We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Aug 12, 2026~Sep 08, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Aug 12, 2026~Sep 08, 2026
This ranking is based on the number of page views on our site.

  1. 共立エレックス Saga//Ceramics
  2. スクリーンプロセス Kanagawa//others
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors

Substrate Product ranking

Last Updated: Aggregation Period:Aug 12, 2026~Sep 08, 2026
This ranking is based on the number of page views on our site.

  1. Ceramic substrate for firing setters 共立エレックス
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 [Information] MR Cylindrical Mirror Polishing Machine (Cylindrical Mirror Grinding Machine) Comprehensive Model Introduction Catalog 太洋テクノレックス 本社 和歌山

Substrate Product List

541~570 item / All 1947 items

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List of Manufacturers Handled by the General Trading Company for Electronic Components

For those looking for electronic components. We have a system in place for immediate responses to quotes, data submissions, and sample submissions!

Kyowa Electronic Components specializes in EMS (Electronic Manufacturing Services) by leveraging its procurement capabilities developed over the years, and we focus on providing proposal-based services such as alternative suggestions. We also handle a wide range of services including harness manufacturing, circuit board design, sheet metal work, resin molding products, and purchasing of materials on behalf of clients. 【Manufacturers We Handle】 (Partial List) Taiyo Yuden Co., Ltd., Rohm Co., Ltd., Tohshin Electric Co., Ltd. SEMITEC Corporation, Sagami Electric Co., Ltd., Tohshin Industry Co., Ltd. Kamaya Electric Co., Ltd., Japan Crimped Terminal Manufacturing Co., Ltd., Nikkoh Electronics Co., Ltd. In addition, we handle many manufacturers both domestically and internationally. *For more details about the manufacturers we handle, please download the PDF or feel free to contact us.

  • Other electronic parts
  • Soldering Equipment
  • others
  • Substrate

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Circuit board "Arm Frogs BLUE"

Space-saving, high reliability, high precision! A board that is also optimal for industrial applications and evaluation boards.

Gofeltec's "Arm Frogs BLUE" is a space-saving, highly reliable, and high-precision circuit board that combines a CPU and FPGA into a single chip. It supports ECC, making it ideal for industrial applications. It can also be used as a PCIe card and is perfect as an evaluation board. The SoC part is on a separate board, allowing for direct mass production of the SoC after evaluation. 【Features】 ■ CPU and FPGA in one chip ■ Supports ECC, making it ideal for industrial applications ■ Can be used as a PCIe card, perfect for evaluation boards ■ SoC part on a separate board ■ Space-saving, highly reliable, and high-precision circuit board *For more details, please refer to the PDF materials or feel free to contact us.

  • Evaluation Board
  • Printed Circuit Board
  • Memory
  • Substrate

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Long-distance transmission board!

Long-distance transmission technology that connects physical space and cyberspace!!

A transmission technology that enables real-time operation and display of PCs used in the office, connecting the office and the field. By allowing high-speed signals to be exchanged bidirectionally, it is possible to use it not only as a monitor but also as an operation terminal equipped with a touch panel.

  • Other network tools
  • Substrate

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Free technical materials for glass substrate processing available!

Various glass substrates, including those for FPD, are packed with technical information on comprehensive processing related to "cutting," "polishing," and "film formation"! Free distribution of technical materials on LCD glass substrate processing.

This document introduces the core technologies of Kuramoto Seisakusho: "Cutting," "Polishing," and "Film Formation." Glass substrates for liquid crystal displays are fundamental components of liquid crystal panels, and their quality significantly affects panel performance and the yield of subsequent processes. Our processed products are highly regarded by various panel manufacturers as a trusted brand. [Contents] ■ Cutting ■ Polishing ■ Film Formation ■ Film Formation Production Equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Contract manufacturing
  • Other FPD related
  • Substrate

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Anju Electric Co., Ltd. Business Introduction

From surface mounting to finished product inspection, everything is completed in-house! We deliver high-quality services.

At Anju Electric Co., Ltd., we design and produce electronic circuit boards and products that incorporate these circuit boards, focusing on home appliances and disaster prevention and security devices. The electronic circuit board acts as the control center for the operation of the devices, supporting your safe and comfortable living in ways that are not visible. We provide comprehensive support from artwork design, circuit board assembly, product assembly, to quality inspection. We can accommodate all electronic products, from prototypes to mass production and rework. 【Business Activities】 ○ Artwork Design ○ Prototype and Mass Production of Circuit Board Assembly ○ Product Assembly ○ Quality Inspection For more details, please contact us or download our catalog.

  • Mechanical Design
  • Circuit board design and manufacturing
  • Contract manufacturing
  • Substrate

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Example 4: Advanced technology for millimeter-wave compatible three-layer RDL substrates and chip bonding.

Semiconductor implementation technology that achieves a 70GHz bandwidth. Completion of a complex 24-step process through collaboration among 15 companies.

We have developed a three-layer coplanar RDL substrate using low-loss insulating materials and simultaneously achieved high-precision bonding of millimeter-wave chips. We overcame technical challenges such as wrinkles and warping due to thermal expansion, as well as deposits during via processing, through thorough process improvements. By utilizing landless vias and three-layer impedance matching RDL, we ensured transmission characteristics over a wide bandwidth of 70 GHz. This is a top-tier example of realizing customer desires by managing 24 complex processes through the amoeba-like collaboration of 15 partner companies. *For detailed information on the millimeter-wave compatible implementation process and verification results, please refer to the downloadable materials.*

  • Contract manufacturing
  • Substrate

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High elongation FPC (Flexible Printed Circuit)

Supports over 50% elongation! There are various applications such as wearable electronic devices and robots.

The "High Stretch FPC" uses copper circuits for fine circuits and electronic component mounting, and is designed for low-temperature soldering of electronic components. For areas that require stretching, elastic conductive materials are used, accommodating stretches of over 50%. By innovating the circuit shape of the elastic conductive materials and using our smart metal masks for thick film printing, it is possible to suppress changes in resistance values. 【Features】 ■ Compatible with low-temperature soldering of electronic components ■ Accommodates stretches of over 50% ■ Capable of suppressing changes in resistance values *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction

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  • Other electronic parts
  • Substrate

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High-frequency compatible FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

"High-Frequency Compatible FPC" and "High-Frequency Compatible Flexible Printed Circuit Board" are products designed to support low transmission loss and impedance matching. Specifications include coplanar lines, microstrip lines, and strip lines. They can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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  • Other electronic parts
  • Substrate

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High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High Frequency Compatible FPC (LCP Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has moisture absorption characteristics that are less affected by humidity and other factors. ● FPC high frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #Flexible substrate #Flexible printed wiring board #Circuit board #Printed circuit board #High frequency #Impedance #Short delivery time #Mass production

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  • Other electronic parts
  • Substrate

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Transparent FPC (Transparent Flexible Printed Circuit Board)

Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine patterns make the wiring inconspicuous.

〇Uses polyimide with excellent heat resistance and flame retardancy. ⇒【Compatible with reflow mounting】 ★ For display devices such as digital signage, as well as medical devices and transparent film antennas! ★ We also accommodate small quantities and a variety of prototypes. For more detailed information, please contact us. #Transparent #Transparent FPC #Transparent Flex

  • Other electronic parts
  • Substrate

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Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)

Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance

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  • Other electronic parts
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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[Information] MR Cylindrical Mirror Polishing Machine (Cylindrical Mirror Grinding Machine) Comprehensive Model Introduction Catalog

Pioneer of cylindrical mirror polishing machines! Introducing the Mirak (Taiyo Kogyo Group) equipment. (Cylindrical mirror grinding machine, mirror finishing, buff polishing, grinding wheel)

We would like to introduce a representative model of the Mirak MR cylindrical mirror polishing machine. The main applications include grinding and polishing with grinding wheels and mirror finishing with buffs. * Rolls for super calendars and elastic rolls * Rolls for rolling various materials (grinding rolls for stainless steel, copper, aluminum) * Gravure printing cylinder rolls * Aluminum rolls * Piston rods for air and hydraulic systems * Plastic rolls (nylon, polyacetal, Teflon, etc.) * Stainless steel rolls * Carbide and ceramic rubber rolls We will provide detailed specifications and other information based on your requests. Please feel free to contact us first.

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Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)

From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!

We support the evaluation of high-frequency characteristics of materials under development. Our company has the know-how to handle everything from short-term prototypes to mass production of FPCs. We can provide optimal proposals tailored to the needs of material manufacturers, flexible printed circuit board manufacturers, and various equipment manufacturers. We assist in evaluating the various characteristics of new materials that are being improved daily.

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  • Printed Circuit Board
  • Substrate

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Static electricity is visible! Static electricity visualization monitor [1 sensor x 8, separated type]

This is a separated type with [1 sensor × 8 units] that enables electrostatic measurement in narrow spaces. It is suitable for various environments such as line processes with real-time measurement.

<Features> - Continuous measurement for 24 hours, can be integrated inline. - Capable of measuring charge in narrow or remote locations. - Data management and storage possible with the included software. <Examples of Use> - Measurement of charge distribution and charge movement on material surfaces. - Charge monitoring on manufacturing lines for LCD panels and organic EL. - Charge inspection while products are flowing on the line with attached sensors.

  • EMC/Static electricity measuring equipment
  • Other anti-static devices
  • Anti-static products
  • Substrate

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Introduction to "Low Reflective Plating" Electroforming Technology

Surface treatment using plating to prevent light reflection, enabling ultra-fine processing at the micron level! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that allows for the high-precision shaping of metal products by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to overlap the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the molding of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Substrate

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[Use Case] Achieving 'Future Co-Creation' between Humans and Robots with Automation Solutions

FA and automation systems, introduction of operational examples. "Future co-creation" between humans and robots.

〇 Introduction of Use Cases We have introduced our proposed automation system in the customer's PR video. We have received consent for its publication on this site, so please view it via the video link. Our automation system: 13-23 seconds, 38-49 seconds *Only the input and output of materials using a dual-arm robot transport system. Elephantech Inc. https://www.elephantech.co.jp/ Elephantech "Elephantech - A startup leading the world in FPC printing" With the mission of "creating a sustainable world through the power of new manufacturing," we manufacture and sell FPC (Flexible Printed Circuit) using environmentally friendly unique methods with inkjet printing and copper plating.

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Ideal for UV-C sterilization devices! Inverter (board type)

TOZAI's inverter shipment record exceeds 10 million units. Feel free to leave custom orders for sterilization devices to us!

【Domestic Production Inverter Board】 The inverter is essential for the use of ultraviolet sterilization lamps. With the technology and experience cultivated by TOZAI over many years, we will contribute to the development of your sterilization lamp equipment. 【Features】 - Reliable domestic production - A wide range of lineups tailored to various power sources - Flexible support for various customizations such as residual heat processing and non-light detection - Lightweight, energy-efficient, and high luminous efficiency compared to copper-iron stabilizers We also offer a variety of other sterilization lamps and sockets for sterilization lamps. Please feel free to consult with us. We have a rich lineup that supports sterilization lamps from GL4 to GL40 in straight tube starter types. For more details, please feel free to contact us. Please note that the dimensions and electrical characteristics of the fluorescent lamp 30W (FL30) and the sterilization lamp (GL30) differ. *Please check the JIS standards for details. *It is necessary to confirm the matching of the lamp you will use with the inverter (this is not a confirmation of sterilization effectiveness). We have evaluation units available, so please feel free to inquire.

  • Air purifiers
  • Inverter
  • inverter
  • Substrate

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Alto Industry Co., Ltd. Company Profile

For reliable electronic circuit boards, trust Alto Industries!

Alto Industrial Co., Ltd. is a company based in Kanagawa Prefecture that designs and manufactures various electronic circuit boards for industrial equipment. Using technical know-how developed over many years in electronic circuit design for major brand products, we create patterns through CAD design and carry out board manufacturing on a fully integrated production line. We provide our customers with the benefits of "domestic in-house production," ensuring high reliability, safety, and quality that pays attention to the finer details characteristic of Japanese craftsmanship. 【Business Description】 ■ Design and manufacture of various electronic circuit boards for industrial equipment *For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Substrate procurement

The compatible board types are IVH/BVH boards and via boards with hole filling processing! A wide range of component procurement is possible through unique purchasing.

Our company selects circuit board manufacturing factories with a wide variety of specialties on behalf of our customers and chooses suppliers for components to meet diverse needs. Prototyping parts procurement can be done through purchasing from market inventory. We achieve procurement focused on speed and delivery time for prototypes. The types of circuit boards we handle include IVH/BVH boards and filled via boards, and by managing quality ourselves, we ensure that our customers do not have to worry about it. 【Types of Circuit Boards We Handle】 ■ IVH/BVH boards ■ Filled via boards ■ Impedance matching and inspection-compatible boards ■ Halogen-free, PB-free, Teflon boards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • Substrate

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Mountaineer "Z:LEX YSM20WR"

Support for W356 width dual lane implementation in high-speed machines! Introduction of the mounter handled by Masu Shoji.

We would like to introduce the YAMAHA manufactured mount 'Z:LEX YSM20WR' handled by Masu Shoji. We have newly developed the ALF (Auto Loading Feeder) that innovates the replenishment of tape components with skill-less operation. In single lane mode, it standardly supports super-large substrates up to L810×W742, and it can also standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg. 【Features】 ■ Supports dual lane mounting with a width of W356 for high-speed machines ■ Standardly supports super-large substrates up to L810×W742 in single lane mode ■ Can standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg ■ Options to improve line operating rates without stopping the machine ■ Non-stop pallet exchange ATS (Auto Tray Sequencer) "sATS30NS" ■ Non-stop feeder bulk exchange system *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Mount "Σ-G5SII"

Reviewing details for further reliability improvement! A mounter that ensures high mounting quality.

We would like to introduce the YAMAHA manufactured mounter 'Σ-G5SII' handled by Masu Shoji. This model has evolved the "1-head solution" that achieves high productivity with two new types of heads, capable of handling ultra-small components such as 0201 (0.25mm x 0.125mm) as well as large components. By expanding the internal buffer size, it reduces transport loss for large PCBs. 【Features】 ■ Capable of handling ultra-small components like 0201 (0.25mm x 0.125mm) to large components ■ Expanded detection range for component holding state ensures high mounting quality ■ Reduces transport loss for large PCBs by increasing internal buffer size ■ Detailed review for further reliability improvement ■ Ensures compatibility with conventional models *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Mountaineer "Σ-F8S"

Introducing a mounter that achieves 150,000 CPH with a compact chassis featuring 4 beams and 4 heads!

We would like to introduce the YAMAHA manufactured mounter 'Σ-F8S' handled by Masu Shoji. It features a rotary head for a one-head solution, achieving speed, versatility, and high operational rates. The variety of parts is up to 80 types, with dimensions of L 1,280 x W 2,240 x H 1,450 mm. 【Features】 ■ One-head solution with a rotary head ■ Achieves speed, versatility, and high operational rates ■ Delivers 150,000 CPH with a compact body using 4 beams and 4 heads ■ Direct drive head that realizes high speed and high precision ■ SL feeder (Super Loading Feeder) that innovates parts supply operations *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Mountaineer "S10"

Pursuit of versatility in setup! A mounter with flexible parts/model compatibility.

We would like to introduce the YAMAHA manufactured mounter 'S10' handled by Masu Shoji. It has enhanced board compatibility and can be expanded for 3D MID mounting. The board dimensions range from a minimum of L50 x W30mm to a maximum of L1,330 x W510mm (standard L955), with a maximum board transport speed of 900mm/sec. 【Features】 ■ Expansion for 3D MID mounting ■ Enhanced board compatibility ■ Flexible component/variety compatibility ■ Setup designed for versatility *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Mountaineer "S20"

The substrate transfer speed is up to 900mm/sec! Introducing a mounter with flexible component/variety compatibility.

The "S20" is a Yamaha-made mounter that enhances substrate compatibility. It features an expansion for 3D MID (three-dimensional molded circuit components) mounting, and it is characterized by its versatility in setup. Additionally, the components that can be mounted include 0201 to 120×90mm BGA, CSP, connectors, and other irregular components (standard 0402 and above). 【Features】 ■ Expansion for 3D MID mounting ■ Enhanced substrate compatibility ■ Flexible component/variety compatibility ■ Versatile setup for general use *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Mountaineer "ALF"

Innovation in parts supply! Introducing YAMAHA's mount with excellent workability.

We would like to introduce the YAMAHA manufactured mount 'ALF' handled by Masu Shoji. The target tape has a width of 8mm and a maximum thickness of 1mm. The mounting width is equivalent to 12mm pitch based on 8mm, and the minimum tape length that can be loaded is 400mm or more. We offer four types of feeders: S (1005), M (1608), L (2012), and LL (3216). 【Features】 ■ Innovation in parts supply ■ Automatic supply of tape components ■ Excellent workability *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Chino Giken Co., Ltd. Business Introduction

For the design and manufacturing of printed circuit boards, contact Chino Giken Co., Ltd.!

Chino Giken Co., Ltd. is a company primarily engaged in the design, manufacturing, and sales of printed circuit boards. We have established a consistent production line capable of handling everything from prototypes to medium-volume production, along with an internal system that guarantees reliable quality and delivery times, earning us high praise from numerous customers. We provide high quality at low cost tailored to our customers' needs. Please feel free to consult us. 【Business Activities】 ■ Design, manufacturing, and sales of printed circuit boards *For more details, please refer to our catalog or feel free to contact us.

  • Contract manufacturing
  • Printed Circuit Board
  • Substrate

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Printed Circuit Board Delivery Time and Quality

Leave it to us for aluminum base printed circuit boards, from high heat dissipation types to bendable ones.

We handle aluminum base printed circuit boards. For high heat dissipation, we offer two types: 8W/mk and 5W/mk. We can accommodate delivery times through our in-house integrated line, allowing for quick turnaround on prototypes. Additionally, we also offer rigid-flex boards as an evolved version of the bendable type. Please feel free to contact us with your requests. 【Delivery Times (Excerpt)】 ■ Double-sided boards ・Super express line: 1 night, 2 days ・Express line: 2 nights, 3 days ・Standard line: 3 nights, 4 days or more *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Substrate

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Single-sided build-up metal base printed circuit board

We can accommodate even small quantities! Introducing single-sided build-up metal base printed circuit boards.

We would like to introduce the "Single-Sided Build-Up Metal Base Printed Circuit Board" handled by our technology research institute. We offer a lineup that includes the "Single-Sided 2-Layer Aluminum Base Printed Circuit Board" for power modules and the "Single-Sided 3-Layer Aluminum Base Printed Circuit Board," which can accommodate various layer configurations. Our company is equipped with an in-house VIA plating line, allowing us to handle even small quantities. 【Features】 ■ Capable of handling small quantities ■ In-house VIA plating line fully equipped ■ For power modules (Single-Sided 2-Layer Aluminum Base Printed Circuit Board) ■ Capable of accommodating various layer configurations (Single-Sided 3-Layer Aluminum Base Printed Circuit Board) *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Substrate

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Thick copper double-sided printed circuit board

The copper board thickness is 200μm, and the through-hole plating thickness is 25μm! Introducing our printed circuit boards.

We would like to introduce our "Thick Copper Double-Sided Printed Circuit Board." The substrate is R-1766/1661, and the copper thickness is 200μm (using C1100-1/2H). It features high current capacity and excellent heat dissipation. Additionally, we also offer a "High-Temperature Double-Sided Printed Circuit Board" with high heat resistance and high elastic modulus. 【Features】 ■ High current capacity ■ Excellent heat dissipation *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Substrate

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