Other semiconductor manufacturing equipmentの製品一覧

We provide manufacturing technology for neutralization, esterification, sulfonation, phosphorylation, polycondensation reactions, powder mixing, emulsification, and dispersion, etc. *We can also handl...

• Contract manufacturing

Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!

• Glass

We undertake the development and production of ultrasonic transducers and ultrasonic oscillators tailored to our customers' needs.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

We accept the development and production of ultrasonic transducers and ultrasonic oscillators tailored to your needs.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

Thorough pursuit of compactness and lightweight design.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

Thorough pursuit of compactness and lightweight design.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

Over the past 30 years, there has been a proven track record of being installed in numerous semiconductor wire bonders.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

High-speed thermal processing equipment (RTP/RTA equipment) AccuThermo series

• Other semiconductor manufacturing equipment

The high-performance, low-cost manual prober was uniquely developed and designed by Highsol based on experience and achievements.

• Other semiconductor manufacturing equipment

We pursue the latest laser technology and its application possibilities as the core of the photonics business within the HOYA Group, focusing on industry and healthcare.

• Other semiconductor manufacturing equipment

Ultra-high precision alignment within ±1um. Ideal for prototype development.

• Other semiconductor manufacturing equipment

Dust prevention and reliable protection of wafers! Bulk transfer is also possible!

• Other semiconductor manufacturing equipment

Featuring the latest products from Tokyo Electron Kyushu, a leading company in semiconductor manufacturing equipment!

• Other semiconductor manufacturing equipment

It is a high-efficiency ozone removal device that can be used under vacuum conditions.

• Other semiconductor manufacturing equipment
• Other filters

This device measures the thickness of wafers fixed to ceramic plates without contact, using optical probes/sensors.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device for measuring the thickness of φ8” silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device that performs macro and micro inspections of φ8-inch wafers in the semiconductor manufacturing process.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device for spin-drying workpieces.

• Other semiconductor manufacturing equipment
• Other industrial robots

It is a device for drying wafers that have been stripped and cleaned.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device for cleaning wafers that are epoxy bonded to a glass plate.

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment
• Other industrial robots

It is a semi-automatic device for visual inspection of 8-inch silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a fixture for visual inspection of the front and back surfaces of the quartz mask.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device for visual inspection and thickness measurement of 8-inch silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device that performs macro inspection of wafers and micro inspection using a microscope.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device for surface inspection of wafers after polishing.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Two-dimensional code reading device

• Other semiconductor manufacturing equipment
• Other semiconductor manufacturing equipment

This is a device for visually inspecting the edges of φ300 mm silicon wafers (chip and chipping inspection).

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Pass/Fail Judgment Device

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Manual device equipped with a safety cover and remote control mechanism.

• Other semiconductor manufacturing equipment
• Other processing machines

This is a device for heating φ300mm bonded wafers using an IR lamp.

• Other semiconductor manufacturing equipment

Bulk cassette to cassette transfer

• Other semiconductor manufacturing equipment

A device capable of performing three types of operations.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device for drying 300mm wafers that have been cleaned after double-sided polishing.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device for simple cleaning (brush + water) of φ300 mm silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Loading and unloading of φ150 mm and φ125 mm silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device for storing φ300 mm wafers, which have completed processing, one by one into a Teflon cassette for submersion.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device that loads wafers one by one.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device used for handling to perform P/N determination and visual inspection of silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device for inverting and transferring silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Classified by resistivity and thickness categories.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that detects the wafer edge using laser light and measures the diameter by comparing it with a calibration wafer (reference wafer).

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that detects the edge of a wafer and measures its diameter through image processing.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that measures the thickness of sapphire wafers and sorts them according to their thickness.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device that measures the thickness of silicon wafers and rearranges them according to their thickness.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and double-sided polishing process.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment