vertical lift, and heating (Max 500℃) ◉ Quartz crystal film thickness monitor/controller
Compact and space-saving! Ideal for organic thin film development, all processes such as deposition, sputtering, and annealing can be seamlessly performed within the glove box.
- Evaporation Equipment
◇◆◇ nanoPVD-S10A Magnetron Sputtering Device ◇◆◇
This is a research and development RF/DC magnetron sputtering device. Despite its high performance and multifunctionality, it fits into limited laboratory space with a compact size and easy operation via a 7-inch front touch panel. ● Achievable pressure: 5x10^-5 Pa (*fastest 30 minutes to 1x10^-4 Pa!) ● Film uniformity: ±3% ● Various options: up/down rotation, heater, cathode for magnetic materials, and more ● 3-source cathode + 3 MFC systems, with additional RF/DC power supply, allowing for versatile applications such as multilayer films and simultaneous deposition. - Insulating films - Conductive films - Compounds, etc. 【Main Features】 ◉ Compatible substrates: 2" (up to 3 sources) or 1" (1 source) ◉ 2" cathode x up to 3 sources ◉ Easy operation via touch panel with PLC automatic program control ◉ High-precision APC process control with MFC ◉ Up to 3 MFC systems ◉ USB port for Windows PC connection, capable of creating and saving recipes for up to 1000 layers and 50 films. Live data logging on PC. ◉ Vacuum system: TMP + RP (*dry pump option) ◉ Substrate rotation, vertical lift, and heating (Max 500℃) ◉ Quartz crystal film thickness monitor/controller
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations with precisely adjusted process gas pressure (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
Sputtering/Dual Chamber System【MiniLab-E080A/S060A】
Two thin-film experimental devices are connected via a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected through the load lock. With Moorfield's unique load lock system, connections to the left, right, and rear process chambers are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB Evaporation: 7cc crucible x 6 - Resistance Heating Evaporation x 2 - Organic Evaporation Limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron Cathode x 4 sources for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma Etching Stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique 'soft etching' technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations with precisely adjusted process gas pressure (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
For applications in solar cells, organic devices, and bio-related fields! Comprehensive catalog of deposition equipment giveaway!
- Evaporation Equipment
We will introduce research and development equipment suitable for the development of organic EL devices.
- Evaporation Equipment
The E-100 retains its features while omitting the automatic exhaust control function to reduce costs.
- Evaporation Equipment
It is possible to measure optical properties in real time during vacuum deposition!
- Evaporation Equipment
A deposition device for ellipsometry that can measure optical properties in real time during vacuum deposition.
- Evaporation Equipment
Uniform carbon deposition is now possible! Ideal for pretreatment in EPMA and analytical SEM.
- Evaporation Equipment
The precision wobble stick was developed for delicate operations within ultra-high vacuum chambers, minimizing the risk of damage to the equipment!
- Vacuum Equipment
- Evaporation Equipment
- Plasma surface treatment equipment
We will introduce hand clean rolls made of silicone-based and non-silicone-based materials.
- Other cleaning tools
- Special labels, etc.
- Evaporation Equipment
To customers considering ultra-wide equipment for roll-to-roll production lines.
- Evaporation Equipment
- Extrusion Machine
- Food Packaging Machinery
The passivation MBE device is composed of various chambers specially designed for laser facet passivation and other purposes.
- Evaporation Equipment
- CVD Equipment
Metal, dielectric, and organic film deposition! Introducing the thermal evaporation device.
- Evaporation Equipment
A one-axis sample transporter designed for transporting samples between UHV chambers!
- Vacuum Equipment
- Evaporation Equipment
- Transport and handling robots
Robust cold cathode ionization vacuum gauge
- Evaporation Equipment
This is a compact thermal cathode ionization vacuum gauge with an integrated sensor, circuit, and display. It supports 16 types of gases and also uses a metal sensor!
- Evaporation Equipment
A wide range of measurements from atmospheric pressure to high vacuum with this one device! A vacuum gauge with an integrated sensor, circuit, and display.
- Evaporation Equipment
One device for measuring a wide range from atmospheric pressure to high vacuum! A vacuum gauge with an integrated sensor, circuit, and display. Compact and saves installation space!
- Evaporation Equipment
"Complete Case Collection of Flow Paths" - Presenting examples of diaphragm valves made with PFA resin sheets that can be used in high-temperature environments up to 200°C for the entire valve.
- Evaporation Equipment
- Other semiconductor manufacturing equipment
- valve
Optimized thermal design for handling delicate organic materials! Suppressing thermal effects on evaporated substances and substrates.
- Evaporation Equipment
Opening up the future of the medical device industry with high-performance and safe materials!
- Evaporation Equipment
A technology that deposits molecules onto a substrate surface to form a thin film! An explanation of vacuum deposition!
- Evaporation Equipment
Easy maintenance and workability! The lift-off film formation mechanism employs a special heat insulation mechanism!
- Evaporation Equipment
You can attach and detach the bell jar inside the glove box, and exchange or replenish the substrate and deposition materials!
- Evaporation Equipment
Can be fixed at any position on an arc-shaped rail corresponding to substrate incidence! The deposition position can be adjusted.
- Evaporation Equipment
Equipped with a holder that supports substrate rotation and substrate heating! Continuous film deposition is possible without releasing into the atmosphere!
- Evaporation Equipment
Transport between chambers is achieved by the transfer rod! Continuous film formation is possible without releasing into the atmosphere!
- Evaporation Equipment
- Sputtering Equipment
Equipped with an EB source expansion port! Compatible with 4-inch substrates, it features a substrate heating mechanism and a film thickness control mechanism!
- Evaporation Equipment
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
- Reflow Equipment
- Evaporation Equipment
- Bonding Equipment
Not only can we create films on flat surfaces, but we can also apply films to three-dimensional objects! Please let us know the areas where you would like the film to be applied.
- Evaporation Equipment
- Sensors
- Contract manufacturing
The refined and simple glove box is suitable for anyone. It comes with a new era gas purification device that does not require recycled gas or recycling processes.
- Glove box
- Vacuum Equipment
- Evaporation Equipment
Glove box system with gas refining equipment for a new era that does not require regeneration gas or regeneration processes.
- Glove box
- Vacuum Equipment
- Evaporation Equipment
MBE cells (molecular beam epitaxy sources) are important for the quality of epitaxial films. We introduce the MBE cells from RIBER, a company with a proven track record.
- Evaporation Equipment
We will handle everything from material arrangement to He leak testing with one company.
- Vacuum Equipment
- Evaporation Equipment
Materials require high purity and stable dissolution. Our company provides materials suitable for deposition!
- Evaporation Equipment
Build a reliable system! Leave maintenance and modifications to us.
- Evaporation Equipment
- Sputtering Equipment
- Vacuum Equipment
Easy-to-handle design allows for easy control of various film formation conditions! Six types of targets can be used.
- Evaporation Equipment
Standard equipped with scanning RHEED! Two motor-driven combinatorial masks installed.
- Evaporation Equipment
A rich lineup is available! Introducing electron beam deposition applicable to the deposition of organic molecules.
- Evaporation Equipment
- Other machine elements
Slide-type UHV viewport shutter ensures ideal optical shielding and field of view when open, with no need for a drive space for the shutter plate, making installation easy.
- Vacuum Equipment
- Evaporation Equipment
- Electron microscope