We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 576 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. 共栄電資 Tokyo//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
Go to Company Ranking

Substrate Product ranking

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社　和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 Printed circuit board 北一電気
  5. 5 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.

Substrate Product List

541～570 item / All 1950 items

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Anju Electric Co., Ltd. Business Introduction

Anju Electric Co., Ltd. Business Introduction

From surface mounting to finished product inspection, everything is completed in-house! We deliver high-quality services.

At Anju Electric Co., Ltd., we design and produce electronic circuit boards and products that incorporate these circuit boards, focusing on home appliances and disaster prevention and security devices. The electronic circuit board acts as the control center for the operation of the devices, supporting your safe and comfortable living in ways that are not visible. We provide comprehensive support from artwork design, circuit board assembly, product assembly, to quality inspection. We can accommodate all electronic products, from prototypes to mass production and rework. 【Business Activities】 ○ Artwork Design ○ Prototype and Mass Production of Circuit Board Assembly ○ Product Assembly ○ Quality Inspection For more details, please contact us or download our catalog.

  • Mechanical Design
  • Circuit board design and manufacturing
  • Contract manufacturing
  • Substrate

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Example 4: Advanced technology for millimeter-wave compatible three-layer RDL substrates and chip bonding.

Example 4: Advanced technology for millimeter-wave compatible three-layer RDL substrates and chip bonding.

Semiconductor implementation technology that achieves a 70GHz bandwidth. Completion of a complex 24-step process through collaboration among 15 companies.

We have developed a three-layer coplanar RDL substrate using low-loss insulating materials and simultaneously achieved high-precision bonding of millimeter-wave chips. We overcame technical challenges such as wrinkles and warping due to thermal expansion, as well as deposits during via processing, through thorough process improvements. By utilizing landless vias and three-layer impedance matching RDL, we ensured transmission characteristics over a wide bandwidth of 70 GHz. This is a top-tier example of realizing customer desires by managing 24 complex processes through the amoeba-like collaboration of 15 partner companies. *For detailed information on the millimeter-wave compatible implementation process and verification results, please refer to the downloadable materials.*

  • Contract manufacturing
  • Substrate

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Types and Examples of High-Performance FPC [Special Bumps, Long and Ultra-Fine, High Flexibility]

Types and Examples of High-Performance FPC [Special Bumps, Long and Ultra-Fine, High Flexibility]

Attention those struggling with cost reduction and space-saving for flexible printed circuit boards (flexible substrates)! We can provide optimal proposals tailored to your needs!

This document summarizes the types and applications of high-performance FPCs. High-performance FPCs are capable of solving various challenges such as cost reduction and space-saving. In this document, we introduce the features and application examples of special bumps, long and ultra-thin FPCs, and highly flexible FPCs. More detailed information is also available, so please take a moment to read through it. 【Contents】 ■ Types of high-performance FPCs ■ Features ■ Application examples *For more details, please refer to the PDF document or feel free to contact us. #ShortLeadTime #MassProduction #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #UltraThin #Flexible

  • Other electronic parts
  • Substrate

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High elongation FPC (Flexible Printed Circuit)

High elongation FPC (Flexible Printed Circuit)

Supports over 50% elongation! There are various applications such as wearable electronic devices and robots.

The "High Stretch FPC" uses copper circuits for fine circuits and electronic component mounting, and is designed for low-temperature soldering of electronic components. For areas that require stretching, elastic conductive materials are used, accommodating stretches of over 50%. By innovating the circuit shape of the elastic conductive materials and using our smart metal masks for thick film printing, it is possible to suppress changes in resistance values. 【Features】 ■ Compatible with low-temperature soldering of electronic components ■ Accommodates stretches of over 50% ■ Capable of suppressing changes in resistance values *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction

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  • Other electronic parts
  • Substrate

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High-frequency compatible FPC

High-frequency compatible FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

"High-Frequency Compatible FPC" and "High-Frequency Compatible Flexible Printed Circuit Board" are products designed to support low transmission loss and impedance matching. Specifications include coplanar lines, microstrip lines, and strip lines. They can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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  • Other electronic parts
  • Substrate

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High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High Frequency Compatible FPC (LCP Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has moisture absorption characteristics that are less affected by humidity and other factors. ● FPC high frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #Flexible substrate #Flexible printed wiring board #Circuit board #Printed circuit board #High frequency #Impedance #Short delivery time #Mass production

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  • Other electronic parts
  • Substrate

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High-frequency compatible flexible substrate (MPI specification)

High-frequency compatible flexible substrate (MPI specification)

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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  • Other electronic parts
  • Substrate

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Transparent FPC (Transparent Flexible Printed Circuit Board)

Transparent FPC (Transparent Flexible Printed Circuit Board)

Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine patterns make the wiring inconspicuous.

〇Uses polyimide with excellent heat resistance and flame retardancy. ⇒【Compatible with reflow mounting】 ★ For display devices such as digital signage, as well as medical devices and transparent film antennas! ★ We also accommodate small quantities and a variety of prototypes. For more detailed information, please contact us. #Transparent #Transparent FPC #Transparent Flex

  • Other electronic parts
  • Substrate

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Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)

Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance

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  • Other electronic parts
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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[Information] MR Cylindrical Mirror Polishing Machine (Cylindrical Mirror Grinding Machine) Comprehensive Model Introduction Catalog

[Information] MR Cylindrical Mirror Polishing Machine (Cylindrical Mirror Grinding Machine) Comprehensive Model Introduction Catalog

Pioneer of cylindrical mirror polishing machines! Introducing the Mirak (Taiyo Kogyo Group) equipment. (Cylindrical mirror grinding machine, mirror finishing, buff polishing, grinding wheel)

We would like to introduce a representative model of the Mirak MR cylindrical mirror polishing machine. The main applications include grinding and polishing with grinding wheels and mirror finishing with buffs. * Rolls for super calendars and elastic rolls * Rolls for rolling various materials (grinding rolls for stainless steel, copper, aluminum) * Gravure printing cylinder rolls * Aluminum rolls * Piston rods for air and hydraulic systems * Plastic rolls (nylon, polyacetal, Teflon, etc.) * Stainless steel rolls * Carbide and ceramic rubber rolls We will provide detailed specifications and other information based on your requests. Please feel free to contact us first.

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  • Other machine tools
  • Substrate

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Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)

Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)

From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!

We support the evaluation of high-frequency characteristics of materials under development. Our company has the know-how to handle everything from short-term prototypes to mass production of FPCs. We can provide optimal proposals tailored to the needs of material manufacturers, flexible printed circuit board manufacturers, and various equipment manufacturers. We assist in evaluating the various characteristics of new materials that are being improved daily.

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  • Printed Circuit Board
  • Substrate

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Static electricity is visible! Static electricity visualization monitor [1 sensor x 8, separated type]

Static electricity is visible! Static electricity visualization monitor [1 sensor x 8, separated type]

This is a separated type with [1 sensor × 8 units] that enables electrostatic measurement in narrow spaces. It is suitable for various environments such as line processes with real-time measurement.

<Features> - Continuous measurement for 24 hours, can be integrated inline. - Capable of measuring charge in narrow or remote locations. - Data management and storage possible with the included software. <Examples of Use> - Measurement of charge distribution and charge movement on material surfaces. - Charge monitoring on manufacturing lines for LCD panels and organic EL. - Charge inspection while products are flowing on the line with attached sensors.

  • EMC/Static electricity measuring equipment
  • Other anti-static devices
  • Anti-static products
  • Substrate

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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FPC【Data Presentation】Fully Understandable! Flexible Printed Circuit Boards! Glossary

FPC【Data Presentation】Fully Understandable! Flexible Printed Circuit Boards! Glossary

Introduction to high-difficulty FPCs, specific issues, and TAIYO's one-stop service, covering the basics of flexible substrates (glossary)!

Thank you for taking a look. With over 40 years of experience in flexible printed circuit board manufacturing, we offer a one-stop service from prototyping to mass production. There are things that can only be done by TAIYO. 【Contents of the document】 1. Solve all your FPC problems at once! 2. What is FPC? 3. One-stop service 4. Achieving short delivery times 5. Support from prototyping to mass production 6. Information on various types of FPC (ultra-fine wires, multilayer, high frequency, and more) 7. FPC glossary 8. Greetings and company overview (Total of 36 pages) We hope this information will be helpful in your consideration of flexible printed circuit boards. Taiyo Industry will sincerely respond to your inquiries regarding FPC.

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  • Printed Circuit Board
  • Other cable related products
  • Other electronic parts
  • Substrate

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Introduction to "Low Reflective Plating" Electroforming Technology

Introduction to "Low Reflective Plating" Electroforming Technology

Surface treatment using plating to prevent light reflection, enabling ultra-fine processing at the micron level! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that allows for the high-precision shaping of metal products by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to overlap the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the molding of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Substrate

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[Use Case] Achieving 'Future Co-Creation' between Humans and Robots with Automation Solutions

[Use Case] Achieving 'Future Co-Creation' between Humans and Robots with Automation Solutions

FA and automation systems, introduction of operational examples. "Future co-creation" between humans and robots.

〇 Introduction of Use Cases We have introduced our proposed automation system in the customer's PR video. We have received consent for its publication on this site, so please view it via the video link. Our automation system: 13-23 seconds, 38-49 seconds *Only the input and output of materials using a dual-arm robot transport system. Elephantech Inc. https://www.elephantech.co.jp/ Elephantech "Elephantech - A startup leading the world in FPC printing" With the mission of "creating a sustainable world through the power of new manufacturing," we manufacture and sell FPC (Flexible Printed Circuit) using environmentally friendly unique methods with inkjet printing and copper plating.

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  • SCARA Robot
  • Substrate

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Flexible substrate short delivery service (FPC - flexible)

Flexible substrate short delivery service (FPC - flexible)

With Taiyo Techno Rex's FPC short delivery service, high quality and smooth transition to mass production can be achieved.

Unified management from prototype to mass production! ■ Reliable track record ■ One-stop service ■ Flexible responsiveness ■ Short delivery times, high quality, latest technology

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  • Printed Circuit Board
  • Substrate

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[Exhibition Report] We exhibited at NEPCON Japan 2025!

[Exhibition Report] We exhibited at NEPCON Japan 2025!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ 　　~ Touch, Compare, Experience FPC! ~ 　　　● Comparison of weight between rigid boards and FPC 　　　● Reduction of board area through high-density wiring 　　　● Difference in heat generation temperature due to copper thickness 　　　● Improved work efficiency with transparent FPC, etc. 　　~ Technology Topics ~ 　　　● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results 　　　● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　● Pattern via fill FPC... Achieving high-density wiring and pad-on-via 　　　● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ 　　　By achieving teaching-less implementation through visual feedback control, 　　　eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ 　　　TY-VISION XAIS AI-based defect detection and false report reduction 　　　　・M111SC (manual machine) high-definition (package) board × high-resolution inspection 　　　　・M109SC (manual machine) diverse workpieces × large format

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots
  • Substrate

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TTL Exhibition Participation Guide: JPCAShow 2025

TTL Exhibition Participation Guide: JPCAShow 2025

Newly developed material.

◆FPC (Flexible Printed Circuit Board)◆ 　　　~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~ 　　　　　FPC manufacturing requires multiple critical processing steps. 　　　　　Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. 　　　　　This time, we will introduce the "strengths" we have cultivated over many years in each process! 　　　　　<Design> Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Treatment> High precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High precision outline processing ±50μm, diverse tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆ 　　　Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ 　　　Proposals for utilizing FA and collaborative robots

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  • Printed Circuit Board
  • Substrate

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[Exhibition Report] We exhibited at JPCAshow 2025!

[Exhibition Report] We exhibited at JPCAshow 2025!

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering 　　>> There are multiple important processing steps in FPC manufacturing. 　　　　Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. 　　　　We have introduced the "strengths" we have cultivated over many years in each process: 　　　　　<Design>　　 Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Processing> High-precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High-precision contour processing ±50μm, a variety of tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing 　　>> Normally, there are no opportunities to see anything other than the finished product, 　　　　but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. 　　　　　*Through-hole drilling, exposure/development, etching, contour processing, etc.

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots
  • Substrate

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FPC - "Technical Information" - Updated September 2025

FPC - "Technical Information" - Updated September 2025

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

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  • Printed Circuit Board
  • Substrate

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【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025

【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025

Wakayama's manufacturing opens up the future of space!

【Dates】November 5 (Wed) - 7 (Fri), 2025, 10:00 AM - 5:00 PM 【Venue】Port Messe Nagoya, Hall 1 (Nagoya Port, Kinjo Pier) Special Exhibition: Space Approach EXPO We will be exhibiting at the Wakayama Prefecture booth, No. 40. With our long-standing experience, we strongly support the space industry modules with our FPC small-lot production technology.

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  • Printed Circuit Board
  • High frequency/microwave parts
  • Substrate

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[Exhibition Report] We exhibited at NEPCON Japan 2026!

[Exhibition Report] We exhibited at NEPCON Japan 2026!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆FPC (Flexible Printed Circuit Board)◆ 　　~Touch, Compare, Experience FPC!~ 　　　●Comparison of weight between rigid boards and FPC 　　　●Reduction of board area through high-density wiring 　　　●Improved work efficiency with transparent FPC 　　　●Introduction of black coverlay, etc. 　　~Technical Topics~ 　　　●High-frequency compatible FPC / High-frequency analysis measurement... Proposing optimal designs and materials based on analysis results 　　　●Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　●Pattern via fill 4-layer FPC... Achieving high-density wiring and pad-on-via 　　　●6-layer stack via FPC... High-density wiring with stack via structure 　　~Our Initiatives~ 　　　●Introduction of "Space" related business 　　　●Demonstration of "Leak Detection Device" ◆Various Boards and Ceramic Material Systems◆ 　　　Introduction of AI technology, final appearance inspection equipment, and electrical inspection equipment 　　 (Semi-automatic appearance inspection equipment TY-VISION M105SC II) Live demonstration ◆Efficiency and Automation◆ 　　　Proposal for utilizing FA and collaborative robots 　　 (Appearance inspection system + ASSISTA = Efficiency) Live demonstration

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  • Printed Circuit Board
  • Cosmetic containers and packaging
  • Pharmaceutical containers and packaging
  • Substrate

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FPC for the space industry

FPC for the space industry

Ability in accordance with "JAXA specification" requirements.

Our company conducts reliability tests for "TRL6" (where the system has been tested as a demonstrated model) as required by JAXA, aiming to ensure a significant level of reliability.

  • Printed Circuit Board
  • connector
  • Substrate

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Ideal for UV-C sterilization devices! Inverter (board type)

Ideal for UV-C sterilization devices! Inverter (board type)

TOZAI's inverter shipment record exceeds 10 million units. Feel free to leave custom orders for sterilization devices to us!

【Domestic Production Inverter Board】 The inverter is essential for the use of ultraviolet sterilization lamps. With the technology and experience cultivated by TOZAI over many years, we will contribute to the development of your sterilization lamp equipment. 【Features】 - Reliable domestic production - A wide range of lineups tailored to various power sources - Flexible support for various customizations such as residual heat processing and non-light detection - Lightweight, energy-efficient, and high luminous efficiency compared to copper-iron stabilizers We also offer a variety of other sterilization lamps and sockets for sterilization lamps. Please feel free to consult with us. We have a rich lineup that supports sterilization lamps from GL4 to GL40 in straight tube starter types. For more details, please feel free to contact us. Please note that the dimensions and electrical characteristics of the fluorescent lamp 30W (FL30) and the sterilization lamp (GL30) differ. *Please check the JIS standards for details. *It is necessary to confirm the matching of the lamp you will use with the inverter (this is not a confirmation of sterilization effectiveness). We have evaluation units available, so please feel free to inquire.

  • Air purifiers
  • Inverter
  • inverter
  • Substrate

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Alto Industry Co., Ltd. Company Profile

Alto Industry Co., Ltd. Company Profile

For reliable electronic circuit boards, trust Alto Industries!

Alto Industrial Co., Ltd. is a company based in Kanagawa Prefecture that designs and manufactures various electronic circuit boards for industrial equipment. Using technical know-how developed over many years in electronic circuit design for major brand products, we create patterns through CAD design and carry out board manufacturing on a fully integrated production line. We provide our customers with the benefits of "domestic in-house production," ensuring high reliability, safety, and quality that pays attention to the finer details characteristic of Japanese craftsmanship. 【Business Description】 ■ Design and manufacture of various electronic circuit boards for industrial equipment *For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Substrate procurement

Substrate procurement

The compatible board types are IVH/BVH boards and via boards with hole filling processing! A wide range of component procurement is possible through unique purchasing.

Our company selects circuit board manufacturing factories with a wide variety of specialties on behalf of our customers and chooses suppliers for components to meet diverse needs. Prototyping parts procurement can be done through purchasing from market inventory. We achieve procurement focused on speed and delivery time for prototypes. The types of circuit boards we handle include IVH/BVH boards and filled via boards, and by managing quality ourselves, we ensure that our customers do not have to worry about it. 【Types of Circuit Boards We Handle】 ■ IVH/BVH boards ■ Filled via boards ■ Impedance matching and inspection-compatible boards ■ Halogen-free, PB-free, Teflon boards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • Substrate

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Mountaineer "Z:LEX YSM20WR"

Mountaineer "Z:LEX YSM20WR"

Support for W356 width dual lane implementation in high-speed machines! Introduction of the mounter handled by Masu Shoji.

We would like to introduce the YAMAHA manufactured mount 'Z:LEX YSM20WR' handled by Masu Shoji. We have newly developed the ALF (Auto Loading Feeder) that innovates the replenishment of tape components with skill-less operation. In single lane mode, it standardly supports super-large substrates up to L810×W742, and it can also standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg. 【Features】 ■ Supports dual lane mounting with a width of W356 for high-speed machines ■ Standardly supports super-large substrates up to L810×W742 in single lane mode ■ Can standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg ■ Options to improve line operating rates without stopping the machine ■ Non-stop pallet exchange ATS (Auto Tray Sequencer) "sATS30NS" ■ Non-stop feeder bulk exchange system *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Mount "Σ-G5SII"

Mount "Σ-G5SII"

Reviewing details for further reliability improvement! A mounter that ensures high mounting quality.

We would like to introduce the YAMAHA manufactured mounter 'Σ-G5SII' handled by Masu Shoji. This model has evolved the "1-head solution" that achieves high productivity with two new types of heads, capable of handling ultra-small components such as 0201 (0.25mm x 0.125mm) as well as large components. By expanding the internal buffer size, it reduces transport loss for large PCBs. 【Features】 ■ Capable of handling ultra-small components like 0201 (0.25mm x 0.125mm) to large components ■ Expanded detection range for component holding state ensures high mounting quality ■ Reduces transport loss for large PCBs by increasing internal buffer size ■ Detailed review for further reliability improvement ■ Ensures compatibility with conventional models *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Mountaineer "Σ-F8S"

Mountaineer "Σ-F8S"

Introducing a mounter that achieves 150,000 CPH with a compact chassis featuring 4 beams and 4 heads!

We would like to introduce the YAMAHA manufactured mounter 'Σ-F8S' handled by Masu Shoji. It features a rotary head for a one-head solution, achieving speed, versatility, and high operational rates. The variety of parts is up to 80 types, with dimensions of L 1,280 x W 2,240 x H 1,450 mm. 【Features】 ■ One-head solution with a rotary head ■ Achieves speed, versatility, and high operational rates ■ Delivers 150,000 CPH with a compact body using 4 beams and 4 heads ■ Direct drive head that realizes high speed and high precision ■ SL feeder (Super Loading Feeder) that innovates parts supply operations *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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