We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. null/null
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. Understand in 3 minutes! Solder Resist Formation Technology [Materials Provided] プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm] 共栄電資
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

Substrate Product List

931～960 item / All 1922 items

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Station-type suction device "FR-410"

Station-type suction device "FR-410"

140W high power! Compatible with ultra-small land diameter and narrow spaces.

The FR-410 is a station-type suction device that allows for stress-free desoldering work on multilayer PCBs, which has been difficult until now. Thanks to its valve function, suction begins 0.2 seconds after pulling the trigger, when the suction pressure increases, allowing for a powerful suction that eliminates any residual solder. Additionally, it offers a lineup of nozzles that accommodate not only very small pad diameters and narrow spaces but also flat terminal components. 【Features】 ■ Ideal for solder desoldering work on multilayer PCBs ■ Unique features improve desoldering work efficiency ■ Improved work efficiency through nozzle selection based on the task ■ Enhanced maintenance *For more details, please download the PDF or feel free to contact us.

  • Other work tools
  • Substrate

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Automated Soldering Robot System 'Separated Pulley Unit'

Automated Soldering Robot System 'Separated Pulley Unit'

The solder wire diameter supports 7 sizes from Φ0.3mm to Φ1.6mm!

The "separable pulley unit" is an automatic soldering robot system that allows for quick and careful maintenance. When changing the solder wire diameter, there is no need to replace the entire pulley unit; it can be addressed by simply replacing the parts. By being disassemblable, maintenance efficiency is improved, and being able to replace only the necessary parts leads to a reduction in running costs. 【Features】 ■ Easy maintenance ・Parts can be removed ■ Reduction in running costs ・Change of solder wire diameter ・Replacement of consumable parts *For more details, please download the PDF or feel free to contact us.

  • Soldering Equipment
  • Substrate

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Supercapacitor "SCPA, SCPB, SCPC Series"

Supercapacitor "SCPA, SCPB, SCPC Series"

Low self-discharge and strong in charge-discharge cycles! It is expected to be utilized in a wide range of fields.

The "SCPA, SCPB, SCPC series" is a high-performance energy storage device designed with an ultra-thin thickness of 0.4mm, making it easy to integrate into limited spaces. With high power density and ultra-low ESR (equivalent series resistance), it enables instantaneous power supply and efficient energy transfer while maintaining stable operation with reduced heat generation. Additionally, due to its low self-discharge and strong resistance to charge and discharge cycles, it is expected to be utilized as a long-lasting and reliable power solution in a wide range of fields, including IoT devices, wearable devices, and medical equipment. 【Features】 ■ Ultra-thin: 0.4mm ■ Rated voltage: 2.5V to 5.5V ■ Capacitance: 0.035F to 2.4F ■ High power density ■ Low self-discharge ■ High durability *For more details, please download the PDF (English version) or feel free to contact us.

  • Other electronic parts
  • Substrate

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Universal board for Arduino

Universal board for Arduino

Let's create an original Arduino shield!

● This is a universal board the same size as the open-source microcontroller board "Arduino." ● The connector positions are aligned with the Arduino, allowing for a secure fit without misalignment. ● The signal names for each pin of the connector are printed in silk screen. ● It features large pads that make soldering easier. ● A connector for connections is included.

  • Printed Circuit Board
  • Substrate

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AT substrate universal type / type with lug terminals

AT substrate universal type / type with lug terminals

Ideal for the construction of analog circuits using discrete components.

Universal board with a dot pitch of 4mm.

  • Printed Circuit Board
  • Substrate

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Seal substrate

Seal substrate

It can be easily cut and used with scissors or a cutter.

A sticker board that implements SOP ICs and chip components and is attached to a universal board.

  • Printed Circuit Board
  • Substrate

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Connector conversion board

Connector conversion board

We offer variations in pin pitch and pin count.

Connector conversion board that extracts various connector pins into a 2.54mm pitch dot pattern.

  • Printed Circuit Board
  • Substrate

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Universal board for microcontroller expansion

Universal board for microcontroller expansion

Material and thickness: Double-sided glass epoxy 1.6t

This is an introduction to the universal board for ISA bus handled by Sanhayato.

  • Printed Circuit Board
  • Substrate

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USB Connector Conversion Board CK-36

USB Connector Conversion Board CK-36

This is a board that converts the signal lines of a USB mini-B type connector to a 2.54mm pitch.

It is equipped with a USB mini-B type connector.

  • Printed Circuit Board
  • Substrate

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Universal board for PIC microcontroller board MB-P11

Universal board for PIC microcontroller board MB-P11

Ideal for electronic projects using PIC microcontrollers.

This is a PIC microcontroller board for experimentation and evaluation compatible with the PIC16F/18F series.

  • Printed Circuit Board
  • Substrate

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Mini board for mobile case UB-FSK01BK

Mini board for mobile case UB-FSK01BK

The size after cutting is perfect for small cases like those used for commercial sweets.

It is a double-sided land, but there are no through holes. It is possible to increase the mounting density.

  • Printed Circuit Board
  • Substrate

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Service: "High Frequency High-Speed Digital Power Circuit Board Design and Manufacturing"

Service: "High Frequency High-Speed Digital Power Circuit Board Design and Manufacturing"

One-stop execution from circuit board design to manufacturing, assembly, and component procurement! We will free your company from the hassle of adjustments.

Our company offers "High-Frequency High-Speed Digital Power Circuit Board Design and Manufacturing." We can accommodate a variety of board materials and hybrid boards, fulfilling customer requirements in terms of schedule, cost, performance, and design. Additionally, we have a track record in designing and manufacturing 60GHz band boards and DDR4×32 boards. For high-end board design and manufacturing, please leave it to us. 【Features】 ■ Diverse high-frequency circuit board materials ■ Stable operation of high-speed digital circuits ■ Thermal management for power circuits ■ Collaboration with universities and research institutions ■ Simulation technology *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other contract services
  • Substrate

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High Frequency Substrate: Analog High Frequency Substrate

High Frequency Substrate: Analog High Frequency Substrate

26GHz Up/Down converter board using a 2-stage mixer! Converted to quasi-millimeter wave for transmission and output.

We would like to introduce the "Analog High-Frequency Board" handled by SDK. When a 3.5GHz signal is input to the upconverter, it is converted and output to quasi-millimeter wave (26GHz band) for transmission. The quasi-millimeter wave (26GHz band) is received by the downconverter and returned to the original 3.5GHz for use. 【Features】 ■ 26GHz Up/Down converter board using a 2-stage mixer ■ When a 3.5GHz signal is input to the upconverter, it is converted and output to quasi-millimeter wave (26GHz band) for transmission ■ The quasi-millimeter wave (26GHz band) is received by the downconverter and returned to the original 3.5GHz for use *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Low transmission loss substrate "xCH3008H" and "xCCF-500"

Low transmission loss substrate "xCH3008H" and "xCCF-500"

A substrate for millimeter-wave radar that suppresses transmission loss and prevents collisions.

■ "xCH3008H" This is a glass cloth reinforced substrate that uses ultra-low roughness copper foil, suppressing the dielectric loss tangent and linear expansion coefficient compared to conventional fluoroplastic substrates (CGP-500A). Generally, fluoroplastic substrates are considered difficult to laminate, but it is also possible to laminate with dissimilar substrates such as FR-4. 【Charateristics】 DK3, DF0.0011, CTE (X:11, Y:11, Z:54) ■ "xCCF-500" This is a glass cloth-free substrate that uses a special fluoroplastic film as a dielectric and ultra-low roughness foil. 【Characteristics】 DK3, DF0.0013, CTE (X:28, Y:29, Z:29) *For more details, please refer to the PDF materials or feel free to contact us.

  • s_xCCF-500(品名アリ).png
  • High frequency/microwave parts
  • Substrate

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Printed Circuit Board "Ultra Long Flexible Circuit Board (Ultra Long FPC)"

Printed Circuit Board "Ultra Long Flexible Circuit Board (Ultra Long FPC)"

Leave the manufacturing of long FPC to us! Standard: Capable of producing sizes up to 2000×500mm. *For lengths beyond that, please consult us (we have experience with lengths up to 20M).

Aiming to be "the leader in long-length printed electronics," we are dedicated to meeting our customers' needs every day. Are you facing challenges such as considering long substrates but finding it difficult to find a suitable provider, or struggling with high labor costs and low-volume production? With over half a century of experience and more than 10,000 types of manufacturing achievements, we are here to assist you with our proposal capabilities for specialized products. 【Specifications】 ○ Board thickness: Single-sided and double-sided 0.0125mm, 0.025mm, 0.05mm ○ L/S (Line & Space): 0.15/0.15mm or more ○ Hole diameter: φ0.3mm or more For more details, please contact us or download the catalog.

  • Circuit board processing machine
  • Contract manufacturing
  • Processing Contract
  • Substrate

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Printed circuit board "flex-rigid board"

Printed circuit board "flex-rigid board"

Achieving connectorless implementation, flex-rigid substrate.

Flexible rigid substrates have a complex structure, involve many processes, and take a considerable amount of time to produce. Therefore, it can be challenging to commit to production for small quantities. We can help solve such concerns. Please feel free to consult with us. 【Features】 - A substrate that combines rigid and flexible materials - Utilizes the advantages of both flexible and rigid substrates - Connector-less mounting is possible - Space-saving design for the substrate - Smoothness and flatness can be produced almost the same as standard rigid substrates - Allows for higher density wiring and mounting compared to single-sided substrates For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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【Manufacturing Achievements】Production of Super Large PCBs

【Manufacturing Achievements】Production of Super Large PCBs

Modified the router machine table to enable large-scale exterior processing! Introducing our manufacturing achievements.

We would like to introduce our achievements in circuit board manufacturing. We produced a "large rigid board measuring 1182×850mm." It features drilling, pattern exposure, etching, and contour routing capabilities that can accommodate sizes of 1000mm×100mm. For large line and space (L/S), we have a 110μ exposure that results in output for 100μ exposure film in the standard size of 1224×91mm.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Pattern exposure corresponding to 20m! Achieving low-cost production through innovative manufacturing methods.

We would like to introduce our achievements in substrate manufacturing. We optimized each device to handle materials in roll form and produced ultra-long substrates with a product size of 20m. We perform exposure, development, and etching processes, using polyester materials to reduce costs. We achieved low-cost production through suggestions during the manufacturing method and product design stages, as well as innovations in the manufacturing process. 【Basic Specifications】 ■ Material: Polyester/0.075 Cu35/0μ ■ Processes: Etching, simple shape processing ■ Substrate Size: 20000×59 ■ Others: Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

4-layer flexible printed circuit board (FPC) using LCP materials! Introducing our manufacturing achievements for a product size of 1300mm.

We would like to introduce our achievements in circuit board manufacturing. We produced an ultra-long multilayer LCP board with a product size of 1300mm. The features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible board made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Process: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Board size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Small-scale production of flex rigid.

Small-scale production of flex rigid.

We are happy to accept small-scale production! We have a wide variety of materials for both PCBs and FPCs in stock, and we can make proposals that meet our customers' needs!

We accept small-scale production of flexible rigid boards. We can assist those who are struggling with "how to create flexible rigid boards or consider specifications" and those who are facing difficulties with "small lot production of flexible rigid boards." Our company has internalized most of the processes, making us suitable for small lot production. We can produce from just one piece. We can also procure materials that are not regularly stocked, so please feel free to consult with us. 【Features】 ■ Most processes are internalized, making us suitable for small lot production ■ Production is possible from one piece ■ We have extensive knowledge of both FPC and PCB production methods ■ A wide variety of materials for both PCB and FPC are readily available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Substrate "Dielectric Substrate for Microwave Use"

Substrate "Dielectric Substrate for Microwave Use"

It has a stable temperature characteristic with a high Q value in the high frequency range, achieving a wide range of inductance!

The "dielectric substrate for microwave applications" can be used for electronic components for mobile phones, microwave communication devices, microwave integrated circuit (MIC) substrates, stripline resonators, Bluetooth, and other applications. This product features stable temperature characteristics with a high Q value in the high-frequency range, achieved through our unique ceramic material technology, and realizes a wide range of permittivity. Precision processing such as surface polishing and slicing is also available upon request. Please feel free to contact us. 【Features】 ■ High Q value in the high-frequency range ■ Stable temperature characteristics ■ Realizes a wide range of permittivity *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components
  • Substrate

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Phonon Meiwa Co., Ltd. Business Introduction

Phonon Meiwa Co., Ltd. Business Introduction

We will flexibly respond to everything from new product development and prototype production to mass production!

Phonon Meiwa Co., Ltd. is a company that mainly deals with products such as ferrite cores and ceramic cores for inductors (coils), ceramic substrates for chip resistors, and ceramic insulators for fixed resistors. With advanced specialized technology and the latest equipment, we respond to various needs. We look forward to your inquiries regarding products related to ceramics and ferrites. Please feel free to contact us. 【Product Line】 ■ Ferrite cores and ceramic cores for inductors (coils), ceramic substrates for chip resistors, ceramic insulators for fixed resistors, and more. *For more details, please refer to our catalog or feel free to contact us.

  • Electronic Components
  • Other electronic components and modules
  • Other contract manufacturing
  • Substrate

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Development board for module [SOM-DB5830]

Development board for module [SOM-DB5830]

Development board for COMExpress R3.0 Type 6/10 module.

Development board for COMExpress R3.0 Type 6/10 modules ● Expansion: PCIe x16, PCIe x4 ● Display types: VGA, LVDS / eDP, HDMI / DP ● ATX form factor compatible with both ATX and AT power supplies ● Compatible with COM Express Basic / Compact / COM-Ultra modules ● Development board compliant with PICMG COM.0 R3.0 Type 6 pin-out

  • Industrial PCs
  • Substrate

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Development board for module [SOM-DB5920]

Development board for module [SOM-DB5920]

Development board for COMExpress R3.0 Type 7 module

Development board for COMExpress R3.0 Type 7 module ● PICMG COM.0 R 3.0 Type 7 pin output ● COM Express Basic/Compact module ● 10 Gigabit Ethernet support via OCP mezzanine card ● Expansion: PCIe x16, PCIe x8, 2 PCIe x4 ● Integrated BMC supporting dedicated NIC for VGA, IPMI, and iKVM ● Visible Debug Utility: BIOS 80 ports and power status

  • Industrial PCs
  • Substrate

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Development board for Qseven module [ROM-DB7502]

Development board for Qseven module [ROM-DB7502]

Development board for Qseven V2.0 / V2.1 RISC modules

- Compatible with Qseven V2.0 / V2.1 module boards - Mini-ITX form factor - Supports 1 PCIe, 1 GbE, 4 USB 2.0, 1 USB OTG 2.0, 1 SATA II, 1 I2C, 1 I2S, 1 CAN bus, and 8 GPIO - Smart battery support - Supports AT / ATX mode, input power +12V - Includes cable pack, built-in evaluation images & test utilities

  • Industrial PCs
  • Substrate

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Development board for Qseven module [ROM-DB7501]

Development board for Qseven module [ROM-DB7501]

Development board for Qseven v2.0 RISC module

- Carrier board for Qseven v2.0 module - Standard Mini-ITX form factor - 2 24-bit LVDS, 1 HDMI, 1 I2S, 2 I2C, 2 SPI - Smart battery support - 8 GPIO, line input/audio output - Supports ATX mode, input power +12V - Comes with cable pack

  • Industrial PCs
  • Substrate

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Development board for RTX 2.0 module [ROM-DB3900]

Development board for RTX 2.0 module [ROM-DB3900]

Development board for RISC RTX2.0 module

- Compatible with RTX 2.0 CPU module board - 3 display outputs: VGA, HDMI, 24-bit LVDS - 1 SATA / SATA-DOM, 1 RJ-45, 1 USB 2.0 / 3.0, 2 CAN buses, 4 UARTs, 10 GPIOs - 2 PCIe slots - 2 MIPI interfaces for camera modules - Onboard eMMC flash 4 GB, SD card, SIM card slot - HD I2S audio codec

  • Industrial PCs
  • Substrate

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Development board for SMARC module [ROM-DB5900]

Development board for SMARC module [ROM-DB5900]

Development board for RISC SMARC module

- Compatible with SGeT SMARC CPU module board - 3 display outputs: VGA, HDMI, 24-bit LVDS - 1 SATA / SATA-DOM, 1 RJ-45, 2 USB 2.0, 2 CAN bus, 4 UART, 12 GPIO - 1 PCIe x 1 and 2 miniPCIe slots - Two MIPI interfaces for camera modules - Onboard eMMC flash 4 GB, SD card, SIM card slot - HD audio codec and SPDIF support - Supports 12V DC and lithium-ion battery power input

  • Industrial PCs
  • Substrate

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