List of Semiconductors and ICs products
- classification：Semiconductors and ICs
3556～3600 item / All 4175 items
RAID development FMC board, capable of connecting up to 10 SATA HDDs/SSDs.
- ASIC
- Board to Board Connectors
Adopting highly reliable AES encryption technology to protect IP assets from illegal copying.
- ASIC
- Encryption and authentication
This is an O-ring that maximizes the excellent chemical resistance and high-temperature resistance of perfluoroelastomer materials while achieving long service life!!
- Other semiconductors
Ideal for the development of new technologies with cutting-edge plasma treatment for improved wettability, enhanced adhesion, and nano cleaning!
- Other semiconductors
A variety of industrial SSDs and industrial memory cards are available!
- Memory
- SSD
- Storage
We solve various problems from the customer's perspective!
- Other semiconductors
- Printed Circuit Board
- Other electronic parts
- Analysis of the supply and demand for 2 metal COF expected to expand for iPhone -
- Dedicated IC
- plastic
Miniaturized the charging capacitor to 1/10 its size! Furthermore, achieved high efficiency of 95%.
- Charger
- LED Module
- Other semiconductors
Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.
- Wafer
- LCD display
- Fine Ceramics
Information on Exhibiting at CEATEC JAPAN 2016
Samsung Diamond Industrial Co., Ltd. will be exhibiting at the exhibition "CEATEC JAPAN 2016," which will be held at Makuhari Messe from Tuesday, October 4 to Friday, October 7, 2016. Until now, our company has cultivated the technology for breaking brittle materials in the glass substrate and flat panel display markets. This time, we will refine our conventional scribe & break technology for various substrates in new fields such as electronic components and semiconductors, and propose the following new process ("High Speed & Dry") that overturns existing industry concepts. ■ High-quality & high-precision scribing processing with next-generation diamond cutting edges (for ceramics, sapphire, glass, etc.) ■ Chip separation (breaking) processing using V-Motion Separation ■ Scribing/drilling/patterning processing using original laser technology We invite you to visit our booth and experience the new era of scribing & breaking technology. ● Contact Information ● Samsung Diamond Industrial Co., Ltd. EC Business Division, Sales Group TEL: 072-648-5013 FAX: 072-648-5206
We respond flexibly and swiftly from prototyping to mass production.
- Other semiconductors
- Other electronic parts
[Sample Presentation] A Rich Lineup! Passive Components and Mechanical Parts from Ultra Electronics.
- Other semiconductors
- transformer
- Inductor Coil
Manufacturing specialists! We meet the needs of the times with high technology that adds value.
- Processing Contract
- Other machine elements
- Other semiconductors
Currently selling low voltage DDR2 and DDR3 for various applications supporting Advanced Driver Assistance Systems (ADAS).
- Memory
- Electrical equipment parts
- Interior parts
We handle various electronic components such as diodes, thyristors, MOS-FETs, IGBTs, switching power supplies, and noise filters.
- diode
- Switching Power Supply
- Printed Circuit Board
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【Industry First!】 High-speed, low-power 4Mbit SRAM (256K x16) with address latch function and ECC support for automotive applications.
- Memory
- Electrical equipment parts
- Routers, Switches, and Hubs
[New Product] High-Speed, Low Voltage 32Mbit SRAM (256K x16) Single Chip Monolithic Compatible
- Memory
- Electrical equipment parts
- Routers, Switches, and Hubs
Complete electrostatic measures: We are giving away a sample book of electronic materials 'carrier tape'!
- Other semiconductors
- Other electronic parts
Stable tape transport is possible even for ultra-small sizes (0402, 0603)! Samples are currently available.
- Other semiconductors
- Other electronic parts
The industry's smallest class! A standalone prototyping system compatible with all purposes!
- Memory
- Memory
Curing applications for wafer dicing tape, featuring stable long lifespan with UV-LED adoption.
- Wafer
In this report, we specifically analyzed the market, suppliers, and application trends related to 2-metal COF, as well as the future demand.
- LCD display
- Dedicated IC
Maximum forward voltage: 432V Maximum reverse voltage: 360KV Maximum forward current: 0.5A Maximum reverse current: 200μA
- diode
Maximum forward voltage: 300V Maximum reverse voltage: 200KV Maximum forward current: 0.5A Maximum reverse current: 200μA
- diode
Maximum forward voltage: 48V; Maximum reverse voltage: 40KV; Maximum forward current: 10A; Maximum reverse current: 200μA.
- diode
Maximum forward voltage: 240V; Maximum reverse voltage: 200KV; Maximum forward current: 10A; Maximum reverse current: 200μA.
- diode
Maximum forward voltage: 330V; Maximum reverse voltage: 140KV; Maximum forward current: 1.5A; Maximum reverse current: 50μA.
- diode
Maximum forward voltage: 352V; Maximum reverse voltage: 160KV; Maximum forward current: 0.02A; Maximum reverse current: 10μA.
- diode
Maximum forward voltage: 440V; Maximum reverse voltage: 200KV; Maximum forward current: 0.02A; Maximum reverse current: 10μA
- diode
10mm x 20mm small xenon strobe flash module
- Other optical parts
- Other electronic parts
- ASIC
In addition to catalog items, we respond quickly to semi-custom requests based on standard specifications with high technical capability.
- Other semiconductors
We respond quickly with high technical skills not only to catalog items but also to semi-custom requests based on standard specifications.
- Other semiconductors
A backplane system compliant with the MicroTCA standard condensed into a compact enclosure.
- Other semiconductors
Support for setting optimal design rules and pin assignments through simulations using the SPICE model.
- Other semiconductors
From procurement of materials to assembly and inspection.
- Other semiconductors